HP 7500 48p 1000BASE-T w/PoE+ SE Mod Installation instructions

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP 7500 48p 1000BASE-T w/ PoE+ SE Mod(JH213A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA) With a surface greater than 10 sq cm 3
Batteries All types including standard alkaline and lithium coin
or button style batteries 0
Mercury-containing components For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries 0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm Includes background illuminated displays with gas discharge lamps 0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height 0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent chambers, and service stations. 0
Components and waste containing asbestos 0
Components, parts and materials containing
refractory ceramic fibers 0
Components, parts and materials containing
radioactive substances 0

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2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screw driver 2#
Socket Spanner
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Unscrew the screws on part 1,and then remove part 1;
2. Unscrew the screws on part 2,and then remove part 2 from PCB 10;
3. Unscrew the screws on part 3,and then remove part 3;
4. Remove the heatsink 4 from PCB 10;
5. Remove the heatsink 5 from PCB 10;
6. Unscrew the hexagonal posts 6 on PCB 7 and 8,and then remove hexagonal posts 6 and PCB 7 and 8;
7. Unscrew the hexagonal posts 9 ,and then remove hexagonal posts 9;
8. Unscrew the screws on PCB 10,and then remove PCB 10 from panel 13;
9. Remove shielding finger 11 from panel 13;
10. Remove film 12 from panel 13.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
3.3 Material of the facility built

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Facility Components Material Weight(g) Weight
percentage Selective treatment for materials and
components
Details
1 Fe 48.6 1.64% Fe recycling
2 Zn 23.4 0.79% Zn recycling
3 Fe 116.2 3.91% Fe recycling
4 Al 23.8 0.80% Al recycling
5 Al 64.6 2.17% Al recycling
6 Fe 5.7 0.19% Fe recycling
7 Complex
PCB 46 1.55% The surface lf PCB is greater than 10 square
centimeters
8 Complex
PCB 46 1.55% The surface lf PCB is greater than 10 square
centimeters
9 Cu 25.2 0.85% Cu recycling
10 Complex
PCB 1174.5 39.53% The surface lf PCB is greater than 10 square
centimeters
11 Be-Cu 2.7 0.09% Cu recycling
12 PC 1.5 0.05% Pla recycling
13 Fe 1392.7 46.88% Fe recycling
4. Revised record
Date Version Author Modify content
2015.06.25 V0 Xu Jianbin Initial version