Htc Gene User manual

HTC confidential

Gene

Service Manual

HTC Proprietary

Confidential Treatment Requested

Rev. A08

Nov 26, 2008

HTC Corp.

Engineering Mobility

HTC confidential

Revision Control Table

Rev Date Contents Dept. Revised App Dept Stage/Per

A01 2006/12/08 First Draft PSE Jerry W. Lin GSD PVT

A02 2006/12/21 Update disassemble procedure PSE Jerry W. Lin GSD MV

A03 2007/03/09 Add pictures on chapter 5.1 PSE Budiman Cheng GSD MP

A04 2007/04/10 Add battery rundown on chapter 6 PSE Budiman Cheng GSD MP

A05 2007/05/08

Add more description at the

“Location” column on chapter 9.2 PSE Budiman Cheng GSD MP

A06 2007/07/23

Add more spare parts and location

on Chapter 9 PSE Budiman Cheng GSD MP

A07 2007/08/06 Add 75H00566-00M on chapter 9.2 PSE Budiman Cheng GSD MP

A08 2008/11/26

Add FRU M/B additional parts

location on chapter 9.3 PSE Budiman Cheng GSD MP

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TABLE OF CONTENTS

CHAPTER 1 – INTRODUCTION....................................................................................................................................................5

1.1 PRODUCTION SPECIFICATION ...................................................................................................................................................5

CHAPTER 2 – SERVICEING TOOLS............................................................................................................................................9

2.1 REPAIR LEVEL DEFINITION......................................................................................................................................................9

2.2 LIST OF SERVICING TOOLS........................................................................................................................................................9

CHAPTER 3 –ASSEMBLINGAND DISASSEMBLING............................................................................................................10

3.1 DISASSEMBLING ......................................................................................................................................................................10

3.2ASSEMBLING............................................................................................................................................................................16

CHAPTER 4 – DIAGNOSTIC PROGRAM..................................................................................................................................21

4.1 LIST OF DIAGNOSTIC /WINCETEST ITEMS...........................................................................................................................21

4.2TEST PROCEDURE....................................................................................................................................................................22

CHAPTER 5 –SOFTWARE UPGRADE PRCEDURE.................................................................................................................24

5.1 RUU (RE-FLASH UPGRADE UTILITY).....................................................................................................................................24

5.2 SD CARD UPGRADE..................................................................................................................................................................28

CHAPTER 6 –LEAKAGE CURRENT MEASUREMENT..........................................................................................................30

BATTERY RUNDOWN TEST PROCEDURE..............................................................................................................................34

TESTPROCEDURE...................................................................................................................................................................34

CHAPTER 7 – COSMETIC INSPECTION CRITERIA..............................................................................................................39

7.1 CLASSES DEFINITION OF INSPECTIVE AREA............................................................................................................................39

7.2. MAIN UNIT INSPECTION..........................................................................................................................................................40

CHAPTER 8 –TROUBLESHOOTINGAND REPAIR.................................................................................................................41

CHAPTER 9 –GENERIC SPARE PART LIST.............................................................................................................................46

9.1 SPLFOR REPAIR......................................................................................................................................................................46

9.2 BOARD LEVEL .........................................................................................................................................................................47

9.3 FRU M/BADDITIONAL PARTS LOCATION ...............................................................................................................................47

APPENDIX........................................................................................................................................................................................49

A. GENERIC LABELING PLAN .......................................................................................................................................................50

B. RF ANTENNA TEST SPECIFICATION.........................................................................................................................................51

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CHAPTER 1 – INTRODUCTION

1.1 Production Specification

¾Platform

•PDA form factor integrated quad-band GSM/EDGE

•OS: Microsoft Windows Mobile 5.0-PocketPC Phone Edition

¾Dimension

•109mm (L) x 58mm (W) x 17.65/18.15mm around camera(T)

•126g with battery pack

¾Processor/Chipset

•TI OMAP 850

¾Memory

•Flash ROM: 128MB (for program and users’ storage)

•SDRAM: 64MB DDR SDRAM

¾LCD Module

•Main LCD Module

- 2.8”, 240x320 dots resolution

- 64K-color TFT LED with backlight

- Sensitive Touch Screen

¾GSM/EDGE Functional

•Internal Antenna

•GSM/GPRS/EDGE:

- Quad-band (850/900/1800/1900MHz)

•Auto Band Switching

•Global roaming

•Audio codec:AMR, EFR, FR, HR

•SMS (MO, MT), concatenated SMS (640 characters)

•Generic services

- Call holding, waiting, forwarding and barring

- CLI (Call Line Identity)

- Display own number

- Network selection

- Cell broadcast

- Multi-party conference capability

- Network lock

- Phase 2+ unstructured supplementary service data

- CPHS

•E-GPRS Function

- EGPRS Class B

- Multi-slot Standard Class 10

- MO/MT SMS over GPRS

- PBCCH

•SIM

- 3V of SIM

- SIM application tool kit release 98 class 3 and 99(Patial)

- Over the Air (OTA) programming

- FDN (Fixed Dialing Number)

- ADN (Abbreviated Dialing Number)

- Security PIN 1&2 control

¾Keyboard/Button/Switch

•Button

- Power button(Short Press: system sleep on/off, Long Press: power on/off)

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- 5-way navigation pad

- Send/Hands-free button(Long Press during call: Hand-free On/Off)

- End button,

- Ok button

- Voice command / Voice record button(Short Press: voice command, Long Press: voice

record)

- 2 soft-keys button (Calendar and Contact)

- Start button

- Volume Up & Down

- Camera capture button

- Reset

¾Notification

•One bi-color(red & green) LED for GSM standby, GSM message, GSM network status, and

charging status

•One blue LED for Bluetooth notification

•Notification by LED, sound, Vibration, message on the display

¾Audio

•Build-in Microphone

•Receiver

•Loud speaker for Hands-free supported

•Full duplex

•AMR/AACWAV/WMA//MP3 codec

•16 bits with 8KHz, 11KHz, 22KHz, 44.1KHz

¾Camera

•2 mega-pixel CMOS

¾Bluetooth

•Compliant with V2.0 without EDR

•Class 2 transmit power

•Supported profiles:

- Generic Access Profile

- Serial Port Profile

- Headset Profile

- Object Push Profile

- PAN

- Heads-free Profile

- Generic Object Exchange Profile

- Advanced Audio Distribution Profile (A2DP)

- Audio/Video Remote Control Profile (AVRCP)

- SIM Access Profile for hTC

- Human Interface Device Profile

- Service discovery application profile

¾Interface

•3V SIM card

•11-pin min-USB (USB 1.1) client/audio jack in one

•SDIO/MMC card slot (support SD2.0 or SDHC)

•External antenna connector

¾Power

•Removable rechargeable Lithium Polymer battery

•Capacity: 1250mAh

•Charging time: 3 hours

•Talk-Time: 3.5~5 hours

•Standby Time: 150~200 hours

•Playing WMV 12 hours

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•Playing WMA 8 hours

•AC Adapter.

- AC input rating: 100-240Vac, 50-60 Hz.

- DC output: 5V / 1A

¾Hanger Hole

•Stylish hanger r to wear phone with neck strap as pendant or to attach various phone hangers.

¾Accessories

•Inbox

- AC adapter with mini-USB power plug

- Sync. Cable (mini-USB)

- Battery (rechargeable and replaceable)

- Stylus

- Carrying case

- Stereo-wired headset with microphone

•Optional

- Car adapter.

- Car Holder

- BT keyboard

- Travel Charger

¾Microsoft Windows Mobile 5.0 Applications

•Pocket Outlook: Calendar, Contacts, Messaging, Tasks, and Voice Notes

•FirectPushl

•Internet Explorer Mobile

•Office Mobile: Word, Excel & PowerPoint Mobile

•Windows Media Player 10 Mobile

•Pictures & Videos

•ActiveSync Client

•Pocket MSN

•Device Management

•OTA Provisioning

•Internet Sharing

•Set-ip Wizard for E-mail

•Terminal Service Client

•Calculator

•Games

¾Value Added Application

•Camera/Camcorder

•Picture Enhancement for Pictures & Videos

•Polyphonic MIDI Ringtone

•Audio/Video enhancement for WMP

•ZIP

•Smart Dialing

•MMS Client: MMS 1.1 supported

•Voice Dial & Command

•Document Viewer – PDF

•OMA DRM 1.0 supported

•SIM Manager

•Comm. Manager

•Smart Dial

•STK

•Audio Manager

•Ringtone Trimmer

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•Task Manager

•Bluetooth FTP

¾Carrier Specific Applications

•Java virtual machine (J2ME,CLDC 1.1, MIDP 2.0)

•SPB GPRS Monitor (for hTC)

•Bluetooth SAP (for hTC)

¾Regulatory

•R&TTE: EMC/EMI, Safety SAR

•FCC Approval

•FCC HAC

•PDCRB Approval

•BQB (Bluetooth Qualification Body) certification

•Microsoft Windows Mobile Logo (NTSL)

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CHAPTER 2 – SERVICEING TOOLS

2.1 Repair Level Definition

Unit

L0 Accessory test and unit swap

L1 Unit Test and ROM Re-flash

L2 Refurbishment and Module Swap +L1

L2.5 M/B Repair(connecter, button, MIC…) +L2

Note : These level is for reference only depends on service model

2.2 List of Servicing Tools

level No. Item Use for Remark

1 Mini USB DATA interface

Cable Check for mini USB

communication; RUU re-flash

2 Earphone Headset For Audio test.

3 AC Adapter Transfer AC to DC for Unit

4 SD Card with Diagnostic test

program (must be encoded by

HTC)

For unit diagnostic test HTC design

5 128MB SD memory card

( must be encoded by HTC) For unit ROM code transfer to

SD card for re-flash HTC design

6 Unit current consumption test

fixture

Measure Unit current

consumption

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7 Power supply Local purchase

8 Current Meter Local purchase

9 Mobile tester

For RF test

Local purchase

L 1

10 Special Made Plastic Stick Assembly & Disassembly

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tools

11 Hand tools Assembly & Disassembly Local purchase

12 Label printer Print agency label if replacing

M/B Local purchase

L 2

13 Lead-free Soldering station Board level repair Local purchase

L 2.5 14 Air heater Board level repair Local purchase

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CHAPTER 3 – ASSEMBLING AND DISASSEMBLING

3.1 Disassembling

Tools needed for Assembling and

Disassembling

1. Torx Screw Driver T4X30

2. Flat Plastic Stick

1. Take out the Stylus.

2. Remove the SD card if any.

Push the battery cover to open.

1 2

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Remove the battery by simply pull up the plastic

ribbon.

Warning: To reduce risk of fire or

burns, do not disassemble, crush, puncture,

short external contacts, or dispose of in fire

or water. Replace only with specified

batteries. Recycle or dispose of used

batteries properly

Release 2 screws on housing.

1. Insert the flat plastic stick into the gap

between the bezel and the housing on the left

and right of the LCD to release the hooks.

2. Separate the housing and the bezel.

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2

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Loosen and take out 2 screws from the

housing.

Remove the main board from the housing (start

from the top side)

Use Stylus to lift up vibrator from the housing.

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UNPLUG VIBRATOR FROM THE MAIN BOARD.

Unplug speaker connector from its connector

on the M/B.

Remove the kapton tape from the LCM

connector.

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Unlock the LCM connector and then release

the LCM FPC.

Loosen 2 screws from LCD bracket.

Remove microphone rubber.

Be careful of the rubber

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Separate the LCD bracket from the M/B then

separate the LCM from LCD bracket.

Unlock 2 antenna hooks to remove the antenna

from the main board.

Disconnect the camera module.

The Disassembly process is finished.

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3.2 Assembling

Connect the Camera module.

1. Install the speaker into the antenna cover.

2. Assemble the antenna on the M/B.

Connect the speaker connector

A

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Attach the microphone rubber.

Be careful of the rubber

1. Assemble the LCM on the LCD bracket.

2. Assemble the LCD bracket to the M/B.

Fasten 2 screws to fix the LCD bracket.

Screw:72H00353-10M

Torque: 0.4+-0.1 kgf-cm

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Insert the LCM FPC into the connector and then

lock the connector.

Connect the vibrator.

Assemble the vibrator on the housing.

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1. Assemble the Main Board into housing.

2. Fasten 2 screws to fix it.

Screw:72H01403-00M

Torque: 1.2 +-0.1 kgf-cm

Attach the receiver to the bezel.

Assemble the bezel to the housing, start from the

earpiece side.

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Fasten 2 screws on the housing.

Screw:72H01403-00M

Torque: 1.2 +-0.1 kgf-cm

Install the battery by insert the right side of the

battery first, then gently push the battery into its

place.

(Note: Leave the end part of the plastic ribbon laid

upon the battery)

1. Replace the battery cover.

2. Put the stylus back into its place.

The Assembly process is finished.

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HTC Gene User manual

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