HP FF 12916E Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP FF 12916E Switch Chassis(JH103A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sqcm 3
Batteries All types including standard alkaline and lithium
coin or button style batteries 0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm Includes background illuminated displays with gas discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame
Retardantsweighing> 25 grams (not including
PCBs or PCAs already listed as a separate item
above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing 0

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radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screw driver 2#
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Remove all of the labels(part 1);
2. Unscrew the screws on part 2, and then remove part 2.
3. Unscrew the screws on part 3, and then remove part 3.
4. Unscrew the screws on part 4, and then remove part 4.
5. Extract all of the part 5.
6. Extract all of the part 6.
7. Unscrew the captive-screws on part 7, and then remove part 7 from part 8.
8. Remove the shielding fingers 3-1 from part 3.
9. Remove the film 3-2 from part 3.
10. Remove the shielding fingers 4-1 from part 4.
11. Remove the film 4-2 from part 4.
12. Remove the spring bottom 5-1 from part 5.
13. Remove the shielding fingers 6-1 from part 6.
14. Unscrew the screws on part 7-1, and then remove part 7-1 from part 7.
15. Unscrew the screws on part 7-2, and then remove part 7-2 from part 7.
16. Unscrew the screws on part 7-3, and then remove part 7-3 from part 7.
17. Unscrew the screws on part 7-4, and then remove part 7-4 from part 7.
18. Unscrew the screws,and then disassemble part 7-3.
19. Unscrew the screws,and then disassemble part 7-4;
20. Unscrew the screws on part 8-1, and then remove part 8-1 from part 8.
21. Unscrew the screws on part 8-2,and then pull out part 8-2.
22. Remove the insulating film and shielding fingers from part 8-2.
23. Unscrew the screws on part 8-3, and then remove part 8-3 from part 8-4.
24. Unscrew the screws on part 8-4, and then remove part 8-4 from part 8.
25. Unscrew the screws and guide pins on part 8-5-1, and then remove it from 8-5.
26. Unscrew the screws on part 8-5-2, and then remove them from 8-5.
27. Unscrew the screws on part 8-5-3, and then remove them from 8-5.
28. Remove the insulating film from part 8-5-3.
29. Unscrew the screws on part 8-5-4, and then remove all of the die-casting parts;
30. Unscrew the screws on part 8-5-5, and then remove them from part 8-5.

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3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Figure 1Overall view of the product
Figure 2Treatments to the product

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Figure 3Treatments to the part 3Figure 4 Treatments to the part 4
Figure5Treatments to the part 5
Figure 6Treatments to the part 6

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Figure 7Treatments to the part 7
Figure8Treatments to the part 7-3
Figure9Treatments to the part 8

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Figure10Treatments to the part 8-5
3.3 Material of the facility built
Facility Components Material Weight(g) Weight
percentage Selective treatment for materials andcomponents Details
1 PC 30 0.04% Pla recycling
2 Fe 2230 2.76% Fe recycling
3
3-1 Cu 6 0.01% Cu recycling
3-2 PC 10.4 0.01% Pla recycling
3-3 Fe,Al 430.4 0.53% Fe,Al recycling
4
4-1 Cu 48 0.06% Cu recycling
4-2 PC 91.2 0.11% Pla recycling
4-3 Fe,Al 3635.2 4.49% Fe,Al recycling
5
5-1 Fe 14.72 0.02% Fe recycling
5-2 Zn 288 0.36% Zn recycling
6
6-1 Fe 1169 1.44% Fe recycling
6-2 Cu 16.8 0.02% Cu recycling
7
7-1 Pa66 30.4 0.04% Pla recycling
7-2 Pa66 26 0.03% Pla recycling
7-3 Zn,Fe,Al 683.2 0.84% Fe, Zn, Al recycling
7-4 Zn,Fe,Al 683.2 0.84% Fe, Zn, Alrecycling
7-5 Fe 8514 10.52% Fe recycling
8
8-1 Fe 721.4 0.89% Fe recycling
8-2 Fe,Cu,PC 19880 24.57% Fe, Cu,PC recycling
8-3 Cu 2394 2.96% Cu recycling
8-4 Complex
PCB(3 PCS) 2400 2.97% The surface of PCB is greater than 10 square centimeters;
8-5 Fe, Zn, Al 37600 46.48% Fe, Zn, Al recycling

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4. Revised record
Date Version Author Modify content
2015.05.11 V0 Xue Gang Initial version