Huawei MG323 Installation instructions

HUAWEI MG323 GSM M2M Module
Hardware Guide
Issue
04
Date
2011-08-22

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HUAWEI MG323 GSM M2M Module
Hardware Guide
About This Document
Issue 04 (2011-08-22)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
3
About This Document
History
Version
Date
Chapter
Descriptions
01
Creation
02
2010-10-25
1
Deleted “1.2 Related Documents”
3.1
Deleted “Charging Interface (TBD)”
3.6.1
Revised “Table 3-5 UART1 interface signals”
3.8
Deleted “Charging Interface (TBD)”
Added “Audio Interface”
7
Revised “Figure 7-1 Circuits of typical
interfaces in the MG323 module”
03
2011-07-18
2.2
Add authentication information-CCC、GCF
and mode of audio services
3.5.2
Add the maximum time of TERM_ON
3.6
Add signal of the RING while receiving a
message and a voice call
5.2
Revised “Table 5-1 Extreme working
conditions for the MG323 module”
5.4
Revised “Table 5-3 Sequence numbers of
pins and definitions of signals on the B2B
interface”and “Table 5-4 Electrical features
of application interfaces”
5.5.2
Revised “Table 5-6 Working current of the
MG323 module”
6.3
Specify the mode of the 50-pin B2B
connector
04
2011-08-22
3.2
Revised “Figure 3-1 Sequence and
definitions of pins on the B2B signal
interface”
6.4
Revised “Figure 6-5 Structure fixing hole”

HUAWEI MG323 GSM M2M Module
Hardware Guide
Contents
Issue 04 (2011-08-22)
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4
Contents
1 Introduction....................................................................................................................................6
1.1 Overview .......................................................................................................................................... 6
2 Overall Description ......................................................................................................................7
2.1 About This Chapter........................................................................................................................... 7
2.2 Function Overview ........................................................................................................................... 7
2.3 Application Block Diagram ............................................................................................................... 9
2.4 Circuit Block Diagram....................................................................................................................... 9
3 Description of the Application Interfaces..............................................................................11
3.1 About This Chapter..........................................................................................................................11
3.2 B2B Connector Interface.................................................................................................................11
3.3 Power Interface.............................................................................................................................. 13
3.3.1 Overview................................................................................................................................ 13
3.3.2 VBAT Interface....................................................................................................................... 13
3.3.3 VCOIN Interface.................................................................................................................... 14
3.3.4 VIO Interface ......................................................................................................................... 14
3.4 Power-On and Power-Off Time Sequence..................................................................................... 15
3.4.1 Overview................................................................................................................................ 15
3.4.2 Power-On Time Sequence.................................................................................................... 15
3.4.3 Power-Off Time Sequence .................................................................................................... 16
3.4.4 RESET................................................................................................................................... 16
3.5 Signal Control Interface.................................................................................................................. 17
3.5.1 Overview................................................................................................................................ 17
3.5.2 Input Signal Control Pins....................................................................................................... 17
3.5.3 Output Signal Control Pin...................................................................................................... 18
3.6 UART Interface............................................................................................................................... 19
3.6.1 Overview................................................................................................................................ 19
3.6.2 Circuit Recommended for the UART Interface...................................................................... 20
3.7 SIM Card Interface......................................................................................................................... 22
3.7.1 Overview................................................................................................................................ 22
3.7.2 Circuit Recommended for the SIM Card Interface................................................................ 22
3.7.3 ESD Protection for the SIM Card Interface........................................................................... 23
3.8 Audio Interface ............................................................................................................................... 24

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Hardware Guide
Contents
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3.8.1 Overview................................................................................................................................ 24
3.8.2 Speaker Interface .................................................................................................................. 24
3.8.3 Microphone Interface............................................................................................................. 25
4 Antenna Interface........................................................................................................................27
4.1 About This Chapter......................................................................................................................... 27
4.2 Antenna Installation........................................................................................................................ 27
4.3 Coaxial Cable and RF Connector .................................................................................................. 28
4.4 ESD Protection for theAntenna Interface...................................................................................... 30
4.5 RF Specifications of the Antenna Interface.................................................................................... 30
4.6 Specifications of the Antenna Interface.......................................................................................... 32
5 Electrical and Reliability Features...........................................................................................33
5.1 About This Chapter......................................................................................................................... 33
5.2 Extreme Working Conditions.......................................................................................................... 33
5.3 Working and Storage Temperatures and Humidity ........................................................................ 34
5.4 Electrical Criteria ofApplication Interfaces..................................................................................... 34
5.5 Power Supply Features.................................................................................................................. 38
5.5.1 Input Power Supply ............................................................................................................... 38
5.5.2 Working Current .................................................................................................................... 38
5.6 Reliability Features......................................................................................................................... 39
5.7 ESD Features................................................................................................................................. 41
6 Structure........................................................................................................................................42
6.1 Overview ........................................................................................................................................ 42
6.2 Dimensions..................................................................................................................................... 42
6.3 Dimensions of the B2B Connector................................................................................................. 44
6.4 MG323 Module Installation Description ......................................................................................... 45
6.5 Specification Selection for Fasteners............................................................................................. 47
7 Appendix A Circuits of Typical Interfaces ............................................................................49
8 Appendix B Acronyms and Abbreviations............................................................................50

HUAWEI MG323 GSM M2M Module
Hardware Guide
Introduction
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1 Introduction
1.1 Overview
This document describes the hardware application interfaces and air interfaces that
are provided when the Huawei MG323 GSM M2M module (hereinafter referred to as
the MG323 module) is used.
This document helps you to understand the interface specifications, electrical
features, and related product information of the MG323 module.

HUAWEI MG323 GSM M2M Module
Hardware Guide
Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the MG323 module and provides:
Function Overview
Application Block Diagram
Circuit Block Diagram
2.2 Function Overview
Table 2-1 Feature
Feature
Description
Working bands
Four supported frequency bands: GSM850 MHz/900 MHz/1800
MHz/1900 MHz
Maximum
transmission
power
GSM850 Class 4 (2 W)
EGSM900 Class 4 (2 W)
GSM1800 Class 1 (1 W)
GSM1900 Class 1 (1 W)
Receiver
sensitivity
< –107 dBm
Working
temperature
Normal working temperature: –20°C to + 70°C
Extreme working temperatures: –30°C to –20°C and + 70°C to
+ 75°C
Ambient
temperature for
storage
–40°C to 85°C
Power voltage
3.3 V to 4.8 V (3.8 V is recommended.)

HUAWEI MG323 GSM M2M Module
Hardware Guide
Overall Description
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Feature
Description
Power
consumption
(current)
Power-off current: 47 µA
Average
standby current
DRX = 2
< 3.0 mA
DRX = 5
< 2.5 mA
DRX = 9
< 2.0 mA
GPRS Class 10 (maximum): 460 mA
Protocols
GSM/GPRS Phase2/2+
AT commands
See the HUAWEI MG323 GSM M2M Module AT Command
Interface Specification.
Application
interface (50-
pin B2B
connector)
UART1 (supporting 8-wire UART)
One standard Subscriber Identity Module (SIM) card interface (3
V or 1.8 V)
Interfaces for two analog audio channels
Power Interface
Network status light-emitting diode (LED) control interface
Antenna
interface
Hirose U.FL-R-SMT-1(80) 50 ohm antenna connector
Antenna pad
Voice services
Two analog voice channels
SMS
New message alert, text message receiving, and text message
sending
Management of text messages: read messages, delete
messages, storage status, and message list
Support for the protocol data unit (PDU) mode
GPRS
GPRS CLASS 10
Encoding schemes: CS 1, CS 2, CS 3, and CS 4
Maximum downlink transmission rate: 85.6 kbps
Maximum uplink transmission rate: 42.8 kbps
Packet Broadcast Control Channel (PBCCH)
Embedded with TCP/IP protocols, supporting multiple links
Circuit
Switched Data
(CSD) data
services
CSD data services at the maximum rate of 9.6 kbit/s
Physical
features
Dimensions (L ×W ×H): 35 mm ×32.5 mm ×3.05 mm
Weight: 5.8 g

HUAWEI MG323 GSM M2M Module
Hardware Guide
Overall Description
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Feature
Description
Certification
information
Restriction of the use of certain Hazardous Substances (RoHS),
European Conformity (CE), Federal Communications
Commission (FCC), CMIIT, China Compulsory Certification
(CCC), GCF (GSM Certification Forum)
2.3 Application Block Diagram
Figure 2-1 shows the application block diagram of the MG323 module.
Figure 2-1 Application block diagram of the MG323 module
Antenna
interface MG323 GSM module
Application interfaces
Charge
UART SIM Analog
voice Power RTC
power Status
LED Power-on/
Power-off Restart
SIM
card
UART Handset or
earphone
Charging
circuit
On/Off Reset
2.4 Circuit Block Diagram
The circuit block diagram and major functional units of the MG323 module contain
the following parts:
GSM baseband controller
Power management
Multi-chip package (MCP) memory

HUAWEI MG323 GSM M2M Module
Hardware Guide
Overall Description
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Radio frequency (RF) transceiver
26 MHz reference clock
RF front-end modules
Receive filter
Figure 2-2 Circuit block diagram of the MG323 module