Congatec conga-MA7 User manual

conga-MA7
COM Express® 3.0 Type 10 Mini Module with Intel® Elkhart Lake Processors
User's Guide
Revision 1.02

Copyright © 2021 congatec GmbH MA70m102 2/60
Revision History
Revision Date (yyyy-mm-dd) Author Changes
0.1 2021-08-20 BEU •Preliminary release
1.00 2023-01-09 BEU •Added note to section 2.2 "Supported Operating Systems" and updated section 6.3.4 "OEM BIOS Code/Data" because
CSM is no longer supported
•Added power consumption values to table 7 "Power Consumption Values" and 8 " CMOS Battery Power Consumption"
•Added note about missing non-legacy UART drivers to section 5.8 "UART/CAN"
•Added inrush and current values to section 5.13 "Power Control"
•Added information to section 9 "System Resources"
•Added supported flash device to section 10.4 "Supported Flash Devices"
1.01 2023-07-27 BEU •Renamed section 1.1 "conga-MA7 Options Information" to "Options Information"
•Added CPU use conditions, Tjunction, and DTR information to Table 2 and 3
•Added note about a Windows 10 issue with S3 to section 2.2 "Supported Operating Systems"
•Updated section 6.2.3 "Power Loss Control"
•Updated section 6.2.5 "Enhanced Soft-Off State"
•Renamed section 9.4 "SM Bus" to "SMBus"
1.02 2024-01-15 BEU •Updated title page
•Updated RoHS Directive in preface section
•Added note to section 2.7 "Environmental Specifications"
•Added note to section 4 "Cooling Solutions"
•Added note to sections 5.7 "SD Card"
•Added note to sections 6.1.1 "eMMC"
•Updated section 6.2.3 "Power Loss Control"

Copyright © 2021 congatec GmbH MA70m102 3/60
Preface
This user’s guide provides information about the components, features, connectors and BIOS Setup menus available on the conga-MA7. It is
one of three documents that should be referred to when designing a COM Express®application. The other reference documents that should
be used include the following:
COM Express®Design Guide
COM Express®Specification
The links to the COM Express®documents can be found on the PICMG®website at www.picmg.org
Software Licenses
Notice Regarding Open Source Software
The congatec products contain Open Source software that has been released by programmers under specific licensing requirements such as
the “General Public License“ (GPL) Version 2 or 3, the “Lesser General Public License“ (LGPL), the “ApacheLicense“ or similar licenses.
You can find the specific details at https://www.congatec.com/en/licenses/. Search for the revision of the BIOS/UEFI or Board Controller
Software (as shown in the POST screen or BIOS setup) to get the complete product related license information. To the extent that any
accompanying material such as instruction manuals, handbooks etc. contain copyright notices, conditions of use or licensing requirements that
contradict any applicable Open Source license, these conditions are inapplicable.
The use and distribution of any Open Source software contained in the product is exclusively governed by the respective Open Source
license. The Open Source software is provided by its programmers without ANY WARRANTY, whether implied or expressed, of any fitness for
a particular purpose, and the programmers DECLINE ALL LIABILITY for damages, direct or indirect, that result from the use of this software.
OEM/ CGUTL BIOS
BIOS/UEFI modified by customer via the congatec System Utility (CGUTL) is subject to the same license as the BIOS/UEFI it is based on. You
can find the specific details at https://www.congatec.com/en/licenses/.

Copyright © 2021 congatec GmbH MA70m102 4/60
Disclaimer
The information contained within this user's guide, including but not limited to any product specification, is subject to change without notice.
congatec GmbH provides no warranty with regard to this user's guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec GmbH assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user's guide. In no event shall congatec GmbH be liable for any incidental, consequential,
special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user's guide or any other
information contained herein or the use thereof.
Intended Audience
This user's guide is intended for technically qualified personnel. It is not intended for general audiences.
RoHS Directive
All congatec GmbH designs comply with EU RoHS Directive 2011/65/EU and Delegated Directive 2015/863.
Electrostatic Sensitive Device
All congatec GmbH products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec GmbH Limited Warranty.

Copyright © 2021 congatec GmbH MA70m102 5/60
Symbols
The following symbols are used in this user's guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2021, congatec GmbH. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec GmbH.
congatec GmbH has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user's guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH, our products, or our website.
Certification
congatec GmbH is certified to DIN EN ISO 9001 standard.
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Copyright © 2021 congatec GmbH MA70m102 6/60
Warranty
congatec GmbH makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec GmbH may in its sole discretion modify its Limited Warranty at any time
and from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner's license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec GmbH represents that
the products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship
or due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec's option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec GmbH prior to returning the non conforming product
freight prepaid. congatec GmbH will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec's direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec GmbH shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Technical Support
congatec GmbH technicians and engineers are committed to providing the best possible technical support for our customers so that our
products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation,
utilities and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our
technical support department by email at [email protected].

Copyright © 2021 congatec GmbH MA70m102 7/60
Terminology
Term Description
GB Gigabyte
GHz Gigahertz
kB Kilobyte
MB Megabyte
Mbit Megabit
kHz Kilohertz
MHz Megahertz
TDP Thermal Design Power
PCIe PCI Express
SATA Serial ATA
DDC Display Data Channel
SoC System On Chip
LVDS Low-Voltage Differential Signaling
GbE Gigabit Ethernet
MLC Multi-level Cell
SLC Single-level Cell
HDA High Definition Audio
cBC congatec Board Controller
I/F Interface
N.C. Not connected
N.A. Not available
TBD To be determined

Copyright © 2021 congatec GmbH MA70m102 8/60
Contents
1 Introduction ............................................................................. 11
1.1 Options Information................................................................. 12
2 Specifications........................................................................... 14
2.1 Feature List .............................................................................. 14
2.2 Supported Operating Systems ................................................ 15
2.3 Mechanical Dimensions ........................................................... 15
2.4 Supply Voltage Standard Power .............................................. 16
2.4.1 Electrical Characteristics .......................................................... 16
2.4.2 Rise Time ................................................................................. 16
2.5 Power Consumption ................................................................ 17
2.6 Supply Voltage Battery Power ................................................. 18
2.7 Environmental Specifications................................................... 19
3 Block Diagram.......................................................................... 20
4 Cooling Solutions..................................................................... 21
4.1 HSP Dimensions ...................................................................... 22
4.2 CSP Dimensions....................................................................... 24
5 Connector Subsystems Rows A, B ........................................... 26
5.1 PCI Express .............................................................................. 26
5.2 Gigabit Ethernet ...................................................................... 26
5.3 SATA ........................................................................................ 27
5.4 USB .......................................................................................... 27
5.5 High Definition Audio (HDA) Interface .................................... 28
5.6 Digital Display Interface........................................................... 28
5.6.1 DP++ ....................................................................................... 28
5.6.2 LVDS/eDP................................................................................. 29
5.7 SD Card ................................................................................... 30
5.8 UART/CAN............................................................................... 30
5.9 LPC Bus/eSPI ........................................................................... 31
5.10 SPI Bus ..................................................................................... 31
5.11 I²C Bus ..................................................................................... 31
5.12 SMBus...................................................................................... 31
5.13 Power Control .......................................................................... 32
5.14 Power Management................................................................. 34
6 Additional Features.................................................................. 35
6.1 Onboard Interfaces.................................................................. 35
6.1.1 eMMC ...................................................................................... 35
6.1.2 Security Features...................................................................... 35
6.2 congatec Board Controller (cBC) ............................................. 35
6.2.1 Board Information.................................................................... 35
6.2.2 Fan Control .............................................................................. 36
6.2.3 Power Loss Control.................................................................. 36
6.2.4 Watchdog ................................................................................ 37
6.2.5 Enhanced Soft-Off State .......................................................... 37
6.2.6 General Purpose Input/Output................................................ 37
6.3 OEM BIOS Customization........................................................ 37
6.3.1 OEM Default Settings .............................................................. 37
6.3.2 OEM Boot Logo....................................................................... 38
6.3.3 OEM POST Logo ..................................................................... 38
6.3.4 OEM BIOS Code/Data............................................................. 38
6.3.5 OEM DXE Driver...................................................................... 38
6.4 congatec Battery Management Interface ................................ 38
6.5 API Support (CGOS) ................................................................ 39
6.6 Suspend to Ram....................................................................... 39
7 conga Tech Notes .................................................................... 40
7.1 Intel®Elkhart Lake SoC Features.............................................. 40
7.1.1 Processor Core......................................................................... 40
7.1.1.1 Intel Virtualization Technology................................................. 40
7.1.1.2 AHCI ........................................................................................ 41
7.1.1.3 Thermal Management ............................................................. 41
7.2 ACPI Suspend Modes and Resume Events.............................. 42
8 Signal Descriptions and Pinout Tables..................................... 43
8.1 COM Express®Connector Pinout ............................................ 44
8.2 COM Express®Connector Signal Descriptions........................ 46

Copyright © 2021 congatec GmbH MA70m102 9/60
9 System Resources .................................................................... 56
9.1 I/O Address Assignment.......................................................... 56
9.2 PCI Configuration Space Map ................................................. 57
9.3 I²C Bus .................................................................................... 58
9.4 SMBus...................................................................................... 58
9.5 congatec System Sensors ........................................................ 58
10 BIOS Setup Description........................................................... 59
10.1 Navigating the BIOS Setup Menu ........................................... 59
10.2 BIOS Versions........................................................................... 59
10.3 Updating the BIOS................................................................... 60
10.4 Supported Flash Devices ......................................................... 60

Copyright © 2021 congatec GmbH MA70m102 10/60
List of Tables
Table 1 COM Express 3.0 Pinout Types................................................ 11
Table 2 Commercial Variants ................................................................ 12
Table 3 Industrial Variants..................................................................... 13
Table 4 Feature Summary..................................................................... 14
Table 5 Power Limits on Type 10 Connector ........................................ 16
Table 6 Measurement Description........................................................ 17
Table 7 Power Consumption Values ..................................................... 18
Table 8 CMOS Battery Power Consumption ........................................ 18
Table 9 Cooling Solution Variants......................................................... 21
Table 10 PCI Express®Options............................................................... 26
Table 11 Display Combination ............................................................... 28
Table 12 Wake Events resuming system from S3 ................................... 42
Table 13 Signal Tables Terminology Descriptions .................................. 43
Table 14 COM Express®Connector Pinouts........................................... 44
Table 15 High Definition Audio Link Signals Descriptions ..................... 46
Table 16 Gigabit Ethernet Signal Descriptions....................................... 46
Table 17 Serial ATA Signal Descriptions ................................................. 47
Table 18 General Pupose PCI Express®Lanes Signal Descriptions........ 47
Table 19 USB Signal Descriptions........................................................... 48
Table 20 LVDS Signal Descriptions......................................................... 49
Table 21 LPC/eSPI Signal Descriptions................................................... 50
Table 22 SPI Interface Signal Descriptions ............................................. 50
Table 23 DDI Signal Descriptions ........................................................... 51
Table 24 DP++ Signal Descriptions........................................................ 51
Table 25 General Purpose Serial Interface Signal Descriptions.............. 52
Table 26 I2C Signal Descriptions............................................................ 52
Table 27 Miscellaneous Signal Descriptions........................................... 52
Table 28 Power and System Management Signal Descriptions ............. 53
Table 29 Thermal Protection Interface Signal Descriptions.................... 53
Table 30 SM Bus Signal Descriptions ..................................................... 54
Table 31 General Purpose I/O Signal Descriptions ................................ 54
Table 32 SDIO Signal Descriptions......................................................... 55
Table 33 Module Type Definition Signal Description ............................. 55
Table 34 Power and GND Signal Descriptions....................................... 55
Table 35 I/O Address Assignment.......................................................... 56

Copyright © 2021 congatec GmbH MA70m102 11/60
1 Introduction
COM Express®is an open industry standard defined specifically for COMs (Computer-on-Modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express®modules are available in following form factors:
•Mini 84 mm x 55 mm
•Compact 95 mm x 95 mm
•Basic 125 mm x 95 mm
•Extended 155 mm x 110 mm
The COM Express®Specification Rev 3.0 currently defines three different pinout types. These are shown in the table below.
Table 1 COM Express 3.0 Pinout Types
Types Connector
Rows
PCIe Lanes PEG SATA Ports LAN ports USB 2.0 /
SuperSpeed USB
Display Interfaces
Type 6 A-B C-D Up to 24 1 Up to 4 1 Up to 8 / 4 ¹ VGA,LVDS/eDP, PEG, 3x DDI
Type 7 A-B C-D Up to 32 - Up to 2 5 (1x 1 Gb, 4x 10 Gb) Up to 4 / 4 ¹
Type 10 A-B Up to 4 - Up to 2 1 Up to 8 / 2 ¹ LVDS/eDP, 1xDDI
1. The SuperSpeed USB ports are not in addition to the USB 2.0 ports.
The conga-MA7 modules use the Type 10 pinout definition and comply with the COM Express®3.0 specification. They are equipped with single
220-pin high performance connector that ensure stable data throughput.
The COM integrates all the core components of a common PC and is mounted onto an application-specific carrier board. COM modules
are legacy-free design (no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These
functions include, but are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA,
USB 2.0, and Gigabit Ethernet. The robust thermal and mechanical concept, combined with extended power-management capabilities, is
perfectly suited for all applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all the
interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a dense
and optimized package, which results in a more reliable product while simplifying system integration.
Most importantly, COM Express®modules are scalable. Once an application has been created, the product range can be diversified by using
different performance-class or form-factor size modules. Simply unplug one module and replace it with another; redesign is not necessary.

Copyright © 2021 congatec GmbH MA70m102 12/60
1.1 Options Information
The conga-MA7 is available in eight variants (five commercial and three industrial). The tables below show the different configurations available.
Table 2 Commercial Variants
Part-No. 049400 049401 049402 049420 049421
Processor Intel®Atom®x6425E
2.0 GHz, Quad Core
Intel®Atom®x6413E
1.5 GHz, Quad Core
Intel®Atom®x6211E
1.3 GHz, Dual Core
Intel®Pentium®J6426
2.0 GHz, Quad Core
Intel®Celeron®J6413
1.8 GHz, Quad Core
Burst Freq. 3.0 GHz 3.0 GHz 3.0 GHz 3.0 GHz 3.0 GHz
Graphics Engine Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics Intel®UHD Graphics
GFX Base/Burst Freq. 500 / 750 MHz 500 / 750 MHz 350 / 750 MHz 400 / 850 MHz 400 / 800 MHz
Onboard Memory
(LPDDR4x)
16 GB, 3200 MT/s
quad channel
8 GB, 3200 MT/s
quad channel
8 GB, 3200 MT/s
quad channel
16 GB, 3200 MT/s
quad channel
8 GB, 3733 MT/s
quad channel
eMMC 64 GB 32 GB 32 GB 64 GB 32 GB
Processor TDP (Max) 12 W 9 W 6 W 10 W 10 W
CPU Use Condition 1Embedded Embedded Embedded PC Client PC Client
CPU
Tjunction
Min. -40ºC -40ºC -40ºC 0ºC 0ºC
Max. 105ºC 105ºC 105ºC 105ºC 105ºC
DTR (Cold to Hot
Transition) 2
TBoot + 90ºC TBoot + 90ºC TBoot + 90ºC TBoot + 70ºC TBoot + 70ºC
DTR (Hot to Cold
Transition) 2
TBoot - 90ºC TBoot - 90ºC TBoot - 90ºC TBoot - 70ºC TBoot - 70ºC
Note
1. Intel SoC use conditions. For more information, see Intel documentation.
2. TBoot is the boot temperature. If the Tjunction is not within the DTR range, you must reboot the system. See Intel documentation for more
information.

Copyright © 2021 congatec GmbH MA70m102 13/60
Table 3 Industrial Variants
Part-No. 049410 049411 049412
Processor Intel®Atom®x6425RE
1.9 GHz, Quad Core
Intel®Atom®x6414RE
1.5 GHz, Quad Core
Intel®Atom®x6212RE
1.2 GHz, Dual Core
Burst Freq. N.A N.A N.A
Graphics Engine Intel®UHD Graphics Intel®HD Graphics 500 Intel®HD Graphics 505
GFX Base/Burst Freq. 400 MHz / N.A 400 MHz / N.A 350 MHz / N.A
Onboard Memory
(LPDDR4x)
8 GB, 4266 MT/s
quad channel
4 GB, 3200 MT/s
quad channel
4 GB, 3200 MT/s
quad channel
eMMC 32 GB 32 GB 32 GB
Processor TDP (Max) 12 W 9 W 6 W
CPU Use Condition 1Industrial Industrial Industrial
CPU
Tjunction
Min. -40ºC -40ºC -40ºC
Max. 110ºC 110ºC 110ºC
DTR (Cold to Hot
Transition) 2, 3
TBoot + 90ºC
TBoot + 110ºC
TBoot + 90ºC
TBoot + 110ºC
TBoot + 90ºC
TBoot + 110ºC
DTR (Hot to Cold
Transition) 2, 3
TBoot - 90ºC
TBoot - 110ºC
TBoot - 90ºC
TBoot - 110ºC
TBoot - 90ºC
TBoot - 110ºC
Note
1. Intel SoC use conditions. For more information, see Intel documentation.
2. TBoot is the boot temperature. If the Tjunction is not within the DTR range, you must reboot the system. See Intel documentation for more
information.
3. For DTR of ±110°C, the speed of any enabled USB 3.1 port must be limited to 5 Gb/s.

Copyright © 2021 congatec GmbH MA70m102 14/60
2 Specifications
2.1 Feature List
Table 4 Feature Summary
Form Factor COM Express®Type 10 Mini (84 mm x 55 mm)
Processor Intel®Atom®, Pentium®and Celeron®SoCs
DRAM Max. 16 GB onboard LPDDR4x; up to 4267 MT/s
Ethernet Intel®GbE with TSN support; real-time trigger
I/O Interfaces 4x PCIe Gen3
2x USB 3.1 Gen2
6x USB 2.0
2x SATA III
2x UART
CAN
GPIO
I²C Bus
SMBus
SPI
LPC
1x SDIO (option)
Mass Storage eMMC 5.1 onboard flash up to 64GB (option for 256 GB)
Audio Intel®HD Audio
Graphics Intel®UHD Graphics (Gen11)
LVDS Single channel LVDS interface up to 1280x1024@60Hz; shared with eDP up to 4096x2160@60Hz (option)
Digital Display
Interface
Dual-Mode DisplayPort (DP++) with support for DisplayPort 1.4 with max. 4096x2160@60Hz
congatec Board
Controller
Multistage watchdog; non volatile user data storage; manufacturing and board Information; board statistics; fast mode and multi master I²C bus;
power loss control
Embedded BIOS
Feature
AMI Aptio®UEFI firmware; 32 MByte serial SPI with congatec Embedded BIOS features; OEM Logo; OEM CMOS Defaults; LCD Control; Display
Auto Detection; Backlight Control; Flash Update
Power Management ACPI 5 .0 compliant; Smart Battery Management
Security Discrete SPI TPM 2.0 (Infineon SLB9670)
Operating Systems Microsoft®Windows 10; Microsoft®Windows 10 IoT Enterprise; Linux (Yocto Project); Android; RTS Hypervisor
Temperature Range Commercial:
Industrial:
Operating Temperature: 0 to +60°C
Operating Temperature: -40 to +85°C
Storage Temperature: -20 to +80°C
Storage Temperature: -40 to +85°C
Humidity Operating:
Storage:
10 to 90% r. H. non cond.
5 to 95% r. H. non cond.

Copyright © 2021 congatec GmbH MA70m102 15/60
2.2 Supported Operating Systems
The conga-MA7 supports the following operating systems:
• Microsoft®Windows®10 (64-bit)
• Microsoft®Windows® IoT Enterprise (64-bit)
• Linux®(64-bit)
• Yocto Project®
• Android™Q (64-bit)
• Real-Time Systems Hypervisor
Note
1. Windows®10 version 21H2 (OS build 19044) may sporadically fail to wake from S3 sleep state (POST Code: 0300). congatec recommends
updating to a later Windows®10 version.
2. For the installation of Windows®10, congatec recommends a minimum storage capacity of 20 GB. congatec will not offer technical support
for systems with less than 20 GB storage space.
3. The conga-MA7 only supports native UEFI operating systems. Legacy operating systems that require the Compatibility Support Module
(CSM) as part of the UEFI firmware are not supported.
2.3 Mechanical Dimensions
•84.0mm x 55.0mm
•Height approximately 18 or 21mm (including heatspreader) depending on the carrier board connector that is used. If the 5mm (height) carrier
board connector is used then approximate overall height is 18mm. If the 8mm (height) carrier board connector is used then approximate
overall height is 21mm
4.00
Heatspreader
Module PCB
Carrier Board PCB
7.00
5.00 1.60
4.50
12.60 17.60

Copyright © 2021 congatec GmbH MA70m102 16/60
2.4 Supply Voltage Standard Power
•4.75V - 20V (Wide input range)
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 10 (single connector, 220 pins).
Table 5 Power Limits on Type 10 Connector
Power Rail Module Pin Current
Capability (A)
Nominal
Input (V)
Input Range
(V)
Derated
Input (V)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(W)
Assumed
Conversion
Efficiency
Max. Load
Power
(W)
VCC_12V 6 12 11.4 - 12.6 11.4 +/- 100 68 85% 58
Wide Input 6 4.75-20.0 4.75 +/- 100 28
VCC_5V_SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.0-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 95% of nominal within 0.1 ms to 20 ms (0.1 ms ≤ Rise Time ≤ 20 ms). Each DC input voltage
must rise from 10% to 90% of its nominal voltage in a smooth, continuous ramp and the slope of the turn-on waveform must be positive.
Static Range
+
Absolute Minimum
Absolute Maximum20.00V
4.75V
Ripple

Copyright © 2021 congatec GmbH MA70m102 17/60
2.5 Power Consumption
The power consumption values were measured with the following setup:
•Input voltage +5 V
•conga-MA7 COM
•modified congatec carrier board
•conga-MA7 cooling solution
•Microsoft Windows®10 (64-bit)
Note
The CPU was stressed to its maximum workload with the Intel®Thermal Analysis Tool.
The power consumption values were recorded during the following system states:
Table 6 Measurement Description
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during
desktop idle.
S0: Maximum value Highest frequency mode (HFM/Turbo Boost). The CPU was stressed to its maximum frequency.
S0: Peak value Highest power spike during the measurement of “S0: Maximum value”.
This state shows the peak value over a short period of time (worst case
power consumption value).
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios.
S3 COM is powered by VCC_5V, while in Suspend to RAM state
S5 COM is powered by VCC_5V, while in Soft-Off state
S5e COM is powered by VCC_5V, while in enhanced Soft-Off state
Note
The peripherals did not influence the measured values because they were powered externally.
The tables below provide additional information about the power consumption data for each of the conga-MA7 variants offered. The values
are recorded at various operating modes.

Copyright © 2021 congatec GmbH MA70m102 18/60
Table 7 Power Consumption Values
Part-No. Memory
Size
H.W
Rev.
BIOS
Rev.
CPU Current (A) @ 12V (S0) or 5V (S3, S5, S5e)
Variant Cores Base / Burst Freq.
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3 S5 S5e
049400 16 GB B.4 TBD Intel®Atom®x6425E 4 2.0 / 3.0 0.32 1.59 2.20 0.30 0.30 0.03
049401 8 GB B.4 TBD Intel®Atom®x6413E 4 1.5 / 3.0 0.32 1.46 2.12 0.29 0.28 0.03
049402 8 GB B.4 TBD Intel®Atom®x6211E 2 1.3 / 3.0 0.32 0.94 1.76 0.35 0.30 0.03
049410 8 GB B.4 TBD Intel®Atom®x6425RE 4 1.9 / N.A 0.33 1.24 1.41 0.30 0.30 0.03
049411 4 GB B.4 TBD Intel®Atom®x6414RE 4 1.5 / N.A 0.32 0.94 1.09 0.29 0.31 0.03
049412 4 GB B.4 TBD Intel®Atom®x6212RE 2 1.2 / N.A 0.32 0.71 0.87 0.29 0.29 0.03
049420 16 GB B.4 TBD Intel®Pentium® J6426 4 2.0 / 3.0 0.28 1.36 2.15 0.31 0.30 0.03
049421 8 GB B.4 TBD Intel®Celeron®J6413 4 1.8 / 3.0 0.25 1.32 2.06 0.30 0.29 0.03
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 8 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3V DC 5.42 µA
20oC 3V DC 5.96 µA
70oC 3V DC 8.4 µA
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption in your customer specific application in worst case conditions (for example, during high
temperature and high battery voltage).
3. Consider also the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note "AN09 RTC Battery Lifetime" at www.congatec.com.
4. We recommend to always have a CMOS battery present when operating the conga-MA7.

Copyright © 2021 congatec GmbH MA70m102 19/60
2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -20° to +80°C
Temperature (industrial variants) Operation: -40° to 85°C Storage: -40° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.
Note
For long term storage of the conga-MA7 (more than six months), keep the conga-MA7 in a climate-controlled building at a constant temperature
between 5°C and 40°C, with humidity of less than 65% and at an altitude of less than 3000 m. Also ensure the storage location is dry and well
ventilated.
We do not recommend storing the conga-MA7 for more than five years under these conditions.

Copyright © 2021 congatec GmbH MA70m102 20/60
3 Block Diagram