HP MSR4060 Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP MSR4060 Router Chassis(JG403A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
2
Batteries
All types including standard alkaline and lithium
coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or
PCAs already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
0

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radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
tweezers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack or cabinet.
2. Remove all of the labels.
3. Unscrew the screws on blank panel 2 and 3, and then remove the blank panel 2 and 3.
4. Remove shielding fingers 4.
5. Remove the part 5 and 6.
6. Remove shielding fingers 4.
7. Remove the part 7.
8. Unscrew the screws on part 8, then remove it.
9. Remove shielding fingers 4.
10. Unscrew the screws on panel 7.1, and then remove panel 7.1.
11. Unscrew the screws on panel 7.2, and then remove panel 7.2.
12. Remove shielding fingers 4.
13. Unscrew the screws on PCB 7.3, and then remove PCB 7.3.
14. Unscrew the screws on panel 7.4, and then remove panel 7.4.
15. Unscrew the screws 7.5, and then remove handle 7.5.
16. Remove shielding fingers 4.
17. Unscrew the screws on panel 7.4.1, and then remove fan 7.4.2.
18. Unscrew the screws on part 8.1, and then remove PCB 8.2.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)

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Figure 1 Remove mounting angle Figure 2 Treatments to the blank panel
Figure 3 Treatments to the product Figure 4 Treatments to the product

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Figure 5 Treatments to fan-assembly Figure 6 Treatments to the fan-assembly
Figure 7 Treatments to fan-assembly Figure 8 Treatments to fan-assembly
Figure 9 Treatments to fan-assembly Figure 10 Treatments to PCB-assembly

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3.3 Material of the facility built
Facility
Components
Material
Weight(g)
Weight percentage
Selective treatment for materials
and components
Details
1
Fe
269
1.69%
Fe recycling
2
Fe
59.6*10
3.76%
Fe recycling
3
Fe
95.8*2
1.21%
Fe recycling
4
Be-Cu
8.9
0.06%
Cu recycling
5
Fe
176.1
1.11%
Fe recycling
6
Fe
341.2*2
4.30%
Fe recycling
7
7.1
Fe
45.5
0.29%
Fe recycling
7.2
Fe
204.5
1.29%
Fe recycling
7.3
Complex PCB
25
0.16%
The surface of PCB is greater
than 10 square centimeters;
7.4
7.4.1
Fe
45.5*4
1.14%
Fe recycling
7.4.2
PBT , Cu
190*4
4.79%
Containing brominated flame
retardants;
7.5
Fe
37.5
0.23%
Fe recycling
7.6
Fe
682.1
4.30%
Fe recycling
8
8.1
Fe
125
0.79%
Fe recycling
8.2
Complex PCB
800
5.04%
The surface of PCB is greater
than 10 square centimeters;
9
Fe
11085.3
69.84%
Fe recycling
3.4 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Clear the yellow adhesive, if had, by the tweezers.
2. Pry the button battery up from socket.

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3.5 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
Figure 11 Clear the yellow adhesives by the tweezers.
Figure 12 Pry up the button battery
4.0 Revised record
Date
Version
Author
Modify content
2012.12.10
V0
Cheng Wei
Initial version