Huawei MU709s-2 Installation instructions

HUAWEI MU709s-2 HSPA+ LGA Module
Hardware Guide
Issue 03
Date 2014-09-18

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HUAWEI MU709s-2 HSPA+ LGA Module
Hardware Guide
About This Document
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3
About This Document
Revision History
Document
Version
Date Chapter Descriptions
01 2014-07-16 Creation
02 2014-09-11 All Deleted the Description of RESIN_N pin
3.4.3 Updated section 3.4.3: Reset the Module
03 2014-09-18 3.4.3 Updated section 3.4.3: Reset the Module

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Hardware Guide
Contents
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Contents
1 Introduction....................................................................................................................................7
2 Overall Description ......................................................................................................................8
2.1 About This Chapter........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram....................................................................................................................... 9
2.4 Application Block Diagram ............................................................................................................. 10
3 Description of the Application Interfaces..............................................................................12
3.1 About This Chapter......................................................................................................................... 12
3.2 LGA Interface ................................................................................................................................. 12
3.3 Power Interface.............................................................................................................................. 23
3.3.1 Overview................................................................................................................................ 23
3.3.2 Power Supply VBAT Interface............................................................................................... 24
3.3.3 Output Power Supply Interface ............................................................................................. 25
3.4 Signal Control Interface.................................................................................................................. 25
3.4.1 Overview................................................................................................................................ 25
3.4.2 Power-on/off (POWER_ON_OFF) Pin .................................................................................. 26
3.4.3 Reset the Module .................................................................................................................. 28
3.4.4 WAKEUP_IN Signal............................................................................................................... 28
3.4.5 WAKEUP_OUT Signal........................................................................................................... 29
3.4.6 SLEEP_STATUS Signal ........................................................................................................ 29
3.4.7 LED_MODE Signal................................................................................................................ 30
3.5 UART Interface............................................................................................................................... 31
3.5.1 Overview................................................................................................................................ 31
3.5.2 Circuit Recommended for the UART Interface...................................................................... 32
3.6 USB Interface................................................................................................................................. 33
3.7 USIM Card Interface ...................................................................................................................... 34
3.7.1 Overview................................................................................................................................ 34
3.7.2 Circuit Recommended for the USIM Card Interface.............................................................. 35
3.8 Audio Interface ............................................................................................................................... 36
3.9 General Purpose I/O Interface....................................................................................................... 38
3.10 JTAG Interface ............................................................................................................................. 38
3.11 RF Antenna Interface.................................................................................................................... 39

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3.12 Reserved Interface....................................................................................................................... 42
3.13 NC Interface................................................................................................................................. 43
4 RF Specifications.........................................................................................................................44
4.1 About This Chapter......................................................................................................................... 44
4.2 Operating Frequencies................................................................................................................... 44
4.3 Conducted RF Measurement......................................................................................................... 45
4.3.1 Test Environment................................................................................................................... 45
4.3.2 Test Standards....................................................................................................................... 45
4.4 Conducted Rx Sensitivity and Tx Power........................................................................................ 45
4.4.1 Conducted Receive Sensitivity.............................................................................................. 45
4.4.2 Conducted Transmit Power................................................................................................... 46
4.5 Antenna Design Requirements ...................................................................................................... 46
4.5.1 Antenna Design Indicators..................................................................................................... 46
4.5.2 Interference ........................................................................................................................... 49
4.5.3 GSM/WCDMAAntenna Requirements.................................................................................. 49
5 Electrical and Reliability Features ...........................................................................................50
5.1 About This Chapter......................................................................................................................... 50
5.2 Absolute Ratings ............................................................................................................................ 50
5.3 Operating and Storage Temperatures............................................................................................ 50
5.4 Power Supply Features.................................................................................................................. 51
5.4.1 Input Power Supply ............................................................................................................... 51
5.4.2 Power Consumption.............................................................................................................. 52
5.5 Reliability Features......................................................................................................................... 55
5.6 EMC and ESD Features................................................................................................................. 58
6 Mechanical Specifications.........................................................................................................60
6.1 About This Chapter......................................................................................................................... 60
6.2 Storage Requirement..................................................................................................................... 60
6.3 Moisture Sensitivity ........................................................................................................................ 60
6.4 Dimensions and Interfaces............................................................................................................. 61
6.5 Packaging....................................................................................................................................... 61
6.6 Label............................................................................................................................................... 63
6.7 Customer PCB Design................................................................................................................... 63
6.7.1 PCB Surface Finish............................................................................................................... 63
6.7.2 PCB Pad Design.................................................................................................................... 63
6.7.3 Solder Mask........................................................................................................................... 64
6.7.4 Requirements on PCB Layout............................................................................................... 64
6.8 Assembly Processes...................................................................................................................... 64
6.8.1 General Description of Assembly Processes ........................................................................ 64
6.8.2 Stencil Design........................................................................................................................ 65
6.8.3 Reflow Profile ........................................................................................................................ 65
6.9 Specification of Rework.................................................................................................................. 66

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6.9.1 Process of Rework ................................................................................................................ 66
6.9.2 Preparations of Rework......................................................................................................... 67
6.9.3 Removing of the Module........................................................................................................ 67
6.9.4 Welding Area Treatment........................................................................................................ 67
6.9.5 Module Installation................................................................................................................. 68
6.9.6 Specifications of Rework ....................................................................................................... 68
7 Certifications................................................................................................................................69
7.1 About This Chapter......................................................................................................................... 69
7.2 Certifications................................................................................................................................... 69
8 Safety Information......................................................................................................................70
8.1 Interference .................................................................................................................................... 70
8.2 Medical Device............................................................................................................................... 70
8.3 Area with Inflammables and Explosives......................................................................................... 70
8.4 Traffic Security................................................................................................................................ 71
8.5 Airline Security................................................................................................................................ 71
8.6 Safety of Children........................................................................................................................... 71
8.7 Environment Protection.................................................................................................................. 71
8.8 WEEE Approval.............................................................................................................................. 71
8.9 RoHS Approval............................................................................................................................... 71
8.10 Laws and Regulations Observance ............................................................................................. 72
8.11 Care and Maintenance................................................................................................................. 72
8.12 Emergency Call............................................................................................................................ 72
8.13 Regulatory Information................................................................................................................. 72
8.13.1 CE Approval (European Union)........................................................................................... 72
9 Appendix A Circuit of Typical Interface................................................................................73
10 Appendix B Acronyms and Abbreviations..........................................................................74

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Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces
provided by MU709s-2 module.
This document helps hardware engineer to understand the interface specifications,
electrical features and related product information of the MU709s-2 module.

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1BOverall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the MU709s-2 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 Features
Feature Description
Physical
Dimensions
Dimensions (L × W × H): 30 mm × 30 mm × 2.27 mm
Weight: about 5 g
Operating
Bands WCDMA/HSDPA/HSUPA/HSPA+: 900 MHz/2100 MHz
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
Operating
Temperature Normal operating temperature: –20°C to +70°C
Extended operating temperature[1]: –40°C to +85°C
Storage
Temperature –40°C to +85°C
Power
Voltage DC 3.3 V–4.2 V (typical value is 3.8 V)
AT
Commands See the HUAWEI MU709 Series HSPA+ LGA Module AT Command Interface Specification.
Application
Interface
(145-pin LGA
interface)
One standard USIM card (Class B and Class C)
Audio interface: PCM interface
USB 2.0 (High Speed)

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Feature Description
8-wire UART (Universal Asynchronous Receiver-Transmitter) x 1,
up to 920 kbit/s
2-wire UART x 1 (this is only used for debugging)
GPIO (General-purpose I/O) x 5
LED (Light-Emitting Diode) x 1
Power on/off interface
JTAG (Joint Test Action Group) interface
Sleep indicator interface (SLEEP_STATUS)
WAKEUP_IN: Sleep authorization signal
WAKEUP_OUT: Module to wake up the host
Antenna
Interface WWAN MAIN antenna pad x1, WWAN AUX antenna pad x 1
SMS New message alert
Management of SMS: read SMS, write SMS, send SMS, delete
SMS and list SMS
Supports MO and MT: Point-to-point
Data Services GPRS: UL 85.6 kbit/s; DL 85.6 kbit/s
EDGE: UL 236.8 kbit/s; DL 236.8 kbit/s
WCDMA PS: UL 384 kbit/s; DL 384 kbit/s
HSPA+: UL 5.76 Mbit/s; DL 21.6 Mbit/s
[1]: When the MU709s-2 module works outside of the range from –40°C to +85°C, NOT all its
RF performances comply with 3GPP specifications.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU709s-2 module. The major
functional units of the MU709s-2 module contain the following parts:
Power management
Baseband controller
Nand flash
RF Circuit

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Figure 2-1 Circuit block diagram of the MU709s-2 module
HI6758M RFIC Hi6361 and
Front end circuits
LGA Interface
VBAT
USIM
Power on/off
GPIO
GND
GND
PCM
USB
UART
JTAG
WAKE
MAIN_ANT
AUX_ANT
LED
Nand flash
2.4 Application Block Diagram
Figure 2-2 Application block diagram of the MU709s-2 module
Antenna Interface
Application Interface
USIM Power on/
Power off
Module
USIM
Card
Power
Supply Audio
UART
UART GPIO
GPIO PCM
Wakeup_
IN/OUT
Wakeup_
IN/OUT
USB
AUX_ANT MAIN_ANT
3.3-–
4.2 V
LED
LED
On/Off

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UART Interface: The module supports 2 UART interfaces. One is 8-wire UART,
and the other is 2-wire UART (only for debugging).
USB Interface: The USB interface supports USB 2.0 high speed standard.
USIM Interface: The USIM interface provides the interface for a USIM card.
External Power
Supply: DC 3.8 V is recommended.
Audio Interface: The module supports one PCM interface.
LED: Indicates the work status.
RF Pad: RF antenna interface.

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Hardware Guide
2BDescription of the Application
Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU709s-2
module, including:
LGA Interface
Power Interface
Signal Control Interface
UART Interface
USB Interface
USIM Card Interface
Audio Interface
General Purpose I/O Interface
JTAG Interface
RFAntenna Interface
Reserved Interface
NC Interface
3.2 LGA Interface
The MU709s-2 module uses a 145-pin LGAas its external interface. For details about
the module and dimensions, see 6.4 Dimensions and Interfaces .

HUAWEI MU709s-2 HSPA+ LGA Module
Hardware Guide
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Figure 3-1 shows the sequence of pins on the 145-pin signal interface of the
MU709s-2 module.
Figure 3-1 Sequence of LGAinterface (Top view)
Table 3-1 shows the definitions of pins on the 145-pin signal interface of the
MU709s-2 module.

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Table 3-1 Definitions of pins on the LGA interface
Pin
No.
Pin
Name
Pad
Type Description Parameter Min.( V)
Typ.
(V)
Max.
(V) Comments
1 UART1_
TX O UART1 transmit output for debugging.VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
2 NC - Not connected,
please keep this pin
open.
- - - - -
3 NC - Not connected,
please keep this pin
open.
- - - - -
4 UART1_
RX I UART1 receive data
input for debugging. VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
5 PCM_SY
NC O PCM sync VOH 1.35 1.80 2.10 -
VOL 0 - 0.45
6 PCM_DI
N I PCM data in VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63
7 PCM_DO
UT O PCM data out VOH 1.35 1.80 2.10 -
VOL 0 - 0.45
8 PCM_CL
K O PCM clock VOH 1.35 1.80 2.10 -
VOL 0 - 0.45
9 SD_DAT
A1 I/O SD Card data signal.
Only used for
debugging.
Please reserve the
test point.
VOH 2.25 3.00 3.30 -
VOL 0 - 0.75 -
VIH 2.10 3.00 3.30 -
VIL –0.30 - 1.05 -
10 SD_DAT
A2 I/O SD Card data signal.
Only used for
debugging.
Please reserve the
test point.
VOH 2.25 3.00 3.30 -
VOL 0 - 0.75 -
VIH 2.10 3.00 3.30 -
VIL –0.30 - 1.05 -
11 WAKEUP
_IN I Sleep authorization
signal.
H: Sleep mode is
disabled.
L: Sleep mode is
enabled (default
value).
VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -

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Pin
No.
Pin
Name
Pad
Type Description Parameter Min.( V)
Typ.
(V)
Max.
(V) Comments
12 VBAT PI Power supply input.
The rising time of
VBAT must > 100 us
- 3.30 3.80 4.20 -
13 VBAT PI Power supply input
The rising time of
VBAT must > 100 us
- 3.30 3.80 4.20 -
14 PS_HOL
D I Power supply hold
signal to the module. VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
15 SLEEP_
STATUS O Sleep status
indicator.
H: Module is in
wakeup state.
L: Module is in sleep
state.
VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
16 NC - Not connected,
please keep this pin
open.
- - - - -
17 NC - Not connected,
please keep this pin
open.
- - - - -
18 NC - Not connected,
please keep this pin
open.
- - - - -
19 NC - Not connected,
please keep this pin
open.
- - - - -
20 NC - Not connected,
please keep this pin
open.
- - - - -
21 NC - Not connected,
please keep this pin
open.
- - - - -
22 NC - Not connected,
please keep this pin
open.
- - - - -
23 NC - Not connected,
please keep this pin
open.
- - - - -
24 NC - Not connected,
please keep this pin
open.
- - - - -

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Pin
No.
Pin
Name
Pad
Type Description Parameter Min.( V)
Typ.
(V)
Max.
(V) Comments
25 NC - Not connected,
please keep this pin
open.
- - - - -
26 NC - Not connected,
please keep this pin
open.
- - - - -
27 NC - Not connected,
please keep this pin
open.
- - - - -
28 Reserved - Reserved - - - - -
29 Reserved - Reserved - - - - -
30 JTAG_T
MS I JTAG test mode
select. VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
31 Reserved - Reserved - - - - -
32 VCC_EX
T1 PO 1.8 V POWER output - 1.75 1.80 1.85 -
33 NC - Not connected,
please keep this pin
open.
- - - - -
34 USIM_V
CC PO Power supply for
USIM card. - –0.30 1.80 1.98 USIM_VC C=1.80 V
–0.30 3.00 3.30 USIM_VC
C=3.00 V
35 Reserved - Reserved - - - - -
36 JTAG_T
RST_N I JTAG reset VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
37 NC - Not connected,
please keep this pin
open.
- - - - -
38 NC - Not connected,
please keep this pin
open.
- - - - -
39 NC - Not connected,
please keep this pin
open.
- - - - -
40 NC - Not connected,
please keep this pin
open.
- - - - -

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Pin
No.
Pin
Name
Pad
Type Description Parameter Min.( V)
Typ.
(V)
Max.
(V) Comments
41 NC - Not connected,
please keep this pin
open.
- - - - -
42 JTAG_T
CK I JTAG clock input VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
43 Reserved - Reserved - - - - -
44 Reserved - Reserved - - - - -
45 Reserved - Reserved - - - - -
46 Reserved - Reserved - - - - -
47 NC - Not connected,
please keep this pin
open.
- - - - -
48 GND - Ground - - - - -
49 NOT
USED - Do not design PAD - - - - -
50 GND - Ground - - - - -
51 GPIO2 I/O General I/O pins. The
function of these pins
has not been defined.
VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
52 GND - Ground - - - - -
53 NOT
USED - Do not design PAD - - - - -
54 GND - Ground - - - - -
55 GPIO5 I/O General I/O pins. The
function of these pins
has not been defined.
VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
56 GND - Ground - - - - -
57 NOT
USED - Do not design PAD - - - - -
58 GND - Ground - - - - -
59 GND - Ground - - - - -

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Pin
No.
Pin
Name
Pad
Type Description Parameter Min.( V)
Typ.
(V)
Max.
(V) Comments
60 Reserved - Reserved - - - - -
61 Reserved - Reserved - - - - -
62 Reserved - Reserved - - - - -
63 Reserved - Reserved - - - - -
64 Reserved - Reserved - - - - -
65 Reserved - Reserved - - - - -
66 SD_DAT
A3 I/O SD Card data signal.
Only used for
debugging.
Please reserve the
test point.
VOH 2.25 3.00 3.30 -
VOL 0 - 0.75 -
VIH 2.1 3.00 3.30 -
VIL –0.30 - 1.05 -
67 SD_CLK O SD Card CLK signal.
Only used for
debugging.
Please reserve the
test point.
VOH 2.25 3.00 3.30 -
VOL 0 - 0.75 -
68 SD_DAT
A0 I/O SD Card data signal.
Only used for
debugging.
Please reserve the
test point.
VOH 2.25 3.00 3.30 -
VOL 0 - 0.75 -
VIH 2.10 3.00 3.30 -
VIL –0.30 - 1.05 -
69 SD_CMD O SD Card CMD signal.
Only used for
debugging.
Please reserve the
test point.
VOH 2.25 3.00 3.30 -
VOL 0 - 0.75 -
70 Reserved - Reserved - - - - -
71 WAKEUP
_OUT O Module to wake up
the host. VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
72 JTAG_T
DO O JTAG test data output VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
73 UART0_
DSR O UART0 data set
ready VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
74 UART0_
RTS O UART0 ready for
receive VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -

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Pin
No.
Pin
Name
Pad
Type Description Parameter Min.( V)
Typ.
(V)
Max.
(V) Comments
75 UART0_
DCD O UART0 data carrier
detect VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
76 UART0_
TX O UART0 transmit
output VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
77 UART0_
RING O UART0 ring indicator VOH 1.35 1.80 2.10 -
VOL 0 - 0.45 -
78 UART0_
RX I UART0 receive data
input VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
79 UART0_
DTR I Data terminal ready VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
80 UART0_
CTS I UART0 clear to send VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
81 POWER_
ON_OFF I System power-on or
power-off VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
82 NC - Not connected,
please keep this pin
open.
- - - - -
83 NC - Not connected,
please keep this pin
open.
- - - - -
84 NC - Not connected,
please keep this pin
open.
- - - - -
85 USB_DM I/O USB Data- defined in
the USB 2.0
Specification
- - - - -
86 USB_DP I/O USB Data+ defined in
the USB 2.0
Specification.
- - - - -
87 JTAG_T
DI I JTAG test data input VIH 1.26 1.80 2.10 -
VIL –0.30 - 0.63 -
88 USIM_R
ESET O USIM card reset VOH 0.7x USIM
_VCC
- 3.30 USIM_VC
C=1.80 V
or 3.0 V

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Pin
No.
Pin
Name
Pad
Type Description Parameter Min.( V)
Typ.
(V)
Max.
(V) Comments
VOL 0 - 0.2x
USI
M_V
CC
89 USIM_D
ATA I/O USIM card data VOH 0.7 x USIM
_VCC
- 3.30 USIM_VC
C=1.80 V
or 3.0 V
VOL 0 - 0.2 x
USI
M_V
CC
VIH 0.65x
USIM
_VCC
- 3.30
VIL 0 - 0.25
x
USI
M_V
CC
90 USIM_CL
K O USIM card clock VOH 0.7 x USIM
_VCC
- 3.30 USIM_VC
C=1.80 V
or 3.0 V
VOL 0 - 0.2 x
USI
M_V
CC
91 Reserved - Reserved - - - - -
92 SD_VCC PO SD Card Power
Used for debug. - 2.90 3.00 3.10 -
93 NC - Not connected,
please keep this pin
open.
- - - - -
94 NC - Not connected,
please keep this pin
open.
- - - - -
95 NC - Not connected,
please keep this pin
open.
- - - - -
96 NC - Not connected,
please keep this pin
open.
- - - - -