HTC confidential
© 2004, HTC CORPORATION. ALL RIGHTS RESERVED. TOTAL 53 CONT.ON. 4 PAGE NO. 3
TABLE OF CONTENTS
CHAPTER 1 – INTRODUCTION....................................................................................................................................................5
1.1 PRODUCTION SPECIFICATION ...................................................................................................................................................5
CHAPTER 2 – SERVICEING TOOLS............................................................................................................................................9
2.1 REPAIR LEVEL DEFINITION......................................................................................................................................................9
2.2 LIST OF SERVICING TOOLS........................................................................................................................................................9
CHAPTER 3 –ASSEMBLINGAND DISASSEMBLING............................................................................................................10
3.1 DISASSEMBLING ......................................................................................................................................................................10
3.2ASSEMBLING............................................................................................................................................................................16
CHAPTER 4 – DIAGNOSTIC PROGRAM..................................................................................................................................21
4.1 LIST OF DIAGNOSTIC /WINCETEST ITEMS...........................................................................................................................21
4.2TEST PROCEDURE....................................................................................................................................................................22
CHAPTER 5 –SOFTWARE UPGRADE PRCEDURE.................................................................................................................24
5.1 RUU (RE-FLASH UPGRADE UTILITY).....................................................................................................................................24
5.2 SD CARD UPGRADE..................................................................................................................................................................28
CHAPTER 6 –LEAKAGE CURRENT MEASUREMENT..........................................................................................................30
BATTERY RUNDOWN TEST PROCEDURE..............................................................................................................................34
TESTPROCEDURE...................................................................................................................................................................34
CHAPTER 7 – COSMETIC INSPECTION CRITERIA..............................................................................................................39
7.1 CLASSES DEFINITION OF INSPECTIVE AREA............................................................................................................................39
7.2. MAIN UNIT INSPECTION..........................................................................................................................................................40
CHAPTER 8 –TROUBLESHOOTINGAND REPAIR.................................................................................................................41
CHAPTER 9 –GENERIC SPARE PART LIST.............................................................................................................................46
9.1 SPLFOR REPAIR......................................................................................................................................................................46
9.2 BOARD LEVEL .........................................................................................................................................................................47
9.3 FRU M/BADDITIONAL PARTS LOCATION ...............................................................................................................................47
APPENDIX........................................................................................................................................................................................49
A. GENERIC LABELING PLAN .......................................................................................................................................................50
B. RF ANTENNA TEST SPECIFICATION.........................................................................................................................................51