Huawei MU509 Series User manual

Copyright © Huawei Technologies Co., Ltd. 2010.
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Notice
Some features of the product and its accessories described herein rely on the
software installed, capacities and settings of local network, and may not be
activated or may be limited by local network operators or network service
providers, thus the descriptions herein may not exactly match the product or its
accessories you purchase.
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information or specifications contained in this manual without prior notice or
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Contents
Getting to Know the MU509..................................................................... 1
PCB Design ........................................................................................... 3
Assembly.............................................................................................. 5

Thank you for purchasing HUAWEI MU509-c
HSDPA Module (hereinafter referred to as the
MU509)
Note:
This manual briefly describes the preparation, the process for PCB Design,
Assembly and safety precautions.
You are recommended to read the manual before using the MU509.
Getting to Know the MU509
The package of the LGA module is 116 pin LGA with a dimension of 30 mm × 30
mm × 2.5 mm and the pitch of 1.5 mm. It is applied to the user interface board,
and can be used as a wireless terminal in a network environment.
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3
PCB Design
CB Pad Design
To achieve high efficiency of the production and solder joints of high reliability, it
is recommended that the PCB pad size be designed as follows: the size of the
middle region is the same as the pad size of the product package; other pads are
0.05 mm larger than the unilateral pad of the product package. For details, see
the following figure:

Requirements on PCB Layout
Other devices must be located more than 3 mm away from the LGA module.
It is recommended to be 5 mm. The minimum distance between the LGA
module and the PCB edge is 1.5 mm.
When the PCB layout is double sided, it is recommended that the LGA module
be placed on the second side for assembly.
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Design of Solder Mask
The PCB pad design can be solder mask defined (SMD), or non-solder mask
defined (NSMD).
NSMD is recommended. In addition, the solder mask of the NSMD pad design is
larger than the pad so the reliability of the solder joint can be improved.
The solder mask must be 100 um to150 um larger than the pad, that is, the single
side of the solder mask must be 50 um to 75 um larger than the pad. The specific
size depends on the processing capability of the PCB manufacturer.
Assembly
Stencil Design
It is recommended that the stencil for the LGA module be 0.12 mm in thickness.
For the stencil design, see the following figure:

Reflow Profile
For the soldering temperature of the LGA module, see the following figure:
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Reflow parameters:
Preheat zone
(40–150°C)
Time: 60–120sec Heating rate: 0.5–2°C/sec
Soak zone
(150-200°C)
Time: 60–120sec Heating rate: <1.0°C/sec
Reflow zone (>
217°C)
Time: 30–90sec Peak reflow temperature:
230–260°C
Cooling zone Cooling rate: 1°C/sec ≤Slope ≤4°C/sec
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