Huawei MU709s-2 Installation instructions

HUAWEI MU709s-2 HSPA+ Mini PCIe Module
Hardware Guide
Issue 02
Date 2014-09-18

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HUAWEI MU709s-2 HSPA+ Mini PCIe Module
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About This Document
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About This Document
Revision History
Document
Version
Date Chapter Descriptions
01 2014-09-15 Creation
02 2014-09-18 3.3.2 Updated section 3.3.2: Reset the Module

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Contents
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Contents
1 Introduction....................................................................................................................................6
2 Overall Description ......................................................................................................................7
2.1 About This Chapter........................................................................................................................... 7
2.2 Function Overview............................................................................................................................ 7
2.3 Circuit Block Diagram....................................................................................................................... 8
3 Description of the Application Interfaces................................................................................9
3.1 About This Chapter........................................................................................................................... 9
3.2 Mini PCIe Interface........................................................................................................................... 9
3.3 Power Sources and Grounds......................................................................................................... 13
3.3.1 Power Supply Time Sequence .............................................................................................. 14
3.3.2 Reset the Module .................................................................................................................. 14
3.4 WAKE# Signal................................................................................................................................ 14
3.5 LED_WWAN# Signal...................................................................................................................... 15
3.6 USB Interface................................................................................................................................. 16
3.7 USIM Card Interface ...................................................................................................................... 17
3.7.1 Overview................................................................................................................................ 17
3.7.2 Circuit Recommended for the USIM Card Interface.............................................................. 17
3.8 Audio Interface ............................................................................................................................... 18
3.9 NC Pins .......................................................................................................................................... 20
4 RF Specifications.........................................................................................................................21
4.1 About This Chapter......................................................................................................................... 21
4.2 Operating Frequencies................................................................................................................... 21
4.3 Conducted RF Measurement......................................................................................................... 22
4.3.1 Test Environment................................................................................................................... 22
4.3.2 Test Standards....................................................................................................................... 22
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 22
4.4.1 Conducted Receive Sensitivity.............................................................................................. 22
4.4.2 Conducted Transmit Power................................................................................................... 23
4.5 Antenna Design Requirements ...................................................................................................... 23
4.5.1 Antenna Design Indicators..................................................................................................... 23
4.5.2 Interference ........................................................................................................................... 26
4.5.3 GSM/WCDMAAntenna Requirements.................................................................................. 26

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5 Electrical and Reliability Features ...........................................................................................28
5.1 About This Chapter......................................................................................................................... 28
5.2 Absolute Ratings ............................................................................................................................ 28
5.3 Operating and Storage Temperatures............................................................................................ 29
5.4 Power Supply Features.................................................................................................................. 29
5.4.1 Input Power Supply ............................................................................................................... 29
5.4.2 Power Consumption.............................................................................................................. 30
5.5 Reliability Features......................................................................................................................... 33
5.6 EMC and ESD Features................................................................................................................. 37
6 Mechanical Specifications.........................................................................................................39
6.1 About This Chapter......................................................................................................................... 39
6.2 Dimensions and Interfaces............................................................................................................. 39
6.3 Dimensions of the Mini PCI Express Connector............................................................................ 40
6.4 Specification Selection for Fasteners............................................................................................. 41
6.4.1 Installing the Mini PCIe Adapter on the Main Board.............................................................. 41
6.4.2 Romoving the Mini PCIe Adapter from the Main Board ........................................................ 43
6.5 Label............................................................................................................................................... 44
6.6 Antenna Plug.................................................................................................................................. 45
6.7 Thermal Design Guide ................................................................................................................... 46
7 Certifications................................................................................................................................48
7.1 About This Chapter......................................................................................................................... 48
7.2 Certifications................................................................................................................................... 48
8 Safety Information......................................................................................................................49
8.1 Interference .................................................................................................................................... 49
8.2 Medical Device............................................................................................................................... 49
8.3 Area with Inflammables and Explosives......................................................................................... 49
8.4 Traffic Security................................................................................................................................ 50
8.5 Airline Security................................................................................................................................ 50
8.6 Safety of Children........................................................................................................................... 50
8.7 Environment Protection.................................................................................................................. 50
8.8 WEEE Approval.............................................................................................................................. 50
8.9 RoHS Approval............................................................................................................................... 50
8.10 Laws and Regulations Observance ............................................................................................. 51
8.11 Care and Maintenance................................................................................................................. 51
8.12 Emergency Call............................................................................................................................ 51
8.13 Regulatory Information................................................................................................................. 51
8.13.1 CE Approval (European Union)........................................................................................... 51
8.13.2 FCC Statement.................................................................................................................... 52
9 Appendix A Circuit of Typical Interface................................................................................53
10 Appendix B Acronyms and Abbreviations..........................................................................54

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Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by HUAWEI MU709s-2 Mini PCIe Module (hereinafter referred to as the
MU709s-2 Mini PCIe module).
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the MU709s-2 Mini PCIe module.

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Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the MU709s-2 Mini PCIe module and
provides:
Function Overview
Circuit Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature Description
Physical
Dimensions Dimensions (L × W × H): 51 mm × 30.4 mm × 3.27 mm
Weight: about 12 g
Operating
Bands WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 8, all bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
Operating
Temperature Normal operating temperature: –40°C to +70°C
Storage
Temperature –40°C to +85°C
Power
Voltage DC 3.0 V–3.6 V (typical value is 3.3 V)
Application
Interface
(52-pin Mini
PCIe interface
One standard USIMcard (Class B and Class C)
Audio interface: PCM interface
USB 2.0 (High Speed)
WAKE#: Wake up signal

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Feature Description
LED_WWAN#: Active-low LED signal indicating the state of the
module
Antenna
connector WWAN MAIN antenna connector x1
WWAN AUX antenna connector x1
Data Services GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU709s-2 Mini PCIe Adapter. The
major functional unit of the Mini PCIe Adapter contains the following parts:
Power supply circuit
LGA Module
Control signals
Antenna Connectors
Figure 2-1 Circuit block diagram of the MU709s-2 Mini PCIe module

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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU709s-2
Mini PCIe module, including:
Mini PCIe Interface
Power Sources and Grounds
WAKE# Signal
LED_WWAN# Signal
USB Interface
USIM Card Interface
Audio Interface
NC Pins
3.2 Mini PCIe Interface
The MU709s-2 module uses a Mini PCIe interface as its external interface. For details
about the module and dimensions, see Dimensions and Interfaces.

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Figure 3-1 shows the sequence of pins on the interface of the Mini PCIe Adapter.
Figure 3-1 Sequence of Mini PCIe interface
Table 3-1 shows the pin definitions of the Mini PCIe Interface.
Table 3-1 Pin definitions of the Mini PCIe Interface
Pin
No.
Pin Name Pad
Type
Description Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
1 WAKE# WAKE# O Open collector
active low signal.
This signal is
used to wake up
the host.
- –0.3 - 0.45
2 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. - 3.0 3.3 3.6
3 COEX1 NC - Not connected - - - -
4 GND GND - Ground - - - -
5 COEX2 NC - Not connected - - - -
6 1.5 V NC - Not connected - - - -

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Pin
No.
Pin Name Pad
Type
Description Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
7 CLKREQ# NC - Not connected - - - -
8 UIM_PWR USIM_PWR PO Power source for
the external
USIM card
Class C –0.3 1.8 1.98
Class B –0.3 3.0 3.3
9 GND GND - Ground - - - -
10 UIM_DATA USIM_DATA I/O External USIM
data signal - - 1.8/3
.0 -
11 REFCLK- NC - Not connected - - - -
12 UIM_CLK USIM_CLK O External USIM
clock signal - - 1.8/3
.0 -
13 REFCLK+ NC - Not connected - - - -
14 UIM_RESET USIM_RESET O External USIM
reset signal - - 1.8/3
.0 -
15 GND GND - Ground - - - -
16 UIM_Vpp NC - Not connected - - - -
17 Reserved NC - Not connected - - - -
18 GND GND - Ground - - - -
19 Reserved NC - Not connected - - - -
20 W_DISABL
E# NC - Not connected - - - -
21 GND GND - Ground - - - -
22 PERST# NC - Not connected - - - -
23 PERn0 NC - Not connected - - - -
24 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. - 3.0 3.3 3.6
25 PERp0 NC - Not connected - - - -
26 GND GND - Ground - - - -
27 GND GND - Ground - - - -
28 1.5 V NC - Not connected - - - -
29 GND GND - Ground - - - -
30 SMB_CLK NC - Not connected - - - -

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Pin
No.
Pin Name Pad
Type
Description Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
31 PETn0 NC - Not connected - - - -
32 SMB_DATA NC - Not connected - - - -
33 PETp0 NC - Not connected - - - -
34 GND GND - Ground - - - -
35 GND GND - Ground - - - -
36 USB_D- USB_DM I/O USB signal D- - - - -
37 GND GND - Ground - - - -
38 USB_D+ USB_DP I/O USB signal D+ - - - -
39 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. - 3.0 3.3 3.6
40 GND GND - Ground - - - -
41 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. - 3.0 3.3 3.6
42 LED_WWA
N# LED_WWAN# O Active-low LED
signal indicating
the state of the
card.
VOL –0.3 - 0.45
43 GND GND - Ground - - - -
44 LED_WLAN
# NC - Not connected - - - -
45 Reserved PCM_CLK O PCM interface
clock VOL –0.3 0 0.45
VOH 1.35 1.8 2.1
46 LED_WPAN
# NC - Not connected - - - -
47 Reserved PCM_DOUT O PCM I/F data
output VOL –0.3 0 0.45
VOH 1.35 1.8 2.1
48 1.5 V NC - Not connected - - - -
49 Reserved PCM_DIN I PCM I/F data
input VIL –0.3 0 0.63
VIH 1.17 1.8 2.1
50 GND GND - Ground - - - -
51 Reserved PCM_SYNC O PCM interface VOL –0.3 0 0.45

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Pin
No.
Pin Name Pad
Type
Description Parameter
Min.
(V)
Typ.
(V)
Max.
(V)
Mini PCI
Express
Standard
Description
HUAWEI Pin
Description
sync
VOH 1.35 1.8 2.1
52 3.3Vaux VCC_3V3 PI 3.3 V DC supply
input. - 3.0 3.3 3.6
Pindicates power pins; Iindicates pins for digital signal input; Oindicates pins for digital
signal output. PO indicates power output pins; PI indicates power input pins.
VIL indicates Low-level Input voltage; VIH indicates High-level Input voltage; VOL indicates
Low-level Output voltage; VOH indicates High-level Output voltage.
The NC (Not Connected) pins are floating and there are no signal connected to these pins.
Therefore, these pins should not be used.
3.3 Power Sources and Grounds
The PCIe Mini Card provides two power sources: one is 3.3Vaux (+3.3Vaux) and the
other is 1.5 V (+1.5 V). For the PCIe Adapter, however, +3.3Vaux is the only voltage
supply that is available. The input voltage is 3.3 V±9%, as specified by PCI Express
Mini CEM Specifications 2.0.
Table 3-2 Power and ground specifications
Pin Name Pin No. Min.(V) Typ .(V) Max.(V)
VCC_3V3 2, 24, 39, 41 and 52 3.0 3.3 3.6
GND 4, 9, 15, 18, 21, 26, 27, 29,
34, 35, 37, 40, 43, and 50 -
To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors
of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.

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3.3.1 Power Supply Time Sequence
Power on Sequence
Figure 3-2 Power on timing sequence
Parameter Remarks Time (Nominal value) Unit
TPD+ Power Valid to USB D+ high 7.0 s
Power off Sequence
Cutting off the VCC_3V3 power supply will power off the module.
3.3.2 Reset the Module
MU709s-2 Mini PCIe module does not support hardware reset, you can send the AT
command to reset the module.
For the details about the AT command, please refer to the HUAWEI MU709 Series HSPA+ LGA
Module AT Command Interface Specification.
3.4 WAKE# Signal
WAKE# pin (signal that the module uses to wake up the host) supports software
control.
This signal is used for module to wake up the host. It is designed as an OC (Open
Collector) gate, so it should be pulled up by the host and it is active-low.
When the module wakes up the host, the WAKE# pin will output low-level-voltage for
1s to wake up the host.

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Figure 3-3 Connections of the WAKE# pin
3.5 LED_WWAN# Signal
MU709s-2 Mini PCIe provides a LED_WWAN# signal to indicate the work status.
Table 3-3 State of the LED_WWAN# pin
No. Operating Status LED_WWAN#
1 No service or Restricted service Outputs: low (0.1s)-high (0.1s)-low
(0.1s)-high (1.7s)
2s cycle
2 Register to the network Outputs: low (0.1s)-high (1.9s)
2s cycle
3 Dial-up successfully Outputs: low
External Circuits
Figure 3-4 shows the recommended circuits of the LED_WWAN# pin. According to
LED feature, you can adjust the LED brightness by adjusting the resistance of resistor
R.

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Figure 3-4 Driving circuit
3.6 USB Interface
The MU709s-2 Mini PCIe module is compliant with USB 2.0 protocol. The USB
interface is powered directly from the VBAT supply. The USB input/output lines are
compatible with the USB 2.0 signal specifications. Figure 3-5 shows the circuit of the
USB interface.
Table 3-4 Definition of the USB interface
Pin
No.
Pin Name Pad Type Description Parameter Min.
(V)
Typ.
(V)
Max.
(V)
36 USB_DM I/O USB signal D- - - - -
38 USB_DP I/O USB signal D+ - - - -
According to USB protocol, for bus timing or electrical characteristics of MU709s-2
Mini PCIe USB signal, please refer to the chapter 7.3.2 of Universal Serial Bus
Specification 2.0.

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Figure 3-5 Recommended circuit of USB interface
3.7 USIM Card Interface
3.7.1 Overview
The MU709s-2 Mini PCIe module provides a USIM card interface complying with the
ISO 7816-3 standard and supports both Class B and Class C USIM cards.
Table 3-5 USIM card interface signals
Pin
No.
Pin Name Pad
Type
Description Parameter Min.
(V) Typ.(V) Max. (V)
14 USIM_RESET O External USIM reset signal - - 1.8/3.0 -
12 USIM_CLK O External USIM clock signal - - 1.8/3.0 -
10 USIM_DATA I/O External USIM data signal - - 1.8/3.0 -
8 USIM_PWR PO Power source for the
external USIM card Class C –0.3 1.8 1.98
Class B –0.3 3.0 3.3
3.7.2 Circuit Recommended for the USIM Card Interface
As the Mini PCIe Adapter is not equipped with a USIM socket, you need to place a
USIM socket on the user interface board.
Figure 3-6 shows the circuit of the USIM card interface.

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Figure 3-6 Circuit of the USIM card interface
To meet the requirements of 3GPP TS 51.010-1 protocols and electromagnetic
compatibility (EMC) authentication, the USIM socket should be placed near the
PCIe interface (it is recommended that the PCB circuit connects the PCIe interface
and the USIM socket does not exceed 100 mm), because a long circuit may lead to
wave distortion, thus affecting signal quality.
It is recommended that you wrap the area adjacent to the USIM_CLK and
USIM_DATA signal wires with ground. The Ground pin of the USIM socket and the
Ground pin of the USIM card must be well connected to the power Ground pin
supplying power to the PCIe Adapter.
A 100 nF capacitor and1 μF capacitor are placed between the USIM_PWR and
Ground pins in a parallel manner (If USIM_PWR circuit is too long, that the larger
capacitance such as 4.7 μF can be employed if necessary). Three 33 pF
capacitors are placed between the USIM_DATA and Ground pins, the
USIM_RESET and Ground pins, and the USIM_CLK and Ground pins in parallel to
filter interference from RF signals.
It is recommended to take electrostatic discharge (ESD) protection measures near
the USIM card socket. The TVS diode with Vrwm of 5 V and junction capacitance
less than 10 pF must be placed as close as possible to the USIM socket, and the
Ground pin of the ESD protection component is well connected to the power
Ground pin that supplies power to the PCIe Adapter.
3.8 Audio Interface
The MU709s-2 Mini PCIe module provides one PCM digital audio interface. Table 3-6
lists the signals on the digital audio interface.

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Table 3-6 Signals on the digital audio interface
Pin
No.
Pin Name Pad
Type
Description Parameter Min.(V) Typ.(V) Max.(V)
45 PCM_CLK O PCM clock VOL –0.3 0 0.45
VOH 1.35 1.8 2.1
47 PCM_DOUT O PCM I/F data output VOL –0.3 0 0.45
VOH 1.35 1.8 2.1
49 PCM_DIN I PCM I/F data input VIL –0.3 0 0.63
VIH 1.17 1.8 2.1
51 PCM_SYNC O PCM interface sync VOL –0.3 0 0.45
VOH 1.35 1.8 2.1
The MU709s-2 Mini PCIe module interface enables communication with an external
codec to support linear format.
Figure 3-7 Circuit diagram of the interface of the PCM (MU709s-2 Mini PCIe module is
used as PCM master)
PCM_SYNC: Output when PCM is in master mode;
PCM_CLK: Output when PCM is in master mode;
The PCM function of MU709s-2 Mini PCIe only supports master mode;
It is recommended that a TVS be used on the related interface, to prevent electrostatic
discharge and protect integrated circuit (IC) components.

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3.9 NC Pins
The MU709s-2 Mini PCIe module has some NC pins. All of NC pins should not be
connected. Please keep these pins open.
Table 3-7 NC pins
Pin No. Pin Name Pad Type Description
3, 5–7, 11, 13, 16, 17, 19, 22,
23, 25, 28, 30–33, 44, 46 and
48
NC - Not connected,
please keep open.