Congatec COM Express conga-TCV2 User manual

Copyright © 2021 congatec GmbH TCV2m01 1/65
COM Express™ conga-TCV2
COM Express Type 6 Compact module based on AMD Ryzen Embedded V2000 SoC
User’s Guide
Revision 0.1 (Preliminary)

Copyright © 2021 congatec GmbH TCV2m01 2/65
Revision History
Revision Date (yyyy-mm-dd) Author Changes
0.1 2021-11-22 AEM •Preliminary release

Copyright © 2021 congatec GmbH TCV2m01 3/65
Preface
This user’s guide provides information about the components, features and interfaces available on the conga-TCV2. It is one of three documents
that should be referred to when designing a COM Express™ application. The other reference documents that should be used include the
following:
COM Express™ Design Guide
COM Express™ Specification
The links to these documents can be found on the congatec GmbH website at www.congatec.com
Software Licenses
Notice Regarding Open Source Software
The congatec products contain Open Source software that has been released by programmers under specific licensing requirements such as
the “General Public License“ (GPL) Version 2 or 3, the “Lesser General Public License“ (LGPL), the “ApacheLicense“ or similar licenses.
You can find the specific details at https://www.congatec.com/en/licenses/. Search for the revision of the BIOS/UEFI or Board Controller
Software (as shown in the POST screen or BIOS setup) to get the complete product related license information. To the extent that any
accompanying material such as instruction manuals, handbooks etc. contain copyright notices, conditions of use or licensing requirements that
contradict any applicable Open Source license, these conditions are inapplicable.
The use and distribution of any Open Source software contained in the product is exclusively governed by the respective Open Source
license. The Open Source software is provided by its programmers without ANY WARRANTY, whether implied or expressed, of any fitness for
a particular purpose, and the programmers DECLINE ALL LIABILITY for damages, direct or indirect, that result from the use of this software.
OEM/ CGUTL BIOS
BIOS/UEFI modified by customer via the congatec System Utility (CGUTL) is subject to the same license as the BIOS/UEFI it is based on. You
can find the specific details at https://www.congatec.com/en/licenses/.

Copyright © 2021 congatec GmbH TCV2m01 4/65
Disclaimer
The information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.
congatec GmbH provides no warranty with regard to this user’s guide or any other information contained herein and hereby expressly disclaims
any implied warranties of merchantability or fitness for any particular purpose with regard to any of the foregoing. congatec GmbH assumes
no liability for any damages incurred directly or indirectly from any technical or typographical errors or omissions contained herein or for
discrepancies between the product and the user’s guide. In no event shall congatec GmbH be liable for any incidental, consequential,
special, or exemplary damages, whether based on tort, contract or otherwise, arising out of or in connection with this user’s guide or any other
information contained herein or the use thereof.
Intended Audience
This user’s guide is intended for technically qualified personnel. It is not intended for general audiences.
Electrostatic Sensitive Device
All congatec GmbH products are electrostatic sensitive devices. They are enclosed in static shielding bags, and shipped enclosed in secondary
packaging (protective packaging). The secondary packaging does not provide electrostatic protection.
Do not remove the device from the static shielding bag or handle it, except at an electrostatic-free workstation. Also, do not ship or store
electronic devices near strong electrostatic, electromagnetic, magnetic, or radioactive fields unless the device is contained within its original
packaging. Be aware that failure to comply with these guidelines will void the congatec GmbH Limited Warranty.
Lead-Free Designs (RoHS)
All congatec GmbH designs are created from lead-free components and are completely RoHS compliant.

Copyright © 2021 congatec GmbH TCV2m01 5/65
Symbols
The following symbols are used in this user’s guide:
Warning
Warnings indicate conditions that, if not observed, can cause personal injury.
Caution
Cautions warn the user about how to prevent damage to hardware or loss of data.
Note
Notes call attention to important information that should be observed.
Copyright Notice
Copyright © 2021, congatec GmbH. All rights reserved. All text, pictures and graphics are protected by copyrights. No copying is permitted
without written permission from congatec GmbH.
congatec GmbH has made every attempt to ensure that the information in this document is accurate yet the information contained within is
supplied “as-is”.
Trademarks
Product names, logos, brands, and other trademarks featured or referred to within this user’s guide, or the congatec website, are the property
of their respective trademark holders. These trademark holders are not affiliated with congatec GmbH, our products, or our website.

Copyright © 2021 congatec GmbH TCV2m01 6/65
Warranty
congatec GmbH makes no representation, warranty or guaranty, express or implied regarding the products except its standard form of limited
warranty (“Limited Warranty”) per the terms and conditions of the congatec entity, which the product is delivered from. These terms and
conditions can be downloaded from www.congatec.com. congatec GmbH may in its sole discretion modify its Limited Warranty at any time
and from time to time.
The products may include software. Use of the software is subject to the terms and conditions set out in the respective owner’s license
agreements, which are available at www.congatec.com and/or upon request.
Beginning on the date of shipment to its direct customer and continuing for the published warranty period, congatec GmbH represents that
the products are new and warrants that each product failing to function properly under normal use, due to a defect in materials or workmanship
or due to non conformance to the agreed upon specifications, will be repaired or exchanged, at congatec’s option and expense.
Customer will obtain a Return Material Authorization (“RMA”) number from congatec GmbH prior to returning the non conforming product
freight prepaid. congatec GmbH will pay for transporting the repaired or exchanged product to the customer.
Repaired, replaced or exchanged product will be warranted for the repair warranty period in effect as of the date the repaired, exchanged
or replaced product is shipped by congatec, or the remainder of the original warranty, whichever is longer. This Limited Warranty extends to
congatec’s direct customer only and is not assignable or transferable.
Except as set forth in writing in the Limited Warranty, congatec makes no performance representations, warranties, or guarantees, either
express or implied, oral or written, with respect to the products, including without limitation any implied warranty (a) of merchantability, (b) of
fitness for a particular purpose, or (c) arising from course of performance, course of dealing, or usage of trade.
congatec GmbH shall in no event be liable to the end user for collateral or consequential damages of any kind. congatec shall not otherwise
be liable for loss, damage or expense directly or indirectly arising from the use of the product or from any other cause. The sole and exclusive
remedy against congatec, whether a claim sound in contract, warranty, tort or any other legal theory, shall be repair or replacement of the
product only.
Certification
congatec GmbH is certified to DIN EN ISO 9001 standard.
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A
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Copyright © 2021 congatec GmbH TCV2m01 7/65
Technical Support
congatec GmbH technicians and engineers are committed to providing the best possible technical support for our customers so that our
products can be easily used and implemented. We request that you first visit our website at www.congatec.com for the latest documentation,
utilities and drivers, which have been made available to assist you. If you still require assistance after visiting our website then contact our
technical support department by email at [email protected]
Terminology
Term Description
DDI Digital Display Interface
eDP Embedded DisplayPort
GB Gigabyte
GHz Gigahertz
HDA High Definition Audio
kB Kilobyte
kHz Kilohertz
Mb Megabit
MB Megabyte
MHz Megahertz
N.C Not connected
N.A Not available
PCH Platform Controller Hub
PCIe PCI Express
PEG PCI Express Graphics
SATA Serial ATA
TBD To be determined
TDP Thermal Design Power
TPM Trusted Platform Module

Copyright © 2021 congatec GmbH TCV2m01 8/65
Contents
1 Introduction ............................................................................. 11
1.1 COM Express™ Concept......................................................... 11
1.2 Options Information................................................................. 12
2 Specifications........................................................................... 13
2.1 Feature List .............................................................................. 13
2.2 Supported Operating Systems ................................................ 14
2.3 Mechanical Dimensions ........................................................... 14
2.4 Supply Voltage Standard Power .............................................. 15
2.4.1 Electrical Characteristics .......................................................... 15
2.4.2 Rise Time ................................................................................. 15
2.5 Power Consumption ................................................................ 16
2.6 Supply Voltage Battery Power ................................................. 17
2.7 Environmental Specifications................................................... 18
3 Block Diagram.......................................................................... 19
4 Cooling Solutions..................................................................... 20
4.1 CSA Dimensions ...................................................................... 21
4.2 CSP Dimensions....................................................................... 22
4.3 Heatspreader Dimensions........................................................ 23
5 Connector Rows....................................................................... 24
5.1 Primary and Secondary Connector Rows................................. 24
5.1.1 PCI Express™........................................................................... 24
5.1.2 PCI Express™ Graphics (PEG).................................................. 24
5.1.3 Display Interface ...................................................................... 25
5.1.3.1 DisplayPort (DP) ....................................................................... 25
5.1.3.2 LVDS/eDP................................................................................. 25
5.1.4 SATA ........................................................................................ 26
5.1.5 USB .......................................................................................... 27
5.1.6 Gigabit Ethernet ...................................................................... 27
5.1.7 High Definition Audio (HDA) ................................................... 27
5.1.8 LPC Bus.................................................................................... 28
5.1.9 I²C Bus ..................................................................................... 28
5.1.10 SM Bus..................................................................................... 28
5.1.11 SPI............................................................................................ 28
5.1.12 GPIO ........................................................................................ 28
5.1.13 General Purpose Serial Interface ............................................ 28
5.1.14 Power Control .......................................................................... 29
5.1.15 Power Management................................................................. 32
6 Additional Features.................................................................. 33
6.1 TPM.......................................................................................... 33
6.2 congatec Board Controller (cBC) ............................................. 33
6.2.1 Board Information.................................................................... 33
6.2.2 General Purpose Input/Output................................................ 33
6.2.3 Watchdog ................................................................................ 33
6.2.4 I2C Bus...................................................................................... 34
6.2.5 Power Loss Control.................................................................. 34
6.2.6 Fan Control .............................................................................. 34
6.2.7 Enhanced Soft-Off State .......................................................... 34
6.3 OEM BIOS Customization........................................................ 34
6.3.1 OEM Default Settings .............................................................. 35
6.3.2 OEM Boot Logo....................................................................... 35
6.3.3 OEM POST Logo ..................................................................... 35
6.3.4 OEM BIOS Code/Data............................................................. 35
6.3.5 OEM DXE Driver...................................................................... 35
6.4 congatec Battery Management Interface ................................ 36
6.5 API Support (CGOS) ................................................................ 36
6.6 Suspend to Ram....................................................................... 36
7 conga Tech Notes .................................................................... 37
7.1 AMD Processor Features ......................................................... 37
7.2 Thermal Management ............................................................. 38
7.3 ACPI Suspend Modes and Resume Events.............................. 39
8 Signal Descriptions and Pinout Tables..................................... 40
8.1 A-B Connector Signal Descriptions ......................................... 41
8.2 Bootstrap Signals..................................................................... 62
9 System Resources .................................................................... 63

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10 BIOS Setup Description........................................................... 64
10.1 Navigating the BIOS Setup Menu ........................................... 64
10.2 BIOS Versions........................................................................... 64
10.3 Updating the BIOS................................................................... 65
10.4 Supported Flash Devices ......................................................... 65

Copyright © 2021 congatec GmbH TCV2m01 10/65
List of Tables
Table 1 COM Express™ 3.0 Pinout Types............................................ 11
Table 2 conga-TCV2 Variants................................................................ 12
Table 3 Feature Summary..................................................................... 13
Table 4 Electrical Characteristics .......................................................... 15
Table 5 Measurement Description........................................................ 16
Table 6 Power Consumption Values ..................................................... 17
Table 7 CMOS Battery Power Consumption ........................................ 17
Table 8 Cooling Solution Variants......................................................... 20
Table 9 Display Combinations and Resolution..................................... 25
Table 10 Wake Events............................................................................. 39
Table 11 Signal Tables Terminology Descriptions .................................. 40
Table 12 Connector A–B Pinout ............................................................. 41
Table 13 Connector C–D Pinout............................................................. 43
Table 14 PCI Express Signal Descriptions (general purpose) ................. 45
Table 15 PCI Express Signal Descriptions (x16 Graphics)....................... 46
Table 16 DDI Signal Description............................................................. 48
Table 17 TMDS Signal Descriptions ....................................................... 49
Table 18 DisplayPort Signal Descriptions............................................... 51
Table 19 Embedded DisplayPort Signal Descriptions............................ 52
Table 20 CRT Signal Descriptions........................................................... 53
Table 21 LVDS Signal Descriptions......................................................... 53
Table 22 SATA Signal Descriptions......................................................... 54
Table 23 USB Signal Descriptions........................................................... 54
Table 24 Gigabit Ethernet Signal Descriptions....................................... 56
Table 25 High Definition Audio Link Signal Descriptions....................... 57
Table 26 LPC Signal Descriptions........................................................... 57
Table 27 SPI BIOS Flash Interface Signal Descriptions........................... 57
Table 28 Miscellaneous Signal Descriptions........................................... 58
Table 29 General Purpose I/O Signal Descriptions ................................ 58
Table 30 Power and System Management Signal Descriptions ............. 58
Table 31 Rapid Shutdown Signal Descriptions....................................... 59
Table 32 Thermal Protection Signal Descriptions................................... 60
Table 33 SMBus Signal Description........................................................ 60
Table 34 General Purpose Serial Interface Signal Descriptions.............. 60
Table 35 Module Type Definition Signal Description ............................. 61
Table 36 Power and GND Signal Descriptions....................................... 62
Table 37 Bootstrap Signal Descriptions.................................................. 62

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1 Introduction
1.1 COM Express™ Concept
COM Express™ is an open industry standard defined specifically for COMs (computer on modules). Its creation makes it possible to smoothly
transition from legacy interfaces to the newest technologies available today. COM Express™ modules are available in following form factors:
•Mini 84 mm x 55 mm
•Compact 95 mm x 95 mm
•Basic 125 mm x 95 mm
•Extended 155 mm x 110 mm
Table 1 COM Express™ 3.0 Pinout Types
Types Connector
Rows
PCIe Lanes PEG SATA Ports LAN ports USB 2.0/
SuperSpeed USB
Display Interfaces
Type 6 A-B C-D Up to 24 1 Up to 4 1 Up to 8 / 4 1VGA,LVDS/eDP, PEG, 3x DDI
Type 7 A-B C-D Up to 32 - Up to 2 5 (1x 1 Gb, 4x 10 Gb) Up to 4 / 4
Type 10 A-B Up to 4 - Up to 2 1 Up to 8 / 2 1LVDS/eDP, 1xDDI
1. The SuperSpeed USB ports are not in addition to the USB 2.0 ports. Up to four of the USB 2.0 ports can support SuperSpeed USB.
The conga-TCV2 modules use the Type 6 pinout definition and comply with COM Express 3.1 specification. They are equipped with two high
performance connectors that ensure stable data throughput.
The COM integrates all the core components and is mounted onto an application specific carrier board. COM modules are legacy-free design
(no Super I/O, PS/2 keyboard and mouse) and provide most of the functional requirements for any application. These functions include, but
are not limited to a rich complement of contemporary high bandwidth serial interfaces such as PCI Express, Serial ATA, USB 2.0, and Gigabit
Ethernet. The robust thermal and mechanical concept, combined with extended power-management capabilities, is perfectly suited for all
applications.
Carrier board designers can use as little or as many of the I/O interfaces as deemed necessary. The carrier board can therefore provide all
the interface connectors required to attach the system to the application specific peripherals. This versatility allows the designer to create a
dense and optimized package, which results in a more reliable product while simplifying system integration. Most importantly, COM Express™
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.
modules are scalable, which means once an application has been created there is the ability to diversify the product range through the use
of different performance class or form factor size modules. Simply unplug one module and replace it with another; no redesign is necessary.

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1.2 Options Information
The conga-TCV2 is currently available in four variants. The table below shows the different configurations available.
Table 2 conga-TCV2 Variants
Part-No. 050500 050501 050502 050503
Processor AMD Ryzen™Embedded
V2748, 2.9 GHz, 8 Core
AMD Ryzen™Embedded
V2546, 3.0 GHz, 6 Core
AMD Ryzen™Embedded
V2718, 1.7 GHz, 8 Core
AMD Ryzen™Embedded
V2516, 2.1 GHz, 6 Core
CPU Max Freq. 4.25 GHz 3.95 GHz 4.15 GHz 3.95 GHz
L2/L3 Shared Cache 4 MB/8 MB 3 MB/8 MB 4 MB/8 MB 3 MB/8 MB
DDR4 Memory
(ECC or Non-ECC)
3200 MT/s dual channel 3200 MT/s dual channel 3200 MT/s dual channel 3200 MT/s dual channel
Graphics Engine AMD Radeon™
(7 Compute Units)
AMD Radeon™
(6 Compute Units)
AMD Radeon™
(7 Compute Units)
AMD Radeon™
(6 Compute Units)
Graphics Freq. 1.6 GHz 1.5 GHz 1.6 GHz 1.5 GHz
PCIe Ports (Lanes) 5x PCIe Gen 3 Ports
(8 lanes)
5x PCIe Gen 3 Ports
(8 lanes)
5x PCIe Gen 3 Ports
(8 lanes)
5x PCIe Gen 3 Ports
(8 lanes)
USB 4x USB 3.1 Gen 2
4x USB 2.0
4x USB 3.1 Gen 2
4x USB 2.0
4x USB 3.1 Gen 2
4x USB 2.0
4x USB 3.1 Gen 2
4x USB 2.0
SATA (6 Gb/s) 2x 2x 2x 2x
DDI 3x DP++ 3x DP++ 3x DP++ 3x DP++
LVDS/eDP Single or dual LVDS Single or dual LVDS Single or dual LVDS Single or dual LVDS
SoC TDP 45 W (35 W – 54 W) 45 W (35 W – 54 W) 15 W (10 W – 15 W) 15 W (10 W – 15 W)

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2 Specifications
2.1 Feature List
Table 3 Feature Summary
Form Factor Based on COM Express™ standard pinout Type 6 (Compact size 95 x 95 mm)
SoC AMD Ryzen™Embedded V2000
Memory Two memory sockets (located on the top and bottom side of the conga-TCV2). Supports:
-SO-DIMM ECC/non-ECC DDR4 memory modules
-Data rates up to 3200 MT/s
-Maximum 64 GB capacity (32 GB on each socket)
Chipset Integrated in the SoC
Audio High Definition Audio (HDA) interface
Ethernet 2.5 Gigabit Ethernet controller (Intel i225V)
Graphics Options AMD Radeon™ Graphics supports:
-API (DirectX® 12, EGL 1.4, OpenCL® 2.1, OpenGL®ES (1.1, 2.x and 3.x), OpenGL®Next, OpenGL®4.6)
-Multimedia hardware accelerator supporting H.264/AVC (8-bit) encode and decode, H.265/HEVC (8-bit and 10-bit) encode and decode,
VP9 (8-bit and 10-bit) decode, MS compliant JPEG encode and decode
-Up to four independent displays (see table 8 “Display Combinations and Resolution”)
3x DP++
1x LVDS/eDP 1.3
PEG x8 port
Resolutions up to 4K @ 60 Hz
NOTE:
The conga-TCV2 does not natively support TMDS. A DP++ to TMDS
converter (e.g. PTN3360D) needs to be implemented on the carrier
board.
Peripheral Interfaces 4x USB 3.1 Gen 2
4x USB 2.0
2x SATA®(6 Gbps )
5x PCIe (8 Gen. 3 lanes)
2x UART (16C550 compatible)
GPIOs
LPC
I²C (fast mode, multi-master)
SMB
SPI
BIOS AMI Aptio®V UEFI 2.x firmware
32 MB serial SPI flash with congatec Embedded BIOS features
Power Management ACPI 5.0 compliant with battery support.
S5e mode (see section 7.1.7 “Enhanced Soft-Off State”)
Suspend to RAM (S3)
cBC Multi-stage watchdog, non-volatile user data storage, manufacturing and board information, board statistics, hardware monitoring, fan control,
I2C bus, Power loss control
Security Discrete SPI TPM (Infineon SLB9670VQ2.0); AES Instructions

Copyright © 2021 congatec GmbH TCV2m01 14/65
2.2 Supported Operating Systems
The conga-TCV2 supports the following operating systems.
•Microsoft®Windows®10 (64-bit)
•Microsoft®Windows®10 IoT Enterprise (64-bit)
•Linux LTS (64-bit)
•Real-Time Systems Hypervisor
Note
Install AMD catalyst driver after installing Microsoft®Windows®Operating System to improve the graphic performance of the conga-TCV2.
2.3 Mechanical Dimensions
•Length of 95 mm
•Width of 95 mm
•Height of 11 mm (5 mm top-side, 2 mm PCB and 4 mm bottom-side)
The overall height for heatspreader is shown below:
Heatspreader
All dimensions in millimeter
Module PCB
Carrier Board PCB
13.00
4.00
5.00 or 8.00
4.50
2.00±10%
7.00

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2.4 Supply Voltage Standard Power
•12 V DC ± 5%
The dynamic range shall not exceed the static range.
2.4.1 Electrical Characteristics
Power supply pins on the module’s connectors limit the amount of input power. The following table provides an overview of the limitations for
pinout Type 6 (dual connector, 440 pins).
Table 4 Electrical Characteristics
Power Rail Module Pin
Current Capability
(Ampere)
Nominal
Input (Volts)
Input
Range
(Volts)
Derated
Input (Volts)
Max. Input Ripple
(10Hz to 20MHz)
(mV)
Max. Module Input
Power (w. derated input)
(Watts)
Assumed
Conversion
Efficiency
Max. Load
Power
(Watts)
VCC_12V 12 12 11.4-12.6 11.4 +/- 100 137 85% 116
VCC_5V-SBY 2 5 4.75-5.25 4.75 +/- 50 9
VCC_RTC 0.5 3 2.5-3.3 +/- 20
2.4.2 Rise Time
The input voltages shall rise from 10% of nominal to 90% of nominal at a minimum slope of 250V/s. The smooth turn-on requires that during
the 10% to 90% portion of the rise time, the slope of the turn-on waveform must be positive.
Nominal Static Range
Dynamic Range
Absolute Minimum
Absolute Maximum12.60V
11.40V
12V
12.10V
11.90V

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2.5 Power Consumption
The power consumption values were measured with the following setup:
•conga-TCV2 module
•modified congatec carrier board
•conga-TCV2 cooling solution
•Microsoft Windows®10 (64-bit)
Note
The SoC was stressed to its maximum workload with the AMD Validation Toolkit (AVT).
Table 5 Measurement Description
The power consumption values were recorded during the following system states:
System State Description Comment
S0: Minimum value Lowest frequency mode (LFM) with minimum core voltage during desktop idle
S0: Maximum value Highest frequency mode (HFM/Turbo Boost) The CPU was stressed to its maximum frequency
S0: Peak current Highest current spike during the measurement of “S0: Maximum value”. This
state shows the peak value during runtime.
Consider this value when designing the system’s power supply to
ensure that sufficient power is supplied during worst case scenarios
S3 COM is powered by VCC_5V_SBY
S5 COM is powered by VCC_5V_SBY
S5e COM is powered by VCC_5V_SBY
Note
1. The fan and SATA drives were powered externally.
2. All other peripherals except the LCD monitor were disconnected before measurement.

Copyright © 2021 congatec GmbH TCV2m01 17/65
Table 6 Power Consumption Values
The table below provides additional information about the conga-TCV2 power consumption data. The values were recorded at various
operating modes.
Part
No.
Memory
Size
H.W
Rev.
BIOS
Rev.
OS
(64-bit)
CPU Current (Ampere)
Variant Cores Base/ Max Freq.
(GHz)
S0:
Min
S0:
Max
S0:
Peak
S3 S5
050500 TBD TBD TBD Windows 10 AMD Ryzen™Embedded V2748 8 2.90 / 4.25 TBD TBD TBD TBD TBD
050501 TBD TBD TBD Windows 10 AMD Ryzen™Embedded V2546 6 3.00 / 3.95 TBD TBD TBD TBD TBD
050502 TBD TBD TBD Windows 10 AMD Ryzen™Embedded V2718 8 1.70 / 4.15 TBD TBD TBD TBD TBD
050503 TBD TBD TBD Windows 10 AMD Ryzen™Embedded V2516 6 2.10 / 3.95 TBD TBD TBD TBD TBD
Note
With fast input voltage rise time, the inrush current may exceed the measured peak current.
2.6 Supply Voltage Battery Power
Table 7 CMOS Battery Power Consumption
RTC @ Voltage Current
-10oC 3 V DC TBD
20oC 3 V DC TBD
70oC 3 V DC TBD
Note
1. Do not use the CMOS battery power consumption values listed above to calculate CMOS battery lifetime.
2. Measure the CMOS battery power consumption of your application in worst case conditions (for example, during high temperature and
high battery voltage).
3. Consider the self-discharge of the battery when calculating the lifetime of the CMOS battery. For more information, refer to application
note AN9_RTC_Battery_Lifetime.pdf on congatec GmbH website at www.congatec.com/support/application-notes.
4. We recommend to always have a CMOS battery present when operating the conga-TCV2.

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2.7 Environmental Specifications
Temperature (commercial variants) Operation: 0° to 60°C Storage: -40° to +85°C
Humidity Operation: 10% to 90% Storage: 5% to 95%
Caution
The above operating temperatures must be strictly adhered to at all times. When using a congatec heatspreader, the maximum operating
temperature refers to any measurable spot on the heatspreader’s surface.
Humidity specifications are for non-condensing conditions.

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3 Block Diagram
SB-TSI
PCIe 0-7 (Gen 3)
DDR4 Channel A
DDR4 Channel B
DDI1
DDI2
DDI 3
PEG x8
eDP
LPC
SATA 0
SATA 1
PCIe
HDA
SPI0
MGMNT
2nd Gen. AMD®V-Series
“Renoir”
FP6 APU
USB 3.1 Gen 2 Port 5
USB 3.1 Gen 2 Port 1
USB Port 2-3,6-7
SPI Flash 0 TPM
Ethernet
Intel i225V
eDP to LVDS
USB 3.1 Hub
eDP
SATA0
SATA2
SATA1
SATA3
4x USB 2.0
3x USB 3.1
1x USB 3.1
PCIe0-7
Optional - Not available by default
congatec
Board
Controller
5th Generation
LPC
GPIO
SMB
UART 0-1
I2C
LID/SLEEP/FAN
2x DDR4 SO-DIMM
Dual Channel
3200 MT/s
MUX
Ethernet
HD Audio
SM Bus
SPI
LVDS/eDP
LPC
I2C Bus
4x USB 2.0 Port 4 - 7
2x SATA
SER0/1
GPIOs
LID# / SLEEP# / FAN
PCIe lane 0 - 7 (Gen 3)
PEG x8
3x USB 3.1 Gen 2/USB 2.0
(Port 1 - 3)
1x USB 3.1 Gen 2/USB 2.0
(Port 0)
DDI 2 (DP++)
DDI 1 (DP++)
DDI 3 (DP++)

Copyright © 2021 congatec GmbH TCV2m01 20/65
4 Cooling Solutions
congatec GmbH offers the cooling solutions listed in Table 8 for conga-TCV2. The dimensions of the cooling solutions are shown in the
sub-sections. All measurements are in millimeters.
Table 8 Cooling Solution Variants
Cooling Solution Part No Description
1 CSA 050550 Active cooling with 2.7 mm bore-hole standoffs.
050551 Active cooling with M2.5 mm threaded standoffs.
2 CSP 050552 Passive cooling with 2.7 mm bore-hole standoffs.
050553 Passive cooling with M2.5 mm threaded standoffs.
3 HSP 050554 Heatspreader with 2.7 mm bore-hole standoffs.
050555 Heatspreader with M2.5 mm threaded standoffs.
Note
1. We recommend a maximum torque of 0.4 Nm for carrier board mounting screws and 0.5 Nm for module mounting screws.
2. The gap pad material used on congatec heatspreaders may contain silicon oil that can seep out over time depending on the environmental
conditions it is subjected to. For more information about this subject, contact your local congatec sales representative and request the gap
pad material manufacturer’s specification.
Caution
1. The congatec heatspreaders/cooling solutions are tested only within the commercial temperature range of 0° to 60°C. Therefore, if your
application that features a congatec heatspreader/cooling solution operates outside this temperature range, ensure the correct operating
temperature of the module is maintained at all times. This may require additional cooling components for your final application’s thermal
solution.
2. For adequate heat dissipation, use the mounting holes on the cooling solution to attach it to the module. Apply thread-locking fluid on
the screws if the cooling solution is used in a high shock and/or vibration environment. To prevent the standoff from stripping or cross-
threading, use non-threaded carrier board standoffs to mount threaded cooling solutions.
3. For applications that require vertically-mounted cooling solution, use only coolers that secure the thermal stacks with fixing post. Without
the fixing post feature, the thermal stacks may move.
4. Do not exceed the recommended maximum torque. Doing so may damage the module or the carrier board, or both.