Ebyte EO01C-MLO1S User manual

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EBYTE
EO01C-MLO1S User Manual
Si24R1 2.4GHz SPI SMD Wireless Module
Chengdu Ebyte Electronic Technology Co.,Ltd.

ene Chengdu Ebyte Electronic Technology Co., Ltd EO01C-MLOLS User Manual
CONTENTS
TLOVETVIEW « «oot ttt e tite ete ee ee ee eee ee ee 2
1.1 Brief Introduction . . . . «coo 2
T2 Features . «o.oo 2
T3APPLCAtION . . . «oo 2
2. Specification and Parameter . . . . ... oo... tte 4
2.1 Limit parameter . . . o.oo. eee 4
2.2 Operating Parameter . . . . .. oo. outta 4
3.Sizeand pin definition . . .........L 5
4.BASIC OPETALION . « «oo oot teeta 6
41 Hardware desi@il . . ... oot 6
42 Software editing . . . . o.oo 6
SCIrCWt dIAGIAIM . . . o.oo tt eee 7
0. FAQ «a 7
6.1 Communication range Stoo short... LL... 7
62 Module is easy to damage . . .... o.oo 7
6.3 BER(BitError Rate)ishigh . ....... 7
7.50ldering gUIdanCe . . . . «oot 7
7.1 Reflow soldering temperature . . . .. oo... tt 8
72 Reflow Soldering CUIVE . . . o.oo ee ee ee 8
8 Packing method for bulk order... ... LL... 8
Revision history . . «oo 9

ene Chengdu Ebyte Electronic Technology Co., Ltd EO01C-MLOLS User Manual
1.0verview
1.1 Brief introduction
EO01C-MLOIS is a small size SMD module based on Si24R1, operates at
2.4Ghz with PCB antenna, using industrial-grade high-precision 16MHz crystal
oscillator. The RF performance of it and components selection during R&D are all
in accordance with industrial grade standards.
The user needs to use the MCU driver or use a dedicated SPI debugging tool
to develop EO1C-MLO1S.
1.2 Features
® Small size, 12x19mm;
® Communication distance tested is up to 300m;
® The maximum transmit power is SmW, and the software is multi-level adjustable;
® Global license-free ISM 2.4GHz frequency band,
® 2Mbps, 1Mbps and 250kbps air rate;
® 125 communication channels to meet application requirements such as multipoint communication, grouping, and
frequency hopping;
® Connect with MCU through SPI interface, the rate is 0~10Mbps;
® 2.0~3.6V power supply, power supply greater than 3.3V can guarantee the best performance;
® Industrial standard design for long-term use at -40~+85°C;
® Comes with PCB onboard antenna, no need for external antenna;
® Fully compatible with EO1-MLOI1S in software, hardware and packaging.
® FE01C-MLO1S has obtained ROHS certification
1.3 Application
Wearable device;
Smart home and industrial sensors;
Security system, positioning system;
Wireless remote control, drone;
Wireless game remote control;
Healthcare products;
Wireless voice, wireless headset;

ene Chengdu Ebyte Electronic Technology Co., Ltd EO01C-MLOLS User Manual
® Automotive industry applications.

ene Chengdu Ebyte Electronic Technology Co., Ltd EO01C-MLOLS User Manual
2. Specification and parameter
2.1 Limit parameter
. Performance
Main parameter - Remark
Min. Max.
Power supply (V) 0 36 Voltage over 3.6V will cause
permanent damage to module
Chances of burn is slim when modules
Blocking power (dBm) 10 are used in short distance
Operating temperature (°C) -40 85
2.2 Operating parameter
Main parameter Performance Remark
Min. Typ. Max.
Operating voltage (V) 2.0 33 3.6 >3.3V ensures output power
Communication level (V) 33 Fors py at risk of
Operating temperature (°C) -40 i +85 Industrial design
Operating frequency (MHz) 24 " 2.525 Support ISM band
Tx current 12 0dBm
Power Rx current 15
consumption
Sleep current 0.7 Software is shut down
Max Tx power (dBm) - 7 -
Receiving sensitivity (dBm) " -83 " Air data rate is 250kbps
Air data rate (bps) 250k - 2M Controlled via user’s programming
Main parameter Description Remark
Do ee | dwn | [on dead sa wns S01 ns
FIFO 32Byte Max length transmitted each time
Crystal frequency 16MHz
Modulation GFSK
Package SMD
Connector 1.27mm
Communication interface SPI 0-10Mbps
Size 12 * 19mm Without SMA
Antenna PCB antenna 500hm impedance

ene Chengdu Ebyte Electronic Technology Co., Ltd EO01C-MLOLS User Manual
3. Size and pin definition
12.0+0.1mm 1.63+0.1mm 1.27 1.56
BEE
allo lolldlldlldllo olldlldlldlldllolollo
8 7 6 5 4 3 2 1 1 2 3 4 5 6 7 8
19.0+0.1mm
0.7200 — |—
ANT
0.60 0.60
Top pad: Bottom pad :
0.60 190 0.601] 1:80
0.90 0.90
Pad quantity : 8
Unit: mm
Pin No. Pin item Pin direction [Pin application
1 VCC Power supply must be 2.0 ~3.6V
CE Input Chip Enable
CSN Input SPI Chip select
SCK Input SPI clock
MISO Output SPI master input slave output
IRQ Output Interrupt request.
GND Ground
2
3
4
5 MOSI Input SPI master output slave input
6
7
8

ene Chengdu Ebyte Electronic Technology Co., Ltd EO01C-MLOLS User Manual
4.Basic operation
4.1 Hardware design
® tis recommended to use a DC stabilized power supply. The power supply ripple factor is as small as possible, and the
module needs to be reliably grounded;
® Please pay attention to the correct connection of the positive and negative poles of the power supply. Reverse connection
may cause permanent damage to the module;
® Please check the power supply to ensure it is within the recommended voltage otherwise when it exceeds the maximum
value the module will be permanently damaged,
® Please check the stability of the power supply, the voltage can not be fluctuated frequently;
® When designing the power supply circuit for the module, it is often recommended to reserve more than 30% of the margin,
so the whole machine is beneficial for long-term stable operation;
® The module should be as far away as possible from the power supply, transformers, high-frequency wiring and other parts
with large electromagnetic interference;
® High-frequency digital routing, high-frequency analog routing, and power routing must be avoided under the module. If it
is necessary to pass through the module, assume that the module is soldered to the Top Layer, and the copper is spread on
the Top Layer of the module contact part(well grounded), it must be close to the digital part of the module and routed in
the Bottom Layer;
® Assuming the module is soldered or placed over the Top Layer, it is wrong to randomly route over the Bottom Layer or
other layers, which will affect the module's spurs and receiving sensitivity to varying degrees;
® It is assumed that there are devices with large electromagnetic interference around the module that will greatly affect the
performance. It is recommended to keep them away from the module according to the strength of the interference. If
necessary, appropriate isolation and shielding can be done;
® Assume that there are traces with large electromagnetic interference (high-frequency digital, high-frequency analog, power
traces) around the module that will greatly affect the performance of the module. It is recommended to stay away from the
module according to the strength of the interference. If necessary, appropriate isolation and shielding can be done.
® If the communication line uses a 5V level, a 1k-5.1k resistor must be connected in series (not recommended, there is still a
risk of damage);
® Try to stay away from some physical layers such as TTL protocol at 2.4GHz , for example: USB3.0;
® The mounting structure of antenna has a great influence on the performance of the module. It is necessary to ensure that
the antenna is exposed, preferably vertically upward. When the module is mounted inside the case, use a good antenna
extension cable to extend the antenna to the outside;
® The antenna must not be installed inside the metal case, which will cause the transmission distance to be greatly weakened.
® Conductors or other sources of interference should be avoided around the onboard PCB antenna.
42 Software editing
® Insert the module into the user circuit board, use the microcontroller to communicate with the module by SPI or serial port,
and operate the control register and the transceiver buffer through the SPI command to complete the wireless data transmit
and receive function.
® As interrupt pin for IRQ, it can be used to wake-up MCU and achieve fast response; But the user can get the interrupt
status through SPI (not recommended, it is not conducive to the overall power consumption, and with low efficiency)
® CE pin can be high level for long-term, but it needs to set as POWER DOWN mode when the module writes registers, and
itis recommended that CE is controlled by MCU pin;

LE Chengdu Ebyte Electronic Technology Co., Ltd EO01C-MLOLS User Manual
5 Circuit diagram
STMSL
| ~ 20 VCC
J PC3 PER —— FF
25
pCa PCI
oH
—
Lid
vee
—9 PAD PCO O75 39 CE
— PAI SPI_SCK/PBS [03 I 70 CSN
—=( pA2 SPI_MISO/PB7 (O= = SCK
—= PA3 SPI_MOSI/PB6 © 2 6 J MOS!
=J VSS SP1_NSS/PB4 3 =i MISO
— 04 VDD PB3 5 rae IRQ
—5C PDO PB2 07 [9 GND
—3 PBO PBl C——— ee
[oe ai i 2 EO1C-MLO1S
iN
6. FAQ
6.1 Communication range is too short
The communication distance will be affected when obstacle exists.
Data lose rate will be affected by temperature, humidity and co-channel interference.
The ground will absorb and reflect wireless radio wave, so the performance will be poor when testing near ground.
Sea water has great ability in absorbing wireless radio wave, so performance will be poor when testing near the sea.
The signal will be affected when the antenna is near metal object or put in a metal case.
Power register was set incorrectly, air data rate is set as too high (the higher the air data rate, the shorter the distance).
The power supply low voltage under room temperature is lower than 2.5V, the lower the voltage, the lower the
transmitting power.
Due to antenna quality or poor matching between antenna and module.
6.2 Module is easy to damage
® Please check the power supply source, ensure it is 2.0V~3.6V, voltage higher than 3.6V will damage the module.
® Please check the stability of power source, the voltage cannot fluctuate too much.
® Please make sure antistatic measure are taken when installing and using, high frequency devices have electrostatic
susceptibility.
® Please ensure the humidity 1s within limited range, some parts are sensitive to humidity.
® Please avoid using modules under too high or too low temperature.
6.3 BER(Bit Error Rate) is high
® There are co-channel signal interference nearby, please be away from interference sources or modify frequency and
channel to avoid interference;
® Poor power supply may cause messy code. Make sure that the power supply is reliable.
® The extension line and feeder quality are poor or too long, so the bit error rate is high;
7.Soldering guidance

LE Chengdu Ebyte Electronic Technology Co., Ltd EO01C-MLOLS User Manual
7.1 Reflow soldering temperature
Lo. Sn-Pb
Profile Feature Curve characteristics Pb-Free Assembly
Assembly
Solder Paste Solder paste Sn63/Pb37 S1n96.5/Ag3/Cu0.5
Preheat Temperature min (Tsmin) Min preheating temp. 100°C 150°C
Preheat temperature max (Tsmax) Mx preheating temp. 150°C 200°C
Preheat Time (Tsmin to Tsmax)(ts) Preheating time 60-120 sec 60-120 sec
Average ramp-up rate(Tsmax to Tp) Average ramp-up rate 3°C/second max 3°C/second max
Liquidous Temperature (TL) Liquid phase temp. 183°C 217°C
Time (tL) Maintained Above (TL) Time below liquid phase line 60-90 sec 30-90 sec
Peak temperature (Tp) Peak temp. 220-235°C 230-250°C
Aveage ramp-down rate (Tp to Tsmax) Average ramp-down rate 6°C/second max 6°C/second max
Time 25°C to peak temperature
Time to peak temperature for
25°C
6 minutes max 8 minutes max
7.2 Reflow soldering curve
Te RE hhh 5s;
Critical Zone
TLto Te
|
o TSmax
I I |
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a
g L
3 BY ee xeapuii tans
Preheat
25
t 257C to Peak
Time
=>
8 Packing method for bulk order

LE Chengdu Ebyte Electronic Technology Co., Ltd EO01C-MLOLS User Manual
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Revision history
Version Date Description Issued by
1.0 2020-06-19 Original version Ren
1.1 2020-06-29 Format updated Ren
12 2020-07-24 Ren
1.3 2022-5-23 Bug fixes Yan
About us
Technical support: [email protected]
Documents and RF Setting download link:: www.ebyte.com
Thank you for using Ebyte products! Please contact us with any questions or suggestions: info(@cdebyte.com
Official hotline:[phone]
Web: www.ebyte.com
Address: B5 Mould Park, 199# Xiqu Ave, High-tech District, Sichuan, China
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