HP 7506 Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP 7506 Switch Chassis (JD239C)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in
product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 2
Batteries All types including standard alkaline and lithium
coin or button style batteries 0
Mercury-containing components For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm Includes background illuminated displays with gas discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardants weighing > 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations. 0

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Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screw driver 2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
3.1.1 Guidance of treatments to the product:
Figure 1 Front of HP 7506

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Figure 2 Rear of HP 7506
1. Unscrew the screws on mounting angle 2, and then remove mounting angle 2;
2. Unscrew the screws on cabling rack 3, and then remove cabling rack 3 from mounting;
3. Unscrew the screws on front panel 4, and then remove front panel 4;
4. Unscrew the screws on front panel 5, and then remove front panel 5;
5. Unscrew the screws on blank panel 6, and then remove blank panel 6;
6. Unscrew the screws on power supply module 7, and then remove power supply module 7;
7. Unscrew the screws on blank panel 8, and then remove blank panel 8;
8. Unscrew the screws on fan module 9, and then remove fan module 9;
9. Remove film 10;
10. Unscrew the screws on rear cover plate 11, and then remove rear cover plate 11;
11. Remove all of the inner cables;
12. Unscrew the screws on PCB 12, and then remove PCB 12;
13. Remove plug 13;
14. Remove all of the labels;
15. Remove all of shielding fingers.
3.1.2 Guidance of treatments to module 4:
Figure 3 Treatments to module 4

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1. Unscrew the screws on PCB 4-2, and then remove PCB 4-2;
2. Unscrew the screws on PCB support plate 4-3, and then remove PCB support plate;
3. Unscrew the screws on PCB 4-4, and then remove PCB 4-4;
4. Remove shielding finger 4-5 from front panel 4-1;
5. Remove film 4-6 from front panel 4-1.
3.1.3 Guidance of treatments to module 5:
Figure 4 Treatments to module 5
1. Unscrew the screws on PCB 5-2, and then remove PCB 5-2;
2. Remove shielding finger 5-3 from front panel 5-1;
3. Remove film 5-4 from front panel 5-1.
3.1.4 Guidance of treatments to blank panel 6:
Figure 5 Treatments to blank panel 6
1. Remove shielding finger 6-2 from blank panel 6-1;
2. Remove film 6-3 from blank panel 6-1.
3.1.5 Guidance of treatments to fan module 9

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Figure 6 Treatments to fan module 9
1. Remove the nine fans 9-2 from fan frame 9-1;
2. Unscrew the screws on PCB 9-3, and then remove PCB 9-3;
3. Remove all of the inner cables;
4. Unscrew the screws on handle 9-4, and then remove handle 9-4;
5. Remove film 9-5 from fan frame 9-1;
6. Remove shielding finger 9-6 from fan frame 9-1.
3.2 Material of the facility built
Facility Components Material Weight
(g) Weight percentage Selective treatment for materials and components Details
1 Fe 23254 47.94% Fe recycling
2 Fe 932 1.92% Fe recycling
3 ABS
58 0.12% Pla recycling
4
4-1 Fe 1566 3.23% Fe recycling
4-2 Complex PWB 528 1.09% The surface of PCB is
greater than 10
square centimeters
4-3 Fe 92.7 0.19% Fe recycling
4-4 Complex PWB 1000 2.06% The surface of PCB is
greater than 10
square centimeters
5
5-1 Fe 1487 3.07% Fe recycling
5-2 Complex PWB 1000 2.06% The surface of PCB is
greater than 10
square centimeters
6
6-1 Fe 303*6 3.75% Fe recycling
7 Complex
PWB+Fe 8021 16.54% 1. Containing brominated flame
retardants ;
2. The surface of
PCB is greater
than 10 square
centimeters;
3. Electrolyte
Fe recycling

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capacitor height
is more than 25
mm.
8 Fe 524 1.08% Fe recycling
9
9-1 Fe 1112 2.29% Fe recycling
9-2 Pla 98*9 1.82% Pla recycling
9-3 Complex PWB 105 0.22% The surface of PCB is
greater than 10
square centimeters
11 Fe 2667 5.50% Fe recycling
12 Complex PWB 2550 5.26% The surface of PCB is
greater than 10
square centimeters
cables 04043396
0404A06W
04042967
0404A07K
Cu, Pla 911 1.88% 1. Containing
brominated
flame retardants
2. 04041104 is
external cables
Cu、Pla
recycling
4. Revised record
Date Version Author Modify content
2015.06.29 V0 Liao
Wenqing Initial version