Congatec COM Express conga-TCA7 User manual

COM Express™ conga-TCA7
COM Express Type 6 Compact module based on the Intel®Atom™, Pentium™and Celeron®Elkhart Lake SoC
User's Guide
Revision 0.1 (Preliminary)

Copyright © 2021 congatec GmbH TA70m01 2/67
Revision History
Revision Date (yyyy-mm-dd) Author Changes
0.1 2021-07-31 AEM •Preliminary release

Copyright © 2021 congatec GmbH TA70m01 3/67
Preface
This user’s guide provides information about the components, features, connectors, system resources and BIOS features available on the
conga-TCA7. It is one of three documents that should be referred to when designing a COM Express™ application. The other reference
documents that should be used include the following:
COM Express™ Design Guide
COM Express™ Specification
The links to these documents can be found on the congatec GmbH website at www.congatec.com.
Software Licences
Notice Regarding Open Source Software
The congatec products contain Open Source software that has been released by programmers under specific licensing requirements such as
the “General Public License“ (GPL) Version 2 or 3, the “Lesser General Public License“ (LGPL), the “ApacheLicense“ or similar licenses.
You can find the specific details at https://www.congatec.com/en/licenses/. Search for the revision of the BIOS/UEFI or Board Controller
Software (as shown in the POST screen or BIOS setup) to get the complete product related license information. To the extent that any
accompanying material such as instruction manuals, handbooks etc. contain copyright notices, conditions of use or licensing requirements that
contradict any applicable Open Source license, these conditions are inapplicable.
The use and distribution of any Open Source software contained in the product is exclusively governed by the respective Open Source
license. The Open Source software is provided by its programmers without ANY WARRANTY, whether implied or expressed, of any fitness for
a particular purpose, and the programmers DECLINE ALL LIABILITY for damages, direct or indirect, that result from the use of this software.
OEM/ CGUTL BIOS
BIOS/UEFI modified by customer via the congatec System Utility (CGUTL) is subject to the same license as the BIOS/UEFI it is based on. You
can find the specific details at https://www.congatec.com/en/licenses/.

Copyright © 2021 congatec GmbH TA70m01 4/67
Disclaimer
The information contained within this user's guide, including but not limited to any product specification, is subject to change without notice.
congatec GmbH provides no warranty with regard to this user's guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec GmbH assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user's guide. In no event shall congatec GmbH be liable for any incidental, consequential,
special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user's guide or any other
information contained herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec GmbH designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec GmbH products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec GmbH Limited Warranty.
Copyright Notice
Copyright © 2021, congatec GmbH. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec GmbH.
congatec GmbH has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.

Copyright © 2021 congatec GmbH TA70m01 5/67
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user's guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH, our products, or our website.
Certification
congatec GmbH is certified to DIN EN ISO 9001 standard.
C
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I
F
I
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A
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Warranty
congatec GmbH makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec GmbH may in its sole discretion modify its Limited Warranty at any time
and from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner's license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec GmbH represents that
the products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship
or due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec's option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec GmbH prior to returning the non conforming product
freight prepaid. congatec GmbH will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec's direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec GmbH shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Technical Support
congatec GmbH technicians and engineers are committed to providing the best possible technical support for our customers so that our
products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation,
utilities and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our
technical support department by email at [email protected].

Copyright © 2021 congatec GmbH TA70m01 7/67
Terminology
Term Description
COM Computer-on-Module
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
MT/s Megatransfers per second
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
PWM Pulse Width Modulation
SATA Serial ATA
DDC Display Data Channel
SoC System On Chip
LVDS Low-Voltage Differential Signaling
Gbe Gigabit Ethernet
eMMC Embedded Multi-media Controller
HDA High Definition Audio
cBC congatec Board Controller
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2021 congatec GmbH TA70m01 8/67
Contents
1 Introduction ............................................................................. 11
1.1 Options Information................................................................. 12
2 Specifications........................................................................... 13
2.1 Feature List .............................................................................. 13
2.2 Supported Operating Systems ................................................ 14
2.3 Mechanical Dimensions ........................................................... 14
2.4 Supply Voltage Standard Power .............................................. 15
2.4.1 Electrical Characteristics .......................................................... 15
2.4.2 Rise Time ................................................................................. 16
2.5 Power Consumption ................................................................ 16
2.6 Supply Voltage Battery Power ................................................. 17
2.7 Environmental Specifications................................................... 18
3 Block Diagram.......................................................................... 19
4 Cooling Solutions..................................................................... 20
4.1 CSP Dimensions....................................................................... 21
4.2 HSP Dimensions....................................................................... 23
4.2.1 Heatspreader Thermal Imagery ............................................... 25
5 Connector Rows....................................................................... 26
5.1 Primary and Secondary Connector Rows................................. 26
5.1.1 PCI Express™........................................................................... 26
5.1.2 Display Interface ...................................................................... 26
5.1.2.1 DisplayPort (DP) ....................................................................... 27
5.1.2.2 LVDS......................................................................................... 27
5.1.2.3 Optional eDP ........................................................................... 28
5.1.3 SATA ........................................................................................ 28
5.1.4 USB .......................................................................................... 28
5.1.5 Gigabit Ethernet ..................................................................... 29
5.1.6 High Definition Audio (HDA) Interface .................................... 29
5.1.7 UART........................................................................................ 29
5.1.8 GPIOs/SDIO............................................................................. 29
5.1.9 LPC Bus.................................................................................... 30
5.1.10 I²C Bus ..................................................................................... 30
5.1.11 SPI............................................................................................ 30
5.1.12 Power Control .......................................................................... 30
5.1.13 Power Management................................................................. 32
6 Additional Features.................................................................. 33
6.1 eMMC ...................................................................................... 33
6.2 TPM.......................................................................................... 33
6.3 congatec Board Controller (cBC) ............................................. 33
6.3.1 Board Information.................................................................... 33
6.3.2 General Purpose Input/Output................................................ 34
6.3.3 Fan Control .............................................................................. 34
6.3.4 Power Loss Control.................................................................. 34
6.3.5 Watchdog ................................................................................ 34
6.3.6 Enhanced Soft-Off State .......................................................... 35
6.3.7 I2C Bus...................................................................................... 35
6.4 OEM BIOS Customization........................................................ 35
6.4.1 OEM Default Settings .............................................................. 35
6.4.2 OEM Boot Logo....................................................................... 35
6.4.3 OEM POST Logo ..................................................................... 36
6.4.4 OEM BIOS Code/Data............................................................. 36
6.4.5 OEM DXE Driver...................................................................... 36
6.5 congatec Battery Management Interface ................................ 36
6.6 API Support (CGOS) ................................................................ 37
6.7 Suspend to Ram....................................................................... 37
7 conga Tech Notes .................................................................... 38
7.1 Intel®Elkhart Lake SoC Features.............................................. 38
7.1.1 Processor Core......................................................................... 38
7.1.1.1 Intel Virtualization Technology................................................. 38
7.1.1.2 Thermal Management ............................................................. 39
7.2 ACPI Suspend Modes and Resume Events.............................. 40
8 Signal Descriptions and Pinout Tables..................................... 41
8.1 Connector Signal Descriptions ................................................ 42
8.2 Bootstrap Signals..................................................................... 64

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9 System Resources .................................................................... 65
10 BIOS Setup Description ........................................................... 66
10.1 Navigating the BIOS Setup Menu ........................................... 66
10.2 BIOS Versions........................................................................... 66
10.3 Updating the BIOS................................................................... 67
10.3.1 Update from External Flash ..................................................... 67
10.4 Supported Flash Devices ......................................................... 67

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List of Tables
Table 1 COM Express™ 3.0 Pinout Types............................................ 11
Table 2 Commercial Variants ................................................................ 12
Table 3 Industrial Variants..................................................................... 12
Table 4 Feature Summary..................................................................... 13
Table 5 Measurement Description........................................................ 16
Table 6 Power Consumption Values ..................................................... 17
Table 7 CMOS Battery Power Consumption ........................................ 17
Table 8 Cooling Solution Variants......................................................... 20
Table 9 Display Combinations and Resolutions ................................... 27
Table 10 Wake Events............................................................................. 40
Table 11 Signal Tables Terminology Descriptions .................................. 41
Table 12 Connector A–B Pinout ............................................................. 42
Table 13 Connector C–D Pinout............................................................. 44
Table 14 PCI Express Signal Descriptions (General Purpose)................. 46
Table 15 PCI Express Signal Descriptions (x16 Graphics)....................... 47
Table 16 DDI Signal Description............................................................. 49
Table 17 HDMI Signal Descriptions........................................................ 50
Table 18 DisplayPort (DP) Signal Descriptions ....................................... 51
Table 19 Embedded DisplayPort Signal Descriptions............................ 53
Table 20 CRT Signal Descriptions........................................................... 53
Table 21 LVDS Signal Descriptions......................................................... 54
Table 22 Serial ATA Signal Descriptions................................................. 54
Table 23 USB 2. 0 Signal Descriptions.................................................... 55
Table 24 USB 3.0 Signal Descriptions..................................................... 56
Table 25 Gigabit Ethernet Signal Descriptions....................................... 56
Table 26 High Definition Audio Link Signals Descriptions ..................... 57
Table 27 LPC Signal Descriptions........................................................... 58
Table 28 SPI BIOS Flash Interface Signal Descriptions........................... 58
Table 29 Miscellaneous Signal Descriptions........................................... 59
Table 30 General Purpose I/O Signal Descriptions ................................ 59
Table 31 Power and System Management Signal Descriptions ............. 60
Table 32 Rapid Shutdown Signal Descriptions....................................... 60
Table 33 Thermal Protection Signal Descriptions................................... 61
Table 34 SMBus Signal Description........................................................ 61
Table 35 General Purpose Serial Interface Signal Descriptions.............. 61
Table 36 Module Type Definition Signal Description ............................. 62
Table 37 Power and GND Signal Descriptions....................................... 63
Table 38 Bootstrap Signal Descriptions.................................................. 64

Copyright © 2021 congatec GmbH TA70m01 11/67
1 Introduction
COM Express™ is an open industry standard defined specifically for COMs (Computer-on-Modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84 mm x 55 mm
•Compact 95 mm x 95 mm
•Basic 125 mm x 95 mm
•Extended 155 mm x 110 mm
Table 1 COM Express™ 3.0 Pinout Types
Types Connector
Rows
PCIe Lanes PEG SATA Ports LAN ports USB 2.0/
SuperSpeed USB
Display Interfaces
Type 6 A-B C-D Up to 24 1 Up to 4 1 Up to 8 / 4 1VGA,LVDS/eDP, PEG, 3x DDI
Type 7 A-B C-D Up to 32 - Up to 2 5 (1x 1 Gb, 4x 10 Gb) Up to 4 / 4
Type 10 A-B Up to 4 - Up to 2 1 Up to 8 / 2 1LVDS/eDP, 1xDDI
1. The SuperSpeed USB ports (USB 3.0) are not in addition to the USB 2.0 ports. Ports that support SuperSpeed USB 3.0 also support USB 2.0.
The conga-TCA7 modules use the Type 6 pinout definition and comply with COM Express 3.0 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM integrates all the core components of a common PC and is mounted onto an application-specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all the
interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense
and optimized package, which results in a more reliable product while simplifying system integration.
Most importantly, COM Express™ modules are scalable. Once an application has been created, the product range can be diversified by using
different performance-class or form-factor size modules. Simply unplug one module and replace it with another; redesign is not necessary.

Copyright © 2021 congatec GmbH TA70m01 12/67
1.1 Options Information
The conga-TCA7 is available in eight variants (five commercial and three industrial). The table below shows the different configurations available.
Table 2 Commercial Variants
Part-No 049300 049301 049302 049320 049321
Processor Intel®Atom®x6425E
2.0 GHz, Quad Core
Intel®Atom®x6413E
1.5 GHz, Quad Core
Intel®Atom®x6211E
1.3 GHz, Dual Core
Intel®Pentium®J6426
2.0 GHz, Quad Core
Intel®Celeron®J6413
1.8 GHz, Quad Core
Burst Freq. 3.0 GHz 3.0 GHz 3.0 GHz 3.0 GHz 3.0 GHz
L2 Cache 1.5 MB 1.5 MB 1.5 MB 1.5 MB 1.5 MB
Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics
GFX Base/Burst Freq. 500 / 750 MHz 500 / 750 MHz 350 / 750 MHz 400 / 850 MHz 400 / 800 MHz
Memory (DDR4) 32 GB, 3200 MTps
dual channel
32 GB, 3200 MTps
dual channel
32 GB, 3200 MTps
dual channel
32 GB, 3200 MTps
dual channel
32 GB, 3200 MTps
dual channel
TPM (Discrete) Infineon SLB9670 Infineon SLB9670 Infineon SLB9670 Infineon SLB9670 Infineon SLB9670
SD Card 1x 4-bit 1x 4-bit 1x 4-bit 1x 4-bit 1x 4-bit
Max. TDP 12 W 9 W 6 W 10 W 10 W
Table 3 Industrial Variants
Part-No 049310 049311 049312
Processor Intel®Atom®x6425RE
1.9 GHz, Quad Core
Intel®Atom®x6414RE
1.5 GHz, Quad Core
Intel®Atom®x6212RE
1.2 GHz, Dual Core
Burst Freq. N.A N.A N.A
L2 Cache 1.5 MB 1.5 MB 1.5 MB
Graphics Intel®UHD Graphics Intel®HD Graphics 500 Intel®HD Graphics 505
GFX Base/Burst Freq. 400 MHz/ N.A 400 MHz/ N.A 350 MHz/ N.A
Memory (DDR4) 32 GB, 3200 MTps
dual channel
32 GB, 3200 MTps
dual channel
32 GB, 3200 MTps
dual channel
TPM (Discrete) Infineon SLB9670 Infineon SLB9670 Infineon SLB9670
SD Card 1x 4-bit 1x 4-bit 1x 4-bit
Max. TDP 12 W 9 W 6 W

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2 Specifications
2.1 Feature List
Table 4 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 revision 3.0 (Compact size 95 x 95 mm)
Processor Intel®Atom®, Pentium®and Celeron SoCs
Memory Two memory sockets (located on the top and bottom side). Supports
-SO-DIMM non-ECC DDR4 modules
-Data rates up to 3200 MT/s
-Maximum 32 GB capacity
Chipset Integrated in the SoC
Audio High Definition Audio
Ethernet 1x Gigabit Ethernet with TSN support via TI DP83867E Ethernet PHY
Graphics
Options
Intel® UHD (Gen 11). Supports:
-API (DirectX 12.1, OpenGL 4.5, OpenCL 1.2, OpenGL ES 3.1, Vulkan 1.0)
-Intel®QuickSync & Clear Video Technology HD (hardware accelerated video decode/encode/processing/transcode)
-Up to 3 independent displays (must be two DDI’s and one eDP/DSI/LVDS)
1x LVDS (dual channel)
2x DP++ (DP/HDMI/DVI)
Optional 1x eDP 1.3 1,2
Peripheral
Interfaces
6x PCIe®Gen3 ports
2x SATA®(6 Gbps)
8x USB 2.0 (Up to 2x USB 3.1 Gen 2)
2x UART
GPIOs/SDIO
Optional eMMC 5.1 2
LPC
SPI
I²C (fast mode, multi-master)
SM Bus
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control, I2C bus,
Power loss control
BIOS AMI Aptio®V UEFI 2.x firmware, 32 MB serial SPI with congatec Embedded BIOS features
Power
Management
ACPI 5.0 compliant with battery support.
S5e mode (see section 6.3.6 "Enhanced Soft-Off State"
Also supports Suspend to RAM (S3)
Configurable TDP
Storage Optional eMMC 5.1
Security Discrete SPI TPM 2.0 (Infineon SLB9670)
Note
1. Variants with optional eDP do not support LVDS
2. Not available by default (assembly option)

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2.2 Supported Operating Systems
The conga-TCA7 supports the following operating systems
•Microsoft®Windows®10 IoT Enterprise (64-bit)
•Linux Ubuntu (64-bit)
•Android 10 (64-bit)
•Yocto (64-bit)
•RTS Hypervisor
Note
Windows®10 installation requires a minimum storage capacity of 20 GB. We will not offer installation support for systems with less than 20 GB
storage space.
2.3 Mechanical Dimensions
The conga-TCA7 has the following dimensions:
•length of 95 mm
•width of 95 mm
The overall height (module, heatspreader and stack) is shown below:
4.00
Heatspreader
Module PCB
Carrier Board PCB
7.00
5.00 1.60
4.50
13.00
18.00

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2.4 Supply Voltage Standard Power
The conga-TCA7 provides a standard supply voltage of 12 V DC ± 5%.
Note
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module's connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin
Current Capability
(Ampere)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.5-3.3 +/- 20
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

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2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
2.5 Power Consumption
The power consumption values were measured with the following setup:
•Input voltage +12 V
•conga-TCA7 COM
•modified congatec carrier board
•conga-TCA7 cooling solution
•Microsoft®Windows®10 IoT Enterprise
Note
The CPU was stressed to its maximum workload.
Table 5 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during desktop idle
S0: Maximum value Highest frequency mode (HFM/Turbo Boost) The CPU was stressed to its maximum frequency.
S0: Peak value Highest current spike during the measurement of “S0: Maximum value”. This
state shows the peak value during runtime.
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V_SBY
S5 COM is powered by VCC_5V_SBY
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

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Table 6 Power Consumption Values
The table below provides additional information about the conga-TCA7 power consumption. The values are recorded at various operating
modes.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64 bit)
CPU Current (A)
Variant Cores Freq/Turbo (GHz) S0:Min S0: Max S0: Peak S3 S5
049300 3 x 4 GB TBD TBD Windows 10 Intel®Atom®x6425E 4 2.0 / 3.0 TBD TBD TBD TBD TBD
049301 3 x 4 GB TBD TBD Windows 10 Intel®Atom®x6413E 4 1.5 / 3.0 TBD TBD TBD TBD TBD
049302 3x 4 GB TBD TBD Windows 10 Intel®Atom®x6211E 2 1.3 / 3.0 TBD TBD TBD TBD TBD
049310 3 x 4 GB TBD TBD Windows 10 Intel®Atom®x6425RE 4 1.9 / N.A TBD TBD TBD TBD TBD
049311 3 x 4 GB TBD TBD Windows 10 Intel®Atom®x6414RE 4 1.5 / N.A TBD TBD TBD TBD TBD
049312 3 x 4 GB TBD TBD Windows 10 Intel®Atom®x6212RE 2 1.2 / N.A TBD TBD TBD TBD TBD
049320 3 x 4 GB TBD TBD Windows 10 Intel®Pentium® J6425 4 2.0 / 3.0 TBD TBD TBD TBD TBD
049321 3 x 4 GB TBD TBD Windows 10 Intel®Celeron®J6413 4 1.8 / 3.0 TBD TBD TBD TBD TBD
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 7 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC TBD µA
20oC 3V DC TBD µA
70oC 3V DC TBD µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec GmbH website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TCA7.

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2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -40° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

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3 Block Diagram
Intel
®
Atom
®
x6000E,
Intel Pentium
®
and
Celeron
®
N and J
Series Processors
(Elkhart Lake)
SM BusMGMNT
DDR4 ECC
DDI 0
DDI 1
DDI 2
SM Bus
UART0
UART1
PCIe Gen. 3
eSPI
SATA 6G
RGMII
USB 2.0
USB 3.1
HDA
SPI
SDIO
congatec
Board
Controller
5
th
Generation
Dual Channel SO-DIMM
ECC / non ECC
SPI Flash 0 TPM
GbE PHY (10/100/1000)
TI DP83867XS
MUX
MUX
eDP to LVDS
Bridge
eSPI to LPC
(UECE1200)
GPIO
LPC
UART
SMBus
I2C
LID/SLEEP/FAN
Ethernet
SPI
LPC
UART0
UART1
SM Bus
HDA
I2C Bus
USB 2.0 Ports 0 - 7
SATA Ports 0 - 2
GPIO/SDIO
LID# / SLEEP# / FAN
PCIe lanes 0 - 7
USB 3.1 Ports 0 - 3
DP++ (DP/HDMI/DVI)
DP++ (DP/HDMI/DVI)
LVDS/eDP
eDP Assembly Option

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4 Cooling Solutions
congatec GmbH offers the following cooling solutions for the conga-TCA7. The dimensions of the cooling solutions are shown in the
sub-sections. All measurements are in millimeters.
Table 8 Cooling Solution Variants
Cooling Solution Part No Description
1 HSP 049350 Heatspreader with 2.7 mm bore-hole standoffs for lidded Intel Atom CPU variants
049351 Heatspreader with M2.5 mm threaded standoffs for lidded Intel Atom CPU variants
049354 Heatspreader with 2.7 mm bore-hole standoffs for bare-die Intel Pentium and Celeron CPU variants
049355 Heatspreader with M2.5 mm threaded standoffs for bare-die Intel Pentium and Celeron CPU variants
2 CSP 049352 Passive cooling with 2.7 mm bore-hole standoffs for lidded Intel Atom CPU variants
049353 Passive cooling with M2.5 mm threaded standoffs for lidded Intel Atom CPU variants
049356 Passive cooling with 2.7 mm bore-hole standoffs for bare-die Intel Pentium and Celeron CPU variants
049357 Passive cooling with M2.5 mm threaded standoffs for bare-die Intel Pentium and Celeron CPU variants
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.