Huawei MU509 Series Installation instructions

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
Issue 09
Date 2014-03-06

Copyright © Huawei Technologies Co., Ltd. 2014. All rights reserved.
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Thus, the descriptions herein may not exactly match the product or its accessories which you purchase.
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About This Document
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About This Document
Revision History
Document
Version
Date Chapter Descriptions
01 2010-11-12 Creation
02 2011-04-18 1 Updated Overview
2.2 Updated Table 2-1 Feature
2.4 Updated 2.4 Application Block Diagram
3.1 Updated 3.1 About This Chapter
3.2 Updated Table 3-1 Definitions of pins on
the LGA interface
3.3.1 Updated 3.3.1 Overview
3.3.2 Updated 3.3.2 VBAT Interface
3.3.3 Updated 3.3.3 VCOIN Interface
3.4 Updated 3.4 Signal Control Interface
3.5 Updated 3.5 UART Interface
3.6 Added 3.6 USB Interface
3.7 Updated 3.7 SIM Card Interface
3.8 Updated 3.8 Audio Interface
3.9 Added 3.9 General Purpose I/O Interface
3.10 Added 3.10 JTAG Interface
3.11 Added 3.11 RF Antenna Interface
3.12 Added 3.12 NC Pins
4.2 Added 4.2 Antenna Installation Guidelines
4.5.1 Updated 4.5.1 Conducted Receive
Sensitivity
4.5.2 Updated 4.5.2 Conducted Transmit Power

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Document
Version
Date Chapter Descriptions
5.5.2 Updated 5.5.2 Power Consumption
6.2 Updated 6.2 Dimensions and interfaces of
MU509
6.3 Added 6.3 Customer PCB Pad Design
6.4 Updated 6.4 Label
7 Added 7 Certifications
8 Added 8 Safety Information
9 Added 9 Appendix A Circuit of Typical
Interface
10 Updated 10 Appendix B Acronyms and
Abbreviations
03 2011-07-08 2.3 Updated the Figure 2-1
3.3.2 Replaced ‘2 mF’ with ‘2.2 mF’
3.4.2 Updated the Figure 3-5 and the Figure 3-6
3.6 Updated the Table 3-10
3.7 Updated the Figure 3-16 and the Figure
3-18
9 Updated the two figures
04 2012-04-23 3.7.2 Updated the value of the resistor which is
used to connect the SIM_DATA pin to the
VSIM pin.
5.5.2 Updated the Table 5-7
5.5.2 Added the Table 5-9 “DC power
consumption for
MU509-c(GSM/GPRS/EDGE)”
7.2 Updated the Table 7-1
05 2012-08-27 All Added the content of MU509-g
2.2 Added A-tick in Table 2-1
3.4.1 Updated the description of WAKEUP_IN in
Table 3-5
3.4.4 Updated the description of WAKEUP_IN
Signal
3.4.5 Updated the description of WAKEUP_OUT
Signal

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Document
Version
Date Chapter Descriptions
5.5.2 Update Table 5-6 DC power consumption
(Power off mode and Standby mode) and
Table 5-7 DC power consumption (Idle
mode)
6 Added the process design
7 Updated the CE number
06 2012-12-19 All Added the related content about HUAWEI
MU509-1
3.3.2 Updated the peak current to 2.75 V and the
storage capacitors to 220 µF
3.3.2 Updated Figure 3-2 Recommended power
circuit of MU509 module
3.4.2 Updated Table 3-7 Power off timing
3.4.4 Updated Figure 3-13 WAKEUP_IN
sequence
3.5.2 Added the description of level conversion
circuit and the wind blow in
07 2013-04-15 2.3 Updated Figure 2-1
3.2 Updated Table 3-1
3.3.1 Updated Table 3-2
3.4.4 Updated Figure 3-13
3.7.2 Updated Figure 3-18
3.10 Updated Table 3-14
4.6.1 Updated Chapter 4.6.1
4.6.3 Updated Chapter 4.6.3
5.2 Updated Table 5-1
9 Updated Chapter 9
08 2013-10-26 2.2 Updated the extended working temperature
in Table 2-1
5.3 Updated the extended working temperature
in Table 5-2
09 2014-03-06 5.5.2 Updated Power Consumption
5.6 Updated Reliability Features
5.7 Updated EMC and ESD Features

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Document
Version
Date Chapter Descriptions
6.5 Updated the note of packaging
6.6 Updated the note of label
Scope
MU509-b
MU509-c
MU509-g
HUAWEI MU509-1
Summary
This document provides information about the major functions, supported services,
system architecture, and technical references of HUAWEI MU509 Series HSDPA
LGA Module.
The following table lists the contents of this document.
Chapter Details
1 Introduction Describes the short introduction of the
product.
2 Overall Description Describes the Function overview, Circuit
Block Diagram and Application Block
Diagram of the product.
3 Description of the Application
Interfaces Describes the external application interfaces of the product.
4 RF Specifications Describes the RF specifications of the
product.
5 Electrical and Reliability Features Describes the electrical and reliability
features of the interfaces in the product.
6 Process Design Describes the process design, the
Dimension, Label and Packing System
of the product.
7 Certifications Describes the certifications of the
product.
8 Safety Information Lists the safety information when using
the product.
8 9 Appendix A Circuit of Typical
Interface Lists the circuit of typical interface of the product.

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Chapter Details
10 Appendix B Acronyms and
Abbreviations Lists the acronyms and abbreviations mentioned in this document.

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Contents
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Contents
1 Introduction..................................................................................................................................11
2 Overall Description ....................................................................................................................12
2.1 About This Chapter......................................................................................................................... 12
2.2 Function Overview.......................................................................................................................... 12
2.3 Circuit Block Diagram..................................................................................................................... 14
2.4 Application Block Diagram ............................................................................................................. 16
3 Description of the Application Interfaces..............................................................................17
3.1 About This Chapter......................................................................................................................... 17
3.2 LGA Interface ................................................................................................................................. 17
3.3 Power Interface.............................................................................................................................. 26
3.3.1 Overview................................................................................................................................ 26
3.3.2 VBAT Interface....................................................................................................................... 27
3.3.3 VCOIN Interface .................................................................................................................... 28
3.3.4 Output Power Supply Interface ............................................................................................. 30
3.4 Signal Control Interface.................................................................................................................. 30
3.4.1 Overview................................................................................................................................ 30
3.4.2 Input Signal Control Pins....................................................................................................... 31
3.4.3 Output Signal Control Pin...................................................................................................... 34
3.4.4 WAKEUP_IN Signal............................................................................................................... 37
3.4.5 WAKEUP_OUT Signal........................................................................................................... 38
3.5 UART Interface............................................................................................................................... 39
3.5.1 Overview................................................................................................................................ 39
3.5.2 Circuit Recommended for the UART Interface...................................................................... 40
3.6 USB Interface................................................................................................................................. 40
3.7 SIM Card Interface......................................................................................................................... 41
3.7.1 Overview................................................................................................................................ 41
3.7.2 Circuit Recommended for the SIM Card Interface ................................................................ 42
3.8 Audio Interface ............................................................................................................................... 44
3.8.1 Analogue Audio...................................................................................................................... 44
3.8.2 Digital Audio........................................................................................................................... 45
3.8.3 Primary Mode ........................................................................................................................ 46
3.9 General Purpose I/O Interface....................................................................................................... 47

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3.10 JTAG Interface ............................................................................................................................. 47
3.11 RF Antenna Interface.................................................................................................................... 48
3.12 NC Pins ........................................................................................................................................ 48
4 RF Specifications.........................................................................................................................49
4.1 About This Chapter......................................................................................................................... 49
4.2 Antenna Installation Guidelines...................................................................................................... 49
4.3 Operating Frequencies................................................................................................................... 49
4.4 Conducted RF Measurement......................................................................................................... 50
4.4.1 Test Environment................................................................................................................... 50
4.4.2 Test Standards....................................................................................................................... 50
4.5 Conducted Rx Sensitivity and Tx Power........................................................................................ 50
4.5.1 Conducted Receive Sensitivity.............................................................................................. 50
4.5.2 Conducted Transmit Power................................................................................................... 51
4.6 Antenna Design Requirements ...................................................................................................... 52
4.6.1 Antenna Design Indicators..................................................................................................... 52
4.6.2 Interference ........................................................................................................................... 53
4.6.3 GSM/WCDMAAntenna Requirements.................................................................................. 54
4.6.4 Radio Test Environment ........................................................................................................ 54
5 Electrical and Reliability Features ...........................................................................................56
5.1 About This Chapter......................................................................................................................... 56
5.2 Extreme Operating Conditions....................................................................................................... 56
5.3 Operating and Storage Temperatures and Humidity...................................................................... 57
5.4 Electrical Features of Application Interfaces.................................................................................. 57
5.5 Power Supply Features.................................................................................................................. 58
5.5.1 Input Power Supply ............................................................................................................... 58
5.5.2 Power Consumption.............................................................................................................. 59
5.6 Reliability Features......................................................................................................................... 69
5.7 EMC and ESD Features................................................................................................................. 71
6 Process Design.............................................................................................................................74
6.1 About This Chapter......................................................................................................................... 74
6.2 Storage Requirement..................................................................................................................... 74
6.3 Moisture Sensitivity ........................................................................................................................ 74
6.4 Dimensions and interfaces............................................................................................................. 75
6.5 Packaging....................................................................................................................................... 76
6.6 Label............................................................................................................................................... 77
6.7 Customer PCB Design................................................................................................................... 79
6.7.1 PCB Surface Finish............................................................................................................... 79
6.7.2 PCB Pad Design.................................................................................................................... 79
6.7.3 Solder Mask........................................................................................................................... 79
6.7.4 Requirements on PCB Layout............................................................................................... 80
6.8 Assembly Processes...................................................................................................................... 80

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6.8.1 General Description of Assembly Processes ........................................................................ 80
6.8.2 Stencil Design........................................................................................................................ 80
6.8.3 Reflow Profile ........................................................................................................................ 81
6.9 Specification of Rework.................................................................................................................. 82
6.9.1 Process of Rework ................................................................................................................ 82
6.9.2 Preparations of Rework......................................................................................................... 83
6.9.3 Removing of the Module........................................................................................................ 83
6.9.4 Welding Area Treatment........................................................................................................ 83
6.9.5 Module Installation................................................................................................................. 84
6.9.6 Specifications of Rework....................................................................................................... 84
7 Certifications................................................................................................................................85
7.1 About This Chapter......................................................................................................................... 85
7.2 Certifications................................................................................................................................... 85
8 Safety Information......................................................................................................................87
8.1 Interference .................................................................................................................................... 87
8.2 Medical Device............................................................................................................................... 87
8.3 Area with Inflammables and Explosives......................................................................................... 87
8.4 Traffic Security................................................................................................................................ 88
8.5 Airline Security................................................................................................................................ 88
8.6 Safety of Children........................................................................................................................... 88
8.7 Environment Protection.................................................................................................................. 88
8.8 WEEE Approval.............................................................................................................................. 88
8.9 RoHS Approval............................................................................................................................... 88
8.10 Laws and Regulations Observance ............................................................................................. 89
8.11 Care and Maintenance................................................................................................................. 89
8.12 Emergency Call............................................................................................................................ 89
8.13 Regulatory Information................................................................................................................. 89
8.13.1 CE Approval (European Union)........................................................................................... 89
8.13.2 FCC Statement.................................................................................................................... 90
9 Appendix A Circuit of Typical Interface................................................................................91
10 Appendix B Acronyms and Abbreviations..........................................................................92

HUAWEI MU509 Series HSDPA LGA Module
Hardware Guide
Introduction
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1 Introduction
This document describes the hardware application interfaces and air interfaces that
are provided when the HUAWEI MU509 Series HSDPA LGA Module (hereinafter
referred to as the MU509 module) is used.
This document helps you to understand the interface specifications, electrical features,
and related product information of the MU509 module.
MU509 module is related to the following products:
Product name Model name Description
MU509 MU509-b UMTS/HSDPA 2100/900 MHz
GSM/GPRS/EDGE 850/900/1800/1900 MHz
MU509-c UMTS/HSDPA 1900/850 MHz
GSM/GPRS/EDGE 850/900/1800/1900 MHz
MU509-g UMTS/HSDPA 2100/850 MHz
GSM/GPRS/EDGE 850/900/1800/1900 MHz
HUAWEI
MU509-1 UMTS/HSDPA 2100 MHz
GSM/GPRS/EDGE 850/900/1800/1900 MHz
Each product has two editions: Data only or Telematics. Data only does not support
the voice function.
Function Data only Telematics
Analog voice input function × √
Analog voice output function × √
PCM voice function × √

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Overall Description
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2 Overall Description
2.1 About This Chapter
This chapter gives a general description of the MU509 module and provides:
Function Overview
Circuit Block Diagram
Application Block Diagram
2.2 Function Overview
Table 2-1 Feature
Feature Description
Physical
Features
Dimensions (L × W × H): 30 mm × 30 mm × 2.6 mm
Weight: about 5.5 g
Working Bands MU509-b: UMTS2100/900 MHz GSM850/900/1800/1900 MHz
(Data only or Telematics)
MU509-c: UMTS1900/850 MHz GSM850/900/1800/1900 MHz
(Data only or Telematics)
MU509-g: UMTS2100/850 MHz GSM850/900/1800/1900 MHz
(Data only or Telematics)
HUAWEI MU509-1: UMTS 2100MHz GSM/GPRS/EDGE
850/900/1800/1900 MHz
(Data only or Telematics)
For the differences between Data only and Telematics, see
"Chapter 1 ".
Operating
Temperature Normal working temperature: –20°C to +70°C
Extended working temperature: –40°C to +85°C

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Feature Description
Ambient
Temperature
for Storage
–40°C to +85°C
Power Voltage 3.3 V to 4.2 V (3.8 V is recommended.)
AT Commands For MU509-b, MU509-g and HUAWEI MU509-1, see the
HUAWEI MU509 HSDPA LGA Module AT Command Interface
Specification.
For MU509-c, see the HUAWEI MU509-c HSDPA LGA Module
AT Command Interface Specification.
Application
Interface
(145-pin LGA
interface)
One 8-wire UART (Universal Asynchronous
Receiver-Transmitter)
One standard USIM (Universal Subscriber Identity Module) card
(Class B and Class C)
Audio (optional): (only Telematics version supports these
functions)
2×Micphone in
1×Handset out
1×Speaker out
1×PCM
USB 2.0 (full speed)
Power on/off
Hardware Reset
Wakeup_In
Wakeup_Out
Light-emitting Diode (LED)
Configurable General-purpose I/O (GPIO)
RF pad
Power
SMS New message alert, text message receiving, and text message
sending
Management of text messages: read messages, delete
messages, storage status, and message list
Support for the Protocol Data Unit (PDU) mode
Data Services GSM CS: UL 14.4 kbps/DL 14.4 kbps
GPRS: UL 85.6 kbps/DL 85.6 kbps
EDGE: UL 236.8 kbps/DL 236.8 kbps

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Feature Description
WCDMA CS: UL 64 kbps/DL 64 kbps
WCDMA PS: UL 384 kbps/DL 384 kbps
HSDPA: DL 3.6 Mbps
Internet
Protocols TCP/IP, UDP/IP, PPP protocol
Applications SVD (Simultaneous Voice and Data), only for 3G
SIM PBM (Phone Book Management)
Certification
Information
Restriction of the use of certain Hazardous Substances (RoHS)
European Conformity (CE)
Federal Communications Commission (FCC)
Globe Certification Forum (GCF)
PCS Type Certification Review Board (PTCRB)
China Compulsory Certification (CCC)
A-tick
The certifications of different type of MU509 module are different because of sale markets.
To get the details, please refer to "Chapter 7 ".
[1]:The temperatures outside of the range –20°C to +70°C; the module might slightly deviate
from 3GPP TS 45.005 and 3GPP TS 34.121-1 specifications.
2.3 Circuit Block Diagram
Figure 2-1 shows the circuit block diagram of the MU509 module. The application
block diagram and major functional units of the MU509 module contain the following
parts:
Baseband controller
Power manager
Multi-chip package (MCP) memory
RF PA

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Overall Description
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Figure 2-1 Circuit block diagram of the MU509 module
Only Telematics version supports the audio function.
Single Chip
BASEBAND
MCP
POWER
MANAGER
RF PA
ANT
SWITCH
RF TRANSCEIVER
145-pin LGA Connector interface
UART
USB
USIM
POWER_ON_OFF
WAKEUP_IN/OUT
LED
RESIN_N
GPIO
AUDIO
JTAG
VBAT
VCC_EXT1
VCC_EXT2
MAIN_ANT
GND

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2.4 Application Block Diagram
Figure 2-2 Application block diagram of the MU509 module
UART Interface The module supports 8-wire UART.
USB Interface The USB interface supports USB 2.0 full speed standard.
USIM Interface The USIM interface provides the interface for a USIM card.
The USIM card can be inserted into the host side.
Power Supply DC 3.8 V is recommended.
Audio Interface The module supports one speaker output, two microphone
input, one earpiece output and one PCM interface (only
telematics version supports the audio function).
RF Pad RF antenna interface

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Description of the Application Interfaces
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the external application interfaces of the MU509
module, including:
LGA Interface
Power Interface
Signal Control Interface
UART Interface
USB Interface
SIM Card Interface
Audio Interface
General Purpose I/O Interface
JTAG Interface
RFAntenna Interface
NC Pins
3.2 LGA Interface
The MU509 module uses a 145-pin LGAas its external interface. For details about the
module and dimensions of the LGA, see "6.4 Dimensions and interfaces".
If DTE supports other Huawei LGAmodules, such as modules with system of CDMA,
TD-SCDMA or HSPA, please refer to HUAWEI 30 mm x 30 mm LGA Module
Hardware Migration Guide.
Table 3-1 shows the definitions of pins on the 145-pin signal interface of the MU509
module.

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Description of the Application Interfaces
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Table 3-1 Definitions of pins on the LGAinterface
PIN
No.
Pin Name I/O Description DC Characteristics (V)
Normal MUX Min. Typ. Max.
1 NC - - Not connected, please
keep this pin open. - - -
2 NC - - Not connected, please
keep this pin open. - - -
3 NC - - Not connected, please
keep this pin open. - - -
4 NC - - Not connected, please
keep this pin open. - - -
5 PCM_SYNC - O PCM interface sync –0.3 2.6 2.9
6 PCM_DIN - I PCM I/F data in –0.3 2.6 2.9
7 PCM_DOUT - O PCM I/F data out –0.3 2.6 2.9
8 PCM_CLK - O PCM interface clock –0.3 2.6 2.9
9 NC - - Not connected, please
keep this pin open. - - -
10 NC - - Not connected, please
keep this pin open. - - -
11 WAKEUP_IN - I Host to set the module into
sleep or wake up the
module from sleep.
–0.3 2.6 2.9
12 VBAT - P Power supply input 3.3 3.8 4.2
13 VBAT - P Power supply input 3.3 3.8 4.2
14 PS_HOLD - I Used for JTAG interface
assigning a test point for it. - 1.8 -
15 Reserved - - Reserved - - -
16 NC - - Not connected, please
keep this pin open. - - -
17 NC - - Not connected, please
keep open. - - -
18 NC - - Not connected, please
keep this pin open. - - -
19 NC - - Not connected, please
keep this pin open. - - -
20 NC - - Not connected, please
keep this pin open. - - -

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PIN
No.
Pin Name I/O Description DC Characteristics (V)
Normal MUX Min. Typ. Max.
21 NC - - Not connected, please
keep this pin open. - - -
22 NC - - Not connected, please
keep this pin open. - - -
23 NC - - Not connected, please
keep this pin open. - - -
24 NC - - Not connected, please
keep this pin open. - - -
25 NC - - Not connected, please
keep this pin open. - - -
26 NC - - Not connected, please
keep this pin open. - - -
27 NC - - Not connected, please
keep this pin open. - - -
28 Reserved - - Reserved - - -
29 Reserved - - Reserved - - -
30 JTAG_TMS - I JTAG Test mode select - - -
31 VCC_EXT2 - P 2.6 V POWER output 2.5 2.6 2.7
32 VCC_EXT1 - P 1.8 V POWER output 1.65 1.8 1.95
33 NC - - Not connected, please
keep this pin open. - - -
34 SIM_VCC - P Power supply for SIM card - 1.8/2.85 -
35 VCOIN - P Coin cell input 1.5 3.0 3.25
36 JTAG_TRST_N - I JTAG reset - - -
37 NC - - Not connected, please
keep this pin open. - - -
38 MIC2_P - I (Only Telematics version
supports audio function,
Data only version does not
support this function)
Positive pole of the input of
audio interface 2
- - -
39 MIC2_N - I (Only Telematics version
supports audio function,
Data only version does not
support this function)
Negative pole of the input
of audio interface 2
- - -

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PIN
No.
Pin Name I/O Description DC Characteristics (V)
Normal MUX Min. Typ. Max.
40 MIC1_P - I (Only Telematics version
supports audio function,
Data only version does not
support this function)
Positive pole of the input of
audio interface 1
- - -
41 MIC1_N - I (Only Telematics version
supports audio function,
Data only version does not
support this function)
Negative pole of the input
of audio interface 1
- - -
42 JTAG_TCK - I JTAG clock input –0.3 1.8 2.1
43 Reserved - - Reserved - - -
44 GPIO - I/O General I/O pin. The
function of these pins has
not been defined.
–0.3 2.6 2.9
45 GPIO - I/O General I/O pin. The
function of these pins has
not been defined.
–0.3 2.6 2.9
46 GPIO - I/O General I/O pins. The
function of these pins has
not been defined.
–0.3 2.6 2.9
47 NC - - Not connected, please
keep this pin open. - - -
48 GND - - Ground - - -
49 GND - - Ground - - -
50 GND - - Ground - - -
51 GPIO - I/O General I/O pins. The
function of these pins has
not been defined.
–0.3 2.6 2.9
52 GND - - Ground - - -
53 GND - - Ground - - -
54 GND - - Ground - - -
55 GPIO - I/O General I/O pins. The
function of these pins has
not been defined.
–0.3 2.6 2.9
56 GND - - Ground - - -