Infineon XENSIV BGT60TR13C User manual

Please read the Important Notice and Warnings at the end of this document
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UM_2205_PL32_2205_105330
User Guide for XENSIV™ KIT CSK BGT60TR13C
About this document
Scope and purpose
This document is a user guide for the XENSIV™ KIT CSK BGT60TR13C, provided as part of the connected sensor
kit (CSK) offering.
Intended audience
Customers interested in using CYSBSYSKIT-DEV-01 in combination with the XENSIV™ BGT60TR13C radar sensor
or the XENSIV™ DPS368 barometric pressure sensor to build their own IoT solution for various consumer
applications.

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Table of contents
About this document....................................................................................................................... 1
Table of contents............................................................................................................................ 2
1Important notice.................................................................................................................... 4
2Introduction .......................................................................................................................... 5
2.1 Kit content...............................................................................................................................................5
2.2 CYSBSYSKIT-DEV-01 ................................................................................................................................6
2.2.1 CYSBSYSKIT-DEV-01 main components............................................................................................6
2.3 XENSIV™ BGT60TR13C radar...................................................................................................................7
2.3.1 Key benefits........................................................................................................................................8
2.3.2 Key features........................................................................................................................................8
2.4 XENSIV™ DPS368 barometric pressure sensor.......................................................................................9
2.4.1 Key benefits........................................................................................................................................9
2.4.2 Key features........................................................................................................................................9
2.5 Board details ...........................................................................................................................................9
2.5.1 Kit and system block diagram ...........................................................................................................9
2.6 Getting started.......................................................................................................................................11
2.7 Abbreviations ........................................................................................................................................12
3Quick IoT Experience .............................................................................................................13
4Build your own application.....................................................................................................24
4.1.1 XENSIV™ BGT60TR13C radar sensor library ....................................................................................24
4.1.2 XENSIV™ DPS3xx pressure sensor library........................................................................................24
4.2 Code examples ......................................................................................................................................24
4.2.1 Getting started with ModusToolbox™ .............................................................................................24
5Presence detection solution ...................................................................................................27
5.1 Radar for presence detection ...............................................................................................................27
5.2 Presence detection application............................................................................................................27
5.3 Key benefits ...........................................................................................................................................28
5.4 Key specifications –presence detection solution................................................................................28
5.5 Mounting guidelines and coverage ......................................................................................................29
5.6 Known limitations and recommendations ..........................................................................................30
5.7 Known limitations.................................................................................................................................30
5.8 Recommendations................................................................................................................................31
6Entrance counter solution......................................................................................................32
6.1 Smart entrance counter application ....................................................................................................32
6.2 Key benefits ...........................................................................................................................................32
6.3 Key specifications –smart entrance counter solution ........................................................................33
6.4 Mounting guidelines and coverage ......................................................................................................34
6.5 Known limitations and recommendations ..........................................................................................35
6.6 Recommendations................................................................................................................................35
7Hardware description............................................................................................................36
7.1 CYSBSYSKIT-DEV-01 ..............................................................................................................................36
7.1.1 Baseboard components...................................................................................................................36
7.1.2 Hardware functional description ....................................................................................................40
7.1.3 CYSBSYS-RP01 module ....................................................................................................................40
7.1.4 PSoC™ 5LP........................................................................................................................................40
7.1.5 Serial interconnection between PSoC™ 5LP and module ..............................................................42
7.1.6 Power supply system .......................................................................................................................42

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7.1.7 Expansion headers...........................................................................................................................44
7.1.8 QSPI ..................................................................................................................................................44
7.1.9 LED....................................................................................................................................................45
7.1.10 User button.......................................................................................................................................45
7.1.11 ECO ...................................................................................................................................................45
7.1.12 10-pin SWD/JTAG programming header.........................................................................................46
7.1.13 KitProg3: on-board programmer/debugger ...................................................................................46
7.1.14 Programming and debugging..........................................................................................................46
7.1.15 USB-UART bridge .............................................................................................................................47
7.1.16 USB-I2C bridge .................................................................................................................................47
7.2 XENSIV™ BGT60TR13C wing..................................................................................................................48
7.2.1 Wing board components..................................................................................................................48
7.3 Adafruit feather-compatible connectors..............................................................................................48
7.3.1 Power supply....................................................................................................................................50
7.3.2 Mechanical buttons..........................................................................................................................50
Appendix A: Hardware design ......................................................................................................51
A1. Schematics ............................................................................................................................................51
A1.1 Sensors .............................................................................................................................................51
A1.2 Adafruit feather-compatible headers..............................................................................................52
A1.3 User interface (buttons, LEDs).........................................................................................................52
A1.4 Others ...............................................................................................................................................53
B1. PCB layout .............................................................................................................................................54
C1. Bill of materials......................................................................................................................................54
Appendix B: Frequently asked questions.......................................................................................57
Revision history.............................................................................................................................58

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1Important notice
Infineon Technologies AG (Infineon) provides the evaluation unit (evaluation kit) titled “connected sensor kit”
which is built to enable testing and evaluation of the XENSIV™ KIT CSK BGT60TR13C under the following
conditions:
•The evaluation unit is intended to be used for development, TESTING and EVALUATION PURPOSES
ONLY and is not considered by Infineon to be a finished end product fit for general consumer use.
•The evaluation unit (not being an end product) is not intended to be complete in various product
aspects such as required design, marketing, manufacturing, product safety, security and environmental
measures.
•The evaluation unit (evaluation kit) does not fall within the scope of the European Union directives and
FCC regulation, and therefore may not meet the technical requirements of these directives or other related
directives and regulations.
•The evaluation unit is provided for test and evaluation purposes only to evaluate the XENSIV™
BGT60TR13C radar and XENSIV™ DPS368 sensors. The evaluation unit is provided “as is” without any warranty
or liability of any kind.
•The user assumes all responsibility and liability for proper and safe handling of the goods, including
following ESD precautions. Further, the user indemnifies Infineon from all claims arising from the handling or
use of the goods.
•NEITHER PARTY SHALL BE LIABLE TO THE OTHER PARTY FOR ANY DAMAGES INCLUDING (BUT NOT
LIMITED TO) INDIRECT, SPECIAL, INCIDENTAL AND CONSEQUENTIAL DAMAGES.
For additional information, please contact an Infineon application engineer or visit www.infineon.com.

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2Introduction
The XENSIV™ KIT CSK BGT60TR13C supports customers in testing sensor-driven IoT products and radar use
cases as well as in prototyping. It offers a real-time sensor evaluation with custom configurations and cloud-
based radar-based solution output visualization.
2.1 Kit content
The XENSIV™ KIT CSK BGT60TR13C (Figure 1) comes with:
•Rapid IoT connect developer kit (CYSBSYSKIT-DEV-01) (Figure 2)
•XENSIV™ BGT60TR13C wing (EVAL_BGT60TR13C_Wing) (Figure 3)
Figure 1 XENSIV™ KIT CSK RADAR
Figure 2 CYSBSYSKIT-DEV-01 rapid IoT connect developer kit
Figure 3 XENSIV™ BGT60TR13C wing

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The key component on the wing board is Infineon’s XENSIV™ BGT60TR13C radar sensor. It enables ultra-wide
bandwidth frequency-modulated continuous-wave (FMCW) operation in a small package that also includes the
antennas. Sensor configuration and data acquisition are enabled with a digital interface, and the integrated state
machine enables independent data acquisition with power mode optimization for lowest power consumption.
The board also comprises the XENSIV™ DPS368 digital barometric pressure sensor. This high-precision pressure
sensor can detect very small changes in barometric pressure, which makes it an ideal device for use cases where
accurate pressure event detection is required (e.g., opening of doors or windows, or fall detection).
Having both the radar sensor and pressure sensor on the board gives the possibility to develop and test more
complex scenarios where data from both sensors is combined for more reliable event detection.
2.2 CYSBSYSKIT-DEV-01
The Rapid IoT connect developer kit carries a CYSBSYS-RP01 Rapid IoT connect system-on-module (SoM). The
Rapid IoT connect SoM includes a PSoC™ 6 MCU device, a CYW43012 single-chip radio, on-board crystals,
oscillators, chip antenna, and passive components. The PSoC™ 6 MCU device on the Rapid IoT connect SoM has
two cores: Cortex M0+ (CM0+) and Cortex M4 (M4). The firmware running on the PSoC™ 6 MCU can be split into
two parts: the application and device management. The device management part runs on the Cortex-M0+ core.
The applications part run on the Cortex-M4 core. The Cotex-M0+ core is called the network processor (NP). The
Cortex-M4 core is called the customer processor (CP). Resources such as flash, RAM and the peripherals are
divided between the NP and CP.
The Rapid IoT connect SoM is the easiest way to provide a secure, scalable, and reliable connection from your
device to your cloud. The Rapid IoT connect SoM is a pre-certified 802.11ac-friendly dual-band (2.4 and 5.0
GHz) Wi-Fi and Bluetooth® 5.0-compliant combo radio with an integrated PSoC™ 6 Secure IoT MCU provided in
an easy-to-use package. Included within the SoM are the crystals, oscillators, RF switches, passive components,
and antenna to help accelerate development of your secure IoT products. It provides up to 51 I/Os in a 26.6 x
14.0 x 2.5-mm castellated surface mount PCB for easy manufacturing.
Along with the Rapid IoT connect developer kit, Infineon® offers the Infineon® Rapid IoT connect cloud
platform. This Rapid IoT connect cloud platform allows users to quickly and easily connect their kits to the
cloud and see real time sensor data. Rapid IoT connect cloud platform provides several example projects that
can be easily programmed onto the user’s kit.
The user signs up with the Infineon® Rapid IoT connect cloud platform and registers the Rapid IoT connect
developer kit with the unique serial number printed on it. The user chooses an application for evaluation on the
Rapid IoT connect developer kit. The Rapid IoT connect cloud platform configures specific application images
which are available for download and programming on the Rapid IoT connect developer kit.
Rapid IoT connect cloud platform offers an array of services such as: Firmware over the air (FOTA) updates,
device management services such as Location services - parameter monitoring, and much more. Users who
desire to use these services for a large number of devices can connect with their respective Infineon® sales
support.
2.2.1 CYSBSYSKIT-DEV-01 main components
The Rapid IoT connect developer kit has the following features:
•CYSBSYS-RP01 module
•512-Mbit external Quad SPI NOR Flash that provides a fast, external expansion memory for data and code
•KitProg3 on-board SWD programmer/debugger, USB-UART, and USB-I2C bridge functionality. KitProg3 is
compatible with Mbed OS development flow and is CMSIS-DAP capable.

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•A user LED, a user button, and a reset button
•Battery connector, charging IC, and charging indicator LED
•One KitProg3 mode button, one KitProg3 status LED, and one KitProg3 power LED
•Optiga Trust M advanced security controller for secure data storage
•Thermistor for sensing the ambient temperature.
•Power supply system consisting of a 3.6V buck-boost regulator with the 1.8V and 3.3V LDO derived from the
3.6V regulator. USB or LiPo battery powers the entire kit.
Figure 4 CYSBSYSKIT-DEV-01
2.3 XENSIV™ BGT60TR13C radar
The BGT60TR13C MMIC is a 60GHz radar sensor with integrated antennas and comes with one transmitting and
three receiving antennas. Thanks to the L-shaped antenna array, horizontal and as well as vertical angular
measurement can be ensured. Moreover, the Antennas in Package (AIP) concept eliminates the antenna design
complexity at the user end and the PCB can be designed with standard FR4 materials.
BGT60TR13C MMIC enables ultra-wide bandwidth FMCW operation in a small package (6.5 x 5.0 x 0.9 mm³) and
is equipped with an integrated Finite-State Machine (FSM). With the aid of the FSM, BGT60TR13C can perform
FMCW frequency sweeps (so-called chirps), data acquisition as well as storing of samples into the internal FIFO
memory autonomously. Thanks to optimized power modes during sensor operation, lowest power consumption
of <5mW (duty cycle) can be guaranteed. Further reduction of average power consumption will be ensured via
DC duty cycling.
Thanks to the ultra-wide bandwidth of 5.5 GHz a very low range resolution down to ~3cm can be offered and in
cooperation with a ramp-up speed of 400 MHz/µs a higher doppler velocity achieved. In addition, the high Signal-
to-Noise Ratio (SNR) ensures detection of people up to 15 m, front facing towards the sensor, while high

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sensitivity allows detection of movements down to sub-millimeter. Via the very commonly used SPI (Serial
Peripheral Interface) the host MCU first configures the sensor, then reads the acquired sensor data, and finally
performs the application-specific signal processing steps.
2.3.1 Key benefits
•Easy and space-saving integration on FR4 PCB, no external antenna needed
•Three receive antennas to support even complex use cases in the horizontal and vertical angular range
•Detects sub-mm movements (micro-motions)
•SPI for chip configuration and radar data acquisition
•Integrated finite state machine (FSM) for flexible configuration of modulation and power modes
2.3.2 Key features
•60 GHz radar sensor for FMCW operation
•5.5 GHz bandwidth
•Antenna-in-package (6.5 mm x 5.0 mm x 0.9 mm)
•Digital interface for chip configuration and radar data acquistion
•Optimized power modes for low-power operation
•Integrated state machine for independent operation

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2.4 XENSIV™ DPS368 barometric pressure sensor
The XENSIV™ DPS368 is a miniaturized digital barometric air pressure sensor that is robust against water, dust
and humidity. It offers high accuracy and low current consumption and is capable of measuring both pressure
and temperature. The pressure sensor element is based on a capacitive sensing principle, which guarantees
high precision during temperature changes. The small package makes the XENSIV™ DPS368 ideal for mobile
applications and wearable devices. Due to its robustness, it can be used in harsh environments.
2.4.1 Key benefits
•Suitable even for harsh environments
•Easy to integrate and operate; allows fast design-to-market
•High precision makes the DPS368 an ideal device for applications such as fall detection, step counting,
door or window opening and environmental scene monitoring in general
•Variety of configurations enables user to choose optimum sensor settings for target application
2.4.2 Key features
•IPx8 certified: temporary immersion of 50 m for 1 hour
•Interface: I2C and SPI (both with optional interrupt)
•Operating modes: command (manual), background (automatic) and standby
•Pressure sensor precision: ± 0.002 hPa (or ±0.02 m) (high-precision mode)
•Absolute accuracy: ± 1 hPa (or ±8 m)
•Package dimensions: 8-pin PG-VLGA-8-2, 2.0 mm x 2.5 mm x 1.1 mm
2.5 Board details
The CYSBSYSKIT-DEV-01 rapid IoT connect developer kit serves as the compute and connect part of the CSK.
Infineon sensor wing boards, such as the XENSIV™BGT60TR13C radar wing, sense the environment. The wing
board has Adafruit feather-compatible connectors to be stacked individually or combined with other CSK-
compatible wing boards on the rapid IoT connect developer kit.
2.5.1 Kit and system block diagram
A block diagram of the wing board is shown in Figure 5. The wing board comprises the XENSIV™ BGT60TR13C
radar sensor, the XENSIV™ DPS368 digital pressure sensor and the required power supply components. Power
lines are highlighted in red. It is also equipped with push buttons and LEDs.

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Figure 5 XENSIV™ BGT60TR13C radar wing block diagram
A system block diagram showing the shield connected to the CSK rapid IoT baseboard is depicted in Figure 6.
The interface from the shield to the rapid IoT baseboard includes I2C, digital signals, analog signals and power
lines. The baseboard can interact with the outside world using Wi-Fi, Bluetooth, USB, or a combination of them
depending on the firmware/software (FW/SW) installed on the baseboard. The kit can be powered from an
external power supply or from a LiPo battery.
Figure 6 CSK system block diagram

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2.6 Getting started
This guide will help you to get acquainted with the XENSIV™ KIT CSK BGT60TR13C:
•Chapter Quick IoT Experience demonstrates how to read sensors and connect to the Rapid IoT connect
cloud platform in less the 10 minutes
•Chapter Build your own application explains how to use ModusToolbox™ to build your own application
to connect to your own cloud solution. ModusToolbox™ provides numerous code examples to make
this process easier.
Note: CYSBSYSKIT-DEV-01 requires ModusToolbox™ 2.2 or higher to design and debug applications.
Download and install ModusToolbox™ from www.cypress.com/modustoolbox. See the ModusToolbox™
Installation Guide and ModusToolbox™ IDE Quick Start Guide for additional information.
Users can experience the XENSIV™ KIT CSK BGT60TR13C in two ways:
a) Quick IoT experience for straightforward evaluation
b) Code examples in ModusToolbox™ for IoT solutions development
Figure 7 CSK experience steps

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2.7 Abbreviations
Table 1 Abbreviations used in this document
Abbreviation
Description
BSP
Board support package
CSK
Connected sensor kit
GPIO
General-purpose input/output
HW
Hardware
I2C
Inter-integrated circuit
IoT
Internet of Things
LED
Light-emitting diode
PAS
Photoacoustic spectroscopy
PCB
Printed circuit board
PSoC
Programmable system-on-chip
SPI
Serial peripheral interface
UART
Universal asynchronous receiver transmitter

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3Quick IoT Experience
1. Signup and login: Create an account with the Infineon® Rapid IoT connect cloud platform by signing up
with your email address. You will receive the password in your registered email address. You will be
prompted to change your password upon your first login to change it to the password of your choice.
Figure 8 Rapid IoT connect cloud platform sign-up view
Figure 9 Rapid IoT connect cloud platform login view
2. Add device: Click on the “Add device” button to add your new KIT CSK BGT60TR13C. A pop-up wizard will
guide you through the process. Provide a name and enter the development kit serial number as shown in
the figure and click “Next” button to continue to next screen.

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Figure 10 Add device
Figure 11 Add device wizard
3. Application: Quick IoT experience will provide a complete IoT sensor experience, in 10 minutes or less, that
is inclusive of telemetry and fleet monitoring. After completing this wizard, you will download and program
your development kit with a pre-built hex file that prepares and configures the development kit with latest
Wi-Fi firmware, an example application, and all the required credentials to securely connect to the cloud.
Kindly note that example application will automatically use integrated temperature sensor. Please select
your desired application based on the XENSIV wing board present with you, in this case the XENSIV™
BGT60TR13C wing.

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Figure 12 Select application
4. Configure Wi-Fi network: You have the option to get the firmware to connect to your preferred WPA2
network by providing the Wi-Fi SSID and password or setup an access point/hotspot of WPA2-PSK security
with the following credentials.
SSID: IFX_Sensor
Security: WPA2-PSK
Password: S66M14022021
Figure 13 Configure and select network
5. Submit your device configurations: Please ensure all the details entered are correct before clicking on the
“Submit” button. You can go back to earlier screens by pressing “Previous” if you need to change anything.
Once you press “Submit”, a custom hex file is built for your device and a software bundle will be generated
to program your development kit.
Note: You can add/register a maximum of 5 devices with Rapid IoT connect cloud platform account.

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6. Download the zip package –Based on your laptop/PC’s operating system (Windows/Linux/Mac), you will
be given with a downloadable package containing the firmware image in a hex file and programming tool to
program your KIT CSK BGT60TR13C. This will be a zip package. Click on the expand button to view the
detailed device status. Please click the download Button next to Success on the application for
downloading the zip package.
Figure 14 Device management dashboard
7. Program the KIT CSK BGT60TR13C: Connect your development kit to your PC/laptop using a Micro USB
cable. Extract the zip and run the program_kit script (*.cmd file for Windows, *.sh for Linux and *.command
for Mac). For Linux and MAC users, please ensure that you run the script from a terminal with necessary
permissions. Please refer the README for detailed instructions.
Figure 15 Package contents

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8. Device management: Manage your device(s) and its configurations from the device management tab. Click
on the expand icon after the Created Date to view the respective device details.
Figure 16 Device connection status
Figure 17 Attributes tabs for connected device
9. Select desired application: Select Attributes tab on the device details. Click on the dropdown menu for
Sensor_Solution in the desired value. Please select the desired application based on the connected
Infineon® sensor wing board, in our case XENSIV™BGT60TR13C wing. Your application will be set to
“Thermistor” as default, since the only sensing element available on CYSBSYSKIT-DEV-01. After the

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application is selected, the attributes will be pushed to the device and the device will reboot to the desired
application.
Note: The selection of a new application may temporarily cause the connectivity to disconnect and reconnect
from the Rapid IoT connect cloud platform.
Please refer Appendix for detailed list of attributes with their definition and possible values.
Table 2 Attributes for Presence application
Table 3 Attributes for Entrance Counter application
Attribute
Description
radar_presence_range_max
0.0 –10.0
Maximum detectable range for presence, in meters.
Default value is 2 m.
radar_presence_sensitivity
0.0 –1.0
Sensitivity for presence detection. Step of 0.1.
Default value is 0.5.
kit_mask_level
Disable logs, enable minimal logs or full logs to cloud
60: WARN, MINOR, MAJOR, FATAL all to UART terminal
62: INFO, WARN, MINOR, MAJOR, FATAL all to UART
terminal
124: WARN, MINOR, MAJOR, FATAL all to Cloud UI as
well as UART terminal
Attribute
Description
radar_counter_installation
side: side mounting installation
ceiling: ceiling mount installation
Default is side.
radar_counter_orientation
portrait: radar board is installed at portrait orientation
landscape: radar is installed at landscape orientation
Default is portrait.
radar_counter_entrance_width
0.0 –3.0
Entrance width in meters. Default is 1.0.
radar_counter_ceiling_height
1.0 –3.0
Ceiling height in meters. This parameter is used in ceiling
mount installation. Default is 1.0.
radar_counter_min_person_height
0.0 –2.0
Minimum person height to count, in meters. This
parameter is used in ceiling mount installation. Default is
1.0.
radar_counter_traffic_light_zone
0.0 –1.0
Area where traffic light is red, in meters. This can be used
for remiding social distancing purpose. Default is 1.0.
radar_counter_sensitivity
0.0 –1.0

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10. Change application attributes: Click on the Items per page drop-down menu at the bottom of the
Attributes tab and change the number of items accordingly so that you can view all attributes in one page.
For the Presnece use-case, please refer to the list of attributed in Table 2. For the Entrance Counter use-
case, please refer to the list of attributed in Table 3. Additional information can be found in Sections 5 and 6
for respectively Presence and Entrance counter detection.
Figure 18 Kit_log level configuration
Sensitivity for presence detection. Step of 0.1. Default
value is 0.5.
kit_mask_level
Disable logs, enable minimal logs or full logs to cloud
60: WARN, MINOR, MAJOR, FATAL all to UART terminal
62: INFO, WARN, MINOR, MAJOR, FATAL all to UART
terminal
124: WARN, MINOR, MAJOR, FATAL all to Cloud UI as
well as UART terminal
radar_counter_reverse
True: reverse IN/OUT count event
False: IN/OUT count event as normal
Default value is False.
room_capacity
Capacity of the room in terms of people. Default value is
100. Mimum value is 1.

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Figure 19 Presence detection attributes
Figure 20 Entrance counter attributes