Epson S5U13C00P00CX00 User manual

Rev 1.01
S1D13C00
S5U13C00P00CX00 Customer
Development Board User
Manual
Document Number: XB8A-G-001-01.01

Evaluation board/kit and Development tool important notice
1. This evaluation board/kit or development tool is designed for use for engineering evaluation, demonstration, or
development purposes only. Do not use it for other purposes. It is not intended to meet the requirements of
design for finished products.
2. This evaluation board/kit or development tool is intended for use by an electronics engineer and is not a
consumer product. The user should use it properly and in a safe manner. Seiko Epson dose not assume any
responsibility or liability of any kind of damage and/or fire coursed by the use of it. The user should cease to
use it when any abnormal issue occurs even during proper and safe use.
3. The part used for this evaluation board/kit or development tool may be changed without any notice.
NOTICE
No part of this material may be reproduced or duplicated in any form or by any means without the written
permission of Seiko Epson. Seiko Epson reserves the right to make changes to this material without notice.
Seiko Epson does not assume any liability of any kind arising out of any inaccuracies contained in this material or
due to its application or use in any product or circuit and, further, there is no representation that this material is
applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any
intellectual property rights is granted by implication or otherwise, and there is no representation or warranty that
anything made in accordance with this material will be free from any patent or copyright infringement of a third
party. When exporting the products or technology described in this material, you should comply with the applicable
export control laws and regulations and follow the procedures required by such laws and regulations. You are
requested not to use, to resell, to export and/or to otherwise dispose of the products (and any technical information
furnished, if any) for the development and/or manufacture of weapon of mass destruction or for other military
purposes.
All brands or product names mentioned herein are trademarks and/or registered trademarks of their respective
companies.
©SEIKO EPSON CORPORATION 2018. All rights reserved.

Customer Development Board User Manual Seiko Epson Corporation i
(Rev 1.01)
Table of Contents
1. Introduction................................................................................................................3
2. LCD Module Options and Parts List.........................................................................4
3. Connecting the LCD Modules...................................................................................5
3.1 J1 – 24-pin RGB Type Connector ..........................................................................................5
3.2 J2 – 21-pin RGB Type Connector ..........................................................................................5
3.3 J3 – 10-pin SPI Type Connector ............................................................................................6
4. Connecting the Host Interface Board.......................................................................7
5. Jumpers Settings.......................................................................................................8
5.1 Host Interface.........................................................................................................................8
5.2 LCD Interface..........................................................................................................................9
5.2.1 S1D13C00 VDD and Panel I/O Supply Selection...............................................................9
5.2.2 SPI Panels (on J3) Power and Control Selection ...............................................................9
5.3 Power Supply .........................................................................................................................9
6. DIP-Switch and Headers..........................................................................................10
6.1 DIP-Switch (S1) ....................................................................................................................10
6.2 Headers ................................................................................................................................11
6.2.1 H1 ...................................................................................................................................11
6.2.2 H2 ...................................................................................................................................11
7. Pre-installed On-board Components......................................................................12
7.1 16Mbytes QSPI Serial Flash (U3).........................................................................................12
7.2 1Kbit 400Kbps I2C EEPROM (U4) ........................................................................................12
7.3 Buzzer (BZ1).........................................................................................................................12
7.4 IR Emitter (LED2) .................................................................................................................12
8. Tiva C Series EK-TM4C1294XL Launchpad Connections.....................................13
9. Pinout for LCD Interfaces........................................................................................15
9.1 J1 - 24-pin RGB LCD Interface ............................................................................................15
9.2 J2 - 21-Pin RGB LCD Interface ............................................................................................16
9.3 J3 - 10-Pin SPI LCD Interface ..............................................................................................17
10. Parts List ..................................................................................................................18
11. S5U13C00P00CX00 Schematics .............................................................................20
12. Revision History ......................................................................................................24

ii Seiko Epson Corporation Customer Development Board User Manual
(Rev 1.01)

Introduction
Customer Development Board User Manual Seiko Epson Corporation 3
(Rev 1.01)
1. Introduction
The S5U13C00P00CX00 is the S1D13C00 BoosterPack MDC Customer Development Board. It is a
BoosterPack board intended to be directly connected to the TI Tiva C Series EK-TM4C1294XL Launchpad
evaluation board for evaluating and developing embedded memory LCD display applications using the Epson
S1D13C00 Memory Display Controller IC.
Figure 1 shows the S5U13C00P00CX00 Customer Development Board.
Figure 1 – S5U13C00P00CX00 Customer Development Board
The S5U13C00P00CX00 Customer Development Board consists of:
A S1D13C00 Memory Display Controller (U1)
Four 2x10 connectors for Host Interface connection (J4, J5, J6 and J7) and +5V/+3.3V power
A 16Mbytes QSPI Serial Flash (U3)
A 1Kbit 400Kbps I2C EEPROM (U4)
A Buzzer (BZ1)
An IR emitter with driving FET (LED2 & Q1)
Three LCD panel interface flexible cable connectors:
24 positions, 0.5mm top and bottom contacts connector (J1)
21 positions, 0.3mm bottom contact connector (J2)
10 positions, 0.5mm top and bottom contacts connector (J3)

LCD Module Options and Parts List
4Seiko Epson Corporation Customer Development Board User Manual
(Rev 1.01)
2. LCD Module Options and Parts List
The S5U13C00P00CX00 Customer Development Board can interface to two types of LCD modules. One type of
LCD module has a parallel RGB interface and the other type has a SPI interface.
The following table shows some of the two LCD module options, their respective interface connectors and their
manufacturer part numbers:
Type
Connector
Manufacturer Part Number
6-bit Color RGB 240x240
J1 (24 pins)
JDI LPM012M134B
6-bit Color RGB 218x218
J1 (24 pins)
JDI LPM011M133B
6-bit Color RGB 240x240
J2 (21 pins)
Sharp LS012B7DD06
3-bit Color SPI 128x128
J3 (10-pins)
Sharp LS13B7DH06
1-bit BW SPI 128x128
J3 (10-pins)
Sharp LS010B7DH01
1-bit BW SPI 240x240
J3 (10-pins)
Sharp LS012B7DH02
3-bit Color SPI 176x176
J3 (10-pins)
JDI LPM013M126C

Connecting the LCD Modules
Customer Development Board User Manual Seiko Epson Corporation 5
(Rev 1.01)
3. Connecting the LCD Modules
3.1 J1 – 24-pin RGB Type Connector
Figure 2 – Example of connecting the JDI LPM012M134B LCD module
3.2 J2 – 21-pin RGB Type Connector
Figure 3 – Example of connecting the Sharp LS012B7DD06 LCD module

Connecting the LCD Modules
6Seiko Epson Corporation Customer Development Board User Manual
(Rev 1.01)
3.3 J3 – 10-pin SPI Type Connector
Figure 4 – Example of connecting the Sharp LS13B7DH06 LCD module

Connecting the Host Interface Board
Customer Development Board User Manual Seiko Epson Corporation 7
(Rev 1.01)
4. Connecting the Host Interface Board
Position the S5U13C00P00CX00 Customer Development Board on TOP of the EK-TM4C1294XL Launchpad
Host Interface Board, press the two boards together with J4 connecting to X8, J5 connecting to X9, J6 connecting to
X6, and J7 connecting to X7 respectively.
Figure 5 – Connecting the S5U13C00P00CX00 to the EK-TM4C1294XL
J4
J5
J6
J7
X8
X9
X6
X7

Jumpers Settings
8Seiko Epson Corporation Customer Development Board User Manual
(Rev 1.01)
5. Jumpers Settings
The following tables show the jumpers settings for the S5U13C00P00CX00 Customer Development Board. The
jumpers are divided into three groups: Host Interface, LCD Interface, and Power Supply.
Figure 6 – S5U13C00P00CX00 Jumpers Locations
5.1 Host Interface
Jumpers
Descriptions
1-2 Position
2-3 Position
Default Position
JP2
HIFVDD Selection
VDD_3V3
HOST_3V3
1-2 (VDD_3V3)
JP14
#HIFWR Selection
8-bit Indirect
SPI/QSPI
2-3 (SPI/QSPI)
JP15
HIFD0 Selection
8-bit Indirect
SPI/QSPI
2-3 (SPI/QSPI)
JP16
HIFD1 Selection
8-bit Indirect
SPI/QSPI
2-3 (SPI/QSPI)
JP17
HIFD2 Selection
8-bit Indirect
SPI/QSPI
2-3 (SPI/QSPI)
JP18
HIFD3 Selection
8-bit Indirect
SPI/QSPI
2-3 (SPI/QSPI)
JP19
HIFCNF Selection
SPI/QSPI
8-bit Indirect
1-2 (SPI/QSPI)
JP15
JP6
JP16
JP18
JP20
JP13
JP1
JP14
JP10
JP8
JP11
JP9
JP7
JP4
JP3
JP19
JP2
JP17
JP5

Jumpers Settings
Customer Development Board User Manual Seiko Epson Corporation 9
(Rev 1.01)
5.2 LCD Interface
5.2.1 S1D13C00 VDD and Panel I/O Supply Selection
Jumpers
Descriptions
1-2 Position
2-3 Position
Default Position
JP3
VCOMVDD Selection
VMDL
VMDH
1-2 (VMDL)
JP4
DISPVDD Selection
VMDL
VMDH
1-2 (VMDL)
JP6
VDD Selection
VDD_3V3
HOST_3V3
1-2 (VDD_3V3)
5.2.2 SPI Panels (on J3) Power and Control Selection
Jumpers
Descriptions
1-2 Position
2-3 Position
Default Position
JP7
EXTMODE Selection
External VCOM
Internal VCOM
1-2 (External VCOM)
JP8
VDDA Selection
VMDH
VMDL
2-3 (VMDL)
JP9
VDD Selection
VMDH
VMDL
2-3 (VMDL)
JP10
EXTVCOM Selection
VCOM
(for JP7 = 1-2)
GND
(for JP7 = 2-3)
1-2 (VCOM)
JP20
J3_DISP_EN
Selection
PA5 of Host MCU
(pin 20 on J6)
P07 of S1D13C00
(pin 30)
2-3 (P07 of S1D13C00)
Jumpers
Descriptions
1-2 Position
3-4 Position
5-6 Position
Default Position
JP11
Display Enable
Control Selection
J3_VDD
(Always enable)
J3_DISP_EN
(see JP20)
GND
(Disable)
3-4 (controlled by JP20)
5.3 Power Supply
Jumpers
Descriptions
Default Settings
JP1
VDD Supplies on pin 22 and pin 34 of S1D13C00
(used for current measurement)
Install
JP5
External 5V Power Supply
JP5-1 = +5V in
JP5-2 = GND
No Connection (NC)
JP13
External VC3 Supply connection
No Connection (NC)

DIP-Switch and Headers
10 Seiko Epson Corporation Customer Development Board User Manual
(Rev 1.01)
6. DIP-Switch and Headers
Figure 7 – S5U13C00P00CX00 DIP-Switch and Headers Locations
6.1 DIP-Switch (S1)
The main purpose of the DIP-switch is used to perform a loopback test on both of the SPI interfaces of the
S1D13C00. During normal operations, all the switches should be OFF (default setting).
The table below shows the pin assignments of S1. When the switch is ON, the corresponding signals are connected.
S1
Pin
S1D13C00
Pin Name
S1 ON Connection
S1D13C00
Pin Name
S1
Pin
1
#QSPISS
< -- >
P00 (#SPISS)
8
2
QSPICLK
< -- >
P01 (SPICLK)
7
3
QSPID0
< -- >
P02 (SPIDI)
6
4
QSPID1
< -- >
P03 (SPIDO)
5
(1) When performing loopback test, R51 in series of #QSPISS needs to be removed
S1
H1
H2
R51

DIP-Switch and Headers
Customer Development Board User Manual Seiko Epson Corporation 11
(Rev 1.01)
6.2 Headers
The main purpose of the headers is to provide a convenient way for users to access different GPIO port functions of
the S1D13C00 other than those components pre-installed on the S5U13C00P00CX00 Customer Development
Board.
Please refer to the S1D13C00 Hardware Functional Specification, document XB8A-A-001-xx, for enabling and
using of the functions.
6.2.1 H1
The table below shows the pin assignments of H1.
H1 Pin
S1D13C00
Pin name
S1D13C00
Pin assignment
S1D13C00 functions
(other than GPIO)
1
VDD
VDD_3V3
VDD_3V3
2
P04
27
I2C interface – SCL (1)
3
P05
28
I2C interface - SDA (1)
4
P06
29
IR / EL control – REMO (2) (3)
5
P07
30
EL control – CLPLS (3)
6
P10
38
Buzzer control – BZOUT (4) or
RTC1S output of RTC
7
P11
39
Buzzer control – #BZOUT (4) or
FOUT output of CLG
8
GND
GND
GND
(1) See section 7.2 below about pre-installed on-board components for this function
(2) See section 7.4 below about pre-installed on-board components for this function
(3) No pre-installed on-board components for EL control function
(4) See section 7.3 below about pre-installed on-board components for this function
6.2.2 H2
External SPI device (master or slave) can be connected through H2 to the S1D13C00.
The table below shows the pin assignments of H2.
H2 Pin
S1D13C00
Pin name
S1D13C00
Pin assignment
S1D13C00 functions
(other than GPIO)
1
VDD
VDD_3V3
VDD_3V3
2
P03
26
SPIDO (1)
3
P02
25
SPIDI (1)
4
P01
24
SPICLK (1)
5
P00
23
#SPISS (1)
6
GND
GND
GND
(1) No pre-installed on-board components for this function, see section 6.1 above for additional
information

Pre-installed On-board Components
12 Seiko Epson Corporation Customer Development Board User Manual
(Rev 1.01)
7. Pre-installed On-board Components
Figure 8 – S5U13C00P00CX00 pre-installed on-board components locations
7.1 16Mbytes QSPI Serial Flash (U3)
This serial flash is directly connected to the QSPI interface of the S1D13C00. The flash can be optionally accessed
(read-only) through the Memory-Mapped Access area on the memory map of the S1D13C00.
7.2 1Kbit 400Kbps I2C EEPROM (U4)
This I2C EEPROM is directly connected to the I2C interface (P04 & P05) of the S1D13C00 with default address at
“000”. If an external I2C device need to be accessed by these two pins through Header H1, R69 and R70 need to be
removed to avoid conflict if the external device has the same slave address as the I2C EEPROM.
7.3 Buzzer (BZ1)
This buzzer is directly connected to the Sound Generator interface (P10 & P11) of the S1D13C00. If external
devices need to be accessed by these two pins through Header H1, R71 and R72 need to be removed to avoid
conflict.
7.4 IR Emitter (LED2)
This IR emitter is driven by a FET (Q1), which in turn is controlled by the REMC interface (P06) of the S1D13C00.
Resistor R75 can optionally be removed if external devices need to be accessed by this pin through Header H1.
U4
R69
R71
R72
R70
LED2
BZ1
U3
R75

Tiva C Series EK-TM4C1294XL Launchpad Connections
Customer Development Board User Manual Seiko Epson Corporation 13
(Rev 1.01)
8. Tiva C Series EK-TM4C1294XL Launchpad Connections
The following tables show the signals of the Tiva C Series EK-TM4C1294XL Launchpad connectors which are
used by the S5U13C00P00CX00 Customer Development Board:
J4
EK-TM4C1294XL
Connector X8 Signals
S1D13C00 MDC
BoosterPack Usage
1
3V3
-
2
5V
HOST_5V
3
PE4
to JP15-3 as HIFSPID0
4
GND
GND
5
PC4
HIFD7
6
PE0
-
7
PC5
HIFD6
8
PE1
-
9
PC6
HIFD5
10
PE2
-
11
PE5
to JP16-3 as HIFSPID1
12
PE3
-
13
PD3
-
14
PD7
-
15
PC7
HIFD4
16
PA6
-
17
PB2
-
18
PM4
-
19
PB3
#HIFRD
20
PM5
HIFIRQ
J5
EK-TM4C1294XL
Connector X9 Signals
S1D13C00 MDC
BoosterPack Usage
1
PF1
-
2
GND
GND
3
PF2
-
4
PM3
-
5
PF3
-
6
PH2
-
7
PG0
-
8
PH3
-
9
PL4
-
10
TARGET_RST#
#RESET_IN
11
PL5
-
12
PD1
-
13
PL0
-
14
PD0
-
15
PL1
-
16
PN2
-
17
PL2
-
18
PN3
-
19
PL3
-
20
PP2
to JP14-1 as #HIFWR

Tiva C Series EK-TM4C1294XL Launchpad Connections
14 Seiko Epson Corporation Customer Development Board User Manual
(Rev 1.01)
J6
EK-TM4C1294XL
Connector X6 Signals
S1D13C00 MDC
BoosterPack Usage
1
3V3
HOST_3V3
2
5V
HOST_5V
3
PD2
-
4
GND
GND
5
PP0
-
6
PB4
#HIFDE
7
PP1
-
8
PB5
to JP14-3 as HIFSPICLK
9
PD4
to JP17-3 as HIFSPID2
10
PK0
to JP15-1 as HIFD0
11
PD5
to JP18-3 as HIFSPID3
12
PK1
to JP16-1 as HIFD1
13
PQ0
-
14
PK2
to JP17-1 as HIFD2
15
PP4
-
16
PK3
to JP18-1 as HIFD3
17
PN5
-
18
PA4
-
19
PN4
-
20
PA5
To JP20-1 as J3_DISP_EN
J7
EK-TM4C1294XL
Connector X7 Signals
S1D13C00 MDC
BoosterPack Usage
1
PG1
-
2
GND
GND
3
PK4
-
4
PM7
-
5
PK5
-
6
PP5
-
7
PM0
-
8
PA7
-
9
PM1
-
10
TARGET_RST#
-
11
PM2
-
12
PA3/PQ2
-
13
PH0
-
14
PA2/PQ3
-
15
PH1
-
16
PP3
#HIFCS
17
PK6
-
18
PQ1
-
19
PK7
-
20
PM6
-

Pinout for LCD Interfaces
Customer Development Board User Manual Seiko Epson Corporation 15
(Rev 1.01)
9. Pinout for LCD Interfaces
9.1 J1 - 24-pin RGB LCD Interface
The following table shows the pinout and signal connections of the 24-pin FPC:
J1 Pin
S1D13C00
Pin name
S5U13C00P00CX00
Connection name
Example LCD module FPC name
(JDI LPM012M134B)
1
GND
GND
GND
2
VMDH
VMDH
VDD2
3
-
T10 (test point)
NC
4
VST
J1_VST
VST
5
VCK
J1_VCK
VCK
6
ENB
J1_ENB
ENB
7
XRST
J1_XRST
XRST
8
VCOM
FRP
FRP
9
XFRP
J1_XFRP
XFRP
10
VMDL
VMDL
VDD1
11
GND
GND
GND
12
HST
J1_HST
HST
13
HCK
J1_HCK
HCK
14
RED0
J1_R1
R1
15
RED1
J1_R2
R2
16
GRN0
J1_G1
G1
17
GRN1
J1_G2
G2
18
BLU0
J1_B1
B1
19
BLU1
J1_B2
B2
20
-
T11 (test point)
NC
21
VCOM
J1_VCOM
VCOM
22
-
(1)
NC
23
-
(2)
NC
24
-
(3)
NC
(1) Connect through R28 to GND
(2) Connect through R27 to GND
(3) Connect through R12 to GND

Pinout for LCD Interfaces
16 Seiko Epson Corporation Customer Development Board User Manual
(Rev 1.01)
9.2 J2 - 21-Pin RGB LCD Interface
The following table shows the pinout and signal connections of the 21-pin FPC:
J2 Pin
S1D13C00
Pin name
S5U13C00P00CX00
Connection name
Example LCD module FPC name
(Sharp LS012B7DD06)
1
VDMH
VDMH
VDD2
2
-
-
NC
3
VST
GSP
GSP
4
VCK
GCK
GCK
5
ENB
GEN
GEN
6
XRST
INTB
INTB
7
VCOM
VB
VB
8
XFRP
VA
VA
9
VMDL
VMDL
VDD1
10
GND
GND
VSS
11
HST
BSP
BSP
12
HCK
BCK
BCK
13
RED0
R[0]
R[0]
14
RED1
R[1]
R[1]
15
GRN0
G[0]
G[0]
16
GRN1
G[1]
G[1]
17
BLU0
B[0]
B[0]
18
BLU1
B[1]
B[1]
19
-
-
NC
20
VCOM
J2_VCOM
VCOM
21
-
-
NC

Pinout for LCD Interfaces
Customer Development Board User Manual Seiko Epson Corporation 17
(Rev 1.01)
9.3 J3 - 10-Pin SPI LCD Interface
The following table shows the pinout and signal connections of the 10-pin FPC:
J3 Pin
S1D13C00
Pin name
S5U13C00P00CX00
Connection name
Example LCD module FPC name
(Sharp LS012B7DH02)
1
VST
J3_SCLK
SCLK
2
ENB
J3_SI
SI
3
HST
J3_SCS
SCS
4
(VCOM)
J3_EXTCOMIN (1)
EXTCOMIN
5
(P07)
J3_DISP (2)
DISP
6
(VMDL)
J3_VDDA (3)
VDDA
7
(VMDL)
J3_VDD (4)
VDD
8
-
J3_EXTMODE (5)
EXTMODE
9
GND
GND
VSS
10
GND
GND
VSSA
(1) JP10 selects J3_EXTCOMIN to either VCOM of S1D13C00 or GND
(2) JP11 selects J3_DISP to one the followings
-J3_VDD
-J3_DISP_EN
-GND
And JP20 in turn selects J3_DISP_EN to either P07 (pin 30) of S1D13C00 or PA5 (pin
20 of J6) of the Host Interface
(3) JP8 selects J3_VDDA to either VMDH or VMDL of S1D13C00
(4) JP9 selects J3_VDD to either VMDH or VMDL of S1D13C00
(5) JP7 selects J3_EXTMODE to either J3_VDD or GND
See Section 5.2.2, SPI Panels and Control Selection for details.

Parts List
18 Seiko Epson Corporation Customer Development Board User Manual
(Rev 1.01)
10. Parts List
Item
Qty
Reference
Part
Description
Manufacturer Part No. /
Comments
1
1
BZ1
BUZZER
1.2cm x 1.2cm SMD Buzzer
Murata PKLCS1212E4001-R1
2
2
C1,C2
10pF
10pF Ceramic 1% 50V COG/NPO C0603
Murata GRM1885C1H100FA01
3
18
C3,C7,C8,C9,C11,C12,
C13,C14,C15,C16,
C18,C19,C21,C22,
C24,C28,C31,C32
1uF
1.0uF Ceramic 10% 16V X5R C0603
Kemet C0603C105K4PACTU
4
2
C4,C6
3.3uF
3.3uF Ceramic 10% 16V X5R C0603
TDK C1608X5R1C335K080AC
5
2
C5,C37
0.1uF
0.1uF Ceramic 10% 16V X5R C0603
Kemet C0603C104K4PAC7867
6
1
C10
10uF
10uF Ceramic 10% 25V X5R C0805
Kemet C0805C106K3PAC7800
7
6
C17,C20,C23,C29,
C30,C33
1nF
1nF Ceramic 10% 16V X7R C0604
Murata GRM188R71C102KA01D
8
3
C34,C35,C36
0.1uF
0.1uF Ceramic 10% 16V X7R C0402
Kemet C0402C104K4RACTU
9
1
D1
DIODE SCHOTTKY
DIODE SCHOTTKY 30V 200MA
Micro Commercial Co.
BAT42W-TP
10
1
H1
HEADER 8x1
CONN HEADER 8POS .100 STR 30AU
Amphenol FCI 68000-108HLF
11
1
H2
HEADER 6x1
CONN HEADER 6POS .100 STR 30AU
Amphenol FCI 68000-106HLF
12
3
JP1,JP5,JP13
HEADER 2x1
BERGSTIK II .100" SR STRAIGHT
Amphenol FCI 68000-102HLF
13
15
JP2,JP3,JP4,JP6,JP7,
JP8,JP9,JP10,JP14,
JP15,JP16,JP17,JP18,
JP19,JP20
HEADER 3x1
BERGSTIK II .100" SR STRAIGHT
Amphenol FCI 68000-103HLF
14
1
JP11
HEADER_3X2
CONN HEADER 6POS .100 STR 15AU
Amphenol FCI 67997-206HLF
15
1
J1
CONN_FLEX_24
CONN FPC/FFC 24POS 0.50MM
Hirose FH34SRJ-24S-0.5SH(99)
16
1
J2
CONN_FLEX_21
CONN FPC BOTTOM 21POS 0.30MM R/A
Molex 503566-2100
17
1
J3
CONN_FLEX_10
CONN FPC 10POS 0.50MM R/A
Omron XF2W-1015-1A
18
4
J4,J5,J6,J7
HEADER_10X2
CONN HOUSING 20POS 2.54MM DUAL
Hirose HIF3H-20DA-2.54DSA(71)
19
1
LED1
LED +3.3V Green
LED GREEN DIFFUSED 0603 SMD
Stanley Electric PY111C-TR
20
1
LED2
EMITTER IR
EMITTER IR 940NM 100MA T 1 3/4
LITEON LTE-5208A
21
1
Q1
MOSFET
MOSFET N-CH 20V 0.25A
Toshiba SSM3K37MFV,L3F
22
1
R1
1K
1K OHM 5% 1/16W SMD R0402
Yageo C0402JR-071KL
23
4
R2,R59,R67,R73
0
0 OHM 1/8W SMD R0805
Yageo RC0805JR-070RL
24
56
R3,R5,R6,R12,R13,R14,
R15,R16,R17,R18,R19,
R20,R21,R22,R23,R24,
R25,R26,R27,R28,R29,
R30,R31,R32,R33,R34,
R35,R36,R37,R38,R39,
R40,R41,R42,R43,R44,
R45,R46,R47,R48,R49,
R51,R52,R53,R54,R55,
R56,R61,R63,R65,R68,
R69,R70,R71,R72,R75
0
0 OHM 1/8W SMD R0603
Vishay MCT06030Z0000ZP500
25
1
R4
560
560 OHM 1% 1/8W SMD R0603
Vishay MCT06030C5600FP500
Item
Qty
Reference
Part
Description
Manufacturer Part No. /
Comments
26
2
R50,R58
10K
10K OHM 5% 1/10W SMD R0603
Yageo RC0603JR-0710KL