HBM QuantumX User manual

Operating Manual
English
QuantumX

Hottinger Brüel & Kjaer GmbH
Im Tiefen See 45
D-64293 Darmstadt
Tel. [phone]
Fax [phone]
[email protected]
www.hbm.com
Mat.:
DVS: A03031_24_E00_01 HBM: public
10.2021
EHottinger Brüel & Kjaer GmbH
Subject to modifications.
All product descriptions are for general information only.
They are not to be understood as a guarantee of quality or
durability.

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English
1 Safety instructions 8........................................
2 Electro magnetic conformity 14...............................
3 Markings used 16............................................
3.1 The markings used in this document 16..........................
3.2 Symbols on the device 17......................................
4 Introduction 20..............................................
4.1 About the QuantumX documentation 20.........................
4.2 The QuantumX family 21......................................
4.3 Module overview/transducer technologies 25.....................
4.4 Digitalization and signal path 26................................
4.5 Synchronization 27............................................
5 Software 34.................................................
5.1 MX Assistant 34..............................................
5.2 catman®AP 35...............................................
5.3 LabVIEW® driver / library 37...................................
5.4 Driver and API for Microsoft® Visual Studio .NET 37..............
5.5 Other drivers 38..............................................
5.6 Firmware update via Ethernet 38................................
6 Mechanical 39...............................................
6.1 Mounting case clips on modules 40.............................
6.2 Connecting housings 43.......................................
6.3 Mounting the housing with CASEFIT 45..........................
6.4 BPX001/BPX002/BPX003 backplane 45.........................
6.4.1 Connection 47................................................
6.4.2 Backplane BPX001 48.........................................
6.4.3 Backplane BPX002 49.........................................
6.4.4 BPX003 backplane 50.........................................
6.4.5 Mounting the modules 50......................................
6.4.6 Backplane with Ethernet connection 53..........................

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6.4.7 System layout with several backplanes 54........................
7 Connecting individual QuantumX modules 55.................
7.1 Connecting the supply voltage 55...............................
7.2 Connection to host PC or data recorder 57.......................
7.2.1 Single Ethernet connection 57..................................
7.2.2 Multiple Ethernet connection with PTP synchronization 58..........
7.2.3 Multiple Ethernet connection and FireWire synchronization 59......
7.2.4 Connecting one or more QuantumX modules to the PC 59.........
7.2.5 Firmware update via Ethernet 66................................
7.2.6 Distributed setup 68...........................................
7.2.7 Layout with data recorder CX22B‐W 69..........................
7.2.8 Output measurement signals to CAN bus (MX840B) 69............
7.2.9 Output measurement signals to CAN bus (MX471C) 70............
7.2.10 Output of signals with standardized voltage in real time (MX878B or
MX879B) 71.................................................
7.2.11 Output signals in real time via EtherCAT®or PROFINET IRT and in
parallel via Ethernet 72........................................
8 Modules and transducers 73.................................
8.1 General information 73........................................
8.1.1 Shielding design 73...........................................
8.1.2 Active transducer connection 74................................
8.1.3 TEDS 75....................................................
8.1.4 Background calibration / autoadjustment 78......................
8.2 MX840/A/B universal amplifier 80...............................
8.2.1 MX840B pin assignment 82....................................
8.2.2 MX840B status display 83.....................................
8.3 MX440B universal amplifier 85..................................
8.4 MX410B highly dynamic universal amplifier 86....................
8.4.1 MX410B pin assignment 87....................................
8.4.2 MX410B status display 89.....................................
8.5 MX430B resistive full bridge measuring amplifier 90...............
8.5.1 MX430B pin assignment 91....................................

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8.5.2 MX430B status display 92.....................................
8.6.1 MX238B pin assignment 93....................................
8.6.2 MX238B status display 95.....................................
8.7 MX460B frequency amplifier 96.................................
8.7.1 MX460B pin assignment 97....................................
8.7.2 MX460B status display 98.....................................
8.8 MX1609KB and MX1609TB thermocouple amplifier 99............
8.8.1 Thermocouple with TEDS functionality (RFID) 100.................
8.8.2 MX1609 status display 102......................................
8.9 MX471C CAN FD/CAN module 103..............................
8.9.1 General information 103........................................
8.9.2 MX471C pin assignment 104....................................
8.9.3 MX471C status LEDs 105.......................................
8.9.4 Receiving CAN messages 106...................................
8.10 MX1601B amplifier 107.........................................
8.10.1 MX1601B pin assignment 108...................................
8.10.2 MX1601B status display 109....................................
8.11 MX1615B/MX1616B amplifier 111................................
8.11.1 MX1615B pin assignment 112...................................
8.11.2 MX1615B status display 114....................................
9 Transducer connection 116....................................
9.1 Full bridge, resistive 116........................................
9.2 Full bridge, inductive 117.......................................
9.3 Full bridge, piezoresistive 118...................................
9.4 Half bridge, resistive 120........................................
9.5 Half bridge, inductive 122.......................................
9.6 Quarter bridge, resistive 123....................................
9.7 Quarter bridge adapter, resistive 124.............................
9.8 Connecting transducers with double shield technique 125...........
9.9 Potentiometric transducers 126..................................
9.10 LVDT transducers 127..........................................
9.11 Current-fed piezoelectric transducer (IEPE, CCLD, ICP) 128.........
9.12 Electrical voltage 100 mV 130...................................

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9.13 DC voltage sources 10 V 131....................................
9.14 DC voltage sources 60 V 132....................................
9.15 Voltage sources up to 300 V (CAT II) 133.........................
9.16 DC current sources 20 mA 134..................................
9.17 DC current sources 20 mA - voltage-fed 135.......................
9.18 Ohmic resistance (e.g. PTC, NTC, KTY, …) 136...................
9.19 Resistance thermometer PT100, PT1000 137.....................
9.20 Thermocouples 138............................................
9.21 Frequency, differential, without directional signal 141...............
9.22 Frequency, differential, with directional signal 142..................
9.23 Frequency, single-pole, without directional signal 143...............
9.24 Frequency, single-pole, with directional signal 144..................
9.25 Incremental encoders, rotary encoders (with/without direction signal),
differential 145.................................................
9.26 Encoder and pulse encoder, single-pole 146.......................
9.27 Rotary encoder and pulse generator, single pole with static directional
signal 147.....................................................
9.28 Absolute value encoder with SSI protocol 148.....................
9.29 Inductive encoders (pickup, crankshaft sensor with gap detection) 150
9.30 Measurement of rotational speed, Crankshaft sensor (digital, TTL) 151
9.31 PWM - Pulse width, pulse duration, period duration 152.............
9.32 PWM - Pulse width, pulse duration, period duration, single-pole 153..
9.33 CAN bus 154..................................................
10 Real-time functions and outputs 156...........................
10.1 MX410B 157..................................................
10.2 MX460B 159..................................................
10.3 MX878B 160..................................................
10.4 MX879B Multi‐I/O module 166...................................
11 FAQ 172.....................................................
12 Accessories 175..............................................
12.1 System accessories 183........................................
12.1.1 BPX001 backplane 183.........................................

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12.1.2 BPX002 backplane 183.........................................
12.1.3 Housing connection elements 184................................
12.2 Voltage supply 185.............................................
12.2.1 Power pack NTX001 185.......................................
12.2.2 Supply cable 185..............................................
12.3 IEEE1394b FireWire 186........................................
12.3.1 IEEE1394b FireWire cable (module-to-module; IP67) 186...........
12.4 General information 186........................................
12.4.1 Plug kit with TEDS chip 186.....................................
12.4.2 Port saver Sub-HD 15-pin 187...................................
12.4.3 Adapter D-Sub-HD 15-pin to D-Sub 15-pin 187....................
12.5 Accessories for MX840B, MX440B 188...........................
12.5.1 Cold junction for thermocouples 188..............................
12.6 SubHD15 to BNC adapter 189...................................
12.7 SCM-HV accessories 189.......................................
12.8 SCM-SG120/350/1000 quarter bridge adapter 190.................
12.9 MX1609KB/TB accessories 190.................................
12.9.1 Thermo-connector with integrated RFID chip 190...................
13 Support 191..................................................

Safety instructions
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1 Safety instructions
Notice
The safety instructions described here also apply to the power pack NTX001
and the active backplane BPX001, BPX002 and BPX003.
Appropriate use
A module with connected transducers is to be used exclusively for
measurement tasks and Test tasks. Use for any purpose other than the above
is deemed to be non-designated, inappropriate use.
In the interests of safety, the module should only be operated as described in
the Operating Manuals. It is also essential to comply with the legal and safety
requirements for the application concerned during use. The same applies to
the use of accessories.
Before commissioning the module for the first time, you must first run a project
planning and risk analysis that takes into account all the safety aspects of
automation technology. This particularly concerns personal and machine
protection.
Additional safety precautions must be taken in plants where malfunctions could
cause major damage, loss of data or even personal injury. In the event of a
fault, these precautions establish safe operating conditions.
This can be done, for example, by mechanical interlocking, error signaling, limit
value switches, etc.
Notice
The module must not be connected directly to a power supply system. The
supply voltage must be 10 V … 30 V (DC).

Safety instructions
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General dangers of failing to follow the safety instructions
Every module is a state of the art device and as such is failsafe. The module
may give rise to residual dangers if it is inappropriately installed and operated
by untrained personnel. Any person instructed to carry out installation,
commissioning, maintenance or repair of the modules must have read and
understood the Operating Manuals and in particular the technical safety
instructions.
The scope of supply and performance of the modules only covers a small area
of measurement technology. In addition, equipment planners, installers and
operators should plan, implement and respond to the safety engineering
considerations of measurement technology in such a way as to minimize
residual dangers. On-site regulations must be complied with at all times. There
must be reference to the residual dangers connected with measurement
technology. After making settings and carrying out activities that are
password-protected, you must make sure that any controls that may be
connected remain in safe condition until the switching performance of the
module has been tested.
Conditions on site
For modules in the housing with degree of protection IP20:
SProtect the modules from dirt and moisture or the effects of weather such
as rain, snow, etc.
SThe permissible relative humidity at 31 oC is 80% (non-condensing); linear
reduction to 50% at 40 oC.
SMake sure that the side ventilation openings are not covered.
For all modules:
SDo not expose the modules to direct sunlight.
SPlease observe the permissible maximum ambient temperatures stated in
the specifications.
SEnsure there is adequate ventilation for installation in the BPX001 back
plane.

Safety instructions
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Maintenance and cleaning
The modules are maintenance-free. Please note the following points when
cleaning the housing:
SBefore cleaning, disconnect all connections.
SClean the housing with a soft, slightly damp (not wet!) cloth. Never use
solvent as this could damage the labeling or the housing.
SWhen cleaning, ensure that no liquid gets into the module or connections.
Outputs
Particular attention must be paid to safety when using the digital, analog or
CAN bus outputs of a module. Ensure that status or control signals cannot
initiate any actions that may pose a danger to persons or the environment.
Product liability
In the following cases, the protection provided for the device may be adversely
affected. Liability for device functionality then passes to the operator:
SThe device is not used in accordance with the operating manual.
SThe device is used outside the field of application described in this section.
SThe operator makes unauthorized changes to the device.
Warning signs and danger symbols
Important instructions for your safety are specifically identified. It is essential to
follow these instructions in order to prevent accidents and damage to property.
Safety instructions are structured as follows:
WARNING
Type of danger
Consequences of non-compliance
Averting the danger

Safety instructions
QuantumX A03031_24_E00_01 HBM: public 11
SWarning sign: draws attention to the danger
SSignal word: indicates the severity of the danger (see table below)
SType of danger: identifies the type or source of the danger
SConsequences:describes the consequences of non-compliance
SDefense: indicates how the danger can be avoided/bypassed.
Danger classes as per ANSI
Warning sign, signal word Meaning
WARNING This marking warns of a potentially dangerous situ
ation in which failure to comply with safety require
ments may result in death or serious physical injury.
CAUTION This marking warns of a potentially dangerous situ
ation in which failure to comply with safety require
ments may result in slight or moderate physical injury.
Note This marking draws your attention to a situation in
which failure to comply with safety requirements may
lead to damage to property.
Working safely
The supply connection, as well as the signal and sensor leads, must be
installed in such a way that electromagnetic interference does not adversely
affect device functionality (HBM recommendation: "Greenline shielding design",
downloadable from the Internet at http://www.hbm.com/Greenline).
Automation equipment and devices must be covered over in such a way that
adequate protection or locking against unintentional actuation is provided (e.g.
access checks, password protection, etc.).
When devices are working in a network, these networks must be designed in
such a way that malfunctions in individual nodes can be detected and shut
down.
Safety precautions must be taken both in terms of hardware and software, so
that a line break or other interruptions to signal transmission, e.g. via the bus
interfaces, do not cause undefined states or loss of data in the automation
device.

Safety instructions
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Error messages should only be acknowledged once the cause of the error is
removed and no further danger exists.
Conversions and modifications
The module must not be modified from the design or safety engineering point
of view except with our express agreement. Any modification shall exclude all
liability on our part for any resultant damage.
In particular, any repair or soldering work on motherboards (exchanging
components) is prohibited. When exchanging complete modules, use only
original parts from HBM.
The module is delivered from the factory with a fixed hardware and software
configuration. Changes can only be made within the possibilities documented
in the manuals.
Qualified personnel
Important
This device is only to be installed and used by qualified personnel strictly in
accordance with the specifications and with the safety rules and regulations
which follow.
Qualified persons means persons entrusted with the installation, fitting,
commissioning and operation of the product who possess the appropriate
qualifications for their function. This module is only to be installed and used by
qualified personnel, strictly in accordance with the specifications and the safety
rules and regulations.
This includes people who meet at least one of the three following requirements:
SKnowledge of the safety concepts of automation technology is a require
ment and as project personnel, you must be familiar with these concepts.
SAs automation plant operating personnel, you have been instructed how to
handle the machinery and are familiar with the operation of the modules and
technologies described in this documentation.

Safety instructions
QuantumX A03031_24_E00_01 HBM: public 13
SAs commissioning engineers or service engineers, you have successfully
completed the training to qualify you to repair the automation systems. You
are also authorized to activate, ground and label circuits and equipment in
accordance with safety engineering standards.
It is also essential to comply with the legal and safety requirements for the
application concerned during use. The same applies to the use of accessories.

Electro magnetic conformity
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2 Electro magnetic conformity
Additional information about the relevant EMC standards EN 61326-1 /
EN61326-2-x.
These standards define emissions limits and immunity requirements for differ
ent environments.
Emissions requirements are defined for the following environments:
- Industrial (Class A) or
- Residential / Laboratory (Class B).
The standard refers to CISPR 11:2009+A1:2010.
Immunity requirements are defined for the following environments:
- Controlled electro-magnetic (lowest requirements)
- Basic or
- Industrial (highest requirements).
The modules listed in the declaration of conformity comply with the require
ments for the following environments:
Emissions: Class A
Immunity: Industrial environment
The QuantumX series and its modules are intended for use in an industrial
environment. When used in residential or commercial environments, additional
arrangements may be required to limit electro-magnetic emissions.
An example is voltage supply of the modules by battery. In this case please
wrap the power supply cable (KAB271-3) around the inductive coil included in
the package four times.

Electro magnetic conformity
QuantumX A03031_24_E00_01 HBM: public 15
ODU plug
When the NTX001 power supply from HBM is used, the system complies with
Emissions: Class B without the necessity to carry out the meaasure
described above.

Markings used
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3 Markings used
3.1 The markings used in this document
Important instructions for your safety are specifically identified. It is essential to
follow these instructions, in order to prevent damage.
Symbol Meaning
Note This marking draws your attention to a situation in
which failure to comply with safety requirements may
lead to damage to property.
CAUTION This marking warns of a potentially dangerous situ
ation in which failure to comply with safety require
ments may result in slight or moderate physical injury.
Important
This marking draws your attention to important in
formation about the product or about handling the
product.
Tip
This marking indicates application tips or other in
formation that is useful to you.
Device -> New Bold text indicates menu items, as well as dialog and
window titles in the user interfaces. Arrows between
menu items indicate the sequence in which the
menus and sub-menus are opened.
Sampling rate, 500 Bold text in italics indicates inputs and input fields in
the user interfaces.
Emphasis
See …
Italics are used to emphasize and highlight text and
identify references to sections, diagrams, or external
documents and files.

Markings used
QuantumX A03031_24_E00_01 HBM: public 17
3.2 Symbols on the device
Caution
To indicate that caution is necessary when operating the
device and the details in the operating manual need to be
taken into account, when operating the module.
CE marking
With the CE marking the manufacturer demonstrates that
the product complies with the requirements of the relev
ant EU directives.
The NTX001 international medical power supply unit
bears further markings such as VDE, UL and PSE
(Japan). The EMC of the power supply unit has been
tested in accordance with IEC61326.
UKCA marking
With the UKCA marking the manufacturer demonstrates
that the product complies with the requirements of the
relevant UK regulations.

Markings used
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Marking in accordance with the requirements of SJ/T 11364-2014 and
SJ/T 11363-2006 ("China RoHS-2")
Marking for products which contain hazardous sub
stances above the maximum limit.
Part Name

Hazardous Substances

Lead 
(Pb)
Mercury
 (Hg)
Cad
mium 
(Cd)
Hexavalent
Chromium

(Cr (VI))
Polybromi
nated
biphenyls

(PBB)
Polybromi
nated
diphenyl
ethers

(PBDE)
Housing O O O O O O
PCB
assemblies
X O O O O O
Fixtures X O O O O O
Cables O O O O O O
This table is prepared in accordance with the provisions of SJ/T 11364.
SJ/T 11364!。
O: Indicates that said hazardous substance contained in all of the homogeneous
materials for this part is below the limit requirement of GB/T 26572.
#$%&$'*+,-08*&GB/T
2657298;<=>。
X: Indicates that said hazardous substance contained in at least one of the homoge
neous materials used for this part is above the limit requirement of GB/T 26572.
#$%?@&$AK*+,-08QRGB/T
2657298;<。
Statutory waste disposal mark
In accordance with national and local environmental pro
tection and material recovery and recycling regulations,
old devices that can no longer be used must be disposed
of separately and not with normal household garbage.

Markings used
QuantumX A03031_24_E00_01 HBM: public 19
Electrostatically sensitive components
Components marked with this symbol can be damaged
beyond repair by electrostatic discharge. Please observe
the handling instructions for components exposed to the
risk of electrostatic discharge.
Class 1 Laser (MXFS only)
The MXFS is a Class 1 laser product: "Any laser or laser
system containing a laser that cannot emit laser radiation
at levels that are known to cause eye or skin injury during
normal operation." It is safe under all conditions of nor
mal use. No safety requirements are needed to use
Class 1 laser devices.
For details please check the MXFS user manual avail
able from www.hbm.com
Connection for functional earth
If necessary, integrate the module into your functional
grounding via this connection, so that interference cur
rents can be surcharged and interference signal injection
prevented.

Introduction
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4 Introduction
4.1 About the QuantumX documentation
The QuantumX family documentation consists of
Sa printed quick-start guide for initial startup and safety instructions
Sthe data sheets in PDF format
SThis operating manual in PDF format
Sthe operating manual for the EtherCAT®ℑ1) / PROFINET / Ethernet gate
ways CX27C in PDF format
Sthe operating manual for data recorder CX22B-W and CX22B data
recorders
Sthe operating manual for the MX403B and MX809B modules for safe
measurement at high electric potential
Sthe MXFS BraggMETER optical module operating manual
Sthe operating instructions for the Signal Conditioning Modules (SCM)
- High-voltage signal conditioned SCM-HV (300 V CAT II)
- Quarter bridge adapter SCM-SG-120 / -350 / -1000 for connecting SGs
individually
Sthe product descriptions for accessories
Sa comprehensive online help with index and easy search options which is
available after the installation of a software package (e.g. MX Assistant,
catman®Easy/AP). Information about module and channel configuration
can also be found here.
These documents can be found
SFrom the starter website www.hbm.com/start/ in the "System software and
documentation" package
SAfter installation of the MX Assistant on the hard drive of your PC, which
can be reached through the Windows start menu
1) EtherCAT® is a registered brand and patented technology, licensed by Beckhoff Automation
GmbH, Germany