HP FlexNetwork MSR3044 Assembly instructions

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Product End-of-Life Disassembly Instructions
Product Category: Networking Equipment
Marketing Name / Model
[List multiple models if applicable.]
HP MSR3044 Router(JG405A)
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic
instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as
defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
3
Batteries
All types including standard alkaline and lithium
coin or button style batteries
1
Mercury-containing components
For example, mercury in lamps, display
backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface
greater than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or
PCAs already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and
toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
Components, parts and materials containing
0

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radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where
components and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Screw driver
2#
tweezers
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Unscrew the screws for mounting angle 1, and then remove the mounting angle 1 from the rack or cabinet.
2. Unscrew the screws on mounting angle 2, and then remove the mounting angle 2.
3. Remove all of the labels.
4. Unscrew the screws on filler panel 3 and 4, and then remove the filler panel 3 and 4.
5. Remove shielding fingers 5.
6. Remove the part 6 and 7. Unscrew the screws on top cover 8, and then remove the top cover 8.
7. Remove shielding fingers 5.
8. Unscrew the screws on part 9, 10 and 11, and then remove them.
9. Unscrew the screws on part 12, and then remove it.
10. Unscrew the screws on part 9.1, and then remove PCB 9.2.
11. Unscrew the screws on fan 11.1, and then remove part 11.2.
12. Unscrew the screws on part 12.1, and then remove PCB 12.2.
13. Unscrew the screws on part 13.1, and then remove PCB 13.2.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)

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Figure 1 Remove mounting angle Figure 2 Treatments to the blank panel
Figure 3 Treatments to the product

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Figure 4 Treatments to the product
Figure 5 Treatments to the product

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Figure 6 Treatments to the product
Figure 7 Treatments to PCB-assembly

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Figure 8 Treatments to the fan-assembly
Figure 9 Treatments to PCB-assembly
Figure 10 Treatments to PCB-assembly

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3.3 List the basic steps that should typically be followed to remove components and materials requiring selective
treatment:
1. Clear the yellow adhesive, if had, by the tweezers.
2. Pry the button battery up from socket.
3.4 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations)
Figure 11 Clear the yellow adhesives by the tweezers.
Figure 12 Pry up the button battery

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3.5 Material of the facility built
Facility
Components
Material
Weight(g)
Weight percentage
Selective treatment for materials
and components
Details
1
Fe
84
0.63%
Fe recycling
2
Fe
150
1.13%
Fe recycling
3
Fe
96
0.73%
Fe recycling
4
Fe
308
2.33%
Fe recycling
5
Be-Cu
6
0.05%
Cu recycling
6
Fe
341
2.58%
Fe recycling
7
Fe
108
0.82%
Fe recycling
8
Fe
1790
13.52%
Fe recycling
9
9.1
Fe
746
5.64%
Fe recycling
9.2
Complex PCB
100
0.76%
The surface of PCB is greater
than 10 square centimeters;
10
Fe
15
0.11%
Fe recycling
11
11.1
PC
109*2
1.65%
Containing brominated flame
retardants
Fan
11.2
Fe
125
0.94%
Fe recycling
12
12.1
Fe
674
5.09%
Fe recycling
12.2
Complex PCB
837
6.32%
The surface of PCB is greater
than 10 square centimeters;
12.3
Fe
60
0.45%
Fe recycling
12.4
AL
163
1.23%
AL recycling
13
13.1
Fe
343
2.59%
Fe recycling
13.2
Complex PCB
300
2.27%
The surface of PCB is greater
than 10 square centimeters;
13.3
Fe
15
0.11%
Fe recycling
14
Fe
6975
52.70%
Fe recycling
4.0 Revised record
Date
Version
Author
Modify content
2012.12.26
V0
Wu Xuejun
Initial version