Congatec COM Express conga-TCA5 User manual

COM Express™ conga-TCA5
COM Express Type 6 Compact module based on the Intel®Atom™, Pentium™and Celeron®Apollo Lake SoC
User's Guide
Revision 1.9

Copyright © 2017 congatec GmbH TA50m19 2/70
Revision History
Revision Date (yyyy-mm-dd) Author Changes
0.1 2017-03-23 AEM •Preliminary release
1.0 2017-10-04 AEM •Removed Android from supported OS in section 2.2 "Supported Operating Systems"
•Updated security features in table 1 "Feature Summary" and section 6.5 "Security Features"
•Updated tables 5 "Power Consumption Values" and 6 "CMOS Battery Power Consumption"
•Updated section 4 "Block Diagram"
•Added content to sections 9 "System Resources", 10 "BIOS Description" and 11 "Additional BIOS Features"
•Official release
1.1 2018-03-19 AEM •Updated "Electrostatic Sensitive Device" information on page 3
•Removed Windows 7, 8 and Embedded Compact from the list of supported OS in section 2.2 "Supported Operating
Systems"
•Updated section 4 "Block Diagram"
•Added caution in section 5.1.4 "USB 2.0"
•Updated section 5.1.8 "UART"
1.2 2018-06-25 BEU •Added errata as a document to read in the preface section
1.3 2018-08-21 AEM •Deleted all notes with references to section 8.5 "Boot Strap Signals"
1.4 2019-07-25 AEM •Deleted product variant with PN: 048513 from table 3 "Industrial Variants"
•Updated section 4 "Cooling Solutions" and added table 7 "Cooling Solution Variants"
•Changed the recommended maximum torque specification for all cooling screws in section 4 "Cooling Solutions"
•Updated the supported Winbond flash in section 10.4 "Supported Flash Devices"
1.5 2020-04-15 AEM •Updated section 10.4 "Supported Flash Devices"
•Added note about the minimum pulse width required for proper button detection in table 24 “Power and System
Management Signal Descriptions”
•Corrected sections 5.2.1 "USB 3.0" and 7.3 "USB Port Mapping"
•Updated section 6.1.1 "Optional eMMC 5.0"
•Deleted section 11 "References"
•Restructured the whole document
1.6 2020-12-08 AEM •Corrected a typographical error in section 10.4 "Supported Flash Devices"
•Corrected the temperature range of industrial variants in section 2.7 "Environmental Specifications"
•Updated section 6.1.1 "Optional eMMC 5.0"
•Updated the note in section 5.1.9 "UART"
1.7 2021-04-19 AEM •Corrected the storage temperature for industrial variants in section 2.7 “Environmental Specifications”
•Updated table 2 “Commercial Variants, table 3"Industrial Variants", table 4 “Feature Summary”, table 9 “Display
Combination” and table 17 “TMDS Signal Descriptions”
•Updated section 3 “Block Diagram” and section 5.1.2 “Display Interfaces
•Deleted section 5.1.2.1 “HDMI” and section 5.1.2.2 “DVI”
•Added note to table 17 “TMDS Signal Descriptions”

Copyright © 2017 congatec GmbH TA50m19 3/70
1.8 2021-07-31 AEM •Added Software License Information
•Changed congatec AG to congatec GmbH
•Updated the note in section 5.1.2.3 "VGA"
•Re-arranged section 6 "Additional Features"
•Updated section 6.5 "congatec Battery Management Interface"
1.9 2021-11-16 AEM •Deleted HDMI references from section 1.2 "Options Information", section 2.1 "Feature List", section 3 "Block Diagram
and section 5.1.2 "Display Interfaces"

Copyright © 2017 congatec GmbH TA50m19 4/70
Preface
This user's guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TCA5.
It is one of four documents that should be referred to when designing a COM Express™ application. This user's guide should be read in
conjunction with the document "Errata_congatec_xA5_designs". Click on the document name to download it.
The other reference documents that should be used include the following:
COM Express™ Design Guide
COM Express™ Specification
The links to these documents can be found on the congatec GmbH website at www.congatec.com.
Software Licenses
Notice Regarding Open Source Software
The congatec products contain Open Source software that has been released by programmers under specific licensing requirements such as
the “General Public License“ (GPL) Version 2 or 3, the “Lesser General Public License“ (LGPL), the “ApacheLicense“ or similar licenses.
You can find the specific details at https://www.congatec.com/en/licenses/. Search for the revision of the BIOS/UEFI or Board Controller
Software (as shown in the POST screen or BIOS setup) to get the complete product related license information. To the extent that any
accompanying material such as instruction manuals, handbooks etc. contain copyright notices, conditions of use or licensing requirements that
contradict any applicable Open Source license, these conditions are inapplicable.
The use and distribution of any Open Source software contained in the product is exclusively governed by the respective Open Source
license. The Open Source software is provided by its programmers without ANY WARRANTY, whether implied or expressed, of any fitness for
a particular purpose, and the programmers DECLINE ALL LIABILITY for damages, direct or indirect, that result from the use of this software.
OEM/ CGUTL BIOS
BIOS/UEFI modified by customer via the congatec System Utility (CGUTL) is subject to the same license as the BIOS/UEFI it is based on. You
can find the specific details at https://www.congatec.com/en/licenses/.

Copyright © 2017 congatec GmbH TA50m19 5/70
Disclaimer
The information contained within this user's guide, including but not limited to any product specification, is subject to change without notice.
congatec GmbH provides no warranty with regard to this user's guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec GmbH assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user's guide. In no event shall congatec GmbH be liable for any incidental, consequential,
special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user's guide or any other
information contained herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec GmbH designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec GmbH products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec GmbH Limited Warranty.
Copyright Notice
Copyright © 2017, congatec GmbH. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec GmbH.
congatec GmbH has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.

Copyright © 2017 congatec GmbH TA50m19 6/70
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user's guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH, our products, or our website.
Certification
congatec GmbH is certified to DIN EN ISO 9001 standard.
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Copyright © 2017 congatec GmbH TA50m19 7/70
Warranty
congatec GmbH makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec GmbH may in its sole discretion modify its Limited Warranty at any time
and from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner's license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec GmbH represents that
the products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship
or due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec's option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec GmbH prior to returning the non conforming product
freight prepaid. congatec GmbH will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec's direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec GmbH shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Technical Support
congatec GmbH technicians and engineers are committed to providing the best possible technical support for our customers so that our
products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation,
utilities and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our
technical support department by email at [email protected].

Copyright © 2017 congatec GmbH TA50m19 8/70
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
MT/s Megatransfers per second
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
DDC Display Data Channel
SoC System On Chip
LVDS Low-Voltage Differential Signaling
Gbe Gigabit Ethernet
eMMC Embedded Multi-media Controller
HDA High Definition Audio
cBC congatec Board Controller
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2017 congatec GmbH TA50m19 9/70
Contents
1 Introduction ............................................................................. 12
1.1 COM Express™ Concept......................................................... 12
1.2 Options Information................................................................. 13
2 Specifications........................................................................... 15
2.1 Feature List .............................................................................. 15
2.2 Supported Operating Systems ................................................ 16
2.3 Mechanical Dimensions ........................................................... 16
2.4 Supply Voltage Standard Power .............................................. 17
2.4.1 Electrical Characteristics .......................................................... 17
2.4.2 Rise Time ................................................................................. 17
2.5 Power Consumption ................................................................ 18
2.6 Supply Voltage Battery Power ................................................. 19
2.7 Environmental Specifications................................................... 20
3 Block Diagram.......................................................................... 21
4 Cooling Solutions..................................................................... 22
4.1 CSP Dimensions....................................................................... 23
4.2 HSP Dimensions....................................................................... 25
5 Connector Rows....................................................................... 27
5.1 Primary and Secondary Connector Rows................................. 27
5.1.1 PCI Express™........................................................................... 27
5.1.2 Display Interface ...................................................................... 27
5.1.2.1 DisplayPort (DP) ....................................................................... 28
5.1.2.2 LVDS......................................................................................... 28
5.1.2.3 VGA.......................................................................................... 29
5.1.3 USB 2.0 .................................................................................... 29
5.1.4 SATA ........................................................................................ 30
5.1.5 Gigabit Ethernet ..................................................................... 30
5.1.6 High Definition Audio (HDA) Interface .................................... 30
5.1.7 UART........................................................................................ 30
5.1.8 ExpressCard™ ......................................................................... 31
5.1.9 SD Card ................................................................................... 31
5.1.10 GPIOs....................................................................................... 31
5.1.11 LPC Bus.................................................................................... 31
5.1.12 I²C Bus ..................................................................................... 31
5.1.13 SPI............................................................................................ 31
5.1.14 Power Control .......................................................................... 32
5.1.15 Power Management................................................................. 33
6 Additional Features.................................................................. 34
6.1 Optional eMMC 5.0................................................................. 34
6.2 congatec Board Controller (cBC) ............................................. 34
6.3 Board Information.................................................................... 34
6.3.1 General Purpose Input/Output................................................ 34
6.3.2 Fan Control .............................................................................. 35
6.3.3 Power Loss Control.................................................................. 35
6.3.4 Watchdog ................................................................................ 35
6.3.5 I2C Bus...................................................................................... 35
6.4 OEM BIOS Customization........................................................ 36
6.4.1 OEM Default Settings .............................................................. 36
6.4.2 OEM Boot Logo....................................................................... 36
6.4.3 OEM POST Logo ..................................................................... 36
6.4.4 OEM BIOS Code/Data............................................................. 37
6.4.5 OEM DXE Driver...................................................................... 37
6.5 congatec Battery Management Interface ................................ 37
6.6 API Support (CGOS) ................................................................ 38
6.7 Security Features...................................................................... 38
6.8 Suspend to Ram....................................................................... 38
7 conga Tech Notes .................................................................... 39
7.1 Intel®Apollo Lake SoC Features.............................................. 39
7.1.1 Processor Core......................................................................... 39
7.1.1.1 Intel Virtualization Technology................................................. 39
7.1.1.2 Thermal Management ............................................................. 40
7.2 ACPI Suspend Modes and Resume Events.............................. 41
7.3 USB Port Mapping ................................................................... 42
8 Signal Descriptions and Pinout Tables..................................... 43

Copyright © 2017 congatec GmbH TA50m19 10/70
8.1 Connector Signal Descriptions ................................................ 44
9 System Resources .................................................................... 65
9.1 I/O Address Assignment.......................................................... 65
9.1.1 LPC Bus.................................................................................... 65
9.2 PCI Configuration Space Map ................................................. 66
9.3 I²C Bus ..................................................................................... 67
9.4 SM Bus..................................................................................... 67
9.5 congatec System Sensors ........................................................ 68
10 BIOS Setup Description ........................................................... 69
10.1 Navigating the BIOS Setup Menu ........................................... 69
10.2 BIOS Versions........................................................................... 69
10.3 Updating the BIOS................................................................... 70
10.3.1 Update from External Flash ..................................................... 70
10.4 Supported Flash Devices ......................................................... 70

Copyright © 2017 congatec GmbH TA50m19 11/70
List of Tables
Table 1 COM Express™ 2.1 Pinout Types ........................................... 12
Table 2 Commercial Variants ................................................................ 13
Table 3 Industrial Variants..................................................................... 14
Table 4 Feature Summary..................................................................... 15
Table 5 Measurement Description........................................................ 18
Table 6 Power Consumption Values ..................................................... 19
Table 7 CMOS Battery Power Consumption ........................................ 19
Table 8 Cooling Solution Variants......................................................... 22
Table 9 Display Combination ............................................................... 28
Table 10 Wake Events............................................................................. 41
Table 11 Signal Tables Terminology Descriptions .................................. 43
Table 12 Connector A–B Pinout ............................................................. 44
Table 13 Connector C–D Pinout............................................................. 46
Table 14 PCI Express Signal Descriptions (general purpose) ................. 48
Table 15 PCI Express Signal Descriptions (x16 Graphics)....................... 49
Table 16 DDI Signal Description............................................................. 51
Table 17 TMDS Signal Descriptions ....................................................... 53
Table 18 DisplayPort (DP) Signal Descriptions ....................................... 54
Table 19 CRT Signal Descriptions........................................................... 55
Table 20 LVDS Signal Descriptions......................................................... 56
Table 21 Serial ATA Signal Descriptions................................................. 56
Table 22 USB 2.0 Signal Descriptions..................................................... 57
Table 23 USB 3.0 Signal Descriptions..................................................... 58
Table 24 Gigabit Ethernet Signal Descriptions....................................... 59
Table 25 Intel®High Definition Audio Link Signals Descriptions............ 59
Table 26 ExpressCard Support Pins Descriptions................................... 60
Table 27 LPC Signal Descriptions........................................................... 60
Table 28 SPI BIOS Flash Interface Signal Descriptions........................... 60
Table 29 Miscellaneous Signal Descriptions........................................... 61
Table 30 General Purpose I/O Signal Descriptions ................................ 61
Table 31 Power and System Management Signal Descriptions ............. 61
Table 32 General Purpose Serial Interface Signal Descriptions ............. 63
Table 33 Module Type Definition Signal Description ............................. 63
Table 34 Power and GND Signal Descriptions....................................... 64
Table 35 I/O Address Assignment.......................................................... 65
Table 36 PCI Configuration Space Map ................................................. 66

Copyright © 2017 congatec GmbH TA50m19 12/70
1 Introduction
1.1 COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84 mm x 55 mm
•Compact 95 mm x 95 mm
•Basic 125 mm x 95 mm
•Extended 155 mm x 110 mm
Table 1 COM Express™ 2.1 Pinout Types
Types Connector Rows PCIe Lanes PCI IDE SATA Ports LAN ports USB 2.0/ USB 3.0 Display Interfaces
Type 1 A-B Up to 6 - 4 1 8 / 0 VGA, LVDS
Type 2 A-B C-D Up to 22 32 bit 1 4 1 8 / 0 VGA, LVDS, PEG/SDVO
Type 3 A-B C-D Up to 22 32 bit - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 4 A-B C-D Up to 32 1 4 1 8 / 0 VGA,LVDS, PEG/SDVO
Type 5 A-B C-D Up to 32 - 4 3 8 / 0 VGA,LVDS, PEG/SDVO
Type 6 A-B C-D Up to 24 - 4 1 8 / 4* VGA,LVDS/eDP, PEG, 3x DDI
Type 10 A-B Up to 4 - 2 1 8 / 0 LVDS/eDP, 1xDDI
* The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Up to four of the USB 2.0 ports can support SuperSpeed USB.
The conga-TCA5 modules use the Type 6 pinout definition and comply with COM Express 2.1 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™

Copyright © 2017 congatec GmbH TA50m19 13/70
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
1.2 Options Information
The conga-TCA5 is available in five variants (two commercial and three industrial). The table below shows the different configurations available.
Table 2 Commercial Variants
Part-No. 048530 048531
Processor Intel®Celeron®N3350
Dual Core 1.1 GHz
Intel®Pentium®N4200
Quad Core, 1.1 GHz
L2 Cache 2 MB 2 MB
Burst Frequency 2.3 GHz 2.5 GHz
Graphics Intel®HD Graphics 500 Intel®HD Graphics 505
GFX Base/Burst 200 MHz / 650 MHz 200 MHz / 750 MHz
Memory (DDR3L) 1866 MT/s dual channel 1866 MT/s dual channel
LVDS Single/dual 18/24 bpp Single/dual 18/24 bpp
Optional VGA Yes Yes
Default PCIe Lanes 3x PCIe lanes 3x PCIe lanes
DDI DP++ DP++
eMMC Optional Optional
SD Card Yes Yes
Max. TDP 6 W 6 W

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Table 3 Industrial Variants
Part-No. 048510 048511 048512
Processor Intel®Atom™ x7-E3950
Quad Core, 1.6 GHz
Intel®Atom™ x5-E3940
Quad Core, 1.6 GHz
Intel®Atom™ x5-E3930
Dual Core, 1.3 GHz
L2 Cache 2 MB 2 MB 2 MB
Burst Frequency 2.0 GHz 1.8 GHz 1.8 GHz
Graphics Intel®HD Graphics 505 Intel®HD Graphics 500 Intel®HD Graphics 500
GFX Base/Burst 500 MHz / 650 Mhz 400 MHz / 600 MHz 400 MHz / 550 MHz
Memory (DDR3L) 1866 MT/s dual channel 1866 MT/s dual channel 1866 MT/s dual channel
LVDS Single/dual 18/24 bpp Single/dual 18/24 bpp Single/dual 18/24 bpp
Optional VGA Yes Yes Yes
Default PCIe Lanes 3x PCIe lanes 3x PCIe lanes 3x PCIe lanes
DDI DP++ DP++ DP++
eMMC Optional Optional Optional
SD Card Yes Yes Yes
Max. TDP 12 W 9 W 6.5 W

Copyright © 2017 congatec GmbH TA50m19 15/70
2 Specifications
2.1 Feature List
Table 4 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Compact size 95 x 95 mm)
Processor Intel®Atom™, Pentium®and Celeron SoC
Memory Two memory sockets (located on the top and bottom side). Supports
-SO-DIMM non-ECC DDR3L modules
-Data rates up to 1866 MT/s
-Maximum 8 GB capacity
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I2C bus,
Power loss control
Chipset Integrated in SoC
Audio High Definition Audio interface with support for multiple codecs
Ethernet Gigabit Ethernet (Intel®i210-IT / i211-AT controller)
Graphics
Options
Next Generation Intel® HD (500/505). Supports:
-API (DirectX 12, OpenGL 4.3, OpenCL 2.0, OpenGL ES 3.0)
-Intel®QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-Up to 3 independent displays (must be two DP++ (DP, HDMI/DVI) and one eDP/LVDS)
2x DP++
1x LVDS
1x Optional eDP 1.3
1x Optional VGA
Resolutions up to 4K
NOTE:
*1 Variants that feature optional eDP interface do not support LVDS
*2 Variants that feature optional VGA interface support only 1x DDI
*3 The conga-TCA5 does not natively support TMDS. A DP++ to TMDS
converter (e.g. PTN3360D) needs to be implemented
Peripheral
Interfaces
8x USB 2.0 (up to 4x USB 3.0)
2x SATA®(6 Gbps)
2x UART
3x PCI Express®Gen. 3 lanes
GPIOs
LPC
I2C (fast mode, multi-master)
SMB
SPI
NOTE:
*1 Five PCIe lanes for variants that feature PCIe switch
*2 Four PCIe lanes for variants without Gigabit Ethernet controller and PCIe
switch
BIOS AMI Aptio®V UEFI 2.x firmware, 8 or 16 MB serial SPI with congatec Embedded BIOS features
Storage Optional eMMC 5.0 onboard flash
Power
Management
ACPI 4.0 compliant with battery support. Also supports Suspend to RAM (S3) and Intel AMT 10
Configurable TDP
Ultra low standby power consumption, Deep Sx
Security Firmware TPM 2.0 (Intel®PTT)
Discrete LPC TPM 2.0 (Infineon SLB9665) or LPC TPM 1.2 (Infineon SLB9660) support via assembly option

Copyright © 2017 congatec GmbH TA50m19 16/70
Note
Some of the features mentioned above are optional (assembly option).
2.2 Supported Operating Systems
The conga-TCA5 supports the following operating systems
• Microsoft®Windows®10 Enterprise (64-bit)
• Microsoft®Windows®10 IoT Core (32/64-bit)
• Linux 3.x/4.x
• Yocto 2.x
Note
Windows®10 installation requires a minimum storage capacity of 20 GB. We will not offer installation support for systems with less than 20 GB
storage space.
2.3 Mechanical Dimensions
•95.0 mm x 95.0 mm (3.75” x 3.75”)
•Height approximately 18 or 21 mm (including heatspreader) depending on the carrier board connector that is used. If the 5 mm (height)
carrier board connector is used then approximate overall height is 18 mm. If the 8 mm (height) carrier board connector is used then
approximate overall height is 21 mm
4.00
Heatspreader
Module PCB
Carrier Board PCB
7.00
5.00 1.60
4.50
13.00
18.00

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2.4 Supply Voltage Standard Power
•12 V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module's connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Ampere)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.5-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

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2.5 Power Consumption
The power consumption values were measured with the following setup:
•Input voltage +12 V
•conga-TCA5 COM
•modified congatec carrier board
•conga-TCA5 cooling solution
•Microsoft Windows 10 (64 bit)
Note
The CPU was stressed to its maximum workload.
Table 5 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during desktop idle
S0: Maximum value Highest frequency mode (HFM/Turbo Boost) The CPU was stressed to its maximum frequency.
S0: Peak value Highest current spike during the measurement of “S0: Maximum value”. This
state shows the peak value during runtime
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios
S3 COM is powered by VCC_5V_SBY
S5 COM is powered by VCC_5V_SBY
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2017 congatec GmbH TA50m19 19/70
Table 6 Power Consumption Values
The table below provides additional information about the conga-TCA5 power consumption. The values are recorded at various operating
modes.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64 bit)
CPU Current (A)
Variant Cores Freq/Turbo (GHz) S0:Min S0: Max S0: Peak S3 S5
048510 2 x 4 GB A.1 R117 Windows 10 Intel®Atom™ x7-E3950 4 1.6 / 2.0 0.14 1.66 1.85 0.07 0.06
048511 2 x 4 GB A.0 R117 Windows 10 Intel®Atom™ x5-E3940 4 1.6 / 1.8 0.16 1.34 1.44 0.12 0.10
048512 2 x 4 GB A.0 R117 Windows 10 Intel®Atom™ x5-E3930 2 1.3 / 1.8 0.11 0.97 1.02 0.12 0.10
048530 2 x 4 GB A.0 R117 Windows 10 Intel®Celeron™ N3350 2 1.1 / 2.3 0.12 1.05 1.53 0.08 0.06
048531 2 x 4 GB A.0 R117 Windows 10 Intel®Pentium® N4200 4 1.1 / 2.5 0.12 1.04 1.85 0.11 0.10
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 7 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 2.17 µA
20oC 3V DC 2.37 µA
70oC 3V DC 3.37 µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec GmbH website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TCA5.

Copyright © 2017 congatec GmbH TA50m19 20/70
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -40° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.