HBM QuantumX User manual

Operating Manual
English
QuantumX

Hottinger Brüel & Kjaer GmbH
Im Tiefen See 45
D-64293 Darmstadt
Tel. [phone]
Fax [phone]
[email protected]
www.hbm.com
Mat.:
DVS: A03031_24_E00_01 HBM: public
10.2021
EHottinger Brüel & Kjaer GmbH
Subject to modifications.
All product descriptions are for general information only.
They are not to be understood as a guarantee of quality or
durability.

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English
1 Safety instructions 8........................................
2 Electro magnetic conformity 14...............................
3 Markings used 16............................................
3.1 The markings used in this document 16..........................
3.2 Symbols on the device 17......................................
4 Introduction 20..............................................
4.1 About the QuantumX documentation 20.........................
4.2 The QuantumX family 21......................................
4.3 Module overview/transducer technologies 25.....................
4.4 Digitalization and signal path 26................................
4.5 Synchronization 27............................................
5 Software 34.................................................
5.1 MX Assistant 34..............................................
5.2 catman®AP 35...............................................
5.3 LabVIEW® driver / library 37...................................
5.4 Driver and API for Microsoft® Visual Studio .NET 37..............
5.5 Other drivers 38..............................................
5.6 Firmware update via Ethernet 38................................
6 Mechanical 39...............................................
6.1 Mounting case clips on modules 40.............................
6.2 Connecting housings 43.......................................
6.3 Mounting the housing with CASEFIT 45..........................
6.4 BPX001/BPX002/BPX003 backplane 45.........................
6.4.1 Connection 47................................................
6.4.2 Backplane BPX001 48.........................................
6.4.3 Backplane BPX002 49.........................................
6.4.4 BPX003 backplane 50.........................................
6.4.5 Mounting the modules 50......................................
6.4.6 Backplane with Ethernet connection 53..........................

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6.4.7 System layout with several backplanes 54........................
7 Connecting individual QuantumX modules 55.................
7.1 Connecting the supply voltage 55...............................
7.2 Connection to host PC or data recorder 57.......................
7.2.1 Single Ethernet connection 57..................................
7.2.2 Multiple Ethernet connection with PTP synchronization 58..........
7.2.3 Multiple Ethernet connection and FireWire synchronization 59......
7.2.4 Connecting one or more QuantumX modules to the PC 59.........
7.2.5 Firmware update via Ethernet 66................................
7.2.6 Distributed setup 68...........................................
7.2.7 Layout with data recorder CX22B‐W 69..........................
7.2.8 Output measurement signals to CAN bus (MX840B) 69............
7.2.9 Output measurement signals to CAN bus (MX471C) 70............
7.2.10 Output of signals with standardized voltage in real time (MX878B or
MX879B) 71.................................................
7.2.11 Output signals in real time via EtherCAT®or PROFINET IRT and in
parallel via Ethernet 72........................................
8 Modules and transducers 73.................................
8.1 General information 73........................................
8.1.1 Shielding design 73...........................................
8.1.2 Active transducer connection 74................................
8.1.3 TEDS 75....................................................
8.1.4 Background calibration / autoadjustment 78......................
8.2 MX840/A/B universal amplifier 80...............................
8.2.1 MX840B pin assignment 82....................................
8.2.2 MX840B status display 83.....................................
8.3 MX440B universal amplifier 85..................................
8.4 MX410B highly dynamic universal amplifier 86....................
8.4.1 MX410B pin assignment 87....................................
8.4.2 MX410B status display 89.....................................
8.5 MX430B resistive full bridge measuring amplifier 90...............
8.5.1 MX430B pin assignment 91....................................

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8.5.2 MX430B status display 92.....................................
8.6.1 MX238B pin assignment 93....................................
8.6.2 MX238B status display 95.....................................
8.7 MX460B frequency amplifier 96.................................
8.7.1 MX460B pin assignment 97....................................
8.7.2 MX460B status display 98.....................................
8.8 MX1609KB and MX1609TB thermocouple amplifier 99............
8.8.1 Thermocouple with TEDS functionality (RFID) 100.................
8.8.2 MX1609 status display 102......................................
8.9 MX471C CAN FD/CAN module 103..............................
8.9.1 General information 103........................................
8.9.2 MX471C pin assignment 104....................................
8.9.3 MX471C status LEDs 105.......................................
8.9.4 Receiving CAN messages 106...................................
8.10 MX1601B amplifier 107.........................................
8.10.1 MX1601B pin assignment 108...................................
8.10.2 MX1601B status display 109....................................
8.11 MX1615B/MX1616B amplifier 111................................
8.11.1 MX1615B pin assignment 112...................................
8.11.2 MX1615B status display 114....................................
9 Transducer connection 116....................................
9.1 Full bridge, resistive 116........................................
9.2 Full bridge, inductive 117.......................................
9.3 Full bridge, piezoresistive 118...................................
9.4 Half bridge, resistive 120........................................
9.5 Half bridge, inductive 122.......................................
9.6 Quarter bridge, resistive 123....................................
9.7 Quarter bridge adapter, resistive 124.............................
9.8 Connecting transducers with double shield technique 125...........
9.9 Potentiometric transducers 126..................................
9.10 LVDT transducers 127..........................................
9.11 Current-fed piezoelectric transducer (IEPE, CCLD, ICP) 128.........
9.12 Electrical voltage 100 mV 130...................................

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9.13 DC voltage sources 10 V 131....................................
9.14 DC voltage sources 60 V 132....................................
9.15 Voltage sources up to 300 V (CAT II) 133.........................
9.16 DC current sources 20 mA 134..................................
9.17 DC current sources 20 mA - voltage-fed 135.......................
9.18 Ohmic resistance (e.g. PTC, NTC, KTY, …) 136...................
9.19 Resistance thermometer PT100, PT1000 137.....................
9.20 Thermocouples 138............................................
9.21 Frequency, differential, without directional signal 141...............
9.22 Frequency, differential, with directional signal 142..................
9.23 Frequency, single-pole, without directional signal 143...............
9.24 Frequency, single-pole, with directional signal 144..................
9.25 Incremental encoders, rotary encoders (with/without direction signal),
differential 145.................................................
9.26 Encoder and pulse encoder, single-pole 146.......................
9.27 Rotary encoder and pulse generator, single pole with static directional
signal 147.....................................................
9.28 Absolute value encoder with SSI protocol 148.....................
9.29 Inductive encoders (pickup, crankshaft sensor with gap detection) 150
9.30 Measurement of rotational speed, Crankshaft sensor (digital, TTL) 151
9.31 PWM - Pulse width, pulse duration, period duration 152.............
9.32 PWM - Pulse width, pulse duration, period duration, single-pole 153..
9.33 CAN bus 154..................................................
10 Real-time functions and outputs 156...........................
10.1 MX410B 157..................................................
10.2 MX460B 159..................................................
10.3 MX878B 160..................................................
10.4 MX879B Multi‐I/O module 166...................................
11 FAQ 172.....................................................
12 Accessories 175..............................................
12.1 System accessories 183........................................
12.1.1 BPX001 backplane 183.........................................

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12.1.2 BPX002 backplane 183.........................................
12.1.3 Housing connection elements 184................................
12.2 Voltage supply 185.............................................
12.2.1 Power pack NTX001 185.......................................
12.2.2 Supply cable 185..............................................
12.3 IEEE1394b FireWire 186........................................
12.3.1 IEEE1394b FireWire cable (module-to-module; IP67) 186...........
12.4 General information 186........................................
12.4.1 Plug kit with TEDS chip 186.....................................
12.4.2 Port saver Sub-HD 15-pin 187...................................
12.4.3 Adapter D-Sub-HD 15-pin to D-Sub 15-pin 187....................
12.5 Accessories for MX840B, MX440B 188...........................
12.5.1 Cold junction for thermocouples 188..............................
12.6 SubHD15 to BNC adapter 189...................................
12.7 SCM-HV accessories 189.......................................
12.8 SCM-SG120/350/1000 quarter bridge adapter 190.................
12.9 MX1609KB/TB accessories 190.................................
12.9.1 Thermo-connector with integrated RFID chip 190...................
13 Support 191..................................................

Safety instructions
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1 Safety instructions
Notice
The safety instructions described here also apply to the power pack NTX001
and the active backplane BPX001, BPX002 and BPX003.
Appropriate use
A module with connected transducers is to be used exclusively for
measurement tasks and Test tasks. Use for any purpose other than the above
is deemed to be non-designated, inappropriate use.
In the interests of safety, the module should only be operated as described in
the Operating Manuals. It is also essential to comply with the legal and safety
requirements for the application concerned during use. The same applies to
the use of accessories.
Before commissioning the module for the first time, you must first run a project
planning and risk analysis that takes into account all the safety aspects of
automation technology. This particularly concerns personal and machine
protection.
Additional safety precautions must be taken in plants where malfunctions could
cause major damage, loss of data or even personal injury. In the event of a
fault, these precautions establish safe operating conditions.
This can be done, for example, by mechanical interlocking, error signaling, limit
value switches, etc.
Notice
The module must not be connected directly to a power supply system. The
supply voltage must be 10 V … 30 V (DC).

Safety instructions
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General dangers of failing to follow the safety instructions
Every module is a state of the art device and as such is failsafe. The module
may give rise to residual dangers if it is inappropriately installed and operated
by untrained personnel. Any person instructed to carry out installation,
commissioning, maintenance or repair of the modules must have read and
understood the Operating Manuals and in particular the technical safety
instructions.
The scope of supply and performance of the modules only covers a small area
of measurement technology. In addition, equipment planners, installers and
operators should plan, implement and respond to the safety engineering
considerations of measurement technology in such a way as to minimize
residual dangers. On-site regulations must be complied with at all times. There
must be reference to the residual dangers connected with measurement
technology. After making settings and carrying out activities that are
password-protected, you must make sure that any controls that may be
connected remain in safe condition until the switching performance of the
module has been tested.
Conditions on site
For modules in the housing with degree of protection IP20:
SProtect the modules from dirt and moisture or the effects of weather such
as rain, snow, etc.
SThe permissible relative humidity at 31 oC is 80% (non-condensing); linear
reduction to 50% at 40 oC.
SMake sure that the side ventilation openings are not covered.
For all modules:
SDo not expose the modules to direct sunlight.
SPlease observe the permissible maximum ambient temperatures stated in
the specifications.
SEnsure there is adequate ventilation for installation in the BPX001 back
plane.

Safety instructions
10 A03031_24_E00_01 HBM: public QuantumX
Maintenance and cleaning
The modules are maintenance-free. Please note the following points when
cleaning the housing:
SBefore cleaning, disconnect all connections.
SClean the housing with a soft, slightly damp (not wet!) cloth. Never use
solvent as this could damage the labeling or the housing.
SWhen cleaning, ensure that no liquid gets into the module or connections.
Outputs
Particular attention must be paid to safety when using the digital, analog or
CAN bus outputs of a module. Ensure that status or control signals cannot
initiate any actions that may pose a danger to persons or the environment.
Product liability
In the following cases, the protection provided for the device may be adversely
affected. Liability for device functionality then passes to the operator:
SThe device is not used in accordance with the operating manual.
SThe device is used outside the field of application described in this section.
SThe operator makes unauthorized changes to the device.
Warning signs and danger symbols
Important instructions for your safety are specifically identified. It is essential to
follow these instructions in order to prevent accidents and damage to property.
Safety instructions are structured as follows:
WARNING
Type of danger
Consequences of non-compliance
Averting the danger