Congatec COM Express conga-TC370 User manual

Copyright © 2019 congatec AG TCWLm12 1/74
COM Express™ conga-TC370
8th Generation Intel®Core™ i7, i5, i3 and Celeron® Single Chip Ultra Low TDP Processors
User’s Guide
Revision 1.2

Copyright © 2019 congatec AG TCWLm12 2/74
Revision History
Revision Date (yyyy-mm-dd) Author Changes
0.1 2019-05-24 AEM •Preliminary release
1.0 2019-10-29 AEM •Deleted Pentium Gold 5405UE variant (PN: 048803) from section 1.2 “Options Information” and from the whole document
•Added section 4.3.2.1 “Heatspreader Thermal Imagery”
•Updated table 6 “Power Consumption Values”
•Updated section 11.4 “Supported Flash Devices”
•Added note about the minimum pulse width required for proper button detection in table 31 “Power and System
Management Signal Descriptions”
•Official release
1.1 2020-04-24 AEM •Updated table 7 “CMOS Battery Power Consumption”
•Changed HDMI resolution from 30 Hz to 24 Hz; corrected display options in table 9 “Display Combinations and Resolution”.
Corrected also HDMI resolution in section 6.1.3.1 “HDMI” and DP resolution in section 6.1.3.3 “DisplayPort (DP)”
•Updated section 7.1 “eMMC 5.1”
•Added information about congatec Menu Layout File (MLF) to section 11 “BIOS Setup Description”
•Deleted section 12 “Industrial Specifications”
1.2 2020-12-08 AEM •Updated section 7.6 “Security Features”
•Removed superscript indication of SPI_MISO as bootstrap signal
•Corrected the eDP_HPD pull-down resistor error in table 19 “Embedded DisplayPort Signal Descriptions”

Copyright © 2019 congatec AG TCWLm12 3/74
Preface
This user’s guide provides information about the components, features, connectors and system resources available on the conga-TC370. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™Design Guide
COM Express™Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.

Copyright © 2019 congatec AG TCWLm12 4/74
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec AG Limited Warranty.
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2019, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.

Copyright © 2019 congatec AG TCWLm12 5/74
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.

Copyright © 2019 congatec AG TCWLm12 6/74
Certification
congatec AG is certified to DIN EN ISO 9001 standard.
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities
and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical
support department by email at [email protected]
Terminology
Term Description
DDI Digital Display Interface
eDP Embedded DisplayPort
GB Gigabyte
GHz Gigahertz
HDA High Definition Audio
kB Kilobyte
kHz Kilohertz
Mb Megabit
MB Megabyte
MHz Megahertz
N.C Not connected
N.A Not available
PCH Platform Controller Hub
PCIe PCI Express
PEG PCI Express Graphics
SATA Serial ATA
TBD To be determined
TDP Thermal Design Power
TPM Trusted Platform Module
C
E
R
T
I
F
I
C
A
T
I
O
N
I
S
O
9
0
0
1
TM

Copyright © 2019 congatec AG TCWLm12 7/74
Contents
1 Introduction ............................................................................. 10
1.1 COM Express™ Concept......................................................... 10
1.2 Options Information................................................................. 11
2 Specifications........................................................................... 12
2.1 Feature List .............................................................................. 12
2.2 Supported Operating Systems ................................................ 13
2.3 Mechanical Dimensions ........................................................... 14
2.4 Supply Voltage Standard Power .............................................. 14
2.4.1 Electrical Characteristics .......................................................... 15
2.4.2 Rise Time ................................................................................. 15
2.5 Power Consumption ................................................................ 15
2.6 Supply Voltage Battery Power ................................................. 17
2.7 Environmental Specifications................................................... 17
3 Block Diagram.......................................................................... 18
4 Cooling Solutions..................................................................... 19
4.1 CSA Dimensions ...................................................................... 20
4.2 CSP Dimensions....................................................................... 21
4.3 HSP Dimensions....................................................................... 22
4.3.2.1 Heatspreader Thermal Imagery ............................................... 23
5 Onboard Temperature Sensors................................................ 24
5.1 Top-Side Sensors ..................................................................... 24
5.2 Bottom-Side Sensors: .............................................................. 25
6 Connector Rows....................................................................... 26
6.1 Primary and Secondary Connector Rows................................. 26
6.1.1 PCI Express™........................................................................... 26
6.1.2 PCI Express Graphics (PEG) ..................................................... 26
6.1.3 Digital Display Interface........................................................... 27
6.1.3.1 HDMI........................................................................................ 28
6.1.3.2 DVI ........................................................................................... 28
6.1.3.3 DisplayPort (DP) ....................................................................... 28
6.1.4 LVDS/eDP................................................................................. 29
6.1.5 VGA.......................................................................................... 29
6.1.6 SATA ........................................................................................ 30
6.1.7 USB .......................................................................................... 30
6.1.8 Gigabit Ethernet ..................................................................... 31
6.1.9 High Definition Audio (HDA) Interface .................................... 31
6.1.10 LPC Bus.................................................................................... 31
6.1.11 I²C Bus ..................................................................................... 31
6.1.12 General Purpose Serial Interface ............................................. 31
6.1.13 GPIOs....................................................................................... 32
6.1.14 Power Control .......................................................................... 32
6.1.15 Power Management................................................................. 35
7 Additional Features.................................................................. 36
7.1 eMMC 5.1 ................................................................................ 36
7.2 congatec Board Controller (cBC) ............................................. 36
7.2.1 Board Information.................................................................... 36
7.2.2 General Purpose Input/Output................................................ 36
7.2.3 Watchdog ................................................................................ 37
7.2.4 I2C Bus...................................................................................... 37
7.2.5 Power Loss Control.................................................................. 37
7.2.6 Fan Control .............................................................................. 37
7.2.7 Enhanced Soft-Off State .......................................................... 37
7.3 OEM BIOS Customization........................................................ 38
7.3.1 OEM Default Settings .............................................................. 38
7.3.2 OEM Boot Logo....................................................................... 38
7.3.3 OEM POST Logo ..................................................................... 38
7.3.4 OEM BIOS Code/Data............................................................. 39
7.3.5 OEM DXE Driver...................................................................... 39
7.4 congatec Battery Management Interface ................................ 39
7.5 API Support (CGOS) ................................................................ 40
7.6 Security Features...................................................................... 40
7.7 Suspend to Ram....................................................................... 40

Copyright © 2019 congatec AG TCWLm12 8/74
8 conga Tech Notes .................................................................... 41
8.1 Adaptive Thermal Monitor and Catastrophic Thermal Protection
41
8.2 Processor Performance Control ............................................... 42
8.2.1 Intel®SpeedStep®Technology (EIST) ...................................... 42
8.2.2 Intel®Turbo Boost Technology ................................................ 42
8.3 Intel®Virtualization Technology ............................................... 43
8.4 Thermal Management ............................................................. 43
8.5 ACPI Suspend Modes and Resume Events.............................. 44
9 Signal Descriptions and Pinout Tables..................................... 45
9.1 Connector Signal Descriptions ................................................ 46
9.2 Bootstrap Signals..................................................................... 69
10 System Resources .................................................................... 70
10.1 I/O Address Assignment.......................................................... 70
10.1.1 LPC Bus.................................................................................... 70
10.2 PCI Configuration Space Map ................................................. 71
10.3 I2C............................................................................................ 72
10.4 SM Bus..................................................................................... 72
11 BIOS Setup Description........................................................... 73
11.1 Navigating the BIOS Setup Menu ........................................... 73
11.2 BIOS Versions........................................................................... 73
11.3 Updating the BIOS................................................................... 74
11.3.1 Update from External Flash ..................................................... 74
11.4 Supported Flash Devices ......................................................... 74

Copyright © 2019 congatec AG TCWLm12 9/74
List of Tables
Table 1 COM Express™ 3.0 Pinout Types ............................................ 10
Table 2 conga-TC370 Variants.............................................................. 11
Table 3 Feature Summary..................................................................... 12
Table 4 Overview of Type 6 Limitations................................................ 15
Table 5 Measurement Description........................................................ 16
Table 6 Power Consumption Values ..................................................... 16
Table 7 CMOS Battery Power Consumption ........................................ 17
Table 8 Cooling Solution Variants......................................................... 19
Table 9 Display Combinations and Resolution..................................... 27
Table 10 Wake Events............................................................................. 44
Table 11 Signal Tables Terminology Descriptions .................................. 45
Table 12 Connector A–B Pinout ............................................................. 46
Table 13 Connector C–D Pinout............................................................. 48
Table 14 PCI Express Signal Descriptions (General Purpose)................. 50
Table 15 PCI Express Signal Descriptions (x16 Graphics)....................... 51
Table 16 DDI Signal Description............................................................. 53
Table 17 HDMI Signal Descriptions........................................................ 54
Table 18 DisplayPort (DP) Signal Descriptions ....................................... 56
Table 19 Embedded DisplayPort Signal Descriptions............................ 57
Table 20 CRT Signal Descriptions........................................................... 58
Table 21 LVDS Signal Descriptions......................................................... 58
Table 22 Serial ATA Signal Descriptions ................................................. 59
Table 23 USB 2. 0 Signal Descriptions.................................................... 59
Table 24 USB 3.0 Signal Descriptions..................................................... 60
Table 25 Gigabit Ethernet Signal Descriptions....................................... 61
Table 26 High Definition Audio Link Signals Descriptions ..................... 62
Table 27 LPC Signal Descriptions........................................................... 62
Table 28 SPI BIOS Flash Interface Signal Descriptions........................... 63
Table 29 Miscellaneous Signal Descriptions........................................... 64
Table 30 General Purpose I/O Signal Descriptions ................................ 64
Table 31 Power and System Management Signal Descriptions ............. 65
Table 32 Rapid Shutdown Signal Descriptions....................................... 66
Table 33 Thermal Protection Signal Descriptions................................... 66
Table 34 SMBus Signal Description........................................................ 66
Table 35 General Purpose Serial Interface Signal Descriptions.............. 66
Table 36 Module Type Definition Signal Description ............................. 67
Table 37 Power and GND Signal Descriptions....................................... 68
Table 38 Bootstrap Signal Descriptions.................................................. 69
Table 39 PCI Configuration Space Map ................................................. 71

Copyright © 2019 congatec AG TCWLm12 10/74
1 Introduction
1.1 COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84 mm x 55 mm
•Compact 95 mm x 95 mm
•Basic 125 mm x 95 mm
•Extended 155 mm x 110 mm
Table 1 COM Express™ 3.0 Pinout Types
Types Connector
Rows
PCIe Lanes PEG SATA Ports LAN ports USB 2.0/
SuperSpeed USB
Display Interfaces
Type 6 A-B C-D Up to 24 1 Up to 4 1 Up to 8 / 4 1VGA,LVDS/eDP, PEG, 3x DDI
Type 7 A-B C-D Up to 32 - Up to 2 5 (1x 1 Gb, 4x 10 Gb) Up to 4 / 4
Type 10 A-B Up to 4 - Up to 2 1 Up to 8 / 2 1LVDS/eDP, 1xDDI
1. The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to 4 of the USB 2.0 ports can support SuperSpeed USB.
The conga-TC370 modules use the Type 6 pinout definition and comply with COM Express 3.0 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM integrates all the core components and is mounted onto an application specific carrier board. COM modules are legacy-free design
(no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These functions include, but
are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0, and Gigabit
Ethernet. The robust thermal and mechanical concept, combined with extended power-management capabilities, is perfectly suited for all
applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.

Copyright © 2019 congatec AG TCWLm12 11/74
1.2 Options Information
The conga-TC370 is currently available in four variants. The table below shows the different configurations available.
Table 2 conga-TC370 Variants
Part-No. 048800 048801 048802 048804
Processor Intel®Core™ i7-8665UE
1.7 GHz Quad Core™
Intel®Core™ i5-8365UE
1.6 GHz Quad Core™
Intel®Core™ i3-8145UE
2.2 GHz Dual Core™
Intel®Celeron®4305UE
2.0 GHz Dual Core
Intel®Smart Cache 8 MB 6 MB 4 MB 2 MB
Max. Turbo Frequency 4.4 GHz 4.1 GHz 3.9 GHz N.A
Processor Graphics Intel®UHD Graphics 620
(GT2)
Intel®UHD Graphics 620
(GT2)
Intel®UHD Graphics 620
(GT2)
Intel®UHD Graphics 610
(GT1)
GFX Base/Max. Dynamic Freq. 0.3 / 1.15 GHz 0.3 / 1.05 GHz 0.3 / 1.0 GHz 0.3 / 1.0 GHz
DDR4 Memory
(ECC or Non-ECC)
2400 MTps dual channel
Non-ECC
2400 MTps dual channel
Non-ECC
2400 MTps dual channel
Non-ECC
2400 MTps dual channel
Non-ECC
PCIe Lanes 8 Gen 3 8 Gen 3 8 Gen 3 8 Gen 3
USB Ports 8 USB 2.0
(4 USB 3.1 Gen 2)
8 USB 2.0
(4 USB 3.1 Gen 2)
8 USB 2.0
(4 USB 3.1 Gen 2)
8 USB 2.0
(4 USB 3.1 Gen 2)
SATA (6 Gbps) 3 3 3 3
LVDS Yes Yes Yes Yes
DisplayPort (DP) Yes Yes Yes Yes
HDMI Yes Yes Yes Yes
Processor TDP (cTDP down) 15 (10) W 15 (10) W 15 (10) W 15 (12.5) W

Copyright © 2019 congatec AG TCWLm12 12/74
2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 3.0 (Compact size 95 x 95 mm)
Processor 8th Generation Intel®Core™ i7,i5, i3 and Celeron®Single Chip Ultra Low TDP Processors
Memory Two memory sockets (located on the top and bottom side of the conga-TC370). Supports
-SO-DIMM non-ECC DDR4 modules
-Data rates up to 2400 MTps
-Maximum 64 GB capacity (32 GB each)
Chipset Intel®300 Series PCH-LP integrated in the Multi-Chip Package
Audio High Definition Audio interface with support for multiple codecs
Ethernet Gigabit Ethernet (Intel®i219-LM/V controller) with support for AMT 12
Graphics Options Intel® Gen. 9 LP (620/610). Supports:
-API (DirectX 12, Direct3D 2015, OpenGL 4.5, OpenCL 2.1)
-Intel®QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-Up to three independent displays (see table 8 “Display Combinations and Resolution”)
Up to two DDIs with support for:
-2 DisplayPort++ (DisplayPort 1.2)
-2 HDMI 1.4a 1 or HDMI 2.0 1, 2
-2 DVI port 1
-Resolutions up to 4K @ 60 Hz
1 LVDS/eDP 1.4
Optional VGA 3
Optional PEG port (x1 or x2) 5, 6
Peripheral
Interfaces
8 USB 2.0 (4 USB 3.1 Gen 2)
3 SATA®(6 Gbps with RAID 0/1/5/10 support)
8 PCI Express®Gen. 3 lanes 6
2 UART (16C550 compatible)
GPIOs/SDIO
LPC/eSPI 4
I²C (fast mode, multi-master)
SMB
SPI
BIOS AMI Aptio®V UEFI 2.x firmware
32 MB serial SPI flash with congatec Embedded BIOS features
Power
Management
ACPI 4.0a compliant with battery support.
S5e mode (see section 7.1.7 “Enhanced Soft-Off State” )
Deep Sx and Suspend to RAM (S3)
Configurable TDP
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I2C
bus, Power loss control
Storage Optional eMMC 5.1 onboard flash
Security Discrete SPI TPM (Infineon SLB9670VQ2.0); AES Instructions

Copyright © 2019 congatec AG TCWLm12 13/74
Note
1. Requires an external level shifter on the carrier board
2. Requires a Level Shifter Protocol Converter (LSPCON) on the carrier board
3. The second DDI is not available if VGA is supported
4. The conga-TC370 does not currently support eSPI interface
5. Requires re-routing of PCIe lanes 4 or 5, or both (assembly option)
6. Seven PCIe lanes if x1 PEG port is implemented or six PCIe lanes if x2 PEG port is implemented.
2.2 Supported Operating Systems
The conga-TC370 supports the following operating systems.
•Microsoft®Windows® 10
•Linux
Note
1. The processor supports only 64-bit operating systems.
2. The CSM (Compatibility Support Module) is disabled in the BIOS setup menu by default because we recommend to operate the system
in native UEFI mode.

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2.3 Mechanical Dimensions
•95.0 mm x 95.0 mm
•Height approximately 18 or 21 mm (including heatspreader) depending on the carrier board connector that is used. If the 5 mm (height)
carrier board connector is used, then approximate overall height is 18 mm. If the 8 mm (height) carrier board connector is used, then
approximate overall height is 21 mm.
2.4 Supply Voltage Standard Power
•12 V DC ± 5 %
The dynamic range shall not exceed the static range.
Heatspreader
All dimensions in millimeter
Module PCB
Carrier Board PCB
13.00
4.00
5.00
4.50
2.00±10%
7.00 18.00
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

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2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Table 4 Overview of Type 6 Limitations
Power Rail Module Pin
Current Capability
(Ampere)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.5-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10 percent of nominal to 90 percent of nominal at a minimum slope of 250 V/s. The smooth turn-on requires
that, during the 10 percent to 90 percent portion of the rise time, the slope of the turn-on waveform must be positive.
2.5 Power Consumption
The power consumption values were measured with the following setup:
•Input voltage +12 V
•conga-TC370 COM
•Modified congatec carrier board
•conga-TC370 cooling solution
•Microsoft Windows 10 (64 bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool

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Table 5 Measurement Description
The power consumption values were recorded during the following system states :
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during desktop idle
S0: Maximum value Highest frequency mode (HFM/Turbo Boost) The CPU was stressed to its maximum frequency
S0: Peak current Highest current spike during the measurement of “S0: Maximum value”. This
state shows the peak value during runtime.
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios
S3 COM is powered by VCC_5V_SBY
S5 COM is powered by VCC_5V_SBY
S5e COM is powered by VCC_5V_SBY
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement
Table 6 Power Consumption Values
The table below provide additional information about the power consumption data for each of the conga-TC370 variants offered. The values
were recorded at various operating mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64 bit)
CPU Current (Ampere)
Variant Cores Freq. /Turbo
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3 S5 S5e
048800 2 x 4 GB A.0 BUWLR017 Windows 10 Intel®Core™ i7-8665UE 4 1.7 / 4.4 0.18 2.80 6.33 0.09 0.07 0.02
048801 2 x 4 GB A.0 BUWLR017 Windows 10 Intel®Core™ i5-8365UE 4 1.6 / 4.1 0.15 2.55 4.34 0.10 0.07 0.02
048802 2 x 4 GB A.0 BUWLR017 Windows 10 Intel®Core™ i3-8145UE 2 2.2 / 3.9 0.23 3.29 4.62 0.09 0.07 0.02
048804 2 x 4 GB A.0 BUWLR017 Windows 10 Intel®Celeron®4305UE 2 2.0 / N.A 0.19 1.47 1.52 0.09 0.07 0.02

Copyright © 2019 congatec AG TCWLm12 17/74
2.6 Supply Voltage Battery Power
Table 7 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 1.39 µA
20oC 3V DC 1.60 µA
70oC 3V DC 3.07 µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption of your application in worst case conditions (for example, during high temperature and
high battery voltage).
3. Consider the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TC370.
2.7 Environmental Specifications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

Copyright © 2019 congatec AG TCWLm12 18/74
3 Block Diagram
PECI
8x PCIe Gen. 3
DDR4 Channel A
DDR4 Channel B
DDI B
DDI C
eDP
SM Bus
LPC
3x SATA 6G
eMMC
PCIe
HDA
SPI0
SDIO
MGMNT
8th Gen. Intel®Core™
“Whiskey Lake”
SOC ULT Processor
4x USB 3.1 Gen 2
8x USB 2.0
conga-TC370 COM Express Rev. 3.0, Compact Size, Type 6 Pinout
XDP
SPI Flash 0 TPM
Ethernet 10/100/1000
Intel i219LM/V
eDP to LVDS
MUX MUX
MUX
DP to VGA
eMMC
PCIe lane 4 - 5
Optional - Not available by default
congatec
Board
Controller
5
th
Generation
LPC
GPIO
SMB
UART
I2C
LID/SLEEP/FAN
2x DDR4 2400
SO-DIMM
up to 32GB each
Ethernet
HD Audio
SM Bus
SPI
CRT
LVDS/eDP
LPC
I2C Bus
USB 2.0 Lanes 0 - 7
SATA Port 0 - 2
SER0/1
CAN
GPIO/SDIO
LID# / SLEEP# / FAN
PCIe lane 0 - 7
PEG Port x2
USB 3.0 Lanes 0 - 3
DDI 2
DDI 1
CAN Controller

Copyright © 2019 congatec AG TCWLm12 19/74
4 Cooling Solutions
congatec AG offers the following cooling solutions for the conga-TC370. The dimensions of the cooling solutions are shown in the sub-sections.
All measurements are in millimeters.
Table 8 Cooling Solution Variants
Cooling Solution Part No Description
1 CSA 048850 Active cooling solution with 2.7 mm bore-hole standoffs
048851 Active cooling with M2.5 mm threaded standoffs
2 CSP 048852 Passive cooling solution with 2.7 mm bore-hole standoffs
048853 Passive cooling solution with M2.5 mm threaded standoffs
3 HSP 048854 Heatspreader with 2.7 mm bore-hole standoffs
048855 Heatspreader with M2.5 mm threaded standoffs
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.
4. Do not exceed the recommended maximum torque. Doing so may damage the module or the carrier board, or both.

Copyright © 2019 congatec AG TCWLm12 20/74
4.1 CSA Dimensions
87
87
95
79.5
3.4
3.4
E
E
53.4
95
18.3
11.1
2.2 3.5±0.05
76
67.6
25.5
5
4
4
4
14.2
M2.5 x 11 mm
threaded standoff
for threaded version
or
ø2.7 x 11 mm
non-threaded standoff
for borehole version
0.75°
1.5°