FLY DS108 User manual

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DS108MaintenanceManual
For internaluse only
2011-8-20
DocumentName DS108Maintenance Manual
Version V1.0
Draft date 2011-8-20
Documentcode

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TableofContents
1Productperformanceis introduced ---------------------------3
2Themachine disassemblechart andpartslists ---------------4
3Assemble and disassemble guidelines -------------------------5
4Circuitdiagram, detailed instructions---------------------12
5Noteson Failure Handling----------------------------------13
6Faultrepairs-----------------------------------------------14
7Troubleshooting --------------------------------------------16

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1 Productperformanceisintroduced
1.1Product overallintroduction
GSM/GPRS850/1800/1900or900/1800/1900MHz（0ptional）
WAP/MMS
MP3player
VoiceRecorder
FMRadio-internal antenna
MicroUSB2.0
JAVA
2.2QCIF
MTK6252Aplatform
1.2 Appearance

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2 Themachinedisassemblechartandparts lists
2.1 DS108GSMdigitaltelephonedecompositionfigure
3Assemble and disassembleguidelines
3.1Assembleintroduction
1. AssemblePCBA.
aAssemble Dome;refertothefourholesinDome.
.
Referenceholes

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bSolderLCD;refertothe signon themainboard, thenstickthegasketunderLCD
d:lie theLCMtomainboard
e. Soldervibratorandspeaker, torch,noticetothe polar, asfigure.
Gasket
Mylartap

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f.Assemble Speaker trestle as belowturn
putSpeaker into trestle，Assembleholderto PCBA vibrator fasten screw.
g. AssembleGSMantenna, thenfastenthescrew.
+
--

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h. Soldermicrophone
2.Assemblecover
aAssemblekeypad，Receiver,asfigure
Herefirst

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b:PutPCBAintocover,notice onthehookandmicrophone.
c:Assembletorchlens
d:AssembleBcover
buttonBcover
②FastenScrews
③Filltheplug
Sol

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3.1Disassembleintroduction
Disassemblyprocessisoppositetoassemblyprocess

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4. Circuit diagram, detailed instructions
Baseband
J501 IO connector
U401 FlashRom
U701FMIC
RDA5802HS
J701SIMSlot
J302 Battery
slot
J603T-Card
slot
U201 CPU
MT6252A
X301Crystal
SSP
-
T7
-
F
Camerapad
Lenspad
Keybacklight
U901BTchip
U102RFPA
RPF88162B

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FlashRoom
FMband

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Dual SIM
5Notes on Failure Handling
Notes:
ThePCBArepairingisaveryimportantprocedureduringthefinalproductionofcellular
phones.Thespeed andqualityofrepairingdecidestheyieldandproductionefficiency.
Therepairideaisveryimportantforagoodrepairingtechnician. Makesurenottoheata
boardright awayonceaphone reachesathand.

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6. Faultrepair
6.1Base band
MTKusesrelativelyhigh integration andhaslimitedperipheralindependentelements.
Check whetherthereisanyadditionalelement, missingorwrongelement beforehotair
gunisused.Ifvisualdetectionfailstofindproblem,usesomeequipmentstofindfailure
positions。
(1)Below20MA: indicatesthat powerstartsworking butthe nextaction isnot performed.
Thecausecanbeincompletesolderingordamageinpowermanagement,CPUor26M
circuit.
(2)20~25MA: thecausecan be:thereisnodownloadsoftware;softwarefunctions
abnormally; or,CPUcannot readorexecutesoftwarenormally.

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(3)30~90MA: ifthesoftware,26Mand32Kareallnormal,thecausecan beincomplete
soldering. CheckCPUand Flash
Startupprocess
WhenthePower-Onbuttonispressed, PWRKEY will detectalowvoltage.Theinternal
PMICwill turnontheLDOswhichprovidepower-supplytobaseband 30mslater; then the
RESETcircuitofthePMICwillgeneratetheresetsignal200mslatertomakethebase
bandchiprunthepower-onsoftware
6.2Fail todownload
MakesurethatthedownloadcurrentofmainboardisnormalandimportantI/Ointerfaces
including /CPUandFlasharenormal.
7. Troubleshooting

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7.1Configurationdefect
Forstructuralpartsofthefault, pleaserefertophonethedisassemblyproceduresforthe
correspondingchange。
7.2 Unabletopoweronthe phone

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7.3RingtoneFault

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7.4LCDdisplayfault

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7.5Failure toCharge

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7.6Failure toidentify SIMcard

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7.7Main Microphone fault