EL-MF877-00 Page 2
Template Revision B
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack or cabinet.
2. Unscrew the screws on mounting angle 2, and then remove the mounting angle 2.
3. Remove all of the labels.
4. Unscrew the screws on filler panel 3 and 4, and then remove the filler panel 3 and 4.
5. Remove shielding fingers 5.
6. Remove the part 6 and 7. Unscrew the screws on top cover 8, and then remove the top cover 8.
7. Remove shielding fingers 5.
8. Unscrew the screws on part 9, 10 and 11, and then remove them.
9. Unscrew the screws on part 12, and then remove it.
10. Unscrew the screws on part 9.1, and then remove PCB 9.2.
11. Unscrew the screws on fan 11.1, and then remove part 11.2.
12. Unscrew the screws on part 12.1, and then remove PCB 12.2.
13. Unscrew the screws on part 13.1, and then remove PCB 13.2.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
