Congatec conga-QA3 User manual

Qseven®conga-QA3/QA3E
Third Generation Intel®Atom™ and Intel®Celeron®SoC
User’s Guide
Revision 1.1

Copyright © 2013 congatec AG QA30_QA3Em11 2/91
Revision History
Revision Date (yyyy.mm.dd) Author Changes
1.0 2015.10.16 AEM •Merged the conga-QA30 with the conga-QA3E user’s guide, to create a single user’s guide. Revision 1.0 is the first revision
for the combined user’s guide
•Added note about USB overcurrent protection in section 5.5 “USB 2.0”, section 7.3 “xHCI & EHCI Port Mapping” and
table 9 “USB Signal Description”
1.1 2017.06.20 AEM •Corrected and updated the Intel®Atom™ E3805 processor features in section 1.2 “conga-QA3 Variants”. Also added note
about the default serial direction settings of the headless variants
•Updated section 2.5 “Power Consumption”
•Updated section 5.15 “Power Control”
•Added note about UART limitation in section 5.8 “UART”
•Corrected the list of reserved pins in table 21 “Miscellaneous Signal Descriptions”
•Updated section 10 “BIOS Setup Description” and section 11 “Additional BIOS Features”

Copyright © 2013 congatec AG QA30_QA3Em11 3/91
Preface
This user’s guide provides information about the components, features, connector and BIOS Setup menus available on the conga-QA3/QA3E.
It is one of three documents that should be referred to when designing a Qseven®application. The other reference documents that should
be used include the following:
Qseven®Design Guide
Qseven®Specification
The links to these documents can be found on the congatec AG website at www.congatec.com
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec AG provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec AG assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec AG be liable for any incidental, consequential, special, or
exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other information
contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Lead-Free Designs (RoHS)
All congatec AG designs are created from lead-free components and are completely RoHS compliant.
Electrostatic Sensitive Device
All congatec AG products are electrostatic sensitive devices and are packaged accordingly. Do not open or handle a congatec AG product
except at an electrostatic-free workstation. Additionally, do not ship or store congatec AG products near strong electrostatic, electromagnetic,
magnetic, or radioactive fields unless the device is contained within its original manufacturer’s packaging. Be aware that failure to comply with
these guidelines will void the congatec AG Limited Warranty.

Copyright © 2013 congatec AG QA30_QA3Em11 4/91
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2015, congatec AG. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec AG.
congatec AG has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec AG, our products, or our website.

Copyright © 2013 congatec AG QA30_QA3Em11 5/91
Warranty
congatec AG makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited warranty
(“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and conditions can
be downloaded from www.congatec.com. congatec AG may in its sole discretion modify its Limited Warranty at any time and from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license agreements,
which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec AG represents that the
products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship or
due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec AG prior to returning the non conforming product freight
prepaid. congatec AG will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either express
or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of fitness for a
particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec AG shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise be liable
for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive remedy
against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the product only.
Certification
congatec AG is certified to DIN EN ISO 9001:2008 standard.
Technical Support
congatec AG technicians and engineers are committed to providing the best possible technical support for our customers so that our products
can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation, utilities and
drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our technical support
department by email at [email protected]
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Copyright © 2013 congatec AG QA30_QA3Em11 6/91
Terminology
Term Description
PCIe Peripheral Component Interface Express – next-generation high speed Serialized I/O bus
PCI Express Lane One PCI Express Lane is a set of 4 signals that contains two differential lines for
Transmitter and two differential lines for Receiver. Clocking information is embedded into the data stream.
x1, x2, x4, x8, x16 x1 refers to one PCI Express Lane of basic bandwidth; x2 to a collection of two PCI Express Lanes; etc.. Also referred to as x1, x2, x4,
x8, or x16 link.
eMMC Embedded Multi-media Controller
SD card Secure Digital card is a non-volatile memory card format developed for use in portable devices.
USB Universal Serial Bus
SATA Serial AT Attachment: serial-interface standard for hard disks
HDA High Definition Audio
DDI Digital Display Interface. DDI can operate as DisplayPort, HDMI or DVI.
DP DisplayPort is a VESA open digital communications interface.
HDMI High Definition Multimedia Interface. HDMI supports standard, enhanced, or high-definition video, plus multi-channel digital audio
on a single cable.
TMDS Transition Minimized Differential Signaling. TMDS is a signaling interface defined by Silicon Image that is used for DVI and HDMI.
DVI Digital Visual Interface is a video interface standard developed by the Digital Display Working Group (DDWG).
LPC Low Pin-Count is a low speed interface used for peripheral circuits such as Super I/O controllers, which typically combine legacy
device support into a single IC.
I²C Bus Inter-Integrated Circuit Bus is a simple two-wire bus with a software-defined protocol that was developed to provide the
communications link between integrated circuits in a system.
SM Bus System Management Bus is a popular derivative of the I²C-bus.
SPI Bus Serial Peripheral Interface is a synchronous serial data link standard that operates in full duplex mode.
GbE Gigabit Ethernet
LVDS Low-Voltage Differential Signaling
DDC Display Data Channel is an I²C bus interface between a display and a graphics adapter.
N.C. Not connected
N.A. Not available
T.B.D. To be determined

Copyright © 2013 congatec AG QA30_QA3Em11 7/91
Contents
1 Introduction ............................................................................. 10
1.1 Qseven®Concept .................................................................... 10
1.2 conga-QA3 Options Information ............................................. 11
1.3 conga-QA3E Options Information........................................... 13
2 Specifications........................................................................... 14
2.1 Feature List .............................................................................. 14
2.2 Supported Operating Systems ................................................ 15
2.3 Mechanical Dimensions ........................................................... 15
2.4 Supply Voltage Standard Power .............................................. 16
2.4.1 Electrical Characteristics .......................................................... 16
2.4.2 Rise Time ................................................................................. 16
2.5 Power Consumption ................................................................ 17
2.6 Supply Voltage Battery Power ................................................. 18
2.7 Environmental Specifications................................................... 19
3 Block Diagram.......................................................................... 20
4 Heatspreader ........................................................................... 21
4.1 Heatspreader Dimensions........................................................ 22
5 Connector Subsystems ............................................................ 23
5.1 PCI Express™........................................................................... 24
5.2 ExpressCard™ ......................................................................... 24
5.3 Gigabit Ethernet ...................................................................... 24
5.4 Serial ATA™ (SATA).................................................................. 24
5.5 USB 2.0 .................................................................................... 24
5.6 USB 3.0 .................................................................................... 25
5.7 SD Card.................................................................................... 25
5.8 UART........................................................................................ 25
5.9 High Definition Audio (HDA) ................................................... 25
5.10 Digital Display Interface........................................................... 26
5.10.1 LVDS/eDP................................................................................. 26
5.10.2 DisplayPort............................................................................... 26
5.10.3 HDMI........................................................................................ 27
5.10.4 DVI ........................................................................................... 27
5.11 LPC........................................................................................... 27
5.12 SPI............................................................................................ 28
5.13 I²C Bus ..................................................................................... 28
5.14 CAN Bus .................................................................................. 28
5.15 Power Control .......................................................................... 28
5.16 Power Management................................................................. 29
6 Additional Features.................................................................. 30
6.1 Onboard Interfaces.................................................................. 30
6.1.1 MIPI-CSI 2.0 ............................................................................. 30
6.1.2 eMMC 4.5 ................................................................................ 30
6.2 congatec Board Controller (cBC) ............................................. 30
6.2.1 Board Information.................................................................... 31
6.2.2 Fan Control .............................................................................. 31
6.2.3 Power Loss Control.................................................................. 31
6.2.4 Watchdog ................................................................................ 31
6.3 Embedded BIOS...................................................................... 31
6.3.1 CMOS Backup in Non Volatile Memory................................... 31
6.3.2 OEM CMOS Default Settings and OEM BIOS Logo ............... 32
6.3.3 OEM BIOS Code...................................................................... 32
6.3.4 congatec Battery Management Interface ................................ 32
6.3.5 API Support (CGOS/EAPI) ....................................................... 33
6.4 Suspend to RAM...................................................................... 33
6.5 ECC Memory Support.............................................................. 33
7 conga Tech Notes .................................................................... 34
7.1 Intel Bay Trail SoC Features ..................................................... 34
7.1.1 Processor Core......................................................................... 34
7.1.1.1 Intel Virtualization Technology................................................. 34
7.1.1.2 AHCI ........................................................................................ 35
7.1.1.3 IDE Mode (Native Vs. Legacy) ................................................. 35
7.1.1.4 Thermal Management ............................................................. 35
7.2 ACPI Suspend Modes and Resume Events.............................. 36
7.3 xHCI and EHCI Port Mapping.................................................. 37
8 Signal Descriptions and Pinout Tables..................................... 38

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9 System Resources .................................................................... 57
9.1 I/O Address Assignment.......................................................... 57
9.1.1 LPC Bus.................................................................................... 57
9.2 PCI Configuration Space Map ................................................. 58
9.3 PCI Interrupt Routing Map....................................................... 59
9.4 I²C Bus ..................................................................................... 59
9.5 SM Bus..................................................................................... 59
10 BIOS Setup Description........................................................... 60
10.1 Entering the BIOS Setup Program........................................... 60
10.1.1 Boot Selection Popup.............................................................. 60
10.2 Setup Menu and Navigation.................................................... 60
10.3 Main Setup Screen................................................................... 61
10.4 Advanced Setup ...................................................................... 62
10.4.1 Watchdog Submenu ................................................................ 63
10.4.2 Graphics Submenu................................................................... 65
10.4.3 Hardware Health Monitoring Submenu ................................... 66
10.4.4 Trusted Computing Submenu.................................................. 67
10.4.5 RTC Wake Submenu................................................................ 67
10.4.6 Module Serial Ports Submenu ................................................. 67
10.4.7 Reserve Legacy Interrupt Submenu......................................... 68
10.4.8 ACPI Submenu......................................................................... 68
10.4.9 SIO Submenu........................................................................... 68
10.4.10 Serial Port 1 Submenu ............................................................. 69
10.4.11 Serial Port 2 Submenu ............................................................. 69
10.4.12 Parallel Port Submenu.............................................................. 69
10.4.13 Intel(R) Smart Connect Technology Submenu ......................... 70
10.4.14 Serial Port Console Redirection Submenu............................... 70
10.4.14.1 Console Redirection Settings COM0 Submenu....................... 71
10.4.14.2 Console Redirection Settings COM1 Submenu....................... 72
10.4.14.3 Console Redirection Settings Out-of-Band Management
Submenu 73
10.4.15 CPU Configuration Submenu................................................... 73
10.4.15.1 Socket 0 CPU Information Submenu ....................................... 74
10.4.15.2 CPU Thermal Configuration Submenu..................................... 74
10.4.16 PPM Configuration Submenu .................................................. 74
10.4.17 Thermal Configuration............................................................. 75
10.4.18 IDE Configuration Submenu.................................................... 76
10.4.19 Miscellaneous Configuration Submenu ................................... 77
10.4.20 SCC Configuration Submenu................................................... 77
10.4.21 PCI Subsystem Settings Submenu........................................... 78
10.4.22 PCI Express Settings Submenu................................................ 79
10.4.23 PCI Express GEN 2 Settings Submenu .................................... 80
10.4.24 Network Stack.......................................................................... 81
10.4.25 CSM Submenu......................................................................... 81
10.4.26 SDIO Submenu ........................................................................ 82
10.4.27 USB Submenu.......................................................................... 82
10.4.28 Platform Trust Technology ....................................................... 82
10.4.29 Security Configuration ............................................................. 83
10.4.30 Intel(R) Ethernet Connection I210 Submenu ........................... 83
10.4.30.1 NIC Configuration Submenu ................................................... 84
10.4.31 Driver Health Submenu............................................................ 84
10.4.31.1 Intel(R) PRO/1000 Submenu .................................................... 84
10.5 Chipset Setup .......................................................................... 84
10.5.1 North Bridge Submenu............................................................ 84
10.5.2 South Bridge Submenu............................................................ 85
10.5.2.1 Azalia HD Audio....................................................................... 85
10.5.2.2 USB Submenu.......................................................................... 86
10.5.2.3 PCI Express Configuration Submenu....................................... 87
10.6 Boot Setup............................................................................... 87
10.6.1 Boot Settings Configuration .................................................... 87
10.7 Security Setup.......................................................................... 89
10.7.1 Security Settings ...................................................................... 89
10.7.2 Hard Disk Security.................................................................... 89
10.8 Save & Exit Menu..................................................................... 89
11 Additional BIOS Features ........................................................ 90
11.1 Supported Flash Devices ......................................................... 90
11.2 Updating the BIOS................................................................... 90
12 Industry Specifications ............................................................. 91

Copyright © 2013 congatec AG QA30_QA3Em11 9/91
List of Tables
Table 1 Feature Summary..................................................................... 14
Table 2 Display Combination ............................................................... 26
Table 3 Signal Tables Terminology Descriptions .................................. 38
Table 4 Edge Finger Pinout.................................................................. 39
Table 5 PCI Express Signal Descriptions .............................................. 43
Table 6 UART Signal Descriptions ........................................................ 44
Table 8 SATA Signal Descriptions......................................................... 45
Table 9 USB Signal Descriptions........................................................... 45
Table 10 SDIO Signal Descriptions......................................................... 46
Table 11 HDA Signal Descriptions.......................................................... 47
Table 12 LVDS Signal Descriptions......................................................... 48
Table 13 DisplayPort Signal Descriptions............................................... 49
Table 14 HDMI/DVI Signal Descriptions................................................. 50
Table 15 LPC Signal Descriptions........................................................... 50
Table 16 SPI Interface Signal Descriptions ............................................. 51
Table 17 CAN Bus Signal Descriptions................................................... 51
Table 18 Power and GND Signal Descriptions....................................... 52
Table 19 Power Control Signal Descriptions .......................................... 52
Table 20 Power Management Signal Descriptions................................. 52
Table 21 Miscellaneous Signal Descriptions........................................... 53
Table 22 Manufacturing Signal Descriptions .......................................... 54
Table 23 Thermal Management Signal Descriptions.............................. 54
Table 24 Fan Control Signal Descriptions .............................................. 54
Table 25 Onboard Camera Interface Signal Descriptions ...................... 55
Table 26 PCI Configuration Space Map ................................................. 58
Table 27 PCI Interrupt Routing Map....................................................... 59

Copyright © 2013 congatec AG QA30_QA3Em11 10/91
1 Introduction
1.1 Qseven®Concept
The Qseven®concept is an off-the-shelf, multi vendor, Single-Board-Computer that integrates all the core components of a common PC and is
mounted onto an application specific carrier board. Qseven®modules have a standardized form factor of 70mm x 70mm and a specified pinout
based on the high speed MXM system connector. The pinout remains the same regardless of the vendor. The Qseven®module provides the
functional requirements for an embedded application. These functions include, but are not limited to, graphics, sound, mass storage, network
interface and multiple USB ports.
A single ruggedized MXM connector provides the carrier board interface to carry all the I/O signals to and from the Qseven®module. This
MXM connector is a well known and proven high speed signal interface connector that is commonly used for high speed PCI Express graphics
cards in notebooks.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all the
interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense
and optimized package, which results in a more reliable product while simplifying system integration.
The Qseven®evaluation carrier board provides carrier board designers with a reference design platform and the opportunity to test all the
Qseven®I/O interfaces available and then choose what are suitable for their application. Qseven®applications are scalable, which means once
a carrier board has been created there is the ability to diversify the product range through the use of different performance class Qseven®
modules. Simply unplug one module and replace it with another, no need to redesign the carrier board.
This document describes the features available on the Qseven®evaluation carrier board. Additionally, the schematics for the Qseven®evaluation
carrier board can be found on the congatec website.

Copyright © 2013 congatec AG QA30_QA3Em11 11/91
1.2 conga-QA3 Options Information
The conga-QA3 is available in various variants (commercial and industrial).This user’s guide describes all of these variants and the table below
shows the different configurations available. Check for the Part No. that applies to your product. This will tell you what options described in this
user’s guide are available on your particular module.
conga-QA3 (Commercial Variants)
Part-No 015100 015101 015102 015103 015104 015105
Processor Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
Intel®Atom™ E3827
(Dual Core, 1.75 GHz)
Intel®Atom™ E3826
(Dual Core, 1.46 GHz)
Intel®Atom™ E3825
(Dual Core, 1.33 GHz)
Intel®Atom™ E3815
(Single Core, 1.46 GHz)
Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
L2 Cache 2 MB 1 MB 1 MB 1 MB 512kB 2 MB
Onboard Memory 2GB DDR3L-1333
dual channel
2GB DDR3L-1333
dual channel
2GB DDR3L-1066
dual channel
2GB DDR3L-1066
single channel
2GB DDR3L-1066
single channel
4GB DDR3L-1333
dual channel
Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics
GFX Normal/
Burst
542 / 792 542 / 792 533 / 667 533 / N.A 400 / N.A 542 / 792
LVDS Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit
DDI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI
eMMC 4 GB 4 GB 4 GB 4 GB 4 GB 8 GB
SD Card Yes Yes Yes Yes Yes Yes
Max. TDP 10 W 8 W 7 W 6 W 5 W 10 W
Part-No. 015106 015107 015108 015109 015111
Processor Intel®Atom™ E3815
(Single Core, 1.46 GHz)
Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
Intel®Atom™ E3827
(Dual Core, 1.75 GHz)
Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
Intel®Celeron®J1900
(Quad Core, 2.0/2.42 GHz)
L2 Cache 512kB 2 MB 1 MB 2 MB 2 MB
Onboard Memory 1GB DDR3L-1066
single channel
4GB DDR3L-1333
dual channel
4GB DDR3L-1333
dual channel
2GB DDR3L-1333
dual channel
2GB DDR3L-1333
dual channel
Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics
GFX Normal/
Burst
400 / N.A 542 / 792 542 / 792 542 / 792 688 / 854
LVDS Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit
DDI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI
eMMC N.A N.A N.A N.A N.A
SD Card Yes Yes Yes Yes Yes
Max. TDP / SDP 5 W 10 W 8 W 10 W 10 W

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Part-No. 015112 015113 015130 015131
Processor Intel®Celeron®N2930
(Quad Core, 1.83/2.16 GHz)
Intel®Celeron®N2807
(Dual Core, 1.58/2.16 GHz)
Intel®Atom™ E3805
(Dual Core, 1.33 GHz)
Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
L2 Cache 2 MB 1 MB 1 MB 2 MB
Onboard Memory 2GB DDR3L-1333
dual channel
2GB DDR3L-1333
single channel
2GB DDR3L-1066
single channel
8GB DDR3L-1333
dual channel
Graphics Intel®HD Graphics Intel®HD Graphics None Intel®HD Graphics
GFX Normal/Burst 313 / 854 313 / 750 N.A 542 / 792
LVDS Single/Dual 18/24bit Single/Dual 18/24bit N.A Single/Dual 18/24bit
DDI DP / HDMI / DVI DP / HDMI / DVI N.A DP / HDMI / DVI
eMMC N.A N.A 4 GB 16 GB
SD Card Yes Yes Yes Yes
Max. TDP / SDP 7.5 / 4.5 W 4.3 / 2.5 W 3 W / N.A 10 W
conga-QA3 (Industrial variants)
Part-No 015120 015121 015123 015124 015125 015126
Processor Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
Intel®Atom™ E3827
(Dual Core, 1.75 GHz)
Intel®Atom™ E3825
(Dual Core, 1.33 GHz)
Intel®Atom™ E3815
(Single Core, 1.46 GHz)
Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
Intel®Atom™ E3805
(Dual Core, 1.33 GHz)
L2 Cache 2 MB 1 MB 1 MB 512kB 2 MB 1 MB
Onboard Memory 2GB DDR3L-1333
dual channel
2GB DDR3L-1333
dual channel
2GB DDR3L-1066
single channel
2GB DDR3L-1066
single channel
4GB DDR3L-1333
dual channel
2GB DDR3L-1066
single channel
Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics Intel®HD Graphics None
GFX Normal/Burst 542 / 792 542 / 792 533 / N.A 400 / N.A 542 / 792 N.A
LVDS Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit Single/Dual 18/24bit N.A
DDI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI DP / HDMI / DVI N.A
eMMC 4 GB 4 GB 4 GB 4 GB 8 GB 4 GB
SD Card Yes Yes Yes Yes Yes Yes
Max. TDP / SDP 10 W / N.A 8 W / N.A 6 W / N.A 5 W / N.A 10 W / N.A 3 W / N.A
Note
On the conga-QA3 variant that features the Intel Atom E3805 (variants without graphic engine), serial redirection is enabled in the BIOS by
default and outputted via the onboard UART.

Copyright © 2013 congatec AG QA30_QA3Em11 13/91
1.3 conga-QA3E Options Information
The conga-QA3E is available in two variants. The table below shows the different configurations available. Check for the Part No. that applies
to your product. This will tell you what options described in this user’s guide are available on your particular module.
conga-QA3E (Commercial Variants)
Part-No 018104 018105
Processor Intel®Atom™ E3815
(Single Core, 1.46 GHz)
Intel®Atom™ E3845
(Quad Core, 1.91 GHz)
L2 Cache 512kB 2 MB
Onboard Memory 2GB DDR3L-1066
single channel ECC
4GB DDR3L-1333
single channel ECC
Graphics Intel®HD Graphics Intel®HD Graphics
GFX Normal/Burst 400 / N.A 542 / 792
LVDS Single/Dual 18/24bit Single/Dual 18/24bit
DDI DP / HDMI / DVI DP / HDMI / DVI
eMMC 4 GB (MLC) 8 GB (MLC)
SD Card Yes Yes
Max. TDP / SDP 5 W / N.A 10 W / N.A

Copyright © 2013 congatec AG QA30_QA3Em11 14/91
2 Specifications
2.1 Feature List
Table 1 Feature Summary
Form Factor Based on Qseven®form factor specification revision 2.0
Processor Intel®Atom™ E3845 /E3827 /E3826 /E3825 /E3815
Intel®Celeron J1900 /N2930 /N2807
Memory conga:QA3: Single or dual channel non-ECC DDR3L onboard memory interface with up to 8 GB and data rates up to 1333 MT/s. Variants equipped
with Intel Atom E3815 and E3825 feature single channel memory interface.
conga:QA3E: Single channel ECC DDR3L onboard memory interface with up to 8 GB and data rates up to 1333 MT/s.
For more information, see section 1.2 “conga-QA3 Options Information” or section 1.3 “conga-QA3E Options Information”.
Chipset Integrated in SoC
Onboard Storage eMMC 4.5 onboard flash up to 32 GB (optional only for variants equipped with Intel®Atom™)
Audio High Definition Audio (HDA) interface with support for multiple codecs
Ethernet Gigabit Ethernet via the onboard Intel®Ethernet controller l210.
Graphics Options Intel®HD Graphics with support for DirectX11, OpenGL 3.2, OpenCL 1.2, OpenGLES 2.0, full HW acceleration for decode/encode of MPEG2, H.264,
MVC and dual simultaneous display support
Flat LVDS (Integrated flat panel interface with 25-112MHz single/dual-channel LVDS
Transmitter). Supports:
-Single-channel LVDS interface: 1 x 18 bpp or 1 x 24 bpp.
-Dual-channel LVDS interface : 2 x 18 bpp or 2 x 24 bpp.
-VESA LVDS color mappings
-Automatic Panel Detection via Embedded Panel Interface based on VESA EDID™ 1.3.
-Resolution up to 1920x1200 in dual LVDS bus mode.
Optional eDP interface
(NOTE: conga-QA3/QA3E supports either eDP or LVDS. Both signals are not supported).
1x DDI (Digital Display Interface) with support for
1x DisplayPort 1.1. Multiplexed with HDMI/DVI ports.
Supports Hot-Plug detect.
1x HDMI 1.4 port. Multiplexed with DisplayPort (DP)/
DVI. Supports Hot-Plug detect
1x DVI ports. Multiplexed with HDMI/DP ports.
Supports Hot-Plug detect.
Peripheral
Interfaces
2x Serial ATA® up to 3Gb/s
3x PCI Express®Gen2 links up to 5.0 GT/s per lane
USB Interfaces:
-6x USB 2.0 or
-1x USB 3.0 and 5x USB 2.0
1x SD/MMC
MIPI-CSI 2.0 (supported only on conga-QA3/QA3E
revision B.x or newer)
UART
SPI Bus
LPC Bus
I²C Bus, multimaster
BIOS Features AMI Aptio®UEFI 5.x firmware; 8 MByte serial SPI with congatec Embedded BIOS features (OEM Logo, OEM CMOS Defaults, LCD Control, Display
Auto Detection, Backlight Control, Flash Update)
Power Mgmt. ACPI 5.0 compliant with battery support. Also supports Suspend to RAM (S3).
congatec Board
Controller
Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, bios setup data backup, I²C bus (fast
mode, 400 kHz, multi-master), power loss control

Copyright © 2013 congatec AG QA30_QA3Em11 15/91
Note
Some of the features mentioned in the above Feature Summary are optional. Check the article number of your module and compare it to the
option information list on page 11 of this user’s guide to determine what options are available on your particular module.
2.2 Supported Operating Systems
The conga-QA3/QA3E supports the following operating systems:
Note
For the installation of Windows 7/8 and WES7/8, congatec AG recommends a minimum storage capacity of 16 GB. congatec will not offer
support for systems with less than 16 GB storage space.
2.3 Mechanical Dimensions
•70.0 mm x 70.0 mm @ (2 ¾” x 2 ¾”)
•The Qseven™ module, including the heatspreader plate, PCB thickness and bottom components, is up to approximately 12mm thick.
• Microsoft®Windows®7
• Microsoft®Windows®Embedded Compact 7
• Microsoft® Windows®Embedded Standard 7
• Microsoft®Windows®8
• Microsoft®Windows®Embedded Standard 8
• Microsoft®Windows®10
• Linux (Timesys Fedora 18)
Heatspeader
Qseven Module PCB
Carrier Board PCB
Dimension is dependent
on connector height used
Dimension is dependent
on connector height used
All measurements are in millimeters
All dimensions without tolerance ±0.2mm
Rear View of Qseven Module
2.00
1.20 ±0.1
6.00 8.00

Copyright © 2013 congatec AG QA30_QA3Em11 16/91
2.4 Supply Voltage Standard Power
•5V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Characteristics Min. Typ. Max. Units Comment
5V Voltage ± 5% 4.75 5.00 5.25 Vdc
Ripple - - ± 50 mVPP 0-20MHz
Current
5V_SB Voltage ± 5% 4.75 5.00 5.25 Vdc
Ripple ± 50 mVPP
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that, during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Note
For information about the input power sequencing of the Qseven®module refer to the Qseven®specification.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum5.25V
4.75V
5V
5.05V
4.95V

Copyright © 2013 congatec AG QA30_QA3Em11 17/91
2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-QA3/QA3E COM
•modified congatec carrier board
•conga-QA3/QA3E cooling solution
•Microsoft Windows 7 (64 bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool
Table 1 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle.
The CPU was stressed to its maximum frequency.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak value Highest current spike during the measurement of “S0: Maximum
value”. This state shows the peak value during runtime
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V_SBY.
S5 COM is powered by VCC_5V_SBY.
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2013 congatec AG QA30_QA3Em11 18/91
Processor Information
Table 2 Power Consumption Values
The tables below provide additional information about the power consumption data for each of the conga-QA3/QA3E variants offered. The
values are recorded at various operating mode.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64 bit)
CPU Current (Amp.)
Variant Cores Freq/Turbo
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3 S5
015100
015120
2 GB A.1 QA30R004 Windows 7 Intel®Atom™ E3845 4 1.91/N.A 0.63 1.45 2.21 0.08 0.06
015101
015121
2 GB A.1 QA30R004 Windows 7 Intel®Atom™ E3827 2 1.75/N.A 0.78 1.10 1.92 0.07 0.05
015102
015122
2 GB A.2 QA30R004 Windows 7 Intel®Atom™ E3826 2 1.46/N.A 0.63 1.45 2.21 0.07 0.07
015103
015123
2 GB A.1 QA30R000 Windows 7 Intel®Atom™ E3825 2 1.33/N.A 0.38 0.61 1.00 0.09 0.07
015104
015124
2 GB A.2 QA30R000 Windows 7 Intel®Atom™ E3815 1 1.46/N.A 0.37 0.54 0.79 0.07 0.06
015111 2 GB A.2 QA30R004 Windows 7 Intel®Celeron®J1900 4 2.00/2.42 0.77 2.02 3.01 0.07 0.05
015112 2 GB A.4 QA32R013 Windows 7 Intel®Celeron®N2930 4 1.83/2.16 0.63 1.55 1.96 0.06 N.A
015113 2 GB A.3 QC31R115 Windows 7 Intel®Celeron®N2807 2 1.58/2.16 0.40 0.96 1.55 0.06 0.05
015130 2 GB A.4 QA30R004 Windows 7 Intel®Atom™ E3805 2 1.33/N.A 0.20 0.27 0.29 0.07 0.05
018104 2 GB A.0 QA30R004 Windows 7 Intel®Atom™ E3815 1 1.46/N.A 0.42 0.60 0.99 0.07 N.A
018105 2 GB A.0 QA30R004 Windows 7 Intel®Atom™ E3845 4 1.91/N.A 0.45 1.36 2.10 0.06 N.A
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 3 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC N.A
20oC 3V DC 1.23 µA
70oC 3V DC N.A

Copyright © 2013 congatec AG QA30_QA3Em11 19/91
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec AG website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-QA3/QA3E.
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -45° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
Humidity specifications are for non-condensing conditions.

Copyright © 2013 congatec AG QA30_QA3Em11 20/91
3 Block Diagram
Intel Bay Trail SoC
COMPUTE UNIT
Core #1 Core #2
Core #3 Core #4
Tri-gate 3-D 22nm Quad core SoC
1MB L2 cache shared by 2 cores
PROCESSOR CORE
SSE4.2 AES AVX
SoC TRANSACTION ROUTER
Interfaces
Multimedia Features
DisplayPort HDMI/DVI VGA LVDS
MPEG-2
H.264
DirectX 11 OpenGL 3.0 OpenGLES 2.0
OpenCL 1.2
WMV9 SVC
WMV
SAMU
MVC
low power
high performance
DISPLAY & GRAPHICS
MEMORY CONTROLLER (1066 or 1333 MT/s)
DivX
Integrated I/O Interfaces
INTEGRATED I/O
SATA USB 2.0
LPC BusPCIe GPIOs
SPIHD Audio PCU
USB 3.0
eDP
2x SATA 3G
4 bit SD card
3x USB 2.0
3x USB 2.0
1x SuperSpeed
X
LVDS/eDP
DDI0
eMMC 4.5
eDP Assembly Option
LPC
SSD
MIPI CSI
*1)
NOTE:
The conga-MA3 supports up to 4 GB single channel or
up to 8 GB dual channel non-ECC DDR3L-1333 MT/s.
The conga-MA3E supports up to 8 GB single channel
ECC DDR3L-1333 MT/s
*1)
MIPI CSI is only supported on conga-QA3/QA3E
hardware revision B.x or newer.
*2)
Build-Time Option (not dynamically selectable)
PCIe to GBE
Intel l210
Feature
Connector
USB Hub
eDP to LVDS
NXP PTN3460 RES
SPI Flash
X
congatec
Board Controller
*2)
Ethernet
LVDS/eDP
Qseven 2.0
Connector
230 Edge Finger
LPC Bus
SPI Bus
CAN Bus
HDA I/F
USB 2.0 Port 0..2
USB 2.0 Port 3..5
USB 3.0 Port 0
SATA Port 0
SATA Port 1
SD/MMC
UART
I2C Bus
SLP_BTN
LID_BTN
SM Bus
Fan Control
TX/RX BC
PCIe Port 3
PCIe Port 2
PCIe Port 1
PCIe Port 0
DP/TMDS
Memory
Channel 0
Channel 0
4 On-module DDR3L
(Up to 4GB)
Memory 4 On-module DDR3L
(Up to 4GB)
8 On-module DDR3L
(Up to 8GB)
1 On-module DDR3L
(ECC module)
1333 MT/s, non-ECC
conga-QA3
1333 MT/s, ECC
conga-QA3E