Blue Technix CM-BF537E Instructions for use

Hardware User Manual
CM-BF537E V3.x

CM‐BF537E‐HardwareUserManual 1
Contact
Bluetechnix Mechatronische Systeme GmbH
Waidhausenstr. 3/19
A-1140 Vienna
AUSTRIA/EUROPE
http://www.bluetechnix.com
Document No.: 100-1221-3.0
Document Revision 3
Date: 2010-02-02

CM‐BF537E‐HardwareUserManual 2
Table of Contents
1 Introduction ..................................................................................................................................................................................7
1.1 Overview...............................................................................................................................................................................7
1.2 Key Features ........................................................................................................................................................................8
1.3 Target Applications...........................................................................................................................................................8
2 Specification..................................................................................................................................................................................9
2.1 Functional Specification..................................................................................................................................................9
2.2 Boot Mode............................................................................................................................................................................9
2.3 Memory MAP.................................................................................................................................................................... 10
2.4 Electrical Specification .................................................................................................................................................. 10
2.4.1 Supply Voltage ....................................................................................................................................................... 10
2.4.2 Supply Voltage Ripple ......................................................................................................................................... 10
2.4.3 Input Clock Frequency......................................................................................................................................... 10
2.4.4 Real Time Clock Crystal........................................................................................................................................ 10
2.4.5 Supply Current ....................................................................................................................................................... 10
2.5 Environmental Specification....................................................................................................................................... 10
2.5.1 Temperature ........................................................................................................................................................... 10
2.5.2 Humidity................................................................................................................................................................... 10
3 CM-BF537E (Connector Version)......................................................................................................................................... 11
3.1 Mechanical Outline ........................................................................................................................................................ 11
3.2 Footprint - Connector Version.................................................................................................................................... 11
3.3 Mount Options................................................................................................................................................................. 13
3.4 Schematic Symbol (Signals of X1 and X2) .............................................................................................................. 14
4 Connectors Pin Assignment ................................................................................................................................................. 15
4.1 Connector X1 – (1-60).................................................................................................................................................... 15
4.2 Connector X2 – (61-120)............................................................................................................................................... 17
4.3 Pin out Description......................................................................................................................................................... 18
4.4 Reset circuit....................................................................................................................................................................... 19
4.5 RJ45 schematic ................................................................................................................................................................ 19
5 Test Points.......................................................................................................................... Error! Bookmark not defined.
5.1 Footprint – Test Points......................................................................................... Error! Bookmark not defined.
6 Software Support ..................................................................................................................................................................... 20
6.1 BLACKSheep ..................................................................................................................................................................... 20
6.2 uClinux................................................................................................................................................................................ 20
7 Application Examples ............................................................................................................................................................. 21
7.1 Sample Schematic .......................................................................................................................................................... 21

CM‐BF537E‐HardwareUserManual 3
7.2 Stand-alone Ethernet based MPEG Webcam ........................................................................................................ 22
7.3 Design Services................................................................................................................................................................ 23
8 Anomalies ................................................................................................................................................................................... 24
9 Production Report.................................................................................................................................................................... 25
9.1 CM-BF537E (100-1221).................................................................................................................................................. 25
9.2 CM-BF537E-I (100-1229) ............................................................................................................................................... 25
10 Product Changes ................................................................................................................................................................. 26
11 Document Revision History.............................................................................................................................................. 27
A List of Figures and Tables ...................................................................................................................................................... 27

CM‐BF537E‐HardwareUserManual
4
Edition 2008-09
© Bluetechnix Mechatronische Systeme GmbH 2008
All Rights Reserved.
The information herein is given to describe certain components and shall not be considered as a guarantee
of characteristics.
Terms of delivery and rights of technical change reserved.
We hereby disclaim any warranties, including but not limited to warranties of non-infringement, regarding
circuits, descriptions and charts stated herein.
Bluetechnix makes and you receive no warranties or conditions, express, implied, statutory or in any
communication with you. Bluetechnix specifically disclaims any implied warranty of merchantability or
fitness for a particular purpose.
Bluetechnix takes no liability for any damages and errors causing of the usage of this board. The user of this
board is responsible by himself for the functionality of his application. He is allowed to use the board only if
he has the qualification. More information is found in the General Terms and Conditions (AGB).
Information
For further information on technology, delivery terms and conditions and prices please contact Bluetechnix
(http://www.bluetechnix.com).
Warning
Due to technical requirements components may contain dangerous substances.
The Core Modules and development systems
contain ESD (electrostatic discharge) sensitive
devices. Electro-static charges readily
accumulate on the human body and
equipment and can discharge without
detection. Permanent damage may occur on
devices subjected to high-energy discharges.
Proper ESD precautions are recommended to
avoid performance degradation or loss of
functionality. Unused Core Modules and
Development Boards should be stored in the
protective shipping

CM‐BF537E‐HardwareUserManual 5
BLACKFIN Products
Core Modules:
CM-BF533: Blackfin Processor Module powered by Analog Devices' single core ADSP-BF533
processor; up to 600MHz, 32MB SDRAM, 2MB flash, 2x60 pin expansion
connectors and a size of 36.5x31.5mm.
CM-BF537E: Blackfin Processor Module powered by Analog Devices' single core ADSP-BF537
processor; up to 600MHz, 32MB SDRAM, 4MB flash, integrated TP10/100 Ethernet
physical transceiver, 2x60 pin expansion connectors and a size of 36.5x31.5mm.
CM-BF537U: Blackfin Processor Module powered by Analog Devices' single core ADSP-BF537
processor; up to 600MHz, 32MB SDRAM, 4MB flash, integrated USB 2.0 Device,
2x60 pin expansion connectors and a size of 36.5x31.5mm.
TCM-BF537: Blackfin Processor Module powered by Analog Devices' single core ADSP-BF537
processor; up to 500MHz, 32MB SDRAM, 8MB flash, a size of 28x28mm, 2x60 pin
expansion connectors, Ball Grid Array or Border Pads for reflow soldering,
industrial temperature range -40°C to +85°C.
CM-BF561: Blackfin Processor Module powered by Analog Devices' dual core ADSP-BF561
processor; up to 2x 600MHz, 64MB SDRAM, 8MB flash, 2x60 pin expansion
connectors and a size of 36.5x31.5mm.
CM-BF527: The new Blackfin Processor Module is powered by Analog Devices' single core
ADSP-BF527 processor; key features are USB OTG 2.0 and Ethernet. The 2x60 pin
expansion connectors are backwards compatible with other Core Modules.
CM-BF548: The new Blackfin Processor Module is powered by Analog Devices' single core
ADSP-BF548 processor; key features are 64MB DDR SD-RAM 2x100 pin expansion
connectors.
TCM-BF518: The new Core Module CM-BF518 is powered by Analog Devices' single core
ADSP-BF518 processor; up to 400MHz, 32MB SDRAM, up to 8MB flash. The 2x60
pin expansion connectors are backwards compatible with other Core Modules.
Development Boards:
EVAL-BF5xx: Low cost Blackfin processor Evaluation Board with one socket for any
Bluetechnix Blackfin Core Module. Additional interfaces are available, e.g. an SD-
Card.
DEV-BF5xxDA-Lite: Get ready to program and debug Bluetechnix Core Modules with this tiny
development platform including an USB-Based Debug Agent. The DEV-BF5xxDA-
Lite is a low cost starter development system including a VDSP++ Evaluation
Software License.
DEV-BF548-Lite: Low-cost development board with one socket for Bluetechnix CM-BF548 Core
Module. Additional interfaces are available, e.g. an SD-Card, USB and Ethernet.
DEV-BF548DA-Lite: Get ready to program and debug Bluetechnix CM-BF548 Core Module with this
tiny development platform including an USB-Based Debug Agent. The DEV-

CM‐BF537E‐HardwareUserManual 6
BF548DA-Lite is a low-cost starter development system including a VDSP++
Evaluation Software License.
EXT-Boards: The following Extender Boards are available: EXT-BF5xx-AUDIO, EXT-BF5xx-
VIDEO, EXT-BF5xx-CAM, EXT-BF5xx-EXP-TR, EXT-BF5xx-USB-ETH2, EXT-BF5xx-
AD/DA, EXT-BF548-EXP and EXT-BF518-ETH. Furthermore, we offer the
development of customized extender boards for our customers.
Software Support:
BLACKSheep: The BLACKSheep VDK is a multithreaded framework for the Blackfin processor
family from Analog Devices that includes driver support for a variety of hardware
extensions. It is based on the real-time VDK kernel included within the VDSP++
development environment.
LabVIEW: LabVIEW embedded support for Bluetechnix Core Modules is done by Schmid-
Engineering AG: http://www.schmid-engineering.ch
uClinux: All the Core Modules are fully supported by uClinux. The required boot loader
and uClinux can be downloaded from: http://blackfin.uClinux.org.
Upcoming Products and Software Releases:
Keep up-to-date with all the changes to the Bluetechnix product line and software updates at:
http://www.bluetechnix.com .
Software Support:
BLACKSheep: The BLACKSheep VDK is a multithreaded framework for the Blackfin processor
family from Analog Devices that includes driver support for a variety of hardware
extensions. It is based on the real-time VDK kernel included within the VDSP++
development environment.
LabVIEW: LabVIEW embedded support for Bluetechnix Core Modules is done by Schmid-
Engineering AG: http://www.schmid-engineering.ch
uClinux: All the Core Modules are fully supported by uClinux. The required boot loader
and uClinux can be downloaded from: http://blackfin.uClinux.org.
Upcoming Products and Software Releases:
Keep up-to-date with all the changes to the Bluetechnix product line and software updates at:
http://www.bluetechnix.com
BLACKFIN Design Service
Based on more than five years of experience with Blackfin, Bluetechnix offers development assistance as well
as custom design services and software development.

CM‐BF537E‐HardwareUserManual 7
1Introduction
The CM-BF537E is a tiny, high performance and low power DSP/RISC Core Module incorporating Analog
Devices Blackfin family of processors. The special feature of this module is the on-board 10/100Mbit Ethernet
interface which includes the physical transceiver chip. The module allows easy integration into high
demanding very space and power limited applications.
1.1 Overview
The Core Module CM-BF537E consists of the following components:
Figure 1-1: Main components of the CM-BF537E Core Module
Analog Devices Blackfin Processor BF537
oSupported Chips :
ADSP-BF537SBBCZ-5A (-40°-85°C) Option upon request
ADSP-BF537SKBCZ-6A (0°-70°C) Standard Mount
32 MB SDRAM
oSDRAM Clock up to 133MHz
oMT48LC16M16A2BG-7 (16Mx16, 256Mbit at 3.3 V)
4 MB of Addressable Flash
oPF48F2000P0ZBQ0 (4Mx16 32Mbit at 3.3 V; default only 4 MByte addressable)
oAdditional flash memory can be connected through the expansion board as parallel flash
using asynchronous chip select lines or as an SPI flash.
Low Voltage Reset Circuit
oResets module if power supply goes below 2.93 V for at least 140 ms
Dynamic Core Voltage Control
oCore voltage is adjustable by setting software registers on the Blackfin processor
oCore voltage range: 0.8 – 1.32V
32MByte
SDRAM
60Pin Expansion Connector A
up to 8 Byte
Flash
BF537
up to
600 MHz
Dynamic
Core Voltage
Control
60Pin Expansion Connector B
Low Voltage
Reset
Ethernet
Physical

CM‐BF537E‐HardwareUserManual 8
Expansion Connector A
oData Bus
oAddress Bus
oControl Signals
oPower Supply
oEthernet Pins
Expansion Connector B
oSPORT0
oJTAG
oUART0/UART1
oCAN
oTWI (I2C compatible)
oSPI
oPPI (Parallel Port Interface)
oGPIO’s
1.2 Key Features
The CM-BF537E is very compact and measures only 36.5x31.5mm
Allows quick prototyping of product that comes very close to the final design
Reduces development costs, faster time to market
Very cost effective for small and medium volumes
1.3 Target Applications
Generic high performance signal processor module
Internet Connected Embedded System
High performance web camera
Robotics: Tiny processor module for mobile robots

CM‐BF537E‐HardwareUserManual 9
2Specification
2.1 Functional Specification
Figure 2-1: Detailed Block Diagram
Figure 2-1 shows a detailed block diagram of the CM-BF537E module. Other than the SDRAM control pins the
CM-BF537E has all other pins of the Blackfin processor on its two main 60 pin connectors.
A special feature of the CM-BF537E Core Module is the on-board physical Ethernet transceiver from Micrel
(KSZ8041BL).
Dynamic voltage control allows reducing power consumption to a minimum adjusting the core voltage and
the clock frequency dynamically in accordance to the required processing power. A low voltage reset circuit
guarantees a power on reset and resets the system when the input voltage drops below 2.93V.
2.2 Boot Mode
By default the boot mode = 000 (BMODE2 = low, BMODE1 = low, BMODE0 = low). All BMODE pins have
internal pull down resistors.
Connect BMODE0 to Vcc and leave BMODE1, BMODE2 pins open for boot mode 001 equals to 8 or 16 bit
PROM/FLASH boot mode, this is the default boot mode of the Blacksheep software. See Blackfin Datasheets
or Eval/DevBoard manuals for more details.
32 MByte
SDRam 4 MByte
Flash
BF537
up to
600MHz
Dynamic
Core Voltage
Control
Low Voltage
Reset
20 Bit Address Bus
16 Bit Data Bus
Ethernet
Physical
Clock
Mem. Control, Boot Mode, JTAG, Ethernet
Data & Address Bus
Clock-out PPI, SPORT0, UART1, UART2, SPI, TWI, CAN, GPIO
3V3 Power , Reset

CM‐BF537E‐HardwareUserManual 10
2.3 Memory MAP
MemoryTypeStartAddressEndAddress Size Comment
FLASHBank0
(PF4Flaglow)
0x200000000x201FFFFF 2MB 4MBMicronFlash,
PF48F2000P0ZBQ0
FLASHBank1
(PF4Flaghigh)
0x200000000x201FFFFF 2MB
SD‐RAM0x000000000x01FFFFFF 32MB 16BitBus,Micron
MT48LC16M16A2FG
Table 2-1: Memory Map
The maximum amount of memory addressable by a single asynchronous memory bank, of the Blackfin
processor is 2MB. In order to be able to use more than 2MB on a single bank, 2 GPIOs are used to select which
2MB section of flash is visible in the memory window of the Blackfin processor. This frees up the remaining
banks for the user.
2.4 Electrical Specification
2.4.1 Supply Voltage
3.3V DC +/-10%
2.4.2 Supply Voltage Ripple
100mV peak to peak 0-20 MHz
2.4.3 Input Clock Frequency
25 MHz
The Blackfin Processor Input Clock frequency is 25MHz, this frequency is derived from the on-board
crystal/oscillator and drives the Blackfin Processors’s Clock generator. This frequency is also provided on
the connector as pin 78 (CLK_out).
2.4.4 Real Time Clock Crystal
32.768kHz
2.4.5 Supply Current
Maximum current: 350mA @ 3.3V
Typical operating conditions:
oProcessor running at 600MHz, Core Voltage 1.2V, SDRAM 20% bandwidth utilization at
130MHz; Ethernet idle: 200mA @ 3.3V
oProcessor running at 300MHz, Core Voltage 0.8V SDRAM 20% bandwidth utilization at
130MHz; Ethernet idle: 140mA @ 3.3V
oProcessor running at 600MHz, Core Voltage 1.2V, SDRAM 20% bandwidth utilization at
130MHz, Ethernet TX/RX active: 250mA
2.5 Environmental Specification
2.5.1 Temperature
Operating at full 600MHz: 0 to + 70° C
2.5.2 Humidity
Operating: 10% to 90% (non condensing)

CM‐BF537E‐HardwareUserManual 11
3CM-BF537E (Connector Version)
3.1 Mechanical Outline
TOP VIEW
All dimensions are given in millimeters!
Figure 3-1: Mechanical outline and Bottom Connectors (Top View)
The mechanical outline represents a top view of the connectors placed at the bottom of the core board.
The module is shipped with two 60pin connectors.
Figure 3-2: Side view with Connector mounted
The total minimum mounting height including receptacle at the motherboard is 6.1mm.
3.2 Footprint
If the connector version (2x Hirose 0.6mm pitch) is used, the footprint for the baseboard may look as shown
in Figure 3-3.

CM‐BF537E‐HardwareUserManual 12
For the baseboard the following connectors have to be used:
PartBaseboardManufacturerManufacturerPartNo.
X1,X2HiroseFX8‐60S‐SV
Table 3-1: Baseboard connector types
The Connectors on the CM-BF537E are of the following type:
PartManufacturerManufacturerPartNo.
X1,X2Hirose3mmheightFX8‐60P‐SV
Table 3-2: Module connector types
Figure 3-3: Recommended footprint for the Core Module (top view)
Hole1
Hole2
Hole1
Hole2
h2
h1

CM‐BF537E‐HardwareUserManual 13
3.3 Mount Options
The mount options of the Core Module are shown in Figure 3-4.
MO1
MO2
MO3
R16
R15 R19
R18
Figure 3-4: Core Module (component side)
MountOptionFlashComment
MO12MBPF4availableonpin7onconnectorX1
MO24MBdefault
MO38MB PF5notavailableonconnectorX1
Table 3-3 Mount Options

CM‐BF537E‐HardwareUserManual 14
3.4 Schematic Symbol (Signals of X1 and X2)
RSCLK0 / TACLK2
1
DR0PRI / TACLK4
2
TSCLK0 / TACLK1
3
DT0PRI / SPI_CS2
4
Vin 3V3
9
Vin 3V3
10
PG0 / PPI1D0
11
PG2 / PPI1D2
12
PG4 / PPI1D4
13
PG6 / PPI1D6
14
PG8 / PPI1D8 / DR1SEC
15
PG10 / PPI1D10 / RSCLK1
16
PG12 / PPI1D12 / DR1PRI
17
PG14 / PPI1D14 / TFS1
18
PPI1Sy3 / PF7 / TMR2
19
PPI1Sy1 / PF9 / TMR0
20
PPI1Sy1 / PF9 / TMR0
21
PF3 / Rx1 / TMR6 / TACI6
22
PF1 / DMAR1 / TACI1 / Rx0
23
PF11 / MOSI
24
PF13 / SCK
25
Bmode0
26
GND
27
TCK
28
TDI
29
TRST
30
EMU
31
TMS
32
TDO
33
Bmode2
34
nc
35
Bmode1
36
PF12 / MISO
37
PF0 / DMAR0 / Tx0
38
PF14 / SPI_SS
39
PF2 / Tx1 / TMR7
40
PPI1Clk/PF15/TMRCLK
41
PPI1Sy2 / PF8 / TMR1
42
PG15 / PPI1D15 / DT1PRI
43
PG13 / PPI1D13 / TSCLK1
44
PG11 / PPI1D11 / RFS1
45
PG9 / PPI1D9 / DT1SEC
46
PG7 / PPI1D7
47
PG5 / PPI1D5
48
PG3 / PPI1D3
49
PG1 / PPI1D1
50
GND
51
GND
52
DT0SEC/ SPI_CS7 / CAN_Tx
57
TFS0 / SPI_CS3
58
DR0SEC / TACI0 / CAN_Rx
59
RFS0 / TACLK3
60 A1 61
A3 62
A5 63
A7 64
A9 65
A11 66
A13 67
A15 68
A17 69
A19 70
GND 79
AMS3 80
AWE 81
NMI 82
D0 83
D2 84
D4 85
D6 86
D8 87
D10 88
D12 89
D14 90
D15 91
D13 92
D11 93
D9 94
D7 95
D5 96
D3 97
D1 98
RESET 99
AOE 100
ARE 101
AMS2 102
A18 112
A16 113
A14 114
A12 115
A10 116
A8 117
A6 118
A4 119
A2 120
CM-BF537E
CLK_out
5
SDA
6
PF4 / TMR5 / SPI_CS6 (or OPEN)
7
PF5 / TMR4/SPI_CS5
8PF6 / TMR3/SPI_CS4
54
PF10 / SPI_CS1
55
SCL
56
CLK_out 78
ABE1 71
ABE0 111
BGH 104
BG 77
BR 105
ARDY 76
VDD-RTC 103
VA25 106
TX- 107
TX+ 108
LED_FD 109
LED_SPEED 110
LED_ACT 72
GND 73
RX+ 74
RX- 75
PF5 / TMR4/SPI_CS5
53
U?
Figure 3-5: Schematic Symbol of Module
Note: For compatibility, 3 pins appear twice at the connector: CLK_out, PF5 and PPISy1

CM‐BF537E‐HardwareUserManual 15
4Connectors Pin Assignment
4.1 Connector X1 – (1-60)
PinNo. SignalIO Type
1RSCLK0/TACLK2 I/O
2DR0PRI/TACLK4I
3TSCLK0/TACLK1I/O
4DT0PRI/SSEL2O
5CLK_outO
6SDAI/O
7PF4/TMR5/SSEL6:MO1*
nc:MO2,MO3*
I/O
8PF5/TMR4/SSEL5:MO1,MO2*
nc:MO3*
I/O
9Vin3V3PWR
10Vin3V3PWR
11PG0/PPI1D0I/O
12PG2/PPI1D2I/O
13PG4/PPI1D4I/O
14PG6/PPI1D6I/O
15PG8/PPI1D8/DR1SECI/O
16PG10/PPI1D10/RSCLK1I/O
17PG12/PPI1D12/DR1PRII/O
18PG14/PPI1D14/TFS1I/O
19PPI1SY3/PF7/TMR2I/O
20PPI1SY1/PF9/TMR0I/O
21PPI1SY1/PF9/TMR0I/O
22PF3/Rx1/TMR6/TACI6I/O
23PF1/DMAR1/TACI1/Rx0I/O
24PF11/MOSII/O
25PF13/SCKI/O
26BMODE0I‐10kpulldown
27GNDPWR
28TCKI‐10kpullup
29TDII‐10kpullup
30TRST¯¯¯¯I‐4k7pulldown
31EMU¯¯¯ O
32TMSI‐10kpullup
33TDOO
34BMODE2I‐10kpulldown
35N.C.‐
36BMODE1I‐10kpulldown
37PF12/MISOI/O
38PF0/DMAR0/Tx0I/O
39PF14/SPI_SSI/O
40PF2/Tx1/TMR7I/O

CM‐BF537E‐HardwareUserManual 16
41PPI1Clk/PF15/TMRCLKI/O
42PPI1Sy2/PF8/TMR1I/O
43PG15/PPI1D15/DT1PRII/O
44PG13/PPI1D13/TSCLK1I/O
45PG11/PPI1D11/RFS1I/O
46PG9/PPI1D9/DT1SECI/O
47PG7/PPI1D7I/O
48PG5/PPI1D5I/O
49PG3/PPI1D3I/O
50PG1/PPI1D1I/O
51GNDPWR
52GNDPWR
53PF5/TMR4/SSEL5I/O
54PF6/TMR3/SSEL4I/O
55PF10/SSEL1I/O
56SCLI/O
57DT0SEC/SSEL7/CANTxO
58TFS0/SSEL3I/O
59DR0SEC/TACI0/ I
60RFS0/TACLK3I/O
Table 4-1: Connector X1 pin assignment
* For mount option details see chapter 3.3.
Note 1: Pin 8 and 53 as well as pin 20 and 21 are identical.
Note 2: Please mind the mounted pull up and pull down resistors on the Core Module. See the third column
of Table 4-1.

CM‐BF537E‐HardwareUserManual 17
4.2 Connector X2 – (61-120)
PinNo.SignalIOType
61A1O
62A3O
63A5O
64A7O
65A9O
66A11O
67A13O
68A15O
69A17O
70A19O
71ABE1¯¯¯¯/SDQM0 O
72LED_ACTO
73GND ‐
74RX+I‐49R9pullupto2V5
75RX‐ I‐49R9pullupto2V5
76ADRYI‐ 10kpullup
77BG¯¯O
78CLK_outO
79GNDPWR
80AMS3¯¯¯¯ O
81AWE¯¯¯ O
82NMI
ത
ത
ത
ത
ത
I‐ 10kpullup
83D0I/O
84D2I/O
85D4I/O
86D6I/O
87D8I/O
88D10I/O
89D12I/O
90D14I/O
91D15I/O
92D13I/O
93D11I/O
94D9I/O
95D7I/O
96D5I/O
97D3I/O
98D1I/O
99RESET¯¯¯¯¯I – seechapter4.4
100AOE¯¯¯O
101ARE¯¯¯O
102AMS2¯¯¯¯ O
103VDD‐RTCPWR
104BGH¯¯¯O
105BR¯¯I‐10kpullup

CM‐BF537E‐HardwareUserManual 18
106VA25/VA33PWR
107TX‐ O‐49R9pullupto2V5
108TX+ O‐49R9pullupto2V5
109LED_FDO
110LED_SPEEDO
111ABE0¯¯¯¯/SDQM0 O
112A18O
113A16O
114A14O
115A12O
116A10O
117A8O
118A6O
119A4O
120A2O
Table 4-2: Connector X2 pin assignment
Note: Please mind the mounted pull up and pull down resistors on the Core Module. See the third column of
Table 4-2.
4.3 Pin out Description
All pin names except those in Table 4-3 of the connectors are processor pins and correspond closely to the
names found in the Blackfin BF537 datasheet from Analog Devices.
PINNr.NameIOTypeDescription
5,78CLK_outO25MHzbufferedclockoutput
9,10Vin3.3VPWR 3V3+‐10%500mApeakforsupply
35nc ‐ Notconnected
72LED_AC
T
OIndicatesEthernetactivity
73GNDPWR AGND(useasGNDforEthernet
74RX+IEthernetreceive+
75RX‐ IEthernetreceive‐
106VA25PWR Ethernettransformervoltagereference
107TX‐ OEthernettransmit‐
108TX+OEthernettransmit+
109LED_FDOFullduplexLED,High=Fullduplexactive,
110LED_SPEEDO10Mbps=Low,100Mbps=High
Table 4-3: Pin description of all non Processor Pins on the CM-BF537E

CM‐BF537E‐HardwareUserManual 19
4.4 Reset circuit
The reset of the flash and the processor are connected to a power monitoring IC. The output can be used as
power on reset for external devices, see Figure 4-1.
Figure 4-1: Schematic of reset circuit on the Core Module
4.5 RJ45 schematic
Figure 4-2: Schematic for RJ45 Connection
DesignatorValueType Description Quantity
X1RJLBC‐060TC1 RJ45withtransformer 1:11
C110uF Capacitor 1
R8,R9220R Resistor 2
V1,V2USBLC6‐2P6 TSV‐Diode 2
Table 4-4: Parts List RJ45
3.3V
RESET
470R
R12
GND
1
VDD
3
RESET 2
TCM809SENB713
U5
RESET of ADSP-BF5xx
GND
99
RESET of Flash
CoreModule
Exte rnal
LED_SPEED
LED_ACT
Rx+
Rx‐
Tx‐
Tx+
49R9
R2
49R9
R3
49R9
R7 49R9
R6
xRx+
xRx‐
xTx‐
xTx+
220R
R8
220R
R9
3V3
GND
GND
GND
3V3
3
Td-
2
Rd-
8
Td+
1
14 13
Rd+
7
9
11
10
12
RJ451:1LED
X1
1
3
25
4
6
D‐TVS‐USB2.0
V1
1
3
2 5
4
6
D‐TVS‐USB2.0
V2
GND
GND2.5V_VA
2.5V_VA
GND
10u
C1
0R
R1
CoreModule External
RJLBC-060TC1
Taimag
75
76
107
108
110
72
REXT 10
GND1
VddIO
17 GND0
LED1/SPEED 31
VddPLL
2
LED0/WAYEN 30
XO 8
REFCLK / XI 9
RESET 32
MDIO
11 MDC
12
RxD3/PHYAD0
13
RxD2/PHYAD1
14
RxD1/PHYAD2
15
RxD0/DUPLEX
16
Rx_DV/CRSDV/CONFIG2
18
Rx_CLK
19
Rx_ER/ISO
20
Tx_CLK
22 Tx_EN
23 TxD0
24 TxD1
25 TxD2
26 TxD3
27
INT_P 21
COL/CONFIG0
28 CRS/CONFIG1
29
Tx- 6
Tx+ 7
Rx- 4
Rx+ 5
VddA
3
KSZ8041NL
U?
3.3V_A_PHY
3.3V_A_PHY
3.3V_A_PHY
3.3V_A_PHY
106
Table of contents
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