Huawei ME909 Series Installation instructions

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Issue
V0.3
Date
2013-05-21

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HUAWEI ME909 Series LTE LGA Module
Hardware Guide
About This Document
Issue V0.3 (2013-05-21)
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3
About This Document
Revision History
Document
Version
Date
Chapter
Descriptions
V0.1
2013-01-21
Draft brief version
V0.2
2013-02-07
Draft brief version
Reserve some interfaces
Explain UART2 for debugging
Fix a mistake: Pin 27 should be reserved
V0.3
2013-05-21
This is a draft version with full content, and
some test data is still "TBD".

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Contents
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Contents
1 Introduction....................................................................................................................................7
2 Overall Description ......................................................................................................................8
2.1 About This Chapter........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram..................................................................................................................... 10
2.4 Application Block Diagram ..............................................................................................................11
3 Description of the Application Interfaces..............................................................................12
3.1 About This Chapter......................................................................................................................... 12
3.2 LGA Interface ................................................................................................................................. 12
3.3 Power Interface.............................................................................................................................. 22
3.3.1 Overview................................................................................................................................ 22
3.3.2 Power Supply VBAT Interface............................................................................................... 23
3.3.3 Output Power Supply Interface ............................................................................................. 24
3.4 Signal Control Interface.................................................................................................................. 24
3.4.1 Overview................................................................................................................................ 24
3.4.2 Power-on/off (POWER_ON_OFF) Pin .................................................................................. 25
3.4.3 RESIN_N Pins....................................................................................................................... 26
3.4.4 WAKEUP_IN Signal............................................................................................................... 28
3.4.5 WAKEUP_OUT Signal........................................................................................................... 29
3.4.6 SLEEP_STATUS Signal ........................................................................................................ 30
3.4.7 LED# Pin ............................................................................................................................... 30
3.5 UART Interface............................................................................................................................... 31
3.5.1 Overview................................................................................................................................ 31
3.5.2 Circuit Recommended for the UART Interface...................................................................... 32
3.6 USB Interface................................................................................................................................. 33
3.7 USIM Card Interface ...................................................................................................................... 34
3.7.1 Overview................................................................................................................................ 34
3.7.2 Circuit Recommended for the USIM Card Interface.............................................................. 34
3.8 Audio Interface ............................................................................................................................... 35
3.9 General Purpose I/O Interface....................................................................................................... 36
3.10 JTAG Interface ............................................................................................................................. 37
3.11 RF Antenna Interface.................................................................................................................... 38

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Hardware Guide
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3.12 Reserved Interface....................................................................................................................... 39
3.13 NC Interface................................................................................................................................. 39
3.14 Tunable Antenna Control.............................................................................................................. 39
4 RF Specifications.........................................................................................................................40
4.1 About This Chapter......................................................................................................................... 40
4.2 Operating Frequencies................................................................................................................... 40
4.3 Conducted RF Measurement......................................................................................................... 41
4.3.1 Test Environment................................................................................................................... 41
4.3.2 Test Standards....................................................................................................................... 41
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 41
4.4.1 Conducted Receive Sensitivity.............................................................................................. 41
4.4.2 Conducted Transmit Power................................................................................................... 43
4.5 Antenna Design Requirements ...................................................................................................... 44
4.5.1 Antenna Design Indicators..................................................................................................... 44
4.5.2 Interference ........................................................................................................................... 47
4.5.3 Antenna Requirements.......................................................................................................... 47
4.5.4 Radio Test Environment ........................................................................................................ 48
5 Electrical and Reliability Features...........................................................................................50
5.1 About This Chapter......................................................................................................................... 50
5.2 Absolute Ratings ............................................................................................................................ 50
5.3 Operating and Storage Temperatures and Humidity...................................................................... 51
5.4 Electrical Features of USIM ........................................................................................................... 51
5.5 Electrical Features of Application Interfaces.................................................................................. 52
5.6 Power Supply Features.................................................................................................................. 52
5.6.1 Input Power Supply ............................................................................................................... 52
5.6.2 Power Consumption.............................................................................................................. 53
5.7 Reliability Features......................................................................................................................... 58
5.8 EMC and ESD Features................................................................................................................. 59
6 Mechanical Specifications.........................................................................................................61
6.1 About This Chapter......................................................................................................................... 61
6.2 Storage Requirement..................................................................................................................... 61
6.3 Moisture Sensitivity ........................................................................................................................ 61
6.4 Dimensions and interfaces............................................................................................................. 62
6.5 Packaging....................................................................................................................................... 64
6.6 Label............................................................................................................................................... 65
6.7 Customer PCB Design................................................................................................................... 66
6.7.1 PCB Surface Finish............................................................................................................... 66
6.7.2 PCB Pad Design.................................................................................................................... 66
6.7.3 Solder Mask........................................................................................................................... 68
6.7.4 Requirements on PCB Layout............................................................................................... 68
6.8 Assembly Processes...................................................................................................................... 68

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Hardware Guide
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6.8.1 General Description of Assembly Processes ........................................................................ 68
6.8.2 Stencil Design........................................................................................................................ 68
6.8.3 Reflow Profile ........................................................................................................................ 69
6.9 Specification of Rework.................................................................................................................. 71
6.9.1 Process of Rework ................................................................................................................ 71
6.9.2 Preparations of Rework......................................................................................................... 71
6.9.3 Removing of the Module........................................................................................................ 71
6.9.4 Welding Area Treatment........................................................................................................ 72
6.9.5 Module Installation................................................................................................................. 72
6.9.6 Specifications of Rework ....................................................................................................... 73
7 Certifications................................................................................................................................74
7.1 About This Chapter......................................................................................................................... 74
7.2 Certifications................................................................................................................................... 74
8 Safety Information......................................................................................................................75
8.1 Interference .................................................................................................................................... 75
8.2 Medical Device............................................................................................................................... 75
8.3 Area with Inflammables and Explosives......................................................................................... 75
8.4 Traffic Security................................................................................................................................ 76
8.5 Airline Security................................................................................................................................ 76
8.6 Safety of Children........................................................................................................................... 76
8.7 Environment Protection.................................................................................................................. 76
8.8 WEEE Approval.............................................................................................................................. 76
8.9 RoHS Approval............................................................................................................................... 76
8.10 Laws and Regulations Observance ............................................................................................. 77
8.11 Care and Maintenance................................................................................................................. 77
8.12 Emergency Call............................................................................................................................ 77
8.13 Regulatory Information................................................................................................................. 77
8.13.1 CE Approval (European Union)........................................................................................... 77
8.13.2 FCC Statement.................................................................................................................... 78
9 Appendix A Circuit of Typical Interface................................................................................79
10 Appendix B Acronyms and Abbreviations..........................................................................80

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI ME909 Series LTE LGA module (ME909u-521, ME909u-121
and ME909u-721).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the ME909 module.
In addition, some significant hardware differences between ME909 and
MU609/MU509/ MC509 will be clearly described in the document HUAWEI LGA
Module Hardware Migration Guide.
Table 1-1 ME909 series product name.
Product name
Description
State
ME909u-521
LTE LGA Module for Europe.
Under development
ME909u-121
LTE LGA Module for North America.
In plan
ME909u-721
LTE LGA Module for Japan.
In plan

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Hardware Guide
Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the ME909 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature
Description
Physical
dimensions
Dimensions (L ×W ×H): 30 mm ×30 mm ×2.35 mm
Weight: about 5 g
Operating
Bands
(ME909u-521)
LTE: FDD Band 1, 2, 3, 5, 7, 8, 20, all bands with diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, 2, 5, 8, all bands with
diversity
GSM/GPRS/EDGE: 850/900/1800/1900 MHz
GPS/GLONASS: L1
Operating
Temperature
Normal operating temperature: –20°C to +70°C
Extended operating temperature[1]: –30°C to +75°C
Storage
Temperature
–40°C to +85°C
Moisture
RH5% to RH95%
Power Voltage
DC 3.3 V–4.2 V (typical value is 3.8 V)
AT Commands
For ME909u-521, see the HUAWEI ME909u-521 LTE LGA
Module AT Command Interface Specification.

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Hardware Guide
Overall Description
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Feature
Description
Application
Interface
(145-pin LGA
interface)
One standard USIM (Universal Subscriber Identity Module) card
(Class B and Class C)
Audio interface: PCM interface
USB 2.0 (High Speed)
Two 4-wire UARTs[2]
one 2-wire UART[3]
GPIOx5
Power on/off pin
Hardware reset pin
Sleep indicator pin (SLEEP_STATUS)
HSIC interface[4]
Tunable Antenna control (4 GPIOs)
SD interface[4]
SPI interface[4]
I2C interface[4]
JTAG
Antenna interface (Main/AUX/GPS)
ADCx2[4]
Power supply
Antenna
interface
WWAN MAIN antenna pad x1,
WWAN AUX antenna pad x1,
GPS antenna pad x1
Data Services
(ME909u-521)
GPRS: DL 85.6 kbps/UL 85.6 kbps
EDGE: DL 236.8 kbps/UL 236.8 kbps
WCDMA CS: DL 64 kbps/UL 64 kbps
WCDMA PS: DL 384 kbps/UL 384 kbps
HSPA+: DL 21.6 Mbps/UL 5.76 Mbps
DC-HSPA+: DL 43.2 Mbps/UL 5.76 Mbps
LTE FDD: DL 100 Mbps/UL 50 Mbps @20M BW cat3

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Hardware Guide
Overall Description
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[1]: When the temperature is outside of the range –20°C to +70°C , the module might slightly
deviate from 3GPP TS 45.005 and 3GPP TS 34.121-1 specifications.
[2]: Currently firmware supports one 2-wire UART only.
[3]: This is only used for debugging.
[4]: These interfaces are reserved for intelligent module in future.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the ME909 module. The major functional
units of the ME909 module contain the following parts:
Power management
Baseband controller
Multi-chip package (MCP) memory
RF Circuit
Figure 2-1 Circuit block diagram of the ME909 module

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Overall Description
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2.4 Application Block Diagram
Figure 2-2 Application block diagram of the ME909 module
UART Interface:
The module supports 3 UART interfaces. Two are 4-wire
UARTs, and the last one is 2-wire UART, which is only for
debugging.
USB Interface:
The USB interface supports USB 2.0 high speed standard.
USIM Interface:
The USIM interface provides the interface for a USIM card.
External Power
Supply:
DC 3.8 V is recommended.
Audio Interface:
The module supports one PCM interface. This function is
under development.
RF Pad:
RF antenna interface.
Tunable ANT
CTRL:
Since LTE bands cover wide frequency, tunable ANT CTRL
helps customer for tunable antenna design. This function is
under development.
ADC:
Reserved for intelligent module in future.
SPI Interface:
Reserved for intelligent module in future.
SDIO Interface:
Reserved for intelligent module in future.
HSIC Interface:
Reserved for intelligent module in future.
I2C Interface:
Reserved for intelligent module in future.

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Hardware Guide
Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the ME909
module, including:
LGA Interface
Power Interface
Signal Control Interface
UART Interface
USB Interface
USIM Card Interface
Audio Interface
General Purpose I/O Interface
JTAG Interface
RF Antenna Interface
Reserved Interface
NC Interface
Tunable Antenna Control
3.2 LGA Interface
The ME909 module uses a 145-pin LGAas its external interface. For details about the
module and dimensions, see "6.4 Dimensions and interfaces".

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Description of the Application Interfaces
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Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the ME909
module.
Figure 3-1 Sequence of LGAinterface (Top view)
Figure 3-2 shows the appearance of ME909 series module. One is top view, and the
other is bottom view.
JTAG pads Reserved pads
GND padsPower pads Control pads
UART pads USB pads
RF ANT pads
GPIO pads
SIM pads Audio pads
1
2
3
4
5
6
7
8
9
10
11
12
13
14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
30
31
32
33
34
35
36
37
38
39
40
41
42
43444546
101116 114 113 112 110 107
111 109 108 106 105 104 103 102
5254555657
59
60
61
62
63
64
65
66
67
68
69
70
71
72 73 74 75 76 77 78 79 80 81 82 83 84 85 86
88
89
90
93
94
95
97
98
99
96
92
91
87
58 53 51 50 49 48 47
100
117
118 119
120
125
124
123
122
121
126 127 128 129
130
131
132
133
140 141
142
143144
145
139
138
137
136 135 134
115
Tunable Antenna
NC

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Description of the Application Interfaces
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Figure 3-2 Appearance of ME909 series module (without label)
Table 3-1 shows the definitions of pins on the 145-pin signal interface of the ME909
module.
Table 3-1 Definitions of pins on the LGAinterface
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
1
UART1_TX
-
O
UART1 transmit output
–0.3
1.8
2.1
2
UART1_RTS
-
O
UART1 Ready for
receive
–0.3
1.8
2.1
3
UART1_CTS
-
I
UART1 Clear to Send
–0.3
1.8
2.1
4
UART1_RX
-
I
UART1 receive data
input
–0.3
1.8
2.1
5
PCM_SYNC
-
O
PCM interface sync
–0.3
1.8
2.1
6
PCM_DIN
-
I
PCM interface data in
–0.3
1.8
2.1
7
PCM_DOUT
-
O
PCM interface data out
–0.3
1.8
2.1
8
PCM_CLK
-
O
PCM interface clock
–0.3
1.8
2.1
9
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
10
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
11
WAKEUP_IN
-
I
Host to set the module
into sleep or wake up
the module from sleep.
–0.3
1.8
2.1
12
VBAT
-
P
Power supply input
3.3
3.8
4.2
13
VBAT
-
P
Power supply input
3.3
3.8
4.2

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Description of the Application Interfaces
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PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
14
PS_HOLD
-
I
Power supply hold
signal to PMU, used for
JTAG
–0.3
1.8
2.1
15
SLEEP_STATUS
-
O
Indicates sleep status of
ME909
–0.3
1.8
2.1
16
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
17
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
18
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
19
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
20
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
21
ANT_TUNE0
-
O
Tunable antenna control
signal, bit 0
–0.3
1.8
2.1
22
ANT_TUNE1
-
O
Tunable antenna control
signal, bit 1
–0.3
1.8
2.1
23
ANT_TUNE2
-
O
Tunable antenna control
signal, bit 2
–0.3
1.8
2.1
24
ANT_TUNE3
-
O
Tunable antenna control
signal, bit 3
–0.3
1.8
2.1
25
NC
-
-
Not connected, please
keep this pin open
-
-
-
26
NC
-
-
Not connected, please
keep this pin open
-
-
-
27
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
28
UART2_TX
-
O
UART2 transmit output
–0.3
1.8
2.1
29
UART2_RX
-
I
UART2 receive data
input
–0.3
1.8
2.1
30
JTAG_TMS
-
I
JTAG test mode select
–0.3
1.8
2.1
31
NC
-
-
Not connected, please
keep this pin open
-
-
-
32
VCC_EXT1
-
P
1.8 V POWER output
1.75
1.8
1.85

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PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
33
NC
-
-
Not connected, please
keep this pin open
-
-
-
34
SIM_VCC
-
P
Output power supply for
USIM card
-
1.8/2.85
-
35
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
36
JTAG_TRST_N
-
I
JTAG reset
–0.3
1.8
2.1
37
NC
-
-
Not connected, please
keep this pin open
-
-
-
38
NC
-
-
Not connected, please
keep this pin open
-
-
-
39
NC
-
-
Not connected, please
keep this pin open
-
-
-
40
NC
-
-
Not connected, please
keep this pin open
-
-
-
41
NC
-
-
Not connected, please
keep this pin open
-
-
-
42
JTAG_TCK
-
I
JTAG clock input
–0.3
1.8
2.1
43
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
44
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
45
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
46
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
47
JTAG_SRST_N
-
I
JTAG reset for
debugging
–0.3
1.8
2.1
48
GND
-
-
Ground
-
-
-
49
GND
-
-
Ground
-
-
-
50
GND
-
-
Ground
-
-
-
51
GPIO
-
I/O
General I/O pins. The
function of these pins
has not been defined
–0.3
1.8
2.1
52
GND
-
-
Ground
-
-
-
53
GND
-
-
Ground
-
-
-

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PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
54
GND
-
-
Ground
-
-
-
55
GPIO
-
I/O
General I/O pins. The
function of these pins
has not been defined
–0.3
1.8
2.1
56
GND
-
-
Ground
-
-
-
57
GND
-
-
Ground
-
-
-
58
GND
-
-
Ground
-
-
-
59
GND
-
-
Ground
-
-
-
60
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
61
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
62
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
63
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
64
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
65
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
66
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
67
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
68
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
69
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
70
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
71
WAKEUP_OUT
-
O
Module to wake up the
host
–0.3
1.8
2.1
72
JTAG_TDO
-
O
JTAG test data output
–0.3
1.8
2.1
73
Reserved
-
-
Reserved, must keep
this pin open
-
-
-

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue V0.3 (2013-05-21)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
18
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
74
UART0_RTS
-
O
UART0 Ready for
receive
–0.3
1.8
2.1
75
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
76
UART0_TX
-
O
UART0 transmit output
–0.3
1.8
2.1
77
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
78
UART0_RX
-
I
UART0 receive data
input
–0.3
1.8
2.1
79
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
80
UART0_CTS
-
I
UART0 Clear to Send
–0.3
1.8
2.1
81
POWER_ON_OFF
-
I
System power-on or
power-off
-
Pulled up
on
module
-
82
NC
-
-
Not connected, please
keep this pin open
-
-
-
83
NC
-
-
Not connected, please
keep this pin open
-
-
-
84
NC
-
-
Not connected, please
keep this pin open
-
-
-
85
USB_DM
-
I/O
USB Data- defined in the
USB 2.0 Specification
-
-
-
86
USB_DP
-
I/O
USB Data+ defined in
the USB 2.0
Specification
-
-
-
87
JTAG_TDI
-
I
JTAG test data input
–0.3
1.8
2.1
88
SIM_RESET
-
O
SIM reset
-
1.8/2.85
-
89
SIM_DATA
-
I/O
SIM data
-
1.8/2.85
-
90
SIM_CLK
-
O
SIM clock
-
1.8/2.85
-
91
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
92
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
93
JTAG_RTCK
-
O
JTAG return clock
–0.3
1.8
2.1

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue V0.3 (2013-05-21)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
19
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
94
NC
-
-
Not connected, please
keep this pin open
-
-
-
95
NC
-
-
Not connected, please
keep this pin open
-
-
-
96
NC
-
-
Not connected, please
keep this pin open
-
-
-
97
NC
-
-
Not connected, please
keep this pin open
-
-
-
98
NC
-
-
Not connected, please
keep this pin open
-
-
-
99
NC
-
-
Not connected, please
keep this pin open
-
-
-
100
RESIN_N
-
I
Reset module, this pin is
pulled up on module
–0.3
1.8
2.1
101
LED_MODE
-
O
Mode indicator
Current sink
Drive strength: 10 mA
-
-
-
102
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
103
NC
-
-
Not connected, please
keep this pin open
-
-
-
104
Reserved
-
-
Reserved, must keep
this pin open
-
-
-
105
GPIO
-
I/O
General I/O pins. The
function of these pins
has not been defined.
–0.3
1.8
2.1
106
GND
-
-
Ground
-
-
-
107
MAIN_ANT
-
-
RF main antenna pad
-
-
-
108
GND
-
-
Ground
-
-
-
109
GPIO
-
I/O
General I/O pins. The
function of these pins
has not been defined
–0.3
1.8
2.1
110
GND
-
-
Ground
-
-
-
111
GPS_ANT
-
-
GPS antenna pad
-
-
-
112
GND
-
-
Ground
-
-
-

HUAWEI ME909 Series LTE LGA Module
Hardware Guide
Description of the Application Interfaces
Issue V0.3 (2013-05-21)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
20
PIN
No.
Pin Name
I/O
Description
DC Characteristics (V)
Normal
MUX
Min.
Typ.
Max.
113
GPIO
-
I/O
General I/O pins. The
function of these pins
has not been defined
–0.3
1.8
2.1
114
GND
-
-
Ground
-
-
-
115
AUX_ANT
-
-
RF aux antenna pad
-
-
-
116
GND
-
-
Ground
-
-
-
117
NC
-
-
Not connected, please
keep this pin open
-
-
-
118
NC
-
-
Not connected, please
keep this pin open
-
-
-
119
NC
-
-
Not connected, please
keep this pin open
-
-
-
120
NC
-
-
Not connected, please
keep this pin open
-
-
-
121
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
122
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
123
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
124
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
125
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
126
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
127
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-
128
GND
-
-
Thermal Ground Pad,
this pad need thermal
via
-
-
-