EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Size (if
applicable)
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove the access panel.(see Figure 1 below)
2. Remove fan duct and clapboard from chassis.(see Figure 2-6 below)
3. Remove front PSU fan from ODD cage.(see Figure 7-8 below)
4. Remove PSU from chassis.(see Figure 9-10 below)
5. Remove the Riser card from the MB(see Figure 11-15 below)
6. Remove SATA cable and HDD from chassis (see Figure 16-22 below)
7. Remove front bezel from chassis.(see Figure 23 below)
8. Remove front system fan from chassis.(see Figure 24-26 below)
9. Remove FIO and speaker from chassis.(see Figure 27-29 below)
10. Remove the Memory from the board.(see Figure 30 below)
11. Remove the CPU from the board .(see Figure 31-33 below)
12. Remove the battery from the system board.(see Figure 34 below)
13. Remove the COMB card from the MB.(see Figure 35 below)
14. Remove M/B from chassis.(see Figure 36-37 below)
15. Remove PSU cover.(see Figure 38-39 below)
16. Disconnect all the cables and remove the Electrolytic Capacitors.(see Figure 40-50 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
