EVOC MEC 7003 User manual

安全使用小常识
1. 产品使用前,务必仔细阅读产品说明书;
2. 为避免人体被电击或产品被损坏,在每次对板卡进行拔插、重新装配或配
置前,须先关闭交流电源或将交流电源线从电源插座中拔掉;
3. 在需对产品进行搬动时,务必先将交流电源线从电源插座中拔掉;
4. 当产品需增加/减少板卡时,务必先拔掉交流电源;
5. 当需连接或拔除任何信号线前,须确定所有的电源线事先已被拔掉;
6. 为避免频繁开关机对产品造成不必要的损伤,关机后,应至少等待 30 秒后
再开机;
7. 如果要进行升级或拆装等动作,须在静电放电工作台上完成所有操作,因
为有些精密器件对静电放电(ESD)很敏感;
8. 如果没有静电放电工作台,可通过以下方法降低 ESD 可能造成的危害:
a) 戴上一条防静电腕带并与相应产品的金属部分相连;
b) 在触摸产品部件前,先触摸相应产品机箱上的金属壳;
c) 当插拔部件时,身体最好与产品的金属机箱保持接触,以释放静电;
d) 避免不必要的走动;
e) 拿产品部件(尤其是板卡)时仅拿住边缘;
f) 将产品部件置于一个接地的无静电的操作平台上。如果可能的话,使
用一块导电泡沫垫(非部件的包装材料);
g) 不要让部件在操作平台上滑动。
9. 用十字螺丝刀进行操作,最好是强力螺丝刀(带磁性,避免螺丝遗留在机
箱内)。要注意的是,一定不要将工具或零件遗漏在机箱内;
10. 保证系统良好的散热与通风;
11. 非专业维修人员不得打开机箱。

目 录
第一章 产品介绍................................................................................................. 1
简介............................................................................................................... 1
主要功能介绍................................................................................................ 1
主要性能指标................................................................................................ 3
安装方式....................................................................................................... 4
运输与贮存要求............................................................................................ 4
第二章 安装说明................................................................................................. 5
产品外观图 ................................................................................................... 5
产品外形及安装尺寸图................................................................................. 5
外部控制接口图............................................................................................ 6
整体装配图 ................................................................................................... 7
硬盘安装....................................................................................................... 8
特殊功能安装说明........................................................................................ 9
第三章 驱动程序安装说明................................................................................ 10

第一章 产品介绍
MEC-7003 - 1 -
第一章 产品介绍
简介
MEC-7003 是一款嵌入式小型整机。机壳主体采用钣金件结构,外形尺寸小
巧,结构紧凑,充分考虑散热和整机走线,包括升级所涉及的相关问题。结构方
面,具有优良的密封防尘、散热与抗振性能。环境适应性强,产品主要定位为高
端客户群; 丰富的扩展接口和扩展功能以及高端的性能, 可广泛应用于视频处理,
如:智能交通、机场航显和数字标牌广告机、医疗监护、医疗 B 超机等领域。
主要功能介绍
微处理器
支持 Intel® rPGA989 封装的 Sandy bridge Mobile SV NON-ECC 处理器。
芯片组
Mobile Intel® QM67 Express Chipset
内存
提供 2 条 204Pin DDRⅢ SO-DIMM 内存插槽,支持 Un-buffered NON-ECC,
支持双通道功能。单条内存插槽可支持最大内存容量 8GB,总支持最大内存容量
16GB;整机标配 2G 内存 1 条。
网络功能
提供 1 个 10/100/1000Mbps 网络接口, 支持网络唤醒、 网络 PXE启动和 AMT7.0
功能。
显示功能
Ø 整机外置1个VGA接口,1个HDMI接口,1个DVI接口,1个Display Port;
Ø 采用Intel® Sandy bridge CPU内置集成图形控制器显示芯片,支持Direct
X10.1;

第一章 产品介绍
- 2 - MEC-7003
Ø 支持VGA+Display Port、VGA+HDMI、VGA+DVI显示;支持热插拔功能;都为
同步输出;
Ø VGA最大支持2048×1536@75HZ,32 bit色深;Display port最大支持2560
×1200@60HZ;DVI和HDMI最大支持1920×1200@60HZ。
音频功能
支持 HDA,采用 ALC887 音效芯片,支持 MIC-in/Line-in/Line-out 功能。
外部 IO 接口
Ø 提供1个10/100/1000Mbps网络接口;
Ø 提供8个USB2.0接口(前置2个,后置6个);
Ø 提供1个Display Port;
Ø 提供1个VGA接口;
Ø 提供1个HDMI接口;
Ø 提供1个DVI接口;
Ø 提供1个音频接口(包含MIC-in/Line-in/Line-out);
Ø 提供1个12V DC输入接口。
其他特性
标配 2.5 寸 250G 硬盘 1 个,整机标配 120W 适配器一个。
AC-DC 适配器特性
电源类型:电源适配器
输入电压/频率:100~240V AC 50Hz/60Hz;
总功率:120W(Max);
输出电压/电流:+12V@10A(Max),+5%/-5%。
扩展总线
可扩展 1 个 Mini PCIE 卡,兼容 PCIE 2.0 标准。

第一章 产品介绍
MEC-7003 - 3 -
整机功耗
Ø 功耗:48.9W(待机状态)
Ø 功耗:64.9W(运行 3D 100%)
主要性能指标
机械尺寸、重量与环境
Ø 外形尺寸:270mm(长)×201.2mm(宽)×60mm(高);
Ø 净重:2.6Kg;
Ø 工作环境:
温度:0℃ ~ 50℃;
湿度:5% ~ 90%(非凝结状态);
Ø 贮存环境:
温度:-20℃ ~ 80℃;
湿度:5% ~ 90%(非凝结状态) 。
电磁兼容性
l GB 9254-2008,辐射骚扰(A)级,传导骚扰(A)级;
l GB/T 17626.2-2006 静电接触放电(2)级;
l GB/T 17626.4-2008 脉冲群抗扰度(2)级;
l GB/T 17626.5-2008 浪涌(冲击)抗扰度(2)级;
l GB/T 17626.6-2008 传导抗扰度(2)级;
l GB/T 17626.11-2008 电压暂降、电压短时中断。
可靠性
l 平均无故障工作时间:MTBF≥50000h;
l 平均维修时间:MTTR≤0.5h。

第一章 产品介绍
- 4 - MEC-7003
安全性
满足 GB4943 的基本要求。
机械环境适应性
l 抗振动:5-19Hz/1.0mm 振幅;19-200Hz/1.0g 加速度;
l 抗冲击:15g 加速度,11ms 周期;
l 噪音:≤50dB。
安装方式
□19″上架式 ■桌面式(台面式) □嵌入面板式
□壁挂式 □VESA 标准支撑臂 □手提便携式
□其他方式___________
运输与贮存要求
l 运输:
包装好的产品能以任何交通工具,运往任何地点,在长途运输时不得装在敞
开的船舱和车厢中,中途转运时不得存放在露天仓库中,在运输过程中不允许和
易燃、易爆、易腐蚀的物品同车(或其他运输工具)装运,并且产品不允许经受
雨、雪或液体物质的淋湿与机械损坏。
l 贮存:
产品贮存时应存放在原包装箱内,存放产品的仓库环境温度为 0℃~40℃,
相对湿度为 20%~85%。仓库内不允许有各种有害气体、易燃、易爆炸的产品及
有腐蚀性的化学物品,并且无强烈的机械振动、冲击和强磁场作用。包装箱应垫
离地面至少 10cm,距离墙壁、热源、冷源、窗口或空气入口至少 50cm。

第二章 安装说明
MEC-7003 - 5 -
第二章 安装说明
产品外观图
产品外形及安装尺寸图
270
201.2
60
单位:mm

第二章 安装说明
- 6 - MEC-7003
外部控制接口图
2 1 3 4 5
前面板
1、USB 接口 2、复位键 3、硬盘指示灯
4、电源指示灯 5、开关
1 2 3 4 5 6 7
9 8 10 11 12 13
后面板
1、电源输入接口 2、DVI 接口
3、HDMI 接口 4、DisplayPort接口
5、USB 接口 6、麦克风接口
7、接地螺孔 8、音频输出接口
9、音频输入接口 10、LAN 接口
11、USB 接口 12、USB 接口
13、VGA 接口

第二章 安装说明
MEC-7003 - 7 -
整体装配图
2 3
4
5
6
7
8
9
10
1
1、箱体 2、箱体挡板
3、开关 4、防尘网支架
5、灯板 6、主板组件
7、箱盖 8、硬盘组件
9、系统风扇 10、USB 转接线
装配说明
1、 把主板组件装配在箱体对应的压铆螺母柱上,同时收紧相应螺钉。
2、 将硬盘组件安装好后,收紧相应固定的螺钉。
3、 将系统风扇、USB 转接线、灯板、开关、防尘网支架装配在机箱对应的安装
位置,同时收紧相应螺钉或者螺母。
4、 将 Mini PCIE 卡从箱体底部插入相应槽位后,将箱体挡板盖好后,用 1PCS
螺钉收紧。
5、 将接地螺钉旋进背板的相应接地螺钉孔位。

第二章 安装说明
- 8 - MEC-7003
硬盘安装
1、 把硬盘按图示方向装配到硬盘支架上,并打紧螺钉,作为硬盘组件;
2、 把硬盘组件按图示方向装配到箱体压铆螺母柱上,并打紧螺钉,插上相应
线缆。

第二章 安装说明
MEC-7003 - 9 -
特殊功能安装说明
把机箱箱体底面向上放置,用螺丝刀将箱体底部挡板上的螺钉旋开,把挡板
取下,插入 Mini PCIE 卡,然后锁上箱体挡板。

第三章 驱动程序安装说明
- 10 - MEC-7003
第三章 驱动程序安装说明
本产品的驱动程序安装及主板详细信息请参考整机配套光盘,在此不做介
绍。


CopyrightNotice
Informationofferedinthismanualisbelievedtobecorrectatthetimeofprinting,and
is subject to change without prior notice in order to improve reliability, design and
functionanddoesnotrepresentacommitmentonthepartofthemanufacturer.Inno
event will the manufacturer be liable for direct, indirect, special, incidental, or
consequentialdamagesarisingoutofimproperinstallationand/oruse,orinabilityto
usetheproductordocumentation.
Thisusermanualisprotectedbycopyright.Nopartofthismanualmaybereproduced,
stored in any retrieval system, or transmitted, in any form or by any means,
mechanical,electronic,photocopied,recordedorotherwise,withouttheprior written
permissionfromthemanufacturer.
Trademarks
EVOC is a registered trademark of EVOC Intelligent Technology Co., Ltd. Other
productnamesmentionedhereinareusedforidentificationpurposesonlyandmaybe
trademarkand/orregisteredtrademarksoftheirrespectivecompanies.
Pleasevisitourwebsite:http://www.evoc.com formoreinformation,
Or send to the Technical Support Mailbox support@evoc.com or
support@evoc.cn forconsultation.

SafetyInstructions
1. Pleasereadthismanualcarefullybeforeusingtheproduct;
2. Before inserting,removingorreconfiguringmotherboards orexpansioncards,
first disconnect the computer and peripherals from their power sources to
preventelectricshocktohumanbodiesordamagetotheproduct;
3. Beforemoving theproduct,pleaseunplugtheACcablefromthepowersocket;
4. Wheninserting orremovingboards,please firstly unplug the ACpowercable;
5. Beforeconnecting ordisconnecting anysignalcable,makesureallpowercables
areunpluggedinadvance;
6. After turning off the computer, wait atleast 30 seconds before turning itback
on;
7. Alltheoperationssuchasupgrade,removeorinstallationshallbeimplemented
on the ESD worktable, because some exactitude components are sensitive to
electrostaticdischarge(ESD).
8. If there's no ESD worktable, please take the following measures to prevent
damagefromelectrostaticdischarge(ESD):
a) Wear a antistatic wrist strap and connect it with the metal part of the
correspondingproduct;
b) Alwaystouchthemetalchassisorframebeforetouching anycomponents;
c) Keeppartof your body incontact withthemetalchassistodischargethe
staticwhilehandlingcomponents;
d) Avoidunnecessarymovement;
e) Holdthecomponents (especiallythe boards)bytheedges;
f) Placethecomponentsonagrounded,staticfreeoperatingplatform.Usea
conductivefoampadifavailable (notthecomponentwrapper).
g) Donotletthecomponentsslideontheoperatingplatform.
9. Usecrossheadscrewdrivertooperate.Amagneticscrewdriverisrecommended
(Magnethelpsto prevent screws from remaining in the chassis).Do not leave
anytoolsoraccessories insidethechassis;
10. Ensureabundantcoolingandventilation.
11. Nonprofessional personnel arenotallowedtoopenthechassis.

Contents
Chapter1ProductIntroduction ................................................................................ 1
Overview................................................................................................................ 1
MainFunction......................................................................................................... 1
MainPerformance................................................................................................... 3
MountingMode ...................................................................................................... 4
RequirementsofTransportationandStorage ............................................................ 4
Chapter2Installation .............................................................................................. 5
ProductOutline....................................................................................................... 5
ProductAppearanceandInstallationDimensions...................................................... 5
ExternalConnectors ................................................................................................ 6
OverallAssemblyDrawing...................................................................................... 7
InstalltheHardDisk................................................................................................ 8
SpecialFunctionInstruction .................................................................................... 9
Chapter3InstalltheDrivers .................................................................................. 10

Chapter1ProductIntroduction
MEC7003 1
Chapter1ProductIntroduction
Overview
MEC7003is an embedded minitype PC. The chassis adopts sheet metalstructure,
which is small in appearance and compact in structure. It has fully taken the heat
dissipationandPCwiringintoconsiderationaswellastheissuesrelatedtoupgrade.
As for the structure, it provides excellent airtight, dustproof, heat dissipation and
antivibrationperformance.Theproductprovidesstrongenvironmentadaptability and
targets the highend clients. With the abundant expansion connectors and functions
and the high performance, the product can be widely applied in video processing
fields, such as: intelligenttransportation,airport flight information display systems,
digital advertisement boards, medical monitoring devices and medicalB supersonic
diagnosticsets,etc.
MainFunction
Microprocessor
Supportsthe SandybridgeMobileSVNONECCCPUof Intel®rPGA989package.
Chipset
MobileIntel®QM67ExpressChipset
Memory
Provides two 204Pin DDRIII SODIMM memory slots, supporting Unbuffered
NONECCanddualchannelfunction.Themaximummemorycapacitysupportedby
a single memory slotis up to8GBwhile the total memory capacity is up to16GB.
ThePCprovidesone2Gmemoryinstandardconfiguration.
NetworkFunction
Provides one 10/100/1000Mbps LAN port, supporting WakeonLAN, LAN PXE
bootingand AMT7.0 functions.

Chapter 1 Product Introduction
2 MEC7003
DisplayFunction
Ø ThePCsupportsoneVGAconnector,oneHDMIconnector,oneDVIconnector
andoneDisplayportexternally;
Ø Adopts Intel® Sandy bridge CPU internally integrated graphics controller
displaychip,supporting DirectX10.1;
Ø Supports VGA+Display port, VGA+HDMI and VGA+DVI display and
hotswapfunction,allofwhichare synchronousoutput;
Ø VGA supports2048x1536@75HZ,32Bitcolordepthinmaximum;Displayport
supports 2560x1200@60HZ in maximum; DVI and HDMI support
1920x1200@60HZ inmaximum.
AudioFunction
Adopts ALC887 audio effect chip, supporting HDA and MICin/Linein/Lineout
function.
Onboard IO
Ø One10/100/1000Mbps LANport;
Ø EightUSB2.0ports (twointhefrontandsixintherear);
Ø OneDisplay port;
Ø One VGA connector;
Ø OneHDMI connector;
Ø OneDVI connector;
Ø Oneaudioconnector(including MICin/Linein/Lineout);
Ø One12VDCinconnector.
OtherFeature
Providesone2.5″ 250GHDDandone120Wadapterinstandardconfiguration.
ACDC AdapterFeature
PowerType:poweradapter

Chapter1ProductIntroduction
MEC7003 3
InputVoltage/Frequency: 100~ 240VAC50Hz/60Hz;
TotalPowerConsumption: 120W (Max);
OutputVoltage/Current: +12V@10A(Max),+5%/5%.
ExpansionBus
Supportsone MiniPCIEcard,complyingwith PCIE2.0 standard;
PowerConsumptionofthePC
Ø PowerConsumption: 48.9 W (Standby)
Ø PowerConsumption: 64.9 W (100%operate 3D)
MainPerformance
MechanicalDimensions,WeightandEnvironment
Ø Dimensions:270mm (L)x 201.2mm (W) x 60mm (H);
Ø NetWeight: 2.6Kg;
Ø OperatingEnvironment:
Temperature: 0°C ~ 50°C;
Humidity:5% ~ 90% (noncondensing);
Ø StorageEnvironment:
Temperature: 20°C~ 80°C;
Humidity:5% ~ 90% (noncondensing);
EMC
l GB92542008 RadiationdisturbanceclassA,ConducteddisturbanceclassA;
l GB/T17626.2.2006Electrostatic discharge,level2;
l GB/T17626.42008Burst immunity,level2;
l GB/T17626.52008Surge(Impact)immunity,level2;
l GB/T17626.62008Conductedsusceptibility,level2;
l GB/T17626.112008 Voltagedipsand shortsupplyinterruption.

Chapter 1 Product Introduction
4 MEC7003
Reliability
l MTBF≥50000h;
l MTTR≤0.5h.
Safety
Meetsthebasicrequirementsof GB4943.
MechanicalandEnvironmentAdaptability
l Antivibration: 519Hz/1.0mm amplitude; 19200Hz/1.0g acceleration;
l Antishock: 15g acceleration, 11ms duration;
l Noise: ≤50dB.
MountingMode
□19″ RackMount ■Desktop □EmbeddedPanel
□WallMount □VESA StandardSupportingArm □Portable
□Others___________
RequirementsofTransportationandStorage
l Transportation
Wellpackagedproductsaresuitedfortransportationbytruck,ship,andplane.During
transportation, products should not be put in open cabin or carriage. When
transshipping enroute,products should not be stored in openair without protection
from the atmospheric conditions. Products should not be transported together with
inflammable,explosiveandcorrosivesubstancesandarenotallowedtobeexposedto
rain,snowandliquidsubstancesandmechanicalforce.
l Storage
Products should be stored in package box when it is not used. And warehouse
temperature should be 0°C ~ 40°C,and relative humidityshould be20%~85%. In
thewarehouse,thereshouldbenoharmfulgas,inflammable,explosiveproducts,and
corrosive chemical products, and strong mechanical vibration, shock and strong
magneticfieldinterference.Thepackageboxshouldbeatleast10cmaboveground,
and50cmawayfromwall,thermalsource,windowand airinlet.
Table of contents
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