HP A-F5000 Assembly instructions

Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP A-F5000 Firewall Chassis (JG216A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Notes
Quantity
of items
included
in product
Item Description
With a surface greater than 10 sq cm
8Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
Batteries All types including standard alkaline and lithium
coin or button style batteries 0
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0Mercury-containing components
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm Includes background illuminated displays with gas discharge lamps 0
0Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT) 0
0Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords 2
0Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or
PCAs already listed as a separate item above)
10
Include the cartridges, print heads, tubes, vent
chambers, and service stations. 0Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and
toner
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0
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Template Revision B
PSG instructions for this template are available at EL-MF877-01

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Template Revision B
PSG instructions for this template are available at EL-MF877-01
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screw driver 2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Unscrew the screws on mounting angle 2, and then remove mounting angle 2 from the chassis.
2. Remove film 3 from plastic panel 4.
3. Remove film 5 from plastic panel 4.
4. Remove plastic panel 4 from the chassis.
5. Unscrew the screws on front panel 6, and then remove front panel 6 from the chassis.
6. Unscrew the screws on front panel 7, and then remove front panel 7 from the chassis.
7. Remove film 8 from the chassis.
8. Unscrew the screws on front panel 9, and then remove front panel 9 from the chassis.
9. Unscrew the screws on blank filler panel 10, and then remove blank filler panel 10 from the chassis.
10. Unscrew the screws on power module 11, and then remove power module 11 from the chassis.
11. Unscrew the screws on blank poe module panel 12, and then remove blank poe module panel 12 from the
chassis.
12. Unscrew the screws on blank power module panel 13, and then remove blank power module panel 13 from the
chassis.
13. Unscrew the screws on fan frame 14, and then remove fan frame 14 from the chassis.
14. Unscrew the screws on back cover 15, and then remove back cover 15.
15. Unscrew the screws on rib 17, and then remove rib 17 from the chassis.
16. Unscrew the screws on PCB 16, and then remove PCB 16.
17. Remove shielding finger 6-2 from front panel 6-1.
18. Unscrew the screws on pcb 6-3, and then remove pcb 6-3 from front panel 6-1.
19. Unscrew the screws on pcb 6-4, and then remove pcb 6-4 from front panel 6-1.
20. Unscrew the screws on pcb 6-5, and then remove pcb 6-5 from front panel 6-1.
21. Unscrew the screws on pcb 6-6, and then remove pcb 6-6 from front panel 6-1.
22. Remove film 6-7 from front panel 6-1.
23. Remove shielding finger 7-3 from front panel 7-1.
24. Unscrew the screws on pcb 7-2, and then remove pcb 7-2 from front panel 7-1.
25. Remove film 7-4 from front panel 7-1.
26. Unscrew the screws on pcb 7-5, and then remove pcb 7-5 from front panel 7-1.
27. Remove shielding finger 10-2 from blank filler panel 10-1.
28. Remove film 10-3 from front panel 10-1.
29. Unscrew the screws on PCB 14-2, and then remove PCB 14-2 from fan frame 14-1.
30. Remove film 14-3 from fan frame 14-1.
31. Remove shielding finger 14-4 from fan frame 14-1.
32. Unscrew the screws on fan 14-5, and then remove fan 14-5 from fan frame 14-1.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Figure 1 Treatments to the product（front view）Figure 2 Treatments to the product(rear view)
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Template Revision B
PSG instructions for this template are available at EL-MF877-01
Figure 3 Part 1 Figure 4 Treatments to front panel 6

Figure 5 Treatments to front panel 7 Figure 6 Treatments to blank filler panel 10
Figure 7 Treatments to fan frame 14
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01