EVOC MEC-5003B Quick setup guide

MEC-5003B
低功耗无风扇嵌入式整机
Low Power Embedded Fanless PC
Version:C00

Copyright Notice
Information offered in this manual is believed to be correct at the time of printing, and
is subject to change without prior notice in order to improve reliability, design and
function and does not represent a commitment on the part of the manufacturer. In no
event will the manufacturer be liable for direct, indirect, special, incidental, or
consequential damages arising out of improper installation and/or use, or inability to
use the product or documentation.
This user manual is protected by copyright. No part of this manual may be reproduced,
stored in any retrieval system, or transmitted, in any form or by any means,
mechanical, electronic, photocopied, recorded or otherwise, without the prior written
permission from the manufacturer.
Trademarks
EVOC is a registered trademark of EVOC Intelligent Technology Co., Ltd. Other
product names mentioned herein are used for identification purposes only and may be
trademark and/or registered trademarks of their respective companies.
Please visit our website: http://www.evoc.com for more information,
or send an email to the Technical Support Mailbox [email protected]
(International) or [email protected] (Domestic) for consultation.
Hotline: [phone]

Safety Instructions
1. Please read this manual carefully before using the product;
2. Before inserting, removing or re-configuring motherboards or expansion cards,
first disconnect the computer and peripherals from their power sources to
prevent electric shock to human bodies or damage to the product;
3. Before moving the product, please unplug the AC cable from the power socket;
4. When inserting or removing boards, please firstly unplug the AC power cable;
5. Before connecting or disconnecting any signal cable, make sure all power cables
are unplugged in advance;
6. After turning off the computer, wait at least 30 seconds before turning it back
on;
7. All the operations such as upgrade, remove or installation shall be implemented
on the ESD worktable, because some exactitude components are sensitive to
electrostatic discharge (ESD).
8. If there's no ESD worktable, please take the following measures to prevent
damage from electrostatic discharge (ESD):
a) Wear a antistatic wrist strap and connect it with the metal part of the
corresponding product;
b) Always touch the metal enclosure or frame before touching any
components;
c) Keep part of your body in contact with the metal enclosure to discharge the
static while handling components;
d) Avoid unnecessary movement;
e) Hold the components (especially the boards) by the edges;
f) Place the components on a grounded, static-free operating platform. Use a
conductive foam pad if available (not the component wrapper).
g) Do not let the components slide on the operating platform.
9. Use cross-head screwdriver to operate. A magnetic screwdriver is recommended
(Magnet helps to prevent screws from remaining in the enclosure). Do not leave
any tools or accessories inside the enclosure;
10. Ensure abundant cooling and ventilation.
11. Non-professional personnel are not allowed to open the enclosure.

Contents
Chapter 1 Product Introduction.....................................................................................1
Overview............................................................................................1
Main Function....................................................................................1
Main Performance..............................................................................3
Mounting Mode .................................................................................4
Requirements of Transportation and Storage .....................................4
Chapter 2 Installation....................................................................................................5
Product Outline ..................................................................................5
Product Appearance and Installation Dimensions..............................6
External Connectors...........................................................................7
Overall Assembly Drawing................................................................8
Installing the Hard Disk .....................................................................9
Installing the CF Card ......................................................................10
Installing the Wall-mounted Bar ......................................................10
Chapter 3 Installing the Drivers..................................................................................11

Chapter 1 Product Introduction
MEC-5003B - 1 -
Chapter 1 Product Introduction
Overview
MEC-5003B is a high performance and low power embedded fanless PC. It adopts
EMB-1811 modular main board, which is developed based on Intel® HM55 PCH
chipset with Intel® Core™ I5 520M 2.4G/Celeron™ P4500 1.86G processor and one
DDR3 SO-DIMM memory slot up to 4GB. The fanless PC dissipates heat via al-alloy
chassis body. The product provides excellent airtightness, dust-proof, heat dissipation
and anti-vibration performance. The external IO connectors can be brought out via
carrier board directly. It supports both DC 18-26V power supply and AC 220V input
via power adapter.
The chassis is molded via al-alloy with small form factor, compact and solid structure;
the chassis body also serves as a heat sink to dissipate heat. The product can be used
in a wide range of harsh environments, such as heavy contamination, heavy dust and
serious EMC, etc. Featuring small form factor, complete functions and strong
environment adaptability, the product can be widely applied in various embedded
fields, such as machinery device, intelligent transportation and industrial automation
control, etc.
Main Function
Microprocessor
Supports Intel® Core™ i7, i5, i3/Pentium®/Celeron™ Mobile series CPU of
rPGA988 package, such as Core™ i5-520M, Celeron™ P4500.
Note: due to the power supplying capacity of the ATX power socket as well as the
fanless design, the power consumption of the adopted CPU shall be no more than
35W.

Chapter 1 Product Introduction
- 2 - MEC-5003B
Chipset
HM55
Memory
Provides one 204Pin SO-DIMM DDR3 memory slot, supporting Un-buffered and
NON-ECC function; the maximum memory capacity supported by a single memory
slot is up to 4GB.
Network Function
Provides two 10/100/1000Mbps Intel® network chips, which can bring out two LAN
ports via carrier board or IO board.
Display Function
The main board supports LVDS display without hot swap function;
The maximum resolution supported by LVDS is up to 1600x1200.
External IO
Six USB2.0 ports;
Up to six serial ports (COM1 and COM2 support RS232/485/422 mode with
optical and electric isolation function; COM1 also supports Modem wake-up
function; COM3~COM6 are optional 4-in-1 connectors);
One DVI connector;
One VGA connector;
One PS/2 keyboard and mouse connector;
Two 10/100/1000Mbps LAN ports; LAN1 supports Wake-on-LAN function;
One 8-channel GPIO connector (DB9 type);
A set of high quality audio connectors, supporting MIC-in and Line-out;
One CF card connector.

Chapter 1 Product Introduction
MEC-5003B - 3 -
Other features:
CF card connector;
Watchdog function.
Expansion Bus
Expandable to one PCI card with 106.68mm in height and 174.63mm in length,
complying with PCI 2.3 standard.
Power Consumption of the PC
Power Consumption: 27.1 W (Standby);
Power Consumption: 39 W (100% operate 3D).
Main Performance
Mechanical Dimensions, Weight and Environment
Dimensions: 270mm (L) x 223.4mm (W) x 94.3mm (H);
Net Weight: 5.5Kg;
Operating Environment:
Temperature: -5°C ~ 50°C;
Humidity: 5% ~ 90% (non-condensing);
Storage Environment:
Temperature: -40°C ~ 65°C;
Humidity: 5% ~ 90% (non-condensing);
EMC
Limits of radio disturbance are compliant with GB9254-2008 class A;
Immunity to disturbance is compliant with the limits of GB/T 17618-1998;
Reliability
MTBF≥50000h;
MTTR≤0.5h.

Chapter 1 Product Introduction
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Safety
Meets the basic requirements of GB4943;
Mechanical and Environment Adaptability
Anti-vibration: 5-19Hz/1.0mm amplitude; 19-200Hz/1.0g acceleration;
Anti-shock: 15g acceleration, 11ms duration;
Noise: 0dB.
Mounting Mode
□19″Rack Mount ■Desktop □Embedded Panel
■Wall Mount □VESA Standard Supporting Arm □Portable
□Others___________
Requirements of Transportation and Storage
Transportation
Well-packaged products are suited for transportation by truck, ship, and plane. During
transportation, products should not be put in open cabin or carriage. During
transshipping, products should not be stored in open air without protection from the
atmospheric conditions. Products should not be transported together with inflammable,
explosive and corrosive substances and are not allowed to be exposed to rain, snow
and liquid substances and mechanical force.
Storage
Products should be stored in package box when it is not used. And warehouse
temperature should be 0°C ~ 40°C, and relative humidity should be 20% ~ 85%. In
the warehouse, there should be no harmful gas, inflammable, explosive products, and
corrosive chemical products, and strong mechanical vibration, shock and strong
magnetic field interference. The package box should be at least 10cm above ground,
and 50cm away from wall, thermal source, window and air inlet.

Chapter 2 Installation
MEC-5003B - 5 -
Chapter 2 Installation
Product Outline

Chapter 2 Installation
- 6 - MEC-5003B
Product Appearance and Installation Dimensions

Chapter 2 Installation
MEC-5003B - 7 -
External Connectors
Front Panel
1. Switch 2. HDD Indicator 3. USB
4. Audio-out 5. Keyboard/Mouse 6. CF Card Door
7. DC-in 8. Power Indicator 9. Mic-in

Chapter 2 Installation
- 8 - MEC-5003B
Rear Panel
1. COM3 ~ COM6 2. GPIO 3. COM2
4. VGA 5. LAN2 6. LAN1
7. GND Screw 8. COM1 9. DVI
10. PCI Slot 11. USB3/4 12. USB1/2
Note: please choose corresponding backplanes when using different
configurations of the foresaid connectors on backplane:
1. For MEC-5003B-0101 and MEC-5003B-0103: no 4-in-1 connector
COM3~COM6 is configured and choose the corresponding backplane;
2. For MEC-5003B-0102: the 4-in-1 connector COM3~COM6 is
configured and choose the corresponding backplane.
Overall Assembly Drawing

Chapter 2 Installation
MEC-5003B - 9 -
1. Top Cover Module 2. Core Module
3. Carrier 4. Carrier Bracket
5. Right Side Board 6. Rear Panel
7. Bottom Cover 8. PCI\PCIE Patch Board
9. Chassis Bracket 10. Left Side Cover
11. Front Panel 12. HDD Module
Installing the Hard Disk
1. Assemble the shock absorption pads between the hard disk supporting bracket
and the hard disk fixation bracket according to the figure;
2. Assemble the hard disk on the hard disk fixation bracket according to the figure,
tighten the screws, to form a hard disk module;
3. Assemble the hard disk module with the corresponding studs of the motherboard
bracket according to the figure, tighten the screws and plug in the relevant
cables.

Chapter 2 Installation
- 10 - MEC-5003B
Installing the CF Card
Loosen the screws on the CF card cover, take off the cover, push in the CF card and
then fix the CF card cover. When removing the CF card, loosen the screws via screw
driver and press the CF card socket push rod with hard object to make the CF card
pop out.
Installing the Wall-mounted Bar
Align the wall-mounted bars with the mounting holes in chassis and then tighten the
corresponding screws (as shown in the above figure).

Chapter 3 Installing the Drivers
MEC-5003B - 11 -
Chapter 3 Installing the Drivers
Regarding the installation of the driver program and the detailed information of the
motherboard, please refer to the enclosed CD of the PC.