Congatec conga-QEVAL/Qseven 2.0 User manual
Copyright © 2014 congatec AG QEV2m11 1/49
conga-QEVAL /Qseven®2.0
Detailed description of the congatec Qseven®2.0 evaluation carrier board
User's Guide
Revision 1.1
Copyright © 2014 congatec AG QEV2m11 2/49
Revision History
Revision Date (yyyy.mm.dd) Author Changes
1.0 2014.05.09 AEM • Ofcial release
1.1 2015.01.15 • Updated section 5.2.7 “Universal Serial Bus (USB)”.
• Updated the User’s Guide to revision B.2.
Copyright © 2014 congatec AG QEV2m11 3/49
Preface
This user's guide provides information about the components, features and connectors available on the conga-QEVAL/Qseven® 2.0 evaluation
carrier board.
The conga-QEVAL/Qseven® 2.0 module is referred to as QEVAL 2.0 throughout this document.
Disclaimer
The information contained within this user’s guide, including but not limited to any product specication, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or tness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualied personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG products are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All electronic parts described in this user’s guide are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a
carrier board or module except at an electrostatic-free workstation. Additionally, do not ship or store electronic devices near strong electrostatic,
electromagnetic, magnetic, or radioactive elds unless the device is contained within its original manufacturer’s packaging.
Copyright © 2014 congatec AG QEV2m11 4/49
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Connector Type
Describes the connector that must be used with the Qseven®2.0 evaluation carrier board, not the connector found on the Qseven®evaluation
carrier board.
Link to connector layout diagram
This link icon is located in the top left corner of each page. It provides a direct link to the connector layout diagram on page 10 of this document.
Copyright Notice
Copyright © 2014, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted without
written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Copyright © 2014 congatec AG QEV2m11 5/49
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not afliated with congatec AG, our products, or our website.
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and
from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
tness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be
liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certication
congatec AG is certied to DIN EN ISO 9001 standard.
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Copyright © 2014 congatec AG QEV2m11 6/49
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you rst visit our website at www.congatec.com for the latest documentation, utilities and
drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support
department by email at [email protected]
Terminology
Term Description
PCI Express (PCIe) Peripheral Component Interface Express – next-generation high speed Serialized I/O bus
PCI Express Lane One PCI Express Lane is a set of 4 signals that contains two differential lines for
Transmitter and two differential lines for Receiver. Clocking information is embedded into the data stream.
x1, x2, x4, x16 x1 refers to one PCI Express Lane of basic bandwidth; x2 to a collection of two PCI Express Lanes; etc.. Also referred to as x1, x2, x4 or x16 link.
PCI Express Mini Card PCI Express Mini Card add-in card is a small size unique form factor optimized for mobile computing platforms.
MMCplus MMCplus was dened for rst time in MMC System Specication v4.0. MMCplus is backward compatible with MMC. MMCplus has 13 pins.
SDIO card SDIO (Secure Digital Input Output) is a non-volatile memory card format developed for use in portable devices.
USB Universal Serial Bus
SATA Serial AT Attachment: serial-interface standard for hard disks
HDA High Denition Audio
S/PDIF S/PDIF (Sony/Philips Digital Interconnect Format) species a Data Link Layer protocol and choice of Physical Layer specications for carrying digital
audio signals between devices and stereo components.
HDMI High Denition Multimedia Interface. HDMI supports standard, enhanced, or high-denition video, plus multi-channel digital audio on a single cable.
TMDS Transition Minimized Differential Signaling. TMDS is a signaling interface dened by Silicon Image that is used for DVI and HDMI.
DVI Digital Visual Interface is a video interface standard developed by the Digital Display Working Group (DDWG).
LPC Low Pin-Count: a low speed interface used for peripheral circuits such as Super I/O controllers, which typically combine legacy device support into a
single IC.
I²C Bus Inter-Integrated Circuit Bus: is a simple two-wire bus with a software-dened protocol that was developed to provide the communications link
between integrated circuits in a system.
SM Bus System Management Bus: is a popular derivative of the I²C-bus.
CAN Controller Area Network
SPI Serial Peripheral Interface
GBE Gigabit Ethernet
LVDS Low-Voltage Differential Signaling
DDC Display Data Channel is an I²C bus interface between a display and a graphics adapter.
N.C. Not connected
N.A. Not available
T.B.D. To be determined
Copyright © 2014 congatec AG QEV2m11 7/49
Contents
1 Introduction ................................................................................8
1.1 Qseven®2.0 Concept.................................................................8
1.2 QEVAL 2.0 .................................................................................8
2 Jumper and DIP Switch Settings ...............................................9
3 Connector Layout.....................................................................10
4 Specications...........................................................................12
4.1 Mechanical Dimensions ...........................................................12
4.2 Power Supply...........................................................................12
4.2.1 PWR_OK Signal ......................................................................14
4.2.2 Power Status LEDs D20-D25 ..................................................14
4.2.3 Power-up Control .....................................................................14
4.3 CMOS Battery..........................................................................15
4.4 Environmental Specications...................................................16
5 Connector Description .............................................................17
5.2.1 SMBus .....................................................................................21
5.2.2 I²C Bus ....................................................................................21
5.2.3 SPI Bus ....................................................................................22
5.2.4 HDA Audio................................................................................23
5.2.5 LPC Super I/O Device..............................................................25
5.2.5.1 COM Ports ...............................................................................25
5.2.5.2 KBC Interface...........................................................................26
5.2.6 LPC/GPIO Header ...................................................................26
5.2.7 Universal Serial Bus (USB)......................................................27
5.2.8 Ethernet 10/100/1000 ..............................................................30
5.2.9 Serial ATA™.............................................................................31
5.2.10 Serial ATA™ Auxiliary Power ...................................................31
5.2.11 LVDS Flat Panel Interface........................................................32
5.2.11.1 Flat Panel and Backlight Power Supply ...................................34
5.2.11.2 Flat Panel and Backlight Power Supply Connection................35
5.2.11.3 Flat Panel Conguration Data..................................................36
5.2.12 PCI Express Routing................................................................36
5.2.13 PCI Express Mini Card.............................................................38
5.2.14 Digital Display Interface (DDI)..................................................39
5.2.15 SDIO Interface .........................................................................40
5.2.15.1 SD/MMC Card Socket..............................................................40
5.2.16 CAN Bus ..................................................................................40
6 Additional Features ..................................................................42
6.1 Power Button ...........................................................................42
6.2 Sleep Button ............................................................................42
6.3 Reset Button ............................................................................42
6.4 LID Button ................................................................................42
6.5 Switch SW3..............................................................................43
6.6 PC Speaker..............................................................................43
6.7 Debug Display..........................................................................43
6.8 Onboard Module’s COM Port...................................................44
6.9 Internal Use Only Connectors..................................................45
6.10 Ground Probes.........................................................................45
6.11 External System Wake Event...................................................45
6.12 Fan Connector and Power Conguration.................................46
6.13 Feature Connector ...................................................................47
7 QEVAL 2.0 Mechanical Drawing..............................................48
8 Industry Specications .............................................................49
Copyright © 2014 congatec AG QEV2m11 8/49
1 Introduction
1.1 Qseven®2.0 Concept
The Qseven® concept is an off-the-shelf, multi vendor, Computer-on-Module that integrates all the core components of a common PC and is
mounted onto an application specic carrier board. Qseven® modules have standardized form factors of 70mm x 70mm and 70mm x 40mm,
and specied pinout based on the high speed MXM system connector. The pinout is the same for all vendors. The Qseven® module provides
the functional requirements for an embedded application. These functions include, but are not limited to, graphics, sound, mass storage,
network interface and multiple USB ports.
A single ruggedized MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven® module. This MXM
connector is a well known and proven high speed signal interface connector that is commonly used for high speed PCI Express graphics cards
in notebooks.
Carrier board designers can utilize as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specic peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration.
The Qseven® evaluation carrier board provides carrier board designers with a reference design platform and the opportunity to test all the
Qseven® I/O interfaces available and then choose what are suitable for their application. Qseven® applications are scalable, which means once
a carrier board has been created there is the ability to diversify the product range through the use of different performance class Qseven®
modules. Simply unplug one module and replace it with another, no need to redesign the carrier board.
This document describes the features available on the Qseven® evaluation carrier board. Additionally, the schematics for the Qseven® evaluation
carrier board can be found on the congatec website.
1.2 QEVAL 2.0
QEVAL 2.0 evaluation carrier board is designed according to Qseven® specication 2.0 and supports both x86 and ARM modules. With this
dual architecture support, customers can test modules with different architectures on a single carrier board, thereby reducing production cost
and time.
The customers however need to make sure the switches and jumpers for the shared pins are set correctly to avoid possible malfunction or
damage to the module/carrier board.
Copyright © 2014 congatec AG QEV2m11 9/49
2 Jumper and DIP Switch Settings
Default Jumper and DIP Switch Settings for QEVAL 2.0
Required DIP Switch Settings when using conga-QMX6
Jumper Default
X9 2-3
X17 1-2
X22 1-2
X28 1-2
X29 1-2
X32 1-2
X33 1-2
X37 1-2
X43 1-2
Jumper Default
X44 1-2
X46 1-2
X47 2-3
X48 1-2
X49 1-2
X50 1-2
X51 1-2
X52 1-2
DIP Switch Switch 1 Switch 2 Switch 3 Switch 4
SW1 ON ON ON ON
SW2 ON ON OFF ON
SW3 ON ON ON ON
SW4 ON ON ON ON
SW9 OFF OFF OFF OFF
M13 OFF OFF
DIP Switch Switch 1 Switch 2 Switch 3 Switch 4 Comment
SW1 OFF OFF OFF OFF
SW2 OFF OFF OFF OFF conga-QMX6 does not support LPC Bus.
SW3 ON OFF OFF OFF FAN_PWMOUT / SPKR / FAN_TACHOIN signals are routed to a GPIO of the i.MX6 SoC (the
signals must be implemented in the Kernel rst before they can be functional)
SW4 ON ON ON ON
SW9 OFF OFF OFF OFF
M13 OFF (BOOT_ALT#
Jumper)
OFF Dip 1 of Switch M13 must be set to ‘ON’ when updating the conga-QMX6 bootloader.
Copyright © 2014 congatec AG QEV2m11 10/49
3 Connector Layout
The connector layout picture below shows each connector and its name designator. The Jumpers are also shown. Select the Adobe ‘Zoom-In-
Tool’ and zoom in on a given component to see its designator. Hover over the component and the ‘Zoom-In-Tool’ will change indicating there
is a link. Click on the link to navigate to the area in the document where the component is described. Use the mouse icon in the top left hand
corner of the destination page to return to the connector layout picture.
COM1
C6
C1 C5
C9
COM0
C6
C1 C5
C9
GND
M13
SW2
SW9
+12V
M9
M8
X26 X20
X21
CN2 CN3
X41
M2
M26
GND
M33
GND
M19
GND
M18
GND
M16
GND
M17
GND
CN4
X42
M1
X31
CN6
Auxiliary Power
X50
Backlight Polarity
Cong
X32
Wi Radio Enable/Disable
X15
X1 and X2 for Internal Use
U37
EEPROM Socket
X46
Backlight Power
Cong
X47
LCD Power
Cong
D2 LED
D3 LED
X11
X43
PWGIN Cong
SPI Header
X8
X40
MOUSE
CN11
LPC/GPIO Header
X39
KEYBOARD
X24
HDA Header
EEPROM SO8 Socket
U4
Internal Use
X5
X17
CMOS Cong
X29 X52 X48
D4
LED
X37
USB 1 OTG Setting
X33
LAN Power Souce Cong
CN7
X35
X53
X34
X51X28X49
M3
POWER ON
M5
SLEEP
M6
LID
M4
RESET
X18
LID
X3
WAKE#
Debug Display Cong
X44
X30
COM2 Header
ATX
CPU FAN
SYS. FAN
LVDS
LCD Power
SD/MMC Socket
SATA0 SATA1
Mini PCIE
CMOS
Battery
SW4
Speaker
SW3
PCIE0
CAN
X10
X19
CAN Termination
X9
Digital Display Port (DDI)
MXM Connector
X12
PCIE1
DEBUG Display
X13
PCIE2
X14
PCIE3
U6
SW1
CN10
Audio Card Connector
Feature Connector
D20-D25
Power LEDs
D9 - D11
Mini PCIE LEDs
LAN
USB
OTG
SuperSpeed
USB Ports
USB 1
USB 2
USB2 5.1 Audio Channel
&
1 S/PPDIF
USB3
L1
L8
(up)
(up)
(up)
(up)
(down)
(down)
(down)
(down)
USB 7
USB 6
USB 5
USB 4
NOTE:
USB OTG supported on revision B.2 and later.
USB Client supported on earlier revisions.
Copyright © 2014 congatec AG QEV2m11 12/49
4 Specications
4.1 Mechanical Dimensions
• 293.4mm x 171.5mm
• Height approximately 37mm
4.2 Power Supply
The QEVAL 2.0 can be used with standard ATX (Connector X26) power supplies. The 3.3V, 5V and -12V power outputs of the ATX power
supply are not used.
Connector X26 Pinout Description
Pin Signal Description Pin Signal Description
1 +3.3V Power Supply +3.3VDC 13 +3.3V Power Supply +3.3VDC
2 +3.3V Power Supply +3.3VDC 14 -12V Power Supply -12VDC
3GND Power Ground 15 GND Power Ground
4 +5V Power Supply +5VDC 16 PS_ON# Power Supply On (active low). Short this pin to GND to switch
power supply ON, disconnect from GND to switch OFF.
5GND Power Ground 17 GND Power Ground
6 +5V Power Supply +5VDC 18 GND Power Ground
7 GND Power Ground 19 GND Power Ground
8PWR_OK Power Ok: A status signal generated by the power supply
to notify the computer that the DC operating voltages are
within the ranges required for proper computer operation.
20 NC Not connected
95V_SB Standby Power Supply +5VDC 21 +5V Power Supply +5VDC
10 +12V Power Supply +12DC 22 +5V Power Supply +5VDC
11 +12V Power Supply +12DC 23 +5V Power Supply +5VDC
12 +3.3V Power Supply +3.3VDC 24 GND Power Ground
ATX Power Connector (X26)
Copyright © 2014 congatec AG QEV2m11 13/49
When using an ATX power supply, the Qseven® module starts after you press the power-on button M3. The ATX power supply can also be used
in AT mode. In this case the module starts when you turn on the power supply. Congure the power supply to ATX or AT mode with Jumper X29.
Jumper X29 Conguration
1 - 2 ATX Power supply (default)
2 - 3 ATX Power supply runs in AT mode
Connector Type
X29 : 2.54mm grid Jumper.
You can isolate the carrier board’s 5V standby power supply from the ATX 5V standby power supply with the Jumper X49. The isolation is
ideal for test purposes.
Jumper X49 Conguration
1 - 2 +5V_SB from ATX PSU enabled (default)
2 - 3 +5V_SB from ATX PSU disabled
Connector Type
X49 : 2.54mm grid Jumper.
The QEVAL 2.0 can also be used with +12VDC power supply (connector M8 and M9). The +3.3V and +5V used by some devices on the
QEVAL 2.0 are generated onboard from the +12V power supply.
Connector Conguration
M8 Ground
M9 +12VDC ±5%
Connector Type
M8,M9: 4mm diameter plug
2
1
3
Power Mode
Cong
(X29)
Pwr On
(M3)
2
1
3
Jumper X49
GND
(M8) +12V
(M9)
Copyright © 2014 congatec AG QEV2m11 14/49
4.2.1 PWR_OK Signal
The PWR_OK (PWGIN) signal is a HIGH active input from the main power supply to the module and indicates whether the power is good. The
Jumper X43 on the QEVAL 2.0 provides the ability to choose different settings for this signal.
Jumper X43 Conguration
1 - 2 PWGIN generated by Pull-up resistor. (default)
3 - 4 PWGIN generated by ATX power source.
5 - 6 PWGIN generated by DC/DC converter.
Connector Type
X43: 2.54mm grid Jumper.
4.2.2 Power Status LEDs D20-D25
The six green status LEDs D20-D25 indicate different power states of the QEVAL 2.0. See table below for more information.
LEDs D20-D25 Power state
All Off No power applied.
D20 +5V standby
D21 +5V
D22 +3.3V standby
D23 +3.3V
D24 +5V standby input
D25 +12V input
4.2.3 Power-up Control
The native system Power-up support of Qseven® modules uses the 'SUS_S3#' signal to control the 'PS_ON#' signal, which is used to switch
the ATX power supply on or off. When using the SUS_S3#' signal, the Qseven® module is capable of supporting Suspend to RAM (S3).
When the system goes to Suspend to RAM (S3) or Soft Off (S5), the 'SUS_S3#' signal is asserted by the chipset of the module. Through the
use of an inverter, the low active 'PS_ON#' signal goes high and switches off the ATX power supply. On the contrary, if the system resides in a
power-down system state, any system wake-up event invokes the chipset of the module to deassert the 'SUS_S3#' signal. This transitions the
system to Full-On (S0).
The way Suspend to RAM is implemented on a Qseven® module may differ depending on the module manufacturer. For this reason, it is
3
1
5
4
2
6
PWGIN Cong.
(X43)
D20-D25
Copyright © 2014 congatec AG QEV2m11 15/49
recommended to implement a hardware Jumper on the carrier board, to provide the ability to choose if the 'PS_ON#' signal should be controlled
by the 'SUS_S3#' signal or the 'SUS_S5#' signal. On the QEVAL 2.0, this is accomplished through the use of Jumper X28.
Jumper X28 Conguration
1 - 2 ATX Power supply controlled via S3# (default)
2 - 3 ATX Power supply controlled via S5#
Connector Type
X28 : 2.54mm grid Jumper.
4.3 CMOS Battery
The CMOS battery on connector M2 supplies power to the RTC and CMOS memory of the Qseven® module. The battery needs to provide 3V
of power. The specied battery type is CR2032. It is possible to disconnect the CMOS battery using Jumper X17.
Jumper X17 Conguration
1 - 2 Normal operation, battery connected (default)
2 - 3 Battery disconnected
Connector Type
X17 : 2.54mm grid Jumper.
Warning
Danger of explosion if battery is incorrectly replaced. Replace only with same or equivalent type recommended by the manufacturer. Dispose
of used batteries according to the manufacturer's instructions.
Note
To fulll the requirements of the EN60950, the QEVAL 2.0 incorporates two current-limiting devices (resistor and diode) in the battery power
supply path.
Control signal
Config
(X28)
2
1
3
CMOS Battery
(M2)
2
1
3
CMOS Battery
Config
(X17)
Copyright © 2014 congatec AG QEV2m11 16/49
4.4 Environmental Specications
Temperature Operation: 0° to 60°C Storage: -20° to +80°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Note
The above operating temperatures must be strictly adhered to at all times.
Humidity specications are for non-condensing conditions.
Copyright © 2014 congatec AG QEV2m11 17/49
5 Connector Description
5.1 Connector CN1 Pinout
Pin Signal Description Pin Signal Description
1GND Power Ground 2GND Power Ground
3GBE_MDI3- Gigabit Ethernet MDI3- 4GBE_MDI2- Gigabit Ethernet MDI2-
5GBE_MDI3+ Gigabit Ethernet MDI3+ 6GBE_MDI2+ Gigabit Ethernet MDI2+
7 GBE_LINK100# 100 Mbps link speed 8GBE_LINK1000# 1000 Mbps link speed
9GBE_MDI1- Gigabit Ethernet MDI1- 10 GBE_MDI0- Gigabit Ethernet MDI0-
11 GBE_MDI1+ Gigabit Ethernet MDI1+ 12 GBE_MDI0+ Gigabit Ethernet MDI0+
13 GBE_LINK# Gigabit Ethernet Link indicator 14 GBE_ACT# Gigabit Ethernet Activity indicator
15 GBE_CTREF Reference voltage for GBE 16 SUS_S5# S5 (Soft OFF) – shutdown state
17 WAKE# External system wake event 18 SUS_S3# S3 (Suspend to RAM) – SLP
19 SUS_STAT# Suspend status 20 PWRBTN# Power button
21 SLP_BTN# Sleep button 22 LID_BTN# LID button
23 GND Power Ground 24 GND Power Ground
25 GND Power Ground 26 PWGIN Power good input
27 BATLOW# Battery low input 28 RSTBTN# Reset button input
29 SATA0_TX+ Serial ATA Channel 0 TX+ 30 SATA1_TX+ Serial ATA Channel 1 TX+
31 SATA0_TX- Serial ATA Channel 0 TX- 32 SATA1_TX- Serial ATA Channel 1 TX-
33 SATA_ACT# Serial ATA Activity 34 GND Power Ground
35 SATA0_RX+ Serial ATA Channel 0 RX+ 36 SATA1_RX+ Serial ATA Channel 1 RX+
37 SATA0_RX- Serial ATA Channel 0 RX- 38 SATA1_RX- Serial ATA Channel 1 RX-
39 GND Power Ground 40 GND Power Ground
41 BIOS_DISABLE#
/BOOT_ALT#
BIOS Module disable
Boot Alternative Enable
42 SDIO_CLK SDIO Clock Output
43 SDIO_CD# SDIO Card Detect 44 SDIO_LED SDIO LED
45 SDIO_CMD SDIO Command/Response 46 SDIO_WP SDIO Write Protect
47 SDIO_PWR# SDIO Power Enable 48 SDIO_DAT1 SDIO Data Line 1
49 SDIO_DAT0 SDIO Data Line 0 50 SDIO_DAT3 SDIO Data Line 3
51 SDIO_DAT2 SDIO Data Line 2 52 SDIO_DAT5 SDIO Data Line 5
53 SDIO_DAT4 SDIO Data Line 4 54 SDIO_DAT7 SDIO Data Line 7
55 SDIO_DAT6 SDIO Data Line 6 56 RSVD Reserved
57 GND Power Ground 58 GND Power Ground
59 HDA_SYNC
/ AC97_SYNC
/ I2S_WS
Serial Bus Synchronization.
Serial Bus Synchronization
Multiplexed with I2S Word Select
60 SMB_CLK
/ GP1_I2C_CLK
SMBus Clock line.
Multiplexed with General Purpose I²C bus #1
clock line
Copyright © 2014 congatec AG QEV2m11 18/49
Pin Signal Description Pin Signal Description
61 HDA_RST#
/ AC97_RST#
/ I2S_RST#
HD Audio Codec Rest
AC’97 Codec Reset.
Multiplexed with I2S Codec Reset
62 SMB_DAT
/ GP1_I2C_DAT
SMBus Data line.
Multiplexed with General Purpose I²C bus #1
data line.
63 HDA_BCLK
/ AC97_BCLK
/ I2S_CLK
HD Audio Serial Bit Clock
AC’97 Serial Bit Clock.
Multiplexed with I2S Serial Data Clock
64 SMB_ALERT# SMBus Alert input
65 HDA_SDI
/ AC97_SDI
/ I2S_SDI
HD Audio Serial Data Input
AC’97 Serial Data Input.
Multiplexed with I2S Serial Data Input
66 GP0_I2C_CLK General Purpose I2C Bus No 0 clock line
67 HDA_SDO
/ AC97_SDO
/ I2S_SDO
HD Audio Serial Data Output
AC’97 Serial Data Output.
Multiplexed with I2S Serial Data Output.
68 GP0_I2C_DAT General Purpose I2C Bus No 0 data line
69 THRM# Thermal Alarm active low 70 WDTRIG# Watchdog trigger signal
71 THRMTRIP# Thermal Trip indicates an overheating condition 72 WDOUT Watchdog event indicator
73 GND Power Ground 74 GND Power Ground
75 USB_P7-
/ USB_SSTX0-
USB Port 7 Differential Pair- . Multiplexed with
Superspeed USB transmit differential pair-
76 USB_P6-
/ USB_SSRX0-
USB Port 6 Differential Pair-. Multiplexed with
Superspeed USB receive differential pair-
77 USB_P7+
/ USB_SSTX0+
USB Port 7 Differential Pair+. Multiplexed with
Superspeed USB transmit differential pair+
78 USB_P6+
/ USB_SSRX0+
USB Port 6 Differential Pair+. Multiplexed with
Superspeed USB receive differential pair+
79 USB_6_7_OC# Over current detect input for USB port 6 and 7 80 USB_4_5_OC# Over current detect input for USB port 4 and 5
81 USB_P5-
/ USB_SSTX1-
USB Port 5 Differential Pair-. Multiplexed with
Superspeed USB transmit differential pair-
82 USB_P4-
/ USB_SSRX1-
USB Port 4 Differential Pair-. Multiplexed with
Superspeed USB receive differential pair-
83 USB_P5+
/ USB_SSTX1+
USB Port 5 Differential Pair+. Multiplexed with
Superspeed USB transmit differential pair+
84 USB_P4+
/ USB_SSRX1+
USB Port 4 Differential Pair+. Multiplexed with
Superspeed USB receive differential pair+
85 USB_2_3_OC# Over current detect input for USB port 2 and 3 86 USB_0_1_OC# Over current detect input for USB port 0 and 1
87 USB_P3- USB Port 3 Differential Pair- 88 USB_P2- USB Port 2 Differential Pair-
89 USB_P3+ USB Port 3 Differential Pair+ 90 USB_P2+ USB Port 2 Differential Pair+
91 USB_CC USB Client present detect pin 92 USB_ID USB ID pin
93 USB_P1- USB Port 1 Differential Pair- 94 USB_P0- USB Port 0 Differential Pair-
95 USB_P1+ USB Port 1 Differential Pair+ 96 USB_P0+ USB Port 0 Differential Pair+
97 GND Power Ground 98 GND Power Ground
99 eDP0_TX0+
/ LVDS_A0+
eDP Primary Channel 0+
LVDS Primary channel 0+
100 eDP1_TX0+
/ LVDS_B0+
eDP Secondary channel 0+
LVDS Secondary channel 0+
101 eDP0_TX0-
/ LVDS_A0-
eDP Primary channel 0-
LVDS Primary channel 0-
102 eDP1_TX0-
/ LVDS_B0-
eDP Secondary channel 0-
LVDS Secondary channel 0-
103 eDP0_TX1+
/ LVDS_A1+
eDP Primary channel 1+
LVDS Primary channel 1+
104 eDP1_TX1+
/ LVDS_B1+
eDP Secondary channel 1+
LVDS Secondary channel 1+
105 eDP0_TX1-
/ LVDS_A1-
eDP Primary channel 1-
LVDS Primary channel 1-
106 eDP1_TX1-
/ LVDS_B1-
eDP Secondary channel 1-
LVDS Secondary channel 1-
107 eDP0_TX2+
/ LVDS_A2+
eDP Primary channel 2+
LVDS Primary channel 2+
108 eDP1_TX2+
/ LVDS_B2+
eDP Secondary channel 2+
LVDS Secondary channel 2+
Copyright © 2014 congatec AG QEV2m11 19/49
Pin Signal Description Pin Signal Description
109 eDP0_TX2-
/ LVDS_A2-
eDP Primary channel 2-
LVDS Primary channel 2-
110 eDP1_TX2-
/ LVDS_B2-
eDP Secondary channel 2-
LVDS Secondary channel 2-
111 LVDS_PPEN LVDS Power enable 112 LVDS_BLEN LVDS Backlight enable
113 eDP0_TX3+
/ LVDS_A3+
eDP Primary channel 3+
LVDS Primary channel 3+
114 eDP1_TX3+
/ LVDS_B3+
eDP Secondary channel 3+
LVDS Secondary channel 3+
115 eDP0_TX3-
/ LVDS_A3-
eDP Primary channel 3-
LVDS Primary channel 3-
116 eDP1_TX3-
/ LVDS_B3-
eDP Secondary channel 3-
LVDS Secondary channel 3-
117 GND Power Ground 118 GND Power Ground
119 eDP0_AUX+
/ LVDS_A_CLK+
eDP Primary Auxilliary channel+
LVDS Primary channel CLK+
120 eDP1_AUX+
/ LVDS_B_CLK+
eDP Secondary Auxiliary channel CLK+
LVDS Secondary channel CLK+
121 eDP0_AUX-
/ LVDS_A_CLK-
eDP Primary Auxilliary channel-
LVDS Primary channel CLK-
122 eDP1_AUX-
/ LVDS_B_CLK-
eDP Secondary Auxiliary channel CLK-
LVDS Secondary channel CLK-
123 LVDS_BLT_CTRL
/ GP_PWM_OUT0
PWM Backlight brightness
General Purpose PWM Output
124 GP_1-Wire_Bus General Purpose 1-wire bus interface
125 LVDS_DID_DAT
/ GP2_I2C_DAT
DDC Display ID Data line
General Purpose I2C Data line
126 eDP0_HPD#
/ LVDS_BLC_DAT
SSC clock chip data line. Can be used as eDP
primary hotplug detect
127 LVDS_DID_CLK
/ GP2_I2C_CLK
DDC Display ID Clock line
General Purpose I2C Clock line
128 eDP1_HPD#
/ LVDS_BLC_CLK
SSC clock chip clock line. Can be used as eDP
secondary hotplug detect
129 CAN0_TX CAN TX Output for CAN Bus Channel 0 130 CAN0_RX CAN RX Input for CAN Bus Channel 0
131 DP_LANE3+
/ TMDS_CLK+
DisplayPort differential pair line lane 3+.
Multiplexed with TMDS differential pair clock+
132 RSVD (Differential) Reserved
133 DP_LANE3-
/ TMDS_CLK-
DisplayPort differential pair line lane 3-.
Multiplexed with TMDS differential pair clock-
134 RSVD (Differential) Reserved
135 GND Power Ground 136 GND Power Ground
137 DP_LANE1+
/ TMDS_LANE1+
DisplayPort differential pair line lane 1+
Multiplexed with TMDS differential pair lane1+
138 DP_AUX+ DisplayPort auxiliary channel
139 DP_LANE1-
/ TMDS_LANE1-
DisplayPort differential pair line lane 1-
Multiplexed with TMDS differential pair lane1-
140 DP_AUX- DisplayPort auxiliary channel
141 GND Power Ground 142 GND Power Ground
143 DP_LANE2+
/ TMDS_LANE0+
DisplayPort differential pair line lane 2+
Multiplexed with TMDS differential pair line lane0+
144 RSVD (Differential Pair) Reserved
145 DP_LANE2-
/ TMDS_LANE0-
DisplayPort differential pair line lane 2-
Multiplexed with TMDS differential pair line lane0-
146 RSVD (Differential Pair) Reserved
147 GND Power Ground 148 GND Power Ground
149 DP_LANE0+
/ TMDS_LANE2+
DisplayPort differential pair line lane 0+
Multiplexed with TMDS differential pair lane2+
150 HDMI_CTRL_DAT DDC based control signal (data) for HDMI/DVI
device.
151 DP_LANE0-
/ TMDS_LANE2-
DisplayPort differential pair line lane 0-
Multiplexed with TMDS differential pair lane2-
152 HDMI_CTRL_CLK DDC based control signal (clock) for HDMI/DVI
device.
153 DP_HDMI_HPD# Hot plug detection 154 DP_HPD DisplayPort Hot Plut Detect
155 PCIE_CLK_REF+ PCI Express Reference Clock+ 156 PCIE_WAKE# PCI Express Wake event
157 PCIE_CLK_REF- PCI Express Reference Clock- 158 PCIE_RST# Reset Signal for external devices
159 GND Power Ground 160 GND Power Ground
Copyright © 2014 congatec AG QEV2m11 20/49
Pin Signal Description Pin Signal Description
161 PCIE3_TX+ PCI Express Channel 3 Output+ 162 PCIE3_RX+ PCI Express Channel 3 Input+
163 PCIE3_TX- PCI Express Channel 3 Output- 164 PCIE3_RX- PCI Express Channel 3 Input-
165 GND Power Ground 166 GND Power Ground
167 PCIE2_TX+ PCI Express Channel 2 Output+ 168 PCIE2_RX+ PCI Express Channel 2 Input+
169 PCIE2_TX- PCI Express Channel 2 Output- 170 PCIE2_RX- PCI Express Channel 2 Input-
171 UART0_TX Serial Data Transmitter 172 UART0_RTS# Request To Send handshake signal
173 PCIE1_TX+ PCI Express Channel 1 Output+ 174 PCIE1_RX+ PCI Express Channel 1 Input+
175 PCIE1_TX- PCI Express Channel 1 Output- 176 PCIE1_RX- PCI Express Channel 1 Input-
177 UART0_RX Serial Data Receiver 178 UART0_CTS# Clear To Send handshake signal
179 PCIE0_TX+ PCI Express Channel 0 Output+ 180 PCIE0_RX+ PCI Express Channel 0 Input+
181 PCIE0_TX- PCI Express Channel 0 Output- 182 PCIE0_RX- PCI Express Channel 0 Input-
183 GND Power Ground 184 GND Power Ground
185 LPC_AD0
/ GPIO0
LPC Interface Address Data 0
General Purpose input/output 0
186 LPC_AD1
/ GPIO1
LPC Interface Address Data 1
General Purpose input/output 1
187 LPC_AD2
/ GPIO2
LPC Interface Address Data 2
General Purpose input/output 2
188 LPC_AD3
/ GPIO3
LPC Interface Address Data 3
General Purpose input/output 3
189 LPC_CLK
/GPIO4
LPC Interface Clock
General Purpose input/output 4
190 LPC_FRAME#
/GPIO5
LPC frame indicator
General Purpose input/output 5
191 SERIRQ
/GPIO6
Serialized interrupt
General Purpose input/output 6
192 LPC_LDRQ#
/GPIO7
LPC DMA request
General Purpose input/output 7
193 VCC_RTC 3V backup cell input 194 SPKR
/GP_PWM_OUT2
Output for audio enunciator
General Purpose PWM Output
195 FAN_TACHOIN
/GP_TIMER_IN
Fan tachometer input
General Purpose Timer In
196 FAN_PWMOUT
/GP_PWM_OUT1
Fan speed control (PWM)
General Purpose PWM Output
197 GND Power Ground 198 GND Power Ground
199 SPI_MOSI SPI Master serial output/Slave serial input 200 SPI_CS0# SPI Chip Select 0 Output
201 SPI_MISO SPI Master serial input/Slave serial output signal 202 SPI_CS1# SPI Chip Select 1 Output
203 SPI_SCK SPI Clock Output 204 MFG_NC4 For manufacturing and debugging purposes
205 VCC_5V_SB +5VDC,Standby ±5% 206 VCC_5V_SB +5VDC Standby ±5%
207 MFG_NC0 For manufacturing and debugging purposes 208 MFG_NC2 For manufacturing and debugging purposes
209 MFG_NC1 For manufacturing and debugging purposes 210 MFG_NC3 For manufacturing and debugging purposes
211 VCC Power supply +5VDC ±5% 212 VCC Power supply +5VDC ±5%
213 VCC Power supply +5VDC ±5% 214 VCC Power supply +5VDC ±5%
215 VCC Power supply +5VDC ±5% 216 VCC Power supply +5VDC ±5%
217 VCC Power supply +5VDC ±5% 218 VCC Power supply +5VDC ±5%
219 VCC Power supply +5VDC ±5% 220 VCC Power supply +5VDC ±5%
221 VCC Power supply +5VDC ±5% 222 VCC Power supply +5VDC ±5%
223 VCC Power supply +5VDC ±5% 224 VCC Power supply +5VDC ±5%
225 VCC Power supply +5VDC ±5% 226 VCC Power supply +5VDC ±5%
227 VCC Power supply +5VDC ±5% 228 VCC Power supply +5VDC ±5%
229 VCC Power supply +5VDC ±5% 230 VCC Power supply +5VDC ±5%
Table of contents
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