Asus P526 User manual

GTC ■ Service Manual
P526 Repair Lv3 4 SOP
Version 1.1 2008/1/10

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Content
1.EQUIPMENT NEED ..................................................................................................................................... 3
2. OUTLINE AND SIDE KEYS ....................................................................................................................... 3
3.INTRODUCTION .......................................................................................................................................... 5
3.1 B LOCK DIAGRAM ........................................................................................................................................ 5
3.2 M AIN COMPONENTS AND PLACEMENT ......................................................................................................... 6
4.﹒
﹒﹒
﹒MMI TEST PROGRAM............................................................................................................................ 7
4.1 A UDIO TEST ( INCLUDING HEADSET , HANDSET AND SPEAKER )...................................................................... 7
4.2 H EADSET TEST : ........................................................................................................................................... 8
4.3 S PEAKER TEST ：........................................................................................................................................ 9
4.4 M ICROPHONE TEST ：................................................................................................................................. 9
4.5 R ECEIVER TEST : .......................................................................................................................................... 9
4.6 B UTTON / KEYPAD TEST ............................................................................................................................ 10
4.8 LED TEST ................................................................................................................................................. 11
4.9 V IBRATOR TEST ......................................................................................................................................... 12
4.10 TMC TEST ............................................................................................................................................ 12
5.TROUBLE SHOOTING.............................................................................................................................. 14
5.1 S YSTEM CAN ’ T POWER ON ........................................................................................................................ 14
5.2 T OUCH PANEL ........................................................................................................................................... 19
5.3.1﹒Headset:......................................................................................................................................... 21
5.3.3﹒Handset: ........................................................................................................................................ 23
5.4 B ATTERY CHARGING ................................................................................................................................. 24
5.5 B UTTON / KEYPAD TEST .............................................................................................................................. 26
5.7 C AMERA ................................................................................................................................................... 29
5.8 LCD ......................................................................................................................................................... 31
5.9 LED.......................................................................................................................................................... 35
5.10 V IBRATOR ............................................................................................................................................... 36
5.11 M ICRO SD CARD ..................................................................................................................................... 37
5.12 TMC....................................................................................................................................................... 38
6. RF PURPOSE:............................................................................................................................................. 40
7.EQUIPMENTS ............................................................................................................................................. 40
7.1 S OFTWARE REQUIREMENT :........................................................................................................................ 40
7.2 H ARDWARE REQUIREMENT : ...................................................................................................................... 40
8. TEST POINTS ............................................................................................................................................. 41
9. COMPONENTS DISPLACEMENT ......................................................................................................... 44
10. THE SETUPS FOR THE MOBILE HARDWARE TESTING AND TESTING RESULTS .............. 48
11. RF BOARD LEVEL EXAMINATION PROCEDURE.......................................................................... 81
11.1
IF THE PCB COULD NOT BOOT .................................................................................................................. 81
11.2 GSM APC FAIL ....................................................................................................................................... 82
11.3 AFC-VISA FAIL ...................................................................................................................................... 83
11.4 E DGE APC FAIL ...................................................................................................................................... 83

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12.GPS PURPOSE: ......................................................................................................................................... 84
13. EQUIPMENT ............................................................................................................................................ 84
14. TEST POINTS ........................................................................................................................................... 85
14.1GPS A CTIVE P ATH ................................................................................................................................... 85
14.2 P ASSIVE P ATH .......................................................................................................................................... 86
14.3 S I RF S TAR III .......................................................................................................................................... 87
14.4 GPS P OWER PART ................................................................................................................................... 88
15. COMPONENT DISPLACEMENT ......................................................................................................... 89
16. T EST POINTS DISPLACEMENT PLOT ............................................................................................................ 91
17. GPS H ARDWARE E XAMINATION P ROCEDURE ........................................................................................... 93
18. MEASUREMENT RESULTS OF ALL TEST POINTS ........................................................................ 97
19. BT REPAIR PURPOSE:........................................................................................................................... 99
20. EQUIPMENTS OF BT REPAIR ............................................................................................................. 99
20.1 S OFTWARE REQUIREMENT :...................................................................................................................... 99
20.2 H ARDWARE REQUIREMENT : .................................................................................................................... 99
21. TEST POINTS ........................................................................................................................................... 99
21.1M AIN TEST POIN ...................................................................................................................................... 99
21.2 C OMPONENTS PLACEMENT ................................................................................................................... 100
22. BT DEBUG............................................................................................................................................... 101
APPENDIX A: ............................................................................................................................................... 105

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1.Equipment need
A. Power supply
B. Oscilloscope
C. Headset of P526
D. TMC cable of P526.
E. AC charger of P526
F. Battery of P526
G. Mini-USB cable
H. Micro SD card
I. PC
2. Outline and side keys

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3.Introduction
3.1 Block diagram

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3.2 Main components and placement
Top Side
Bottom Side

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4.﹒
﹒﹒
﹒MMI test program
(following hardware tests could be done more convenient through MMI testing program, and others
will be tested through CrossBow)
4.1 Audio test (including headset, handset and speaker)
Select “audio” application software.
Insert headset and click “OK”

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4.2 Headset test:
After click “tri-angle button”, some voice shall output to left and right side of headset. Then,
click “X” to next test for microphone of headset.
Please click “circle button” and speak some words. The words you spoke will be played back
to headset. Then, click “X” to next test for speaker.
Before entering next test for speaker, please unplug the headset and click “OK”.

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4.3 Speaker test：
：：
：
After click ”tri-angle button”, some audio is played to speaker. Then click “X” to next test for
microphone.
4.4 Microphone test：
：：
：
The action is same with the testing of microphone in headset except the words will be played
back to speaker.
4.5 Receiver test:
The action is same with speaker test except the audio is played to receiver.

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4.6 Button/keypad test
Select “Button” application software
Please follow up the indication to press correct key and next indication will show up, if the last
correct key is pressed.

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4.7 BT test (blue tooth test, only UART interface)
Select “BTTestMode” application software
It is auto-run and finally the string “Run Script successfully” is shown up, meaning the UART
interface between OMAP850 and blue tooth chip is OK.
4.8 LED test
Just select “LED” application software. It is auto test.

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4.9 Vibrator test
Just select “LED” application software. It is auto test.
4.10 TMC test
TMC cable
Just select “A63xTMC” application software. It is auto test.

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In version pop up windows, just click “OK”
TMC function is checked OK if the string “GPRMC,xxxxxx” is shown on the screen..

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5.Trouble shooting
Note: Let SW17 activated (pressed) to simulate battery cover existing with something; for example a
tape etc.
5.1 System can’t power on
Needed Equipments:
A. Power supply set to 4V/2A.
B. Oscilloscope
Note: Normally, the current during system powered on will not over 300mA, and will be in the
range of 50mA ~ 200mA.
Please check following parts and signals.
Battery cover detection: System will be shut down by software, if battery cover detection is no function.

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a. R169 shall be high (4V).
b. R270 shall be high (4V).
c. R255 shall be high (4V).
d. Pin#1 of R250 shall be low (0V).
Power on key: system will not be powered up if power on key is no function.
Please press SW6 (power on key) and measure following signals.
a. R92 and R109 shall be low (0V).
b. Pin#1 of R128 shall be high (1.8V).
32K clock: System will not be powered up if 32K clock is no function.

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Pin#1 of R26 (XTAL_OUT) shall have 32K clock after power supply is turned on.
Outputs of DC/DC and LDOs

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(VIO_2V8) -- R134, R28, R24, R196, R33 shall be 2.8V.
(VRTC_1V5) -- Pin#2 of C134, R30 shall be 1.5V.
(VCORE_1V6) -- R27, pin#1 of C59 shall be 1.6V.
(VMEM_1V8) -- R29, R55, R191 shall be 1V8.
(VCAM_2V85) -- R5, pin#1 of C163 shall 2.85V
(VBAT) -- R137, R54, pin1# of C161 shall be 4V
Signals related with power on sequence.
Following wave is shown the timing after “power supply is turned on”

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Timing after power supply is turned on
Following wave is shown the timing after “power on key is pressed”
(REGEN in channel 2) -- R59 shall be high (4V).
(ON_nOFF in channel 3) -- R131 shall be high (1.5V).
(MPU_RST# in channel 4) – R46 shall be high (2.8V)
Timing after power on key is pressed (1)
(XOEN in channel 2) – R304 shall is high (1.5V)
(RF_CLK in channel 3) – C9 shall have 26M clock.

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Timing after power on key is pressed (2)
If above everything is OK and the current of power supply is stable stop in the range of 20mA to 70mA, then
it could be memory (flash/ SDRAM (U4) or OMAP850 (U1)) problem.
5.2 Touch panel
Needed Equipments:
A. Power supply set to 4V/2A.
B. Oscilloscope