AXIOMTEK CEM313 User manual

CEM312/313
Intel®AtomTM E3950/E3940/E3930,
Pentium N4200®and Celeron®N3350
COM ExpressTM Type 6 Compact
Module
User’s Manual

ii
Disclaimers
This manual has been carefully checked and believed to contain accurate information.
Axiomtek Co., Ltd. assumes no responsibility for any infringements of patents or any third
party’s rights, and any liability arising from such use.
Axiomtek does not warrant or assume any legal liability or responsibility for the accuracy,
completeness or usefulness of any information in this document. Axiomtek does not make any
commitment to update the information in this manual.
Axiomtek reserves the right to change or revise this document and/or product at any time
without notice.
No part of this document may be reproduced, stored in a retrieval system, or transmitted, in
any form or by any means, electronic, mechanical, photocopying, recording, or otherwise,
without the prior written permission of Axiomtek Co., Ltd.
CAUTION
If you replace wrong batteries, it causes the danger of explosion. It is recommended by the
manufacturer that you follow the manufacturer’s instructions to only replace the same or
equivalent type of battery, and dispose of used ones.
Copyright 2018 Axiomtek Co., Ltd.
All Rights Reserved
May 2018, Version A2
Printed in Taiwan

iii
ESD Precautions
Computer boards have integrated circuits sensitive to static electricity. To prevent chipsets
from electrostatic discharge damage, please take care of the following jobs with precautions:
Do not remove modules or integrated circuits from their anti-static packaging until you are
ready to install them.
Before holding the module or integrated circuit, touch an unpainted portion of the system
unit chassis for a few seconds. It discharges static electricity from your body.
Wear a wrist-grounding strap, available from most electronic component stores, when
handling modules and components.
Trademarks Acknowledgments
Axiomtek is a trademark of Axiomtek Co., Ltd.
Windows®is a trademark of Microsoft Corporation.
AMI is a trademark of American Megatrend Inc.
IBM, PC/AT, PS/2, VGA are trademarks of International Business Machines Corporation.
Intel®, Celeron® are trademarks of Intel Corporation.
Other brand names and trademarks are the properties and registered brands of their
respective owners.

iv
Table of Contents
Disclaimers.....................................................................................................ii
ESD Precautions...........................................................................................iii
Chapter 1 Introduction............................................. 1
1.1 Features...............................................................................................1
1.2 Specifications......................................................................................2
1.3 Utilities Supported ..............................................................................3
Chapter 2 Module and Pin Assignments.................. 5
2.1 Module Dimensions and Fixing Holes...............................................5
2.2 Module Layout.....................................................................................7
2.3 Installing Thermal Solution ................................................................9
2.4 Switch Settings .................................................................................11
2.4.1 Auto Power On and Restore BIOS Optimal Defaults (SW1)......................11
2.5 Connectors........................................................................................12
2.5.1 COM ExpressTM Connectors (SS1 and SS2)............................................ 12
Chapter 3 Hardware Description ........................... 15
3.1 Microprocessor .................................................................................15
3.2 BIOS ...................................................................................................15
3.3 System Memory.................................................................................15
3.4 I/O Port Address Map........................................................................16
3.5 Interrupt Controller (IRQ) Map .........................................................17
3.6 Memory Map ......................................................................................26
Chapter 4 AMI BIOS Setup Utility .......................... 27
4.1 Starting...............................................................................................27
4.2 Navigation Keys ................................................................................27
4.3 Main Menu..........................................................................................29
4.4 Advanced Menu.................................................................................30
4.5 Chipset Menu.....................................................................................45
4.6 Security Menu....................................................................................49
4.7 Boot Menu..........................................................................................50
4.8 Save & Exit Menu ..............................................................................54

v
Appendix A Watchdog Timer and GPIO .................. 57
B.1 About Watchdog Timer.....................................................................57
B.2 How to Use Watchdog Timer............................................................57
B.3 About GPIO........................................................................................57
B.4 Sample Program................................................................................58
Appendix B BIOS Flash Utility ................................ 59

vi
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CEM312/313 COM ExpressTM Type 6 Compact Module
Introduction 1
Chapter 1
Introduction
The CEM312 is a new COM ExpressTM Type 6 Compact Module supporting Intel®AtomTM
quad core x7-E3950, x5-E3940 and dual core x5-E3930. Meanwhile, CEM313 is a new COM
ExpressTM Type 6 Compact Module supporting Intel®Pentium®quad core N4200 and Celeron®
dual core N3350. Both of them deliver outstanding system performance and support excellent
multiple I/Os like LVDS, one Gigabit Ethernet, HD Audio interface, two SATA-600, four USB 3.0
and eight USB 2.0 ports. For extension purpose, it provides maximum up to 4 lanes of
PCI-Express Gen 2 at 5GT/s.
1.1 Features
CEM312: Intel®AtomTM x7-E3950 and x5-E3940/E3930 processors
CEM313: Intel®Pentium®N4200 and Celeron®N3350 processors
Two 204-pin SO-DIMMs supporting up to 8GB memory capacity
Support max. up to 4 lanes of PCI-Express
2 SATA-600
4 USB 3.0 and 8 USB 2.0 ports

CEM312/313 COM ExpressTM Type 6 Compact Module
2 Introduction
1.2 Specifications
CPU
CEM312
- Intel®AtomTM quad core x7-E3950 1.60GHz.
- Intel®AtomTM quad core x5-E3940 1.60GHz.
- Intel®AtomTM dual core x5-E3930 1.30GHz.
CEM313
- Intel®Pentium®quad core N4200 1.10GHz.
- Intel®Celeron®dual core N3350 1.10GHz.
BIOS
American Megatrends Inc. BIOS.
64Mbit SPI Flash, DMI, Plug and Play.
PXE Ethernet Boot ROM, customized default saving features, LPC-free supported,
uses SPI type Flash memory.
System Memory
Two 204-pin DDR3L 1866MHz SO-DIMM sockets support maximum memory
capacity up to 8GB.
Expansion Interface
Four PCI-Express x1 (three PCI-Express x1 while onboard LAN is connected) routed
through COM ExpressTM A_B connector.
USB Interface
Four USB ports comply with USB Spec. Rev. 3.0.
Eight USB ports comply with USB Spec. Rev. 2.0.
SATA Interface
Two SATA 6Gb/s ports supported through COM ExpressTM connector.
TPM
Trusted Platform Module compatible with TPM1.2 Main and PC Client specification
based on Intel LPC Bus Interface.
Graphics
Integrated in processor HD graphics 505/500.
CRT interface supports up to 1920x1200 (optional).
18/24-bit dual channel LVDS interface.
Two DDI interfaces support DVI/HDMI/DisplayPort.
Ethernet
CEM312
- One 1000/100/10 Base-T provided by Intel®I210IT with integrated boot ROM.
CEM313
- One 1000/100/10 Base-T provided by Intel®I211AT with integrated boot ROM.
Audio
Intel®High Definition Audio interface.
eMMC
Support eMMC 5.0 onboard flash (Optional).

CEM312/313 COM ExpressTM Type 6 Compact Module
Introduction 3
Power Management
ACPI (Advanced Configuration and Power Interface).
Form Factor
Compact module 95mm x 95mm.
1.3 Utilities Supported
Chipset driver
Graphics driver
Ethernet utility and driver
Trusted execution engine
Sideband fabric device
USB 3.0 driver
Note
All specifications and images are subject to change without notice.

CEM312/313 COM ExpressTM Type 6 Compact Module
4 Introduction
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CEM312/313 COM ExpressTM Type 6 Compact Module
Module and Pin Assignments 5
Chapter 2
Module and Pin Assignments
2.1 Module Dimensions and Fixing Holes
Top View

CEM312/313 COM ExpressTM Type 6 Compact Module
6 Module and Pin Assignments
Bottom View

CEM312/313 COM ExpressTM Type 6 Compact Module
Module and Pin Assignments 7
2.2 Module Layout
Top View

CEM312/313 COM ExpressTM Type 6 Compact Module
8 Module and Pin Assignments
Bottom View

CEM312/313 COM ExpressTM Type 6 Compact Module
Module and Pin Assignments 9
2.3 Installing Thermal Solution
For thermal dissipation, a thermal solution enables the CEM312/313’s components to dissipate
heat efficiently. All heat generating components are thermally conducted to the heatsink in
order to avoid hot spots. Figure below illustrates how to install the thermal solution on
CEM312/313.
1. There is a protective plastic covering on the thermal pads. This must be removed before
the heatsink can be mounted.
2. Each heatsink is designed for a specific CEM module. The thermal pads on the heatsink
are designed to make contact with the necessary components on the CEM module.
When mounting the heatsink you must make sure that the thermal pads on the heatsink
make complete contact (no space between thermal pad and component) with the
corresponding components on the CEM module. This is especially critical for CEM
modules that have higher CPU speeds (for example 1.46GHz or more) to ensure that the
heatsink acts as a proper thermal interface for cooling solutions.
3. Before installing the heatsink to the CPU module, please apply thermal grease on the
CPU die. This CPU module has four assembly holes for installing heatsink plate. Use the
four screws to secure the heatsink plate to the CEM312/313. Be careful not to
over-tighten the screws.

CEM312/313 COM ExpressTM Type 6 Compact Module
10 Module and Pin Assignments
Note
When installing CEM312/313 on CEB94006 or CEB94011, please add stand-off and
secure with nut. Then, use the screws to secure heatsink plate to CEM312/313.

CEM312/313 COM ExpressTM Type 6 Compact Module
Module and Pin Assignments 11
2.4 Switch Settings
Properly configure switch settings on the CEM312/313 to meet your application purpose.
Below you can find a summary table of all switches and onboard default settings.
Note
Once the default switch setting needs to be changed, please do it under power-off
condition.
Switch
Description
Setting
SW1
Auto Power On
Default: Disable
SW1-1 OFF
Restore BIOS Optimal Defaults
Default: Normal Operation
SW1-2 OFF
2.4.1 Auto Power On and Restore BIOS Optimal Defaults (SW1)
If dip1 of SW1 (SW1-1) is set to ON position, the system will be automatically power on
without pressing soft power button. If this switch is set to OFF position, it is necessary to
manually press soft power button to power on the system.
The dip2 of SW1 (SW1-2) is for restoring BIOS default status. Flip SW1-2 to ON position
for a few seconds then flip it back to OFF position. Doing this procedure can restore
BIOS optimal defaults.
Function
Setting
Disable auto power on (Default)
SW1-1 OFF
Enable auto power on
SW1-1 ON
Normal operation (Default)
SW1-2 OFF
Restore BIOS optimal defaults
SW1-2 ON

CEM312/313 COM ExpressTM Type 6 Compact Module
12 Module and Pin Assignments
2.5 Connectors
Signals go to the other parts of the system through connectors. Loose or improper connection
might cause problems, please make sure all connectors are properly and firmly connected.
Here is a summary table which shows connectors on the hardware.
Connector
Description
SODIMM1
Channel 1 DDR3L SO-DIMM Socket
SODIMM2
Channel 0 DDR3L SO-DIMM Socket
SS1
COM ExpressTM Connector
SS2
COM ExpressTM Connector
Note
For single memory channel configuration, install memory module in channel 0
DDR3L SO-DIMM socket (SODIMM2).
For dual memory channel configuration, install memory modules of the same
size, chip width, density and rank in channel 0 (SODIMM2) and channel 1
(SODIMM1) DDR3L SO-DIMM sockets.
2.5.1 COM ExpressTM Connectors (SS1 and SS2)
The following table shows pin assignments of the 220-pin COM ExpressTM connectors.

CEM312/313 COM ExpressTM Type 6 Compact Module
Module and Pin Assignments 13
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
A1
GND (FIXED)
B1
GND (FIXED)
C1
GND (FIXED)
D1
GND (FIXED)
A2
GBE0_MDI3-
B2
GBE0_ACT#
C2
GND
D2
GND
A3
GBE0_MDI3+
B3
LPC_FRAME#
C3
USB_SSRX0-
D3
USB_SSTX0-
A4
GBE0_LINK100#
B4
LPC_AD0
C4
USB_SSRX0+
D4
USB_SSTX0+
A5
GBE0_LINK1000#
B5
LPC_AD1
C5
GND
D5
GND
A6
GBE0_MDI2-
B6
LPC_AD2
C6
USB_SSRX1-
D6
USB_SSTX1-
A7
GBE0_MDI2+
B7
LPC_AD3
C7
USB_SSRX1+
D7
USB_SSTX1+
A8
GBE0_LINK#
B8
N.C.
C8
GND
D8
GND
A9
GBE0_MDI1-
B9
N.C.
C9
USB_SSRX2-
D9
USB_SSTX2-
A10
GBE0_MDI1+
B10
LPC_CLK
C10
USB_SSRX2+
D10
USB_SSTX1+
A11
GND (FIXED)
B11
GND (FIXED)
C11
GND (FIXED)
D11
GND (FIXED)
A12
GBE0_MDI0-
B12
PWRBTN#
C12
USB_SSRX3-
D12
USB_SSTX3-
A13
GBE0_MDI0+
B13
SMB_CK
C13
USB_SSRX3+
D13
USB_SSTX3+
A14
GBE0_CTREF
B14
SMB_DAT
C14
GND
D14
GND
A15
SUS_S3#
B15
SMB_ALERT#
C15
N.C.
D15
DDI0_CTRLCLK_AUX+
A16
SATA0_TX+
B16
SATA1_TX+
C16
N.C.
D16
DDI0_CTRLDATA_AUX-
A17
SATA0_TX-
B17
SATA1_TX-
C17
N.C.
D17
N.C.
A18
SUS_S4#
B18
SUS_STAT#
C18
N.C.
D18
N.C.
A19
SATA0_RX+
B19
SATA1_RX+
C19
N.C.
D19
N.C.
A20
SATA0_RX-
B20
SATA1_RX-
C20
N.C.
D20
N.C.
A21
GND (FIXED)
B21
GND (FIXED)
C21
GND (FIXED)
D21
GND (FIXED)
A22
N.C.
B22
N.C.
C22
N.C.
D22
N.C.
A23
N.C.
B23
N.C.
C23
N.C.
D23
N.C.
A24
SUS_S5#
B24
PWR_OK
C24
DDI1_HPD
D24
N.C.
A25
N.C.
B25
N.C.
C25
N.C.
D25
N.C.
A26
N.C.
B26
N.C.
C26
N.C.
D26
DDI0_TX0_DP
A27
BATLOW#
B27
WDT
C27
N.C.
D27
DDI0_TX0_DN
A28
(S)ATA_ACT#
B28
N.C.
C28
N.C.
D28
N.C.
A29
AC/HDA_SYNC
B29
N.C.
C29
N.C.
D29
DDI0_TX1_DP
A30
AC/HDA_RST#
B30
AC/HDA_SDIN0
C30
N.C.
D30
DDI0_TX1_DN
A31
GND (FIXED)
B31
GND (FIXED)
C31
GND (FIXED)
D31
GND (FIXED)
A32
AC/HDA_BITCLK
B32
SPKR
C32
DDI1_CTRLCLK_AUXP
D32
DDI0_TX2_DP
A33
AC/HDA_SDOUT
B33
N.C.
C33
DDI1_CTRLDAT_AUXN
D33
DDI0_TX2_DN
A34
BIOS_DISABLE#
B34
N.C.
C34
N.C.
D34
DDI0_SEL
A35
N.C.
B35
THRM#
C35
N.C.
D35
N.C.
A36
USB6-
B36
USB7-
C36
N.C.
D36
DDI0_TX3_DP
A37
USB6+
B37
USB7+
C37
N.C.
D37
DDI0_TX3_DN
A38
USB_6_7_OC#
B38
USB_4_5_OC#
C38
N.C
D38
N.C.
A39
USB4-
B39
USB5-
C39
N.C
D39
DDI1_TX0_DP
A40
USB4+
B40
USB5+
C40
N.C
D40
DDI1_TX0_DN.
A41
GND (FIXED)
B41
GND (FIXED)
C41
GND (FIXED)
D41
GND (FIXED)
A42
USB2-
B42
USB3-
C42
N.C
D42
DDI1_TX1_DP
A43
USB2+
B43
USB3+
C43
N.C
D43
DDI1_TX1_DN
A44
USB_2_3_OC#
B44
USB_0_1_OC#
C44
N.C
D44
DDI1_HPD_CB
A45
USB0-
B45
USB1-
C45
N.C.
D45
N.C.
A46
USB0+
B46
USB1+
C46
N.C
D46
DDI1_TX2_DP
A47
VCC_RTC
B47
EXCD1_PERST#
C47
N.C
D47
DDI1_TX2_DN
A48
N.C.
B48
EXCD1_CPPE#
C48
N.C.
D48
N.C.
A49
N.C.
B49
SYS_RESET#
C49
N.C.
D49
DDI1_TX3_DP
A50
LPC_SERIRQ
B50
CB_RESET#
C50
N.C.
D50
DDI1_TX3_DN
A51
GND (FIXED)
B51
GND (FIXED)
C51
GND (FIXED)
D51
GND (FIXED)
A52
N.C.
B52
N.C.
C52
N.C.
D52
N.C.
A53
N.C.
B53
N.C.
C53
N.C.
D53
N.C.
A54
GPI0
B54
GPO1
C54
N.C.
D54
N.C.
A55
N.C.
B55
N.C.
C55
N.C.
D55
N.C.

CEM312/313 COM ExpressTM Type 6 Compact Module
14 Module and Pin Assignments
Pin
Signal
Pin
Signal
Pin
Signal
Pin
Signal
A56
N.C.
B56
N.C.
C56
N.C.
D56
N.C.
A57
GND
B57
GPO2
C57
N.C.
D57
TYPE2#
A58
PCIE_TX3+
B58
PCIE_RX3+
C58
N.C.
D58
N.C.
A59
PCIE_TX3-
B59
PCIE_RX3-
C59
N.C.
D59
N.C.
A60
GND (FIXED)
B60
GND (FIXED)
C60
GND (FIXED)
D60
GND (FIXED)
A61
PCIE_TX2+
B61
PCIE_RX2+
C61
N.C.
D61
N.C.
A62
PCIE_TX2-
B62
PCIE_RX2-
C62
N.C.
D62
N.C.
A63
GPI1
B63
GPO3
C63
N.C.
D63
N.C.
A64
PCIE_TX1+
B64
PCIE_RX1+
C64
N.C.
D64
N.C.
A65
PCIE_TX1-
B65
PCIE_RX1-
C65
N.C.
D65
N.C.
A66
GND
B66
WAKE0#
C66
N.C.
D66
N.C.
A67
GPI2
B67
WAKE1#
C67
N.C.
D67
GND
A68
PCIE_TX0+
B68
PCIE_RX0+
C68
N.C.
D68
N.C.
A69
PCIE_TX0-
B69
PCIE_RX0-
C69
N.C.
D69
N.C.
A70
GND(FIXED)
B70
GND(FIXED)
C70
GND(FIXED)
D70
GND(FIXED)
A71
LVDS_A0+
B71
LVDS_B0+
C71
N.C.
D71
N.C.
A72
LVDS_A0-
B72
LVDS_B0-
C72
N.C.
D72
N.C.
A73
LVDS_A1+
B73
LVDS_B1+
C73
GND
D73
GND
A74
LVDS_A1-
B74
LVDS_B1-
C74
N.C.
D74
N.C.
A75
LVDS_A2+
B75
LVDS_B2+
C75
N.C.
D75
N.C.
A76
LVDS_A2-
B76
LVDS_B2-
C76
GND
D76
GND
A77
LVDS_VDD_EN
B77
LVDS_B3+
C77
N.C.
D77
N.C.
A78
LVDS_A3+
B78
LVDS_B3-
C78
N.C.
D78
N.C.
A79
LVDS_A3-
B79
LVDS_BKLT_EN
C79
N.C.
D79
N.C.
A80
GND(FIXED)
B80
GND(FIXED)
C80
GND(FIXED)
D80
GND(FIXED)
A81
LVDS_A_CK+
B81
LVDS_B_CK+
C81
N.C.
D81
N.C.
A82
LVDS_A_CK-
B82
LVDS_B_CK-
C82
N.C.
D82
N.C.
A83
LVDS_I2C_CK
B83
LVDS_BKLT_CTRL
C83
N.C.
D83
N.C.
A84
LVDS_I2C_DAT
B84
VCC_5V_SBY
C84
GND
D84
GND
A85
GPI3
B85
VCC_5V_SBY
C85
N.C.
D85
N.C.
A86
N.C.
B86
VCC_5V_SBY
C86
N.C.
D86
N.C.
A87
N.C.
B87
VCC_5V_SBY
C87
GND
D87
GND
A88
PCIE0_CK_REF+
B88
BIOS_DIS1
C88
N.C.
D88
N.C.
A89
PCIE0_CK_REF-
B89
VGA_RED
C89
N.C.
D89
N.C.
A90
GND (FIXED)
B90
GND (FIXED)
C90
GND (FIXED)
D90
GND (FIXED)
A91
SPI_POWER
B91
VGA_GRN
C91
N.C.
D91
N.C.
A92
SPI_MISO
B92
VGA_BLU
C92
N.C.
D92
N.C.
A93
GPO0
B93
VGA_HSYNC
C93
GND
D93
GND
A94
SPI_CLK
B94
VGA_VSYNC
C94
N.C.
D94
N.C.
A95
SPI_MOSI
B95
VGA_I2C_CK
C95
N.C.
D95
N.C.
A96
TPM_PP
B96
VGA_I2C_DAT
C96
GND
D96
GND
A97
N.C.
B97
SPI_CS#
C97
N.C.
D97
N.C.
A98
SER0_TX
B98
N.C.
C98
N.C.
D98
N.C.
A99
SER0_RX
B99
N.C.
C99
N.C.
D99
N.C.
A100
GND (FIXED)
B100
GND (FIXED)
C100
GND (FIXED)
D100
GND (FIXED)
A101
SER1_TX
B101
FAN_PWMOUT
C101
N.C.
D101
N.C.
A102
SER1_RX
B102
FAN_TACHIN
C102
N.C.
D102
N.C.
A103
LID#
B103
SLEEP#
C103
GND
D103
GND
A104
VCC_12V
B104
VCC_12V
C104
VCC_12V
D104
VCC_12V
A105
VCC_12V
B105
VCC_12V
C105
VCC_12V
D105
VCC_12V
A106
VCC_12V
B106
VCC_12V
C106
VCC_12V
D106
VCC_12V
A107
VCC_12V
B107
VCC_12V
C107
VCC_12V
D107
VCC_12V
A108
VCC_12V
B108
VCC_12V
C108
VCC_12V
D108
VCC_12V
A109
VCC_12V
B109
VCC_12V
C109
VCC_12V
D109
VCC_12V
A110
GND (FIXED)
B110
GND (FIXED)
C110
GND (FIXED)
D110
GND (FIXED)