Huawei G700-U10 User manual

G700-U10 Smartphone
Maintenance Manual
Issue
1.0
Date
2013-07-22
HUAWEI TECHNOLOGIES CO., LTD.

Issue 1.0 (2013-07-22)
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Copyright © Huawei Technologies Co., Ltd.
i
Copyright © Huawei Technologies Co., Ltd. 2013. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees or
representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every effort has been made in the
preparation of this document to ensure accuracy of the contents, but all statements, information, and
recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address:
Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
People's Republic of China
Website:
http://www.huawei.com
Email:
[email protected]

G700-U10 Smartphone
Maintenance Manual
1About This Document
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ii
1 About This Document
Author
Prepared by
Date
Reviewed by
Date
Approved by
Date
Change History
Date
Version
Change
Reason
Changed
Chapter
Description
Author

G700-U10 Smartphone
Maintenance Manual
Contents
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iii
Contents
1 About This Document................................................................................................................. ii
2 Product Overview .........................................................................................................................1
2.1 Appearance ...................................................................................................................................................................1
2.2 Product Specifications ..................................................................................................................................................1
3 Applicable Scope and Precautions ............................................................................................3
3.1 Applicable Scope ..........................................................................................................................................................3
3.2 Precautions....................................................................................................................................................................3
3.3 How to Obtain Product and Maintenance Information.................................................................................................3
4 Exploded View...............................................................................................................................4
5 Components Layout......................................................................................................................6
5.1 PCBA............................................................................................................................................................................6
5.2 Proximity Sensor FPC ..................................................................................................................................................8
5.3 Speaker FPC .................................................................................................................................................................8
5.4 Component Lists...........................................................................................................................................................9
5.4.1 PCBA Components....................................................................................................................................................9
5.4.2 Proximity Sensor FPC Components ........................................................................................................................13
5.4.3 Speaker FPC Components .......................................................................................................................................13
6 Software Upgrade .......................................................................................................................15
6.1 Upgrade Preparation...................................................................................................................................................15
6.2 Precautions..................................................................................................................................................................15
6.3 Installing the USB Driver ...........................................................................................................................................16
6.4 Upgrade Methods........................................................................................................................................................16
6.4.1 Performing a USB Upgrade.....................................................................................................................................16
6.4.2 Performing a mircoSD Card Upgrade......................................................................................................................16
6.5 Troubleshooting Upgrade Failures..............................................................................................................................19
7 Maintenance Tools......................................................................................................................20
8 Disassembly Procedure..............................................................................................................22
9 Assembly Procedure ...................................................................................................................26
10 Circuit and Failure Analysis ...................................................................................................29

G700-U10 Smartphone
Maintenance Manual
Contents
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iv
10.1 Solution Introduction................................................................................................................................................29
10.2 Baseband Subsystem ................................................................................................................................................30
10.2.1 Startup Management Circuit..................................................................................................................................30
10.2.2 Charging Management Circuit...............................................................................................................................36
10.2.3 Clock Circuit..........................................................................................................................................................41
10.2.4 Memory Circuit .....................................................................................................................................................44
10.3 RF Subsystem...........................................................................................................................................................45
10.3.2 Receive Channel ....................................................................................................................................................46
10.3.3 Transmit Channel...................................................................................................................................................50
10.3.4 GPS Channel..........................................................................................................................................................52
10.3.5 Wi-Fi Channel........................................................................................................................................................52
10.4 Peripheral Circuits ....................................................................................................................................................54
10.4.1 LCD Circuit ...........................................................................................................................................................54
10.4.2 TP Circuit...............................................................................................................................................................57
10.4.3 Front Camera Circuit .............................................................................................................................................59
10.4.4 Rear Camera Circuit ..............................................................................................................................................61
10.4.5 G-Sensor Circuit ....................................................................................................................................................63
10.4.6 3-in-1 Sensor Circuit..............................................................................................................................................65
10.4.7 Key Circuit.............................................................................................................................................................66
10.4.8 Motor Circuit .........................................................................................................................................................68
10.4.9 Receiver Circuit.....................................................................................................................................................69
10.4.10 Microphone Circuit..............................................................................................................................................71
10.4.11 Speaker Circuit.....................................................................................................................................................73
10.4.12 Headset Circuit ....................................................................................................................................................75
10.4.13 SIM Card Circuit .................................................................................................................................................78
10.4.14 microSD Card Circuit..........................................................................................................................................80
10.4.15 USB Port Circuit..................................................................................................................................................82
10.4.16 Wi-Fi Module Circuit...........................................................................................................................................84
10.4.17 Bluetooth Module Circuit....................................................................................................................................86
10.4.18 GPS Module Circuit.............................................................................................................................................87
10.4.19 FM Module Circuit..............................................................................................................................................88
11 Solder Points on the PCB and BGA Chips...........................................................................91
12 Functional Tests.........................................................................................................................93
12.1 Keys..........................................................................................................................................................................93
12.2 MMI Test ..................................................................................................................................................................94
12.3 Voice Call Test..........................................................................................................................................................96

G700-U10 Smartphone
Maintenance Manual
2 Product Overview
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Copyright © Huawei Technologies Co., Ltd.
1
2 Product Overview
2.1 Appearance
Figure 2-1 G700-U10
2.2 Product Specifications
Table 2-1 G700-U10 specifications
Item
Description
Dimensions
134 mm x 67 mm x 9.0 mm (5.28 in. x
2.64 in. x 0.35 in.)

G700-U10 Smartphone
Maintenance Manual
2 Product Overview
Issue 1.0 (2013-07-22)
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2
Item
Description
Technical standard
WCDMA/GSM
Frequency bands
WCDMA 900/2100 MHz
GSM 900/1800/1900 MHz
Weight
About 150 g (with battery)
Type
Bar-type; with touchscreen
Antenna
Built-in
UIM
Standard SIM card
Power supply
5 V, 1 A
Battery
2150 mAh Li-polymer
battery
Standby time: more than 120 hours
Talk time: more than 180 minutes
(network dependent)
Display
Resolution
1280 x 720 pixels
LCD type
TFT
Color
16M
LCD size
5 inches
Interfaces
Charging interface
Micro USB port
USB interface
Micro USB port
microSD card
interface
microSD card slot
Headset interface
3.5 mm headset jack
Maximum transmit
power
WCDMA: 23 dBm
GSM: 32.5 dBm
Static sensitivity
< 108 dBm (wired); BER ≤ 0.001 (UE)
Temperature
Operating temperature: –10°C to +45°C
Storage temperature: –40°C to +70°C
Humidity
Operating humidity: 5% to 95% RH

G700-U10 Smartphone
Maintenance Manual
3 Applicable Scope and Precautions
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Copyright © Huawei Technologies Co., Ltd.
3
3 Applicable Scope and Precautions
3.1 Applicable Scope
This document provides maintenance instructions for technical support at the authorized
service centers. Being Huawei proprietary, this document is accessible only for authorized
service centers and companies.Although every effort was made to ensure the accuracy of this
document, errors may still exist. If you find any errors or have any suggestions, contact
Huawei customer service.
3.2 Precautions
Only qualified technicians are allowed to perform maintenance and calibration.
Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps
throughout the operations.
Ensure that all the components, screws, and insulators are properly installed after
maintenance and calibration and that all cables and wires are installed and connected
correctly.
Ensure that the soldering is lead-free and compliant with eco-friendly requirements.
3.3 How to Obtain Product and Maintenance Information
To obtain the product and maintenance information, visit Huawei website at:
http://www.huaweidevice.com/worldwide/technicaIndex.do.
ESD is a major cause for damage to sensitive electronic components. Every
service center must attach great importance to ESD protection to meet ESD
protection requirements specified in this document.

G700-U10 Smartphone
Maintenance Manual
4 Exploded View
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4
4 Exploded View
Figure 4-1 G700-U10 exploded view
The components listed in Table 4-1 are structural parts of the phone and cannot be used as
reference when requesting spare parts.
Table 4-1 Components in the exploded view
No.
PN
Description
Quantity
1
51660EGF
Battery cover
1
2
27161365
GPS antenna
1
3
27161364
Wi-Fi antenna
1
4
14240155
SIM card 2
1
5
14240155
SIM card 1
1
6
23060108
Rear camera
1

G700-U10 Smartphone
Maintenance Manual
4 Exploded View
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5
No.
PN
Description
Quantity
7
03022AFD
Proximity sensor FPC
1
8
51660EHD
Proximity sensor rubber
1
9
23060111
Front camera
1
10
22030063
Receiver
1
11
51634472
TP protective film
1
12
23070282
TP-LCD module
1
13
51660EFY
Front cover
1
14
51634474
Antenna decoration
1
15
51634473
Front camera adhesive
1
16
03010UPG
Volume key FPC
1
17
03022BEX
Speaker FPC
1
18
03022ALM
PCBA
1
19
03010UPH
Power key FPC
1
20
22020111
Speaker
1
21
51660EGB
Rear cover
1
22
27161363
Main antenna
1
23
24021243
Battery
1

G700-U10 Smartphone
Maintenance Manual
5 Components Layout
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6
5 Components Layout
5.1 PCBA
Figure 5-1 SideAof the PCBA
U1302 LCD bias
driver
Fault symptom: LCD
failure
U1801 Memory
Fault symptom:
startup failure
J902 USB connector
Fault symptom: USB device detection
failure or charging failure
Q302 triode
Fault symptom:
charging failure
Mircrophone
Fault symptom:
microphone failure
U202 PM IC
Fault symptom:
startup failure
U2403 RF multi-
functional
component
Fault symptom:
reception failure
X700 RF crystal
oscillator
Fault symptom:
startup failure
U700 TD-WCDMA
baseband processing
IC
Fault symptom:
reception failure
J901 battery
connector
Fault symptom:
startup failure
X301 32 kHz crystal
oscillator
Fault symptom:
clock failure
U401 CPU
Fault symptom:
startup failure
J1502 power key
Fault symptom:
startup failure
Shielding case
Fault symptom:
FM/Wi-
Fi/Bluetooth/GPS
failure
J1101 Headset
connector
Fault symptom:
headset failure
J1001 front camera
BTB connector
Fault symptom:
front camera failure
U1201 G-sensor
Fault symptom: G-
sensor failure
J801 proximity
sensor FPC
Fault symptom:
proximity sensor
and light sensor
failure
D801 tri-color LED
Fault symptom: LED
failure

G700-U10 Smartphone
Maintenance Manual
5 Components Layout
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Figure 5-2 Side B of the PCBA
Main antenna
connectors
Fault symptom:
reception failure
Receiver
Fault symptom:
receiver failure
J1501 TP BTB
connector
Fault symptom:
touchscreen failure
U1503 TP IC
Fault symptom:
Touchscreen
failure
Compass
Fault symptom:
compass failure
Backlight driving IC
Fault symptom:
backlight failure
J1301 LCD BTB
connector
Fault symptom: LCD
failure J802 Speaker BTB
connector
Fault symptom: motor
failure, speaker failure,
and keypad backlight
failure
J1501 side key ZIF
socket
Fault symptom:
volume key failure
J1401 SIM card contacts
Fault symptom: SIM card
detection failure
J1402 SIM card
contacts
Fault symptom: SIM
card detection failure
J1403 microSD card
holder
Fault symptom:
microSD card
detection failure
J1002 rear camera BTB
connector
Fault symptom: rear
camera failure
J
1
0
0
2
c
a
m
e

G700-U10 Smartphone
Maintenance Manual
5 Components Layout
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5.2 Proximity Sensor FPC
Figure 5-3 Proximity sensor FPC
5.3 Speaker FPC
Figure 5-4 Speaker FPC
3-in-1 sensor
Fault symptom:
proximity sensor
failure, light sensor
failure, and IR sensor
failure
Motor
Fault symptom:
motor failure

G700-U10 Smartphone
Maintenance Manual
5 Components Layout
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9
5.4 Component Lists
5.4.1 PCBA Components
Table 5-1 Components on the PCBA
No.
PN
Description
Location
Number
1
03010UXJ
PCB,WCDMA G700,HD2G700M,WCDMA
Handset Main Board-2*1
2
05021FDU
Board
Software,HD2G700MC,HD2G700MC001,G700
-U10 Handset Software,Program,Global
General,WCDMA+GSM,MT6589W+Android
4.2+EMUI+Quad-Core 1.2G+5.0-inch
screen,Load Type
U1802
3
7090800
Chip Thick Film
Resistor,0ohm,1A,50mohmMAX,0402,BT
C2307, C2309,
C3202, C3205,
C3206, R1107,
R1505, R210,
R3114, R404,
and R801
4
15020111
LED,0.05cd/0.1cd/0.18cd,B(470)R(632)G(525)n
m,20mA,SMD,Terminal Dedicated
D801
5
15040350
Constant Voltage
Diode,5.1V,0.5W,SOD123,Terminal Dedicated
D902
6
15040264
Transient Suppressing Diodes
7.0V,15V,1A,SOD882/0402,Terminal Dedicated
D1105, D904,
and D905
7
15040311
Transient Suppression
Diode,6V,12V,50W,5A,SOD923
D1103, D1104,
D1111, D1112,
D1113, D1501,
D1502, and
D1503
8
15010397
Schottky Barrier
Diode,40V,1A,0.6V,SOD1608,5A,Terminal
Dedicated
D1301
9
14240460
BTB
Connector,female,10Pin,0.4mm,0.9mm,SMT,Te
rminal Dedicated
J801 and J802
10
14240582
Card Socket,Battery connector,4PIN,Mid
Mount,Side Contact,2.50mm,With Plastic
Peg,0.50mm,Terminal Dedicated
J901
11
14240272
IO Connector,Micro_B-Female,5pin,Side
Plugging Type,SMT,Terminal Dedicated
J902
12
14240181
BTB
J1001

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Maintenance Manual
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10
No.
PN
Description
Location
Number
Connector,Female,24Pin,0.4mm,SMT,Mating
Height 1.0mm,Terminal Dedicated
13
14240579
BTB Connector,BTB
connector,34PIN,0.4mm,0.8mm,SMT,female,Te
rminal Dedicated
J1002 and J1301
14
14240663
Headphone
Connector,12.6*6.7*4.2,6pin,arc,SMT,cambered
surface 2.5mm under board,Terminal Dedicated
J1101
15
14240155
Card Socket Connector,SIM Card
Socket,6pin,Horizontal,2.54mm,Without
Lock,Without Hold Peg,Height
0.95mm,Terminal Dedicated
J1401 and J1402
16
14240303
Card Block
Connector,Micro-SD,8,PUSH-PULL,1.1mm,Det
ect PIN
J1403
17
14240151
FPC
CONNECTOR,4pin,0.5pitch,horizontal,Termina
l Dedicated
J1501
18
51621024
WN9149-N83-7F-W,Antenna Spring,U1250
J1502, J1503,
J1601, J1602,
J1616, J2302,
J2305, and J3205
19
14240226
BTB Connector,Female,50Pin,0.4mm,Mating
Height 1.0mm,SMT,Width 3.74mm After
Mating,Terminal Dedicated
J1506
20
51621023
108-5785,Ground Spring,U1250
J1614
21
51621274
DKBA8.382.0615,Main Antenna SMT
Spring,C5600
J2301, J2304,
J3202, J3203, and
J3204
22
14240004
Coaxial Connector,RF
Switch,Straight,Female,SMT,Terminal
Dedicated
J3201
23
10100150
ZD Dedicated Inductor and Bead,EMI
Bead,330ohm@100MHZ,25%,1.5A,0.08ohm,06
03,Terminal Dedicated
LB301 and
LB302
24
10100078
Terminal EMI
Bead,1000ohm,25%,0.6A,0.35ohm,0603,1000oh
m typ@1GHZ
LB1101
25
10100184
Terminal EMI
Bead,1800ohm,25%,0.2A,2.2ohm,0402,Termina
l Dedicated
LB1102,
LB1103,
LB1104, and
LB1107

G700-U10 Smartphone
Maintenance Manual
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11
No.
PN
Description
Location
Number
26
10070019
EMI
beads,+/-25%,1000ohm,1.25ohm,0.25A,0402
LB1301,
LB1302,
LB1303,
LB1304, and
LB1305
27
15020175
LED,180cd,white,350mA,2.0mm*1.6mm*0.7m
m,Terminal Dedicated
LED301
28
22050091
Microphone,-44dB.,D4*1.5mm,wideband,termin
al
MIC1101 and
MIC1102
29
15060238
MOSFET,N
Channel,20V,0.7A,530mohm,6V,SC,75
Q201 and Q901
30
15050211
Transistor,PNP,20V,2.5A,545mW,320mV,TSO
P-6,100S,Terminal Dedicated
Q302
31
12070061
Temperature Compensated
Oscillator,26MHz,+/-1.5ppm(max),+1.8V,+/-0.5
ppm(max),-40degC,85degC,Terminal Dedicated
TCXO2200
32
39200503
Terminal Baseband process IC,PMIC,Input
range:3.4-4.3V;Charger input of up to
10V,TFBGA
U201
33
39200511
Terminal Baseband process IC,WSCDMA/GSM
BASEBAND PROCESSOR
MT6589,1.2V/1.8V/2.8V/3.3V,TFBGA-515,Ter
minal Dedicated
U401
34
39110756
Switching Regulators,DC/DC
buck,2.5V~5.5V,Voadj,1.2A,DFN/QFN
U1001 and
U2001
35
38140069
Semiconductor
Sensor,E-Compass,WLCSP(Pb-free),3axis,Term
inal Dedicated
U1200
36
38140098
Semiconductor
Sensor,Accelerometer,LGA,3axis,Terminal
Dedicated
U1201
37
39110762
Switching Regulators,dual channel backlight
driver,2.7V~6.5V,30mA*2,1.2MHz,CSP-9L,Ter
minal Dedicated
U1301
38
39110636
Switching Regulators,0~5.5V
0~-7V,1%,0.08A,ThinQFN,SMT,3mm*3mm,LC
D Driver,Terminal Dedicated
U1302
39
43140187
Interface Controller,TP IC,2.85V,UFBGA60,
Terminal Dedicated
U1501
40
40020226
DDR2 DRAM,16Gb
LPDDR2,533MHz,32bit,1.8V/1.2V,134BALL
FBGA,Terminal Dedicated
U1801

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12
No.
PN
Description
Location
Number
41
40060461
NAND FLASH,8GB EMMC V4.41/V4.5,
52MHz,4096KB,3.3V/1.8V,FBGA153(Pb-free),
Terminal Dedicated
U1802
42
39210101
Terminal Baseband process
IC,WLAN-BT-GPS-FM Transmitter and
Receiver,2.3~5.5V,151pin WLCSP, Terminal
Dedicated
U2200
43
47990034
RF Impedance Converter,50:50
Balun,2300MHz~2700MHz,50:50,1.2dB
max.,0.5W,1608SMD,Terminal Dedicated
U2301
44
47090053
RF LNA,1575MHz,14dB min.,1.6dB
max.,SOT886,Terminal Dedicated
U2302
45
39200510
Terminal Baseband process
IC,WCDMA/HSDPA/HSUPA RF transceiver
MT6167,1.2V /1.8V/ 2.8V RF,HBGA-Terminal
Dedicated
U3101
46
47150274
RF Multi-Functional Component,Linear EDGE
PAM(Polar
GPRS(2Tx+6TRx),824~849MHz/880~915MHz/
1710~1785MHz/1850~1910MHz,QFN,Terminal
Dedicated
U3201
47
47100595
RF Power Amplifying
Module,1920~1980MHz,28.5dB typ. at
Pout=28.25dBm for
WCDMA,28.25dBm,QFN,Terminal Dedicated
U3301
48
13080135
Duplexer,1920~1980MHz/2110~2170MHz,1.9d
B.,2.4dB.,50dB./45dB.,2016,Terminal
Dedicated-Balance
U3302
49
47100679
RF Power Amplifying
Module,880M-915M,GAIN:28,28dBm,3*3*0.9
MM,Terminal Dedicated
U3401
50
13080176
Duplexer,880~915MHz;925~960MHz,3.9dB.,4.
7dB.,38dB.,2016,Terminal Dedicated
U3402
51
12020125
Crystal,0.032768MHz,12.5pF+/-30ppm,60/80ko
hm,3.2*1.5 SMD,Terminal
Dedicate,ELOM,TS16949
X301
52
12020268
Crystal
Oscillitor,26MHz,7.5pF,+/-10ppm,30ohm,3225,
Terminal Dedicated
X3101
53
15040393
Transient Suppression
Diode,6V,25V,0.1w,3A,400um 15pin
SMT,Terminal Dedicated
Z1401

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13
No.
PN
Description
Location
Number
54
13030067
Ceramic Filter,2450MHz,1.8dB,20125,Terminal
Dedicated
Z2301
55
13010180
SAW filter,1575.42MHz,0.9dB,1.4*1.1mm,for
terminal using only
Z2302
56
13010212
SAW
Filter,1842.5MHz,1.6dB(typ),50V,SFLT5-0101,
Terminal Dedicated
Z3501
57
13010177
SAW filter,1960MHz,2.7dB-1.4*1.1mm,for
terminal using only
Z3502
5.4.2 Proximity Sensor FPC Components
Table 5-2 Components on the proximity sensor FPC
No.
PN
Description
Location
Number
1
14240459
BTB
Connector,male,10Pin,0.4mm,0.9mm,SMT,Ter
minal Dedicated
J101
2
38140032
Semiconductor Sensor,APS/ALS/IR
Sensor,QFN8,Terminal Dedicated
U101
5.4.3 Speaker FPC Components
Table 5-3 Components on the speaker FPC
No.
PN
Description
Location
Number
1
15040311
Transient Suppression
Diode,6V,12V,50W,5A,SOD923
D101 and D102
2
15020099
LED,0.045cd,White,5mA,0603,SMD,Terminal
Dedicated
D103, D104, and
D105
3
14240459
BTB
Connector,male,10Pin,0.4mm,0.9mm,SMT,Ter
minal Dedicated
J101
4
32050032
Oscillating
Motor,SMT,2.7,75A,14000rpm,11mm*4.4mm*
3.6mm,Null,28ohm
U101
5
15040311
Transient Suppression
D101 and D102

G700-U10 Smartphone
Maintenance Manual
5 Components Layout
Issue 1.0 (2013-07-22)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
14
No.
PN
Description
Location
Number
Diode,6V,12V,50W,5A,SOD923
These component lists are for your reference only and subject to changes without notices. The
latest component lists are available in Huawei's BOM information system. If you have any
questions, contact technical support in your region.

G700-U10 Smartphone
Maintenance Manual
6 Software Upgrade
Issue 1.0 (2013-07-22)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
15
6 Software Upgrade
6.1 Upgrade Preparation
Table 6-1 Items to be prepared for upgrades
Category
Item
Remarks
Upgrade
environment
Computer
Operating system: Windows XP or Windows 7
USB cable
Batch upgrade tool
HUAWEI THMTK6515ML02Ver1003 (1312)
Micro SD card
512 MB available space or more
Battery
Ensure that the battery used for the upgrade has
sufficient power remaining.
Upgrade file
Use the latest version for the upgrade.
Upgrading
method
Batch upgrade (USB
upgrade)
HUAWEI THMTK6515ML02Ver1003 (1312)
microSD card
upgrade
microSD card upgrade is recommended.
6.2 Precautions
Check that the battery has sufficient power remaining to prevent an upgrade from being
interrupted.
Upgrading the phone will erase the user data. Back up the important data before an
upgrade.