Congatec COM Express conga-TC87 User manual

Copyright © 2013 congatec AG TU87m10 1/108
COM Express™ conga-TC87
4th Generation Intel®Core™ i7, i5, i3 and Mobile Intel® Celeron Single Chip Ultra Low TDP Processors
User’s Guide
Revision 1.0

Copyright © 2013 congatec AG TU87m10 2/108
Revision History
Revision Date (yyyy.mm.dd) Author Changes
0.1 2013.11.14 AEM • Preliminary release
1.0 2014.03.27 AEM • Updated section 2.5 “Power Consumption”.
• Updated section 3 “Block Diagram”.
• Corrected the name of the congatec board controller in section 5.1.6 “I2C Bus Fast Mode”.
• Corrected pins D63 and D64 in section 8.4 “C-D Connector Pinout”.
• Added section 10 “BIOS Setup Description”.
• Ofcial release.

Copyright © 2013 congatec AG TU87m10 3/108
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-TC87. It is
one of three documents that should be referred to when designing a COM Express™ application. The other reference documents that should
be used include the following:
COM Express™ Design Guide
COM Express™ Specication
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specication, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or tness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualied personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive elds unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2013 congatec AG TU87m10 4/108
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Terminology
Term Description
GB Gigabyte (1,073,741,824 bytes)
GHz Gigahertz (one billion hertz)
kB Kilobyte (1024 bytes)
MB Megabyte (1,048,576 bytes)
Mbit Megabit (1,048,576 bits)
kHz Kilohertz (one thousand hertz)
MHz Megahertz (one million hertz)
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
PEG PCI Express Graphics
PCH Platform Controller Hub
eDP Embedded DisplayPort
T.O.M. Top of memory = max. DRAM installed
HDA High Denition Audio
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2013 congatec AG TU87m10 5/108
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not afliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
tness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.

Copyright © 2013 congatec AG TU87m10 6/108
Certication
congatec AG is certied to DIN EN ISO 9001 standard.
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you rst visit our website at www.congatec.com for the latest documentation, utilities and
drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support
department by email at [email protected]
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Copyright © 2013 congatec AG TU87m10 7/108
Contents
1 INTRODUCTION ..................................................................... 10
2 Specications........................................................................... 12
2.1 Feature List .............................................................................. 12
2.2 Supported Operating Systems................................................. 13
2.3 Mechanical Dimensions ........................................................... 13
2.4 Supply Voltage Standard Power .............................................. 14
2.4.1 Electrical Characteristics.......................................................... 14
2.4.2 Rise Time ................................................................................. 14
2.5 Power Consumption................................................................. 15
2.5.1 Intel®Core™ i7-4650U 1.7 GHz Dual Core™ 4MB Cache ..... 16
2.5.2 Intel® Core™ i5-4300U 1.9 GHz Dual Core™ 3MB Cache ..... 16
2.5.3 Intel®Core™ i3-4010U 1.7 GHz Dual Core™ 3MB Cache ..... 17
2.5.4 Intel®Celeron® 2980U 1.6 GHz Dual Core™ 2MB Cache ....... 17
2.6 Supply Voltage Battery Power ................................................. 17
2.6.1 CMOS Battery Power Consumption ........................................ 18
2.7 Environmental Specications................................................... 18
3 Block Diagram.......................................................................... 19
4 Heatspreader ........................................................................... 20
4.1 Heatspreader Dimensions ....................................................... 21
5 Connector Subsystems Rows A, B, C, D ................................. 22
5.1 Primary Connector Rows A and B............................................ 23
5.1.1 Serial ATA™ (SATA)................................................................. 23
5.1.2 USB 2.0.................................................................................... 23
5.1.3 High Denition Audio (HDA) Interface...................................... 23
5.1.4 Gigabit Ethernet ...................................................................... 23
5.1.5 LPC Bus................................................................................... 24
5.1.6 I²C Bus Fast Mode ................................................................... 24
5.1.7 PCI Express™ ......................................................................... 24
5.1.8 ExpressCard™......................................................................... 24
5.1.9 Graphics Output (VGA/CRT) ................................................... 24
5.1.10 LCD (LVDS/eDP) ..................................................................... 25
5.1.11 General Purpose Serial Interface............................................. 25
5.1.12 Power Control .......................................................................... 26
5.1.13 Power Management................................................................. 29
5.2 Secondary Connector Rows C and D ...................................... 30
5.2.1 PCI Express™ ......................................................................... 30
5.2.2 PCI Express Graphics (PEG)................................................... 30
5.2.3 Digital Display Interface ........................................................... 30
5.2.3.1 HDMI........................................................................................ 31
5.2.3.2 DVI ........................................................................................... 31
5.2.3.3 DisplayPort (DP) ...................................................................... 31
5.2.4 USB 3.0.................................................................................... 32
6 Additional Features .................................................................. 33
6.1 congatec Board Controller (cBC) ............................................. 33
6.2 Board Information .................................................................... 33
6.3 Watchdog ................................................................................. 33
6.4 I2C Bus ..................................................................................... 33
6.5 Power Loss Control.................................................................. 33
6.6 Embedded BIOS ...................................................................... 34
6.6.1 CMOS Backup in Non Volatile Memory ................................... 34
6.6.2 OEM CMOS Default Settings and OEM BIOS Logo................ 34
6.6.3 OEM BIOS Code...................................................................... 34
6.6.4 congatec Battery Management Interface ................................. 35
6.6.5 API Support (CGOS/EAPI) ...................................................... 35
6.7 Security Features..................................................................... 36
6.8 Suspend to Ram ...................................................................... 36
7 conga Tech Notes .................................................................... 37
7.1 Intel®PCH-LP Features ........................................................... 37
7.1.1 Intel®Rapid Storage Technology ............................................ 37
7.1.1.1 AHCI ........................................................................................ 37
7.1.1.2 RAID ........................................................................................ 37
7.1.1.3 Intel®Smart Response Technology ......................................... 37
7.1.2 Intel®Rapid Start Technology .................................................. 38
7.2 Intel®Processor Features ........................................................ 38
7.2.1 Intel®Turbo Boost Technology ................................................. 38
7.2.2 Thermal Monitor and Catastrophic Thermal Protection ........... 39
7.2.3 Processor Performance Control............................................... 39
7.2.4 Intel®64 Architecture................................................................ 40

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7.2.5 Intel®Virtualization Technology................................................ 41
7.2.6 Thermal Management.............................................................. 41
7.3 ACPI Suspend Modes and Resume Events ............................ 42
7.4 Low Voltage Memory (DDR3L) ................................................ 42
7.5 USB 2.0 EHCI Host Controller Support ................................... 43
8 Signal Descriptions and Pinout Tables..................................... 44
8.1 A-B Connector Signal Descriptions.......................................... 45
8.2 A-B Connector Pinout .............................................................. 54
8.3 C-D Connector Signal Descriptions ......................................... 56
8.4 C-D Connector Pinout.............................................................. 65
8.5 Boot Strap Signals ................................................................... 67
9 System Resources................................................................... 68
9.1 I/O Address Assignment........................................................... 68
9.1.1 LPC Bus................................................................................... 68
9.2 PCI Conguration Space Map ................................................. 69
9.3 PCI Interrupt Routing Map ....................................................... 70
9.4 I²C Bus ..................................................................................... 70
9.5 SM Bus .................................................................................... 70
10 BIOS Setup Description ........................................................... 71
10.1 Entering the BIOS Setup Program........................................... 71
10.1.1 Boot Selection Popup .............................................................. 71
10.2 Setup Menu and Navigation..................................................... 71
10.3 Main Setup Screen .................................................................. 72
10.3.1 Platform Information Submenu ................................................ 73
10.4 Advanced Setup....................................................................... 73
10.4.1 Graphics Submenu .................................................................. 74
10.4.1.1 GOP Conguration Submenu .................................................. 76
10.4.2 Watchdog Submenu................................................................. 76
10.4.3 Module Serial Ports Submenu ................................................. 78
10.4.4 Hardware Health Monitoring Submenu.................................... 78
10.4.5 PCI & PCI Express Submenu .................................................. 78
10.4.5.1 PCI Express Settings Submenu............................................... 79
10.4.5.2 PIRQ Routing & IRQ Reservation Submenu ........................... 80
10.4.5.3 PCI Express Port Submenu ..................................................... 81
10.4.6 ACPI Submenu ........................................................................ 82
10.4.7 RTC Wake Submenu ............................................................... 83
10.4.8 Trusted Computing Submenu .................................................. 84
10.4.9 CPU Submenu ......................................................................... 84
10.4.10 SATA Submenu ........................................................................ 88
10.4.10.1 Software Feature Mask Conguration Submenu ..................... 89
10.4.11 Intel(R) Rapid Start Technology Submenu............................... 89
10.4.12 Acoustic Management Submenu ............................................. 90
10.4.13 USB Submenu ......................................................................... 91
10.4.14 SMART Settings Submenu ...................................................... 93
10.4.15 Super I/O Submenu ................................................................. 93
10.4.16 Serial Port Console Redirection Submenu .............................. 94
10.4.16.1 Console Redirection Settings Submenu .................................. 94
10.4.17 UEFI Network Stack Submenu ................................................ 95
10.4.18 Intel (R) Ethernet Connection I218-LM Submenu.................... 95
10.4.19 NIC Conguration Submenu .................................................... 96
10.5 Chipset Setup .......................................................................... 96
10.5.1 Platform Controller Hub (PCH) Submenu................................ 96
10.5.2 Processor (Integrated Components) Submenu ....................... 98
10.5.2.1 DMI Conguration Submenu.................................................... 98
10.5.2.2 Memory Conguration Submenu ............................................. 99
10.5.2.3 GT - Power Management Control Submenu.......................... 100
10.6 Boot Setup ............................................................................. 101
10.6.1 Boot Settings Conguration ................................................... 101
10.6.1.1 CSM & Option ROM Control Submenu.................................. 103
10.7 Security Setup........................................................................ 104
10.7.1 Security Settings .................................................................... 104
10.7.1.1 Hard Disk Drive (HDD) Security Conguration ...................... 104
10.7.1.2 Secure Boot Menu ................................................................. 104
10.8 Save & Exit Menu .................................................................. 104
11 Additional BIOS Features ...................................................... 106
11.1 Supported Flash Devices....................................................... 106
11.2 Updating the BIOS ................................................................. 106
11.3 BIOS Security Features ......................................................... 107
11.4 Hard Disk Security Features .................................................. 107
12 Industry Specications ........................................................... 108

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9/108
List of Tables
Table 1 Feature Summary .................................................................... 12
Table 2 Display Combination (U-processor line) .................................. 30
Table 3 Signal Tables Terminology Descriptions .................................. 44
Table 4 Intel® High Denition Audio Link Signals Descriptions ............. 45
Table 5 Gigabit Ethernet Signal Descriptions ....................................... 45
Table 6 Serial ATA Signal Descriptions ................................................. 46
Table 7 PCI Express Signal Descriptions (general purpose)................ 47
Table 8 ExpressCard Support Pins Signal Descriptions....................... 47
Table 9 LPC Signal Descriptions .......................................................... 48
Table 10 USB Signal Descriptions.......................................................... 48
Table 11 CRT Signal Descriptions.......................................................... 49
Table 12 LVDS Signal Descriptions ........................................................ 49
Table 13 Embedded DisplayPort Signal Descriptions ............................ 50
Table 14 SPI BIOS Flash Interface Signal Descriptions ......................... 50
Table 15 Miscellaneous Signal Descriptions .......................................... 51
Table 16 General Purpose I/O Signal Descriptions ................................ 51
Table 17 Power and System Management Signal Descriptions ............. 52
Table 18 General Purpose Serial Interface Signal Descriptions............. 52
Table 19 Power and GND Signal Descriptions ....................................... 53
Table 20 Connector A-B Pinout .............................................................. 54
Table 21 PCI Express Signal Descriptions (general purpose)................ 56
Table 22 USB 3.0 Signal Descriptions.................................................... 56
Table 23 PCI Express Signal Descriptions (x16 Graphics)..................... 57
Table 24 DDI Signal Description............................................................. 59
Table 25 HDMI Signal Descriptions ........................................................ 61
Table 26 DisplayPort (DP) Signal Descriptions ...................................... 62
Table 27 Module Type Denition Signal Description .............................. 64
Table 28 Power and GND Signal Descriptions ....................................... 64
Table 29 Connector C-D Pinout.............................................................. 65
Table 30 Boot Strap Signal Descriptions ................................................ 67
Table 31 PCI Conguration Space Map ................................................. 69
Table 32 PCI Interrupt Routing Map ....................................................... 70

Copyright © 2013 congatec AG TU87m10 10/108
1 INTRODUCTION
COM Express™ Concept
COM Express™ is an open industry standard dened specically for COMs (computer on modules). Its creation provides the ability to make a
smooth transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form
factors:
• Compact 95mm x 95mm
• Basic 125mm x 95mm
• Extended 155mm x 110mm
The COM Express™ specication 2.1 denes seven different pinout types.
Types Connector Rows PCI Express Lanes PCI IDE Channels LAN ports USB 2.0/
USB 3.0
Display Interfaces
Type 1 A-B Up to 6 1 8 / 0 VGA, LVDS
Type 2 A-B C-D Up to 22 32 bit 1 1 8 / 0 VGA, LVDS,PEG/SDVO
Type 3 A-B C-D Up to 22 32 bit 3 8 / 0 VGA,LVDS,PEG/SDVO
Type 4 A-B C-D Up to 32 1 1 8 / 0 VGA,LVDS,PEG/SDVO
Type 5 A-B C-D Up to 32 3 8 / 0 VGA,LVDS,PEG/SDVO
Type 6 A-B C-D Up to 24 1 8 / 4 VGA,LVDS,PEG, 3x DDI
Type 10 A-B Up to 4 1 8 / 0 1x DDI
The conga-TC87 modules use the Type 6 pinout denition and comply with COM Express 2.1 specication. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM (computer on module) integrates all the core components and is mounted onto an application specic carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The Type 6 pinout provides the ability to offer PCI Express, Serial ATA, and LPC options thereby expanding
the range of potential peripherals. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specic peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use

Copyright © 2013 congatec AG TU87m10 11/108
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
conga-TC87 Options Information
The conga-TC87 is currently available in four variants. This user’s guide describes all of these variants. The table below show the different
congurations available. Check for the Part No. that applies to your product. This will tell you what options described in this user’s guide are
available on your particular module.
conga-TC87
Part-No. 046901 046902 046903 046904
Processor Intel®Core™ i7-4650U 1.7
GHz Dual Core™
Intel® Core™ i5-4300U 1.9 GHz
Dual Core™
Intel®Core™ i3-4010U 1.7 GHz
Dual Core™
Intel®Celeron® 2980U
1.6 GHz Dual Core™
Intel®Smart Cache 4 MByte 3 MByte 3 MByte 2 MByte
Max. Turbo Frequency 3.3 GHz 2.9 GHz N.A N.A
Processor Graphics Intel®HD graphics 5000 (GT3) Intel®HD graphics 4400 (GT2) Intel®HD graphics 4400 (GT2) Intel®HD graphics (GT2)
Graphics Max. Dynamic Freq 1.1 GHz 1.1 GHz 1.0 GHz 1.0 GHz
PEG No No No No
LVDS Yes Ye s Yes Yes
DisplayPort (DP) Yes Ye s Yes Yes
HDMI Yes Ye s Yes Yes
Processor TDP (Max) 15 W 15 W 15 W 15 W

Copyright © 2013 congatec AG TU87m10 12/108
2 Specications
2.1 Feature List
Table 1 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 Rev. 2.1 (Compact size 95 x 95 mm).
Processor Intel®Core™ i7-4650U 1.7 GHz Dual Core™ with 4-MByte Intel®Smart Cache
Intel® Core™ i5-4300U 1.9 GHz Dual Core™ with 3-MByte Intel®Smart Cache
Intel®Core™ i3-4010U 1.7 GHz Dual Core™ with 3-MByte Intel®Smart Cache
Intel®Celeron® 2980U 1.6 GHz Dual Core™ with 2-MByte Intel®Smart Cache
Memory 2 sockets: SO-DIMM DDR3L (Low voltage @ 1.35V) up to 1600MT/s, with 16GB maximum capacity. Sockets located top and bottom side of module.
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, BIOS setup data backup, I2C bus, Power
loss control.
Chipset Intel®8 Series PCH-LP integrated in the Multi-Chip Package (MCP).
Audio High Denition Audio (HDA)/digital audio interface with support for multiple codecs
Ethernet Gigabit Ethernet support via the onboard Intel®l218LM GbE Phy. Also offers AMT 9.5 support.
Graphics Options Next Generation Intel® HD Graphics (4400/5000) with support for Intel®Clear Video Technology (HD encode/transcode, Blu-ray playback), DirectX
Video Acceleration (full AVC/VC1/MPEG2 hardware decode), OpenGL 4.0 and DirectX11.1. Up to 3 independent displays supported (Must be two DDI’s
(DP, HDMI/DVI) plus one eDP/LVDS)
• LVDS (Integrated at panel interface with 25-112MHz single/dual-channel
LVDS Transmitter). Supports:
• Single-channel LVDS interface: 1 x 18 bpp or 1 x 24 bpp.
• Dual channel LVDS interface: 2 x 18 bpp or 2 x 24 bpp panel.
• VESA LVDS color mappings
• Automatic Panel Detection via Embedded Panel Interface based on
VESA EDID™ 1.3.
• Resolution up to 1920x1200 in dual LVDS bus mode.
• Optional eDP interface
(NOTE: Either eDP or LVDS signals supported. Both not supported).
• DisplayPort 1.1 (DP): 2x DisplayPorts ports on digital ports B, C.
Multiplexed with HDMI/DVI ports. Hot-Plug detect support.
• HDMI 1.4: 2x HDMI ports on digital ports B, C. Multiplexed with
DisplayPort (DP)/DVI. Hot-plug detect support.
• DVI: 2x DVI ports on digital ports B, C. Multiplexed with HDMI/DP
ports. Hot-Plug detect support.
• Optional VGA interface
(NOTE: This option is offered on digital port C and supported only on rev.
C.x. and later. The display combination for revisions with VGA support is
1x DDI, 1x VGA and 1x eDP).
Peripheral
Interfaces
• 4x Serial ATA®6Gb/s with RAID support 0/1/5/10 (Celeron variant
supports only 2x SATA 6Gb/s)
• 4 PCI Express®Lanes. Support for full 5 Gb/s bandwidth in each direction
per x1 links. (can be congured via special/customized BIOS rmware to
support four x1 and one x4 links.
• 8x USB 2.0 (EHCI)
• 2x USB 3.0 (XHCI)
• 2x Serial Interface (UART0/1)
• LPC Bus
• I²C Bus, Fast Mode, multi-master
• SM Bus
• SPI
• GPIOs
BIOS AMI Aptio® UEFI 2.x rmware, 8/16 MByte serial SPI with congatec Embedded BIOS features.
Power Management • ACPI 4.0 compliant with battery support. Also supports Suspend to RAM (S3) and Intel AMT 9.5.
• Congurable TDP
• Ultra low standby power consumption, Deep Sx.
Security Optional discrete Trusted Platform Module “TPM”, new AES Instructions for faster and better encryption.

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Note
Some of the features mentioned in the above feature summary are optional. Check the article number of your module and compare it to the
option information list on page 11 of this user’s guide to determine what options are available on your particular module.
2.2 Supported Operating Systems
The conga-TC87 supports the following operating systems.
• Microsoft®Windows® 8
• Microsoft®Windows®7
• Microsoft®Windows®Embedded Standard
• Linux
2.3 Mechanical Dimensions
• 95.0 mm x 95.0 mm (3.74” x 3.74”)
• Height approximately 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm
(height) carrier board connector is used, then approximate overall height is 18mm. If the 8mm (height) carrier board connector is
used, then approximate overall height is 21mm.
4.00
Heatspreader
Module PCB
Carrier Board PCB
7.00
5.00 2.00
4.50
13.0018.00

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2.4 Supply Voltage Standard Power
• 12V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Power Rail Module Pin Current
Capability (Amps)
Nominal Input
(Volts)
Input Range
(Volts)
Derated Input
(Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input Power
(w. derated input)
(Watts)
Assumed
Conversion
Efciency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that, during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

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2.5 Power Consumption
The power consumption values listed in this document were measured under a controlled environment. The hardware used for testing includes
a conga-TC87 module, conga-TEVAL carrier board, hdmi-equipped LCD monitor, SATA SSD drive, and USB keyboard/mouse. The SATA drive
was powered externally by an ATX power supply so that it does not inuence the power consumption value that is measured for the module.
To ensure that only the power consumption of the CPU module is measured, the conga-TEVAL power consumption was determined before the
measurement and subtracted from the overall power consumption value measured.
The USB keyboard/mouse were detached once the module was congured within the OS. All recorded values were averaged over a 30
second time period. Cooling of the module was done by the module specic heatspreader and a fan cooled heatsink to measure the power
consumption under normal thermal conditions.
Each module was measured while running Windows 7 Professional 64Bit, Hyper Threading enabled, Speed Step enabled, CPU Turbo Mode
enabled and Power Plan set to “Power Saver”. This setting ensures that Core™ processors run in LFM (lowest frequency mode) with minimal
core voltage during desktop idle. Each module was tested while using two 2GB memory modules. Using different sizes of RAM, as well as one
or two memory modules, will cause slight variances in the measured results.
To measure the worst case power consumption the cooling solution was removed and the CPU core temperature was allowed to run up to
between 90° and 95°C while running 100% workload with the Power Plan set to “Balanced”. The peak current value was then recorded. This
value should be taken into consideration when designing the system’s power supply to ensure that the power supply is sufcient during worst
case scenarios.
Power consumption values were recorded during the following stages:
Windows 7 (64 bit)
• Desktop Idle (power plan = Power Saver)
• 100% CPU workload (see note below, power plan = Power Saver)
• 100% CPU workload at approximately 100°C peak power consumption (power plan = Balanced)
• Suspend to RAM. Supply power for S3 mode is 5V.
Note
A software tool was used to stress the CPU to Max Turbo Frequency.

Copyright © 2013 congatec AG TU87m10 16/108
Processor Information
The tables below provide additional information about the power consumption data for each of the conga-TC87 variants offered. The values
are recorded at various operating mode.
2.5.1 Intel®Core™ i7-4650U 1.7 GHz Dual Core™ 4MB Cache
conga-TC87 Art. No. 046901
(GT3 Graphics)
Intel®Core™ i7-4650U 1.7 GHz 2 Core™ 4MB Intel®Smart Cache
22nm
Layout Rev. TU87LB1 /BIOS Rev. TU87R005
Max Turbo Frequency 3.3 GHz
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amperes/Watts) Desktop Idle 0.23 A/2.8 W (12V) Suspend to Ram (S3) 5V Input
Power
0.06 A/0.3 W (5V)
100% workload
(turbo mode disabled)
1.00 A/12.0 W (12V) 100% Workload
(turbo mode enabled)
2.30 A/27.6 W (12V)
100% CPU and GPU workload
(turbo mode disabled)
1.59 A/19.1 W (12V) 100% CPU and GPU workload
(turbo mode enabled)
2.41 A/28.9 W (12V)
Peak Power Consumption 2.14 A/28.9 W (12V)
2.5.2 Intel®Core™ i5-4300U 1.9 GHz Dual Core™ 3MB Cache
conga-TC87 Art. No. 046902
(GT2 Graphics)
Intel®Core™ i5-4300U 1.9 GHz 2 Core™ 3MB Intel®Smart Cache
22nm
Layout Rev. TU87LB1 /BIOS Rev. TU87R005
Max Turbo Frequency 2.9 GHz
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amperes/Watts) Desktop Idle 0.28 A/3.4 W (12V) Suspend to Ram (S3) 5V Input
Power
0.06 A/0.3 W (5V)
100% workload
(turbo mode disabled)
1.28 A/15.3 W (12V) 100% Workload
(turbo mode enabled)
1.95 A/23.4 W (12V)
100% CPU and GPU workload
(turbo mode disabled)
1.53 A/18.4 W (12V) 100% CPU and GPU workload
(turbo mode enabled)
N.A
Peak Power Consumption 1.95 A/23.4 W (12V)

Copyright © 2013 congatec AG TU87m10 17/108
2.5.3 Intel®Core™ i3-4010U 1.7 GHz Dual Core™ 3MB Cache
conga-TC87 Art. No. 046903
(GT2 Graphics)
Intel®Core™ i3-4010U 1.7 GHz 2 Core™ 3MB Intel®Smart Cache
22nm
Layout Rev. TU87LB1 /BIOS Rev. TU87R005
Max Turbo Frequency N.A
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amperes/Watts) Desktop Idle 0.23 A/2.8 W (12V) Suspend to Ram (S3) 5V Input
Power
0.06 A/0.3 W (5V)
100% workload
(turbo mode disabled)
0.99 A/11.9 W (12V) 100% Workload
(turbo mode enabled)
N.A
100% CPU and GPU workload
(turbo mode disabled)
1.52 A/18.2 W (12V) 100% CPU and GPU workload
(turbo mode enabled)
N.A
Peak Power Consumption 1.67 A/20.0 W (12V)
2.5.4 Intel®Celeron®2980U 1.6 GHz Dual Core™ 2MB Cache
conga-TC87 Art. No. 046904
(GT2 Graphics)
Intel®Celeron®2980U 1.6 GHz 2 Core™ 2MB Intel®Smart Cache
22nm
Layout Rev. TU87LB1 /BIOS Rev. TU87R005
Max Turbo Frequency N.A
Memory Size 2 x 2GB
Operating System Windows 7 (64 bit)
Power Consumption (Amperes/Watts) Desktop Idle TBD Suspend to Ram (S3) 5V Input
Power
TBD
100% workload
(turbo mode disabled)
TBD 100% Workload
(turbo mode enabled)
N.A
100% CPU and GPU workload
(turbo mode disabled)
TBD 100% CPU and GPU workload
(turbo mode enabled)
N.A
Peak Power Consumption TBD
2.6 Supply Voltage Battery Power
• 2.0V-3.5V DC
• Typical 3V DC

Copyright © 2013 congatec AG TU87m10 18/108
2.6.1 CMOS Battery Power Consumption
RTC @ 20ºC Voltage Current
Integrated in the Intel®8 Series PCH-LP 3V DC 9 µA
The CMOS battery power consumption value listed above should not be used to calculate CMOS battery lifetime. You should measure the
CMOS battery power consumption in your customer specic application in worst case conditions, for example during high temperature and high
battery voltage. The self-discharge of the battery must also be considered when determining CMOS battery lifetime. For more information about
calculating CMOS battery lifetime refer to application note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com.
2.7 Environmental Specications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a heatspreader, the maximum operating temperature
refers to any measurable spot on the heatspreader’s surface.
congatec AG strongly recommends that you use the appropriate congatec module heatspreader as a thermal interface between the module
and your application specic cooling solution.
If for some reason it is not possible to use the appropriate congatec module heatspreader, then it is the responsibility of the operator to ensure
that all components found on the module operate within the component manufacturer’s specied temperature range.
For more information about operating a congatec module without heatspreader, contact congatec technical support.
Humidity specications are for non-condensing conditions.

Copyright © 2013 congatec AG TU87m10 19/108
3 Block Diagram
Intel® ULT SOC (CPU + PCH)
Integrated Intel HD Graphics
Vector Graphics
3D
Turbo Boost 2.0 Technology
HT Technology
AVX2
AES-NI
SSE4.2 TSX
VT
64 Architecture
TXT
2D DXVA
MPEG-2
Video Codecs APIs
Hardware Graphics Accelerators
DisplayPort 1.2 HDMI 1.4 (3D, 4k)
Digital Display Interfaces
4th Generaon Intel® Core™ Processor
WMV9
H.264
OpenCL 1.2
DirectX 11.1
OpenGL 4.0
Intel® 8 Series PCH-LP
Digital Display Signals
High Definion Audio
ASRC
DDC AUX CH Hot Plug Detect
SATA USB 2.0
LPC BusPCIe
I/O Interfaces
GPIOs
USB 3.0
MGMNT
PECI
Dual Channel DDR3L
eDP
Low Power Interconnect
PCIe0
PCIe1
PCIe2
PCIe3
PCIe5-L0
PCIe5-L1
PCIe5-L2
eDP to LVDS
Bridge
HUB
congatec System
Management
Controller
X
X
X
X
X
X
PCIe5-L3
X
X
X X
X
X
2x SO-DIMM (X1/X2)
SPI Flash
0
SPI Flash
1
LVDS/eDP
VGA supported only on rev. C.x and later
Ethernet 10/100/1000
Intel I218LM
Oponal DP to VGA
(Only on rev. C.x and later)
TPM
XDP
LPC
I2C
SATA0 - SATA3
USB 2.0
SM Bus
UART0/1
Ethernet
CRT
LVDS/eDP
COM Express
Type 6
A-B Connector
LPC Bus
HDA I/F
SER0/1
USB Port 0..7
SATA Port 0
SATA Port 1
SATA Port 2
SATA Port 3
GPIOs
I2C Bus
SM Bus
SPI
SPI
LID#/SLEEP#
FAN control
CRT
PCIe Port 0
PCIe Port 1
PCIe Port 2
PCIe Port 3
PCIe Port 4
PCIe Port 5
USB 3.0 Port 0
USB 3.0 Port 1
USB 3.0 Port 2
USB 3.0 Port 3
(TX BC)
congatec custom
PCIe Port 6
PCIe Port 7
COM Express
Type 6
C-D Connector
PEG x16
DP/HDMI Port C
DP/HDMI Port B
DP/HDMI Port D

Copyright © 2013 congatec AG TU87m10 20/108
4 Heatspreader
An important factor for each system integration is the thermal design. The heatspreader acts as a thermal coupling device to the module and
its aluminum plate is 4mm thick. The heatspreader is thermally coupled to the CPU and other heat generating components via a heat pipe.
Although the heatspreader is the thermal interface where most of the heat generated by the module is dissipated, it is not to be considered
as a heatsink. It has been designed to be used as a thermal interface between the module and the application specic thermal solution. The
application specic thermal solution may use heatsinks with fans, and/or heat pipes, which can be attached to the heatspreader. Some thermal
solutions may also require that the heatspreader is attached directly to the systems chassis thereby using the whole chassis as a heat dissipater.
For additional information about the conga-TC87 heatspreader, refer to section 4.1 of this document.
Caution
There are mounting holes on the heatspreader designed to attach the heatspreader to the module. These mounting holes must be used
to ensure that all components that are required to make contact with heatspreader do so. Failure to use these mounting holes will result in
improper contact between these components and heatspreader thereby reducing heat dissipation efciency.
Attention must be given to the mounting solution used to mount the heatspreader and module into the system chassis. Do not use a threaded
heatspreader together with threaded carrier board standoffs. The combination of the two threads may be staggered, which could lead to
stripping or cross-threading of the threads in either the standoffs of the heatspreader or carrier board.