Intel 7512 Instruction Manual

Reference Number: 322828-002
Intel®7500, 7510, and 7512
Scalable Memory Buffer
Thermal/Mechanical Design Guidelines
April 2011

2 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
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Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG 3
Contents
1 Introduction ..............................................................................................................7
1.1 Design Flow........................................................................................................7
1.2 Definition of Terms..............................................................................................8
1.3 Reference Documents..........................................................................................9
2 Packaging Technology .............................................................................................11
2.1 Package Mechanical Requirements.......................................................................13
3 Thermal Specifications ............................................................................................ 15
3.1 Thermal Design Power (TDP) .............................................................................. 15
3.2 Die Case Temperature Specifications.................................................................... 15
4 Thermal Metrology .................................................................................................. 17
4.1 Die Temperature Measurements.......................................................................... 17
4.1.1 Zero Degree Angle Attach Methodology ..................................................... 17
5 Reference Thermal Solution 1..................................................................................21
5.1 Operating Environment ...................................................................................... 21
5.1.1 Maximum Fan Speed Assumption .............................................................21
5.1.2 Acoustics Fan Speed Assumption.............................................................. 21
5.2 Heatsink Performance........................................................................................ 22
5.3 Mechanical Design Envelope ...............................................................................23
5.4 Board-Level Components Keepout Dimensions ...................................................... 23
5.5 Tall Torsional Clip Heatsink Thermal Solution Assembly .......................................... 25
5.5.1 Heatsink Orientation............................................................................... 26
5.5.2 Extruded Heatsink Profiles.......................................................................26
5.5.3 Mechanical Interface Material................................................................... 27
5.5.4 Thermal Interface Material....................................................................... 27
5.5.5 Heatsink Clip ......................................................................................... 27
5.5.6 Clip Retention Anchors............................................................................ 27
5.6 Reliability Guidelines.......................................................................................... 28
6 Reference Thermal Solution 2..................................................................................29
6.1 Operating Environment ...................................................................................... 29
6.1.1 Maximum Fan Speed Assumption .............................................................29
6.1.2 Acoustics Fan Speed Assumption.............................................................. 29
6.2 Heatsink Performance........................................................................................ 30
6.3 Mechanical Design Envelope ...............................................................................31
6.4 Board-Level Components Keepout Dimensions ...................................................... 31
6.5 Short Torsional Clip Heatsink Thermal Solution Assembly........................................ 31
6.5.1 Heatsink Orientation............................................................................... 32
6.5.2 Extruded Heatsink Profiles.......................................................................32
6.5.3 Mechanical Interface Material................................................................... 33
6.5.4 Thermal Interface Material....................................................................... 33
6.5.5 Heatsink Clip ......................................................................................... 33
6.5.6 Clip Retention Anchors............................................................................ 33
6.6 Reliability Guidelines.......................................................................................... 33
A Thermal Solution Component Suppliers ................................................................... 35
A.1 Tall Torsional Clip Heatsink Thermal Solution ........................................................35
A.2 Short Torsional Clip Heatsink Thermal Solution......................................................36
B Mechanical Drawings............................................................................................... 37

4 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
Figures
1-1 Thermal Design Process....................................................................................... 8
2-1 Scalable Memory Buffer Package Dimensions (Top View).........................................11
2-2 Scalable Memory Buffer Package Dimensions (Side View)........................................11
2-3 Scalable Memory Buffer Package Dimensions (Bottom View)....................................12
4-1 Thermal Solution Decision Flowchart ....................................................................18
4-2 Zero Degree Angle Attach Heatsink Modifications ...................................................18
4-3 Zero Degree Angle Attach Methodology (Top View) ................................................19
5-1 Tall Torsional Clip Heatsink Measured Thermal Performance Versus
Approach Velocity..............................................................................................22
5-2 Tall Torsional Clip Heatsink Volumetric Envelope for the
Intel 7500 Scalable Memory Buffer.......................................................................23
5-3 Tall Torsional Clip Heatsink Board Component Keepout ...........................................24
5-4 Retention Mechanism Component Keepout Zones...................................................25
5-5 Tall Torsional Clip Heatsink Assembly ...................................................................26
5-6 Tall Torsional Clip Heatsink Extrusion Profile..........................................................26
5-7 Anchors for Tall and Short Heatsink Retention .......................................................28
6-1 Short Torsional Clip Heatsink Measured Thermal Performance Versus
Approach Velocity..............................................................................................30
6-2 Short Torsional Clip Heatsink Volumetric Envelope .................................................31
6-3 Short Torsional Clip Heatsink Assembly.................................................................32
6-4 Short Torsional Clip Heatsink Extrusion Profile .......................................................32
B-1 Tall Torsional Clip Heatsink Assembly Orientation A Drawing....................................38
B-2 Tall Torsional Clip Heatsink Assembly Orientation B Drawing....................................39
B-3 Tall Torsional Clip Heatsink Drawing.....................................................................40
B-4 Tall/Short Torsional Clip Heatsink Clip Drawing ......................................................41
B-5 Short Torsional Clip Heatsink Assembly Orientation A Drawing.................................42
B-6 Short Torsional Clip Heatsink Assembly Orientation B Drawing .................................43
B-7 Short Torsional Clip Heatsink Assembly.................................................................44
Tables
3-1 Intel Scalable Memory Buffer Thermal Design Power...............................................15
3-2 Intel 7500 Scalable Memory Buffer Thermal Specification........................................16
5-1 Honeywell PCM45 F* TIM Performance as a Function of Attach Pressure....................27
5-2 Anchor Bend Angle and Maximum Pullout Force as a Function of Board Thickness.......28
5-3 Reliability Guidelines ..........................................................................................28
B-1 Mechanical Drawing List......................................................................................37

Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG 5
Revision History
§
Revision Description Date
001 Initial Release April 2010
002
• Added product specifications for Intel 7510 and 7512 Scalable Memory
buffer
• Replaced reference to ‘Intel 7500 Scalable Memory Buffer’ with
‘components’ where guidance also applies to Intel 7510 and 7512 Scalable
Memory Buffer. See change bars throughout document.
• Section 2: Revised the figures title
• Section 3.1: Reworded the paragraph
• Table 3-1: Updated the table
• Table 3-2: Added note 6
April 2011

6 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG

Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG 7
Introduction
1Introduction
As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
Note: This document addresses thermal design and specifications for the Intel®7500, 7510,
and 7512 Scalable Memory Buffer. Information provided in this document is intended
only for use with these products. Unless otherwise specified, specification and guidance
provided in this document applies to products identified above. In this document the
term ‘component’ refer to Intel 7500, 7510, and 7512 Scalable Memory Buffer
components unless other wise identified.
The goals of this document are to:
• Outline the mechanical operating limits and specifications for the Intel®7500,
7510, and 7512 Scalable Memory Buffer (MB).
• Outline reference TDP specifications for the Intel 7500, 7510, and 7512 Scalable
Memory Buffer specific to that of Intel®Xeon®processor 7500 series-based
platform and Intel®Itanium®processor 9300 series-based platform.
• Describe reference thermal solutions that meet the specifications of the Intel 7500,
7510, and 7512 Scalable Memory Buffer.
Properly designed thermal solutions provide adequate cooling to maintain the
component die temperature at or below thermal specifications. This is accomplished by
providing a low local-ambient temperature, ensuring adequate local airflow, and
minimizing the die to local-ambient thermal resistance. By maintaining the memory
buffer component die temperature at or below the specified limits, a system designer
can ensure the proper functionality, performance, and reliability of the chipset.
Operation outside the functional limits can degrade system performance and may
cause permanent changes in the operating characteristics of the component.
The simplest and most cost-effective method to improve the inherent system cooling
characteristics is through proper chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
1.1 Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided
to the system designer. Figure 1-1 illustrates the design process implicit to this
document and the tools appropriate for each step.

Introduction
8 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
1.2 Definition of Terms
FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where
a die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls
attached to the substrate opposite the die. Note that the device arrives at
the customer with solder balls attached.
BLT Bond Line Thickness. Final settled thickness of the thermal interface
material after installation of heatsink.
MB Intel 7500 Scalable Memory Buffer. The chipset component responsible for
handling Intel®Scalable Memory Interconnect (Intel®SMI) channel and
memory requests to and from the local DIMM. All memory control for the
DRAM resides in the host, including memory request initiation, timing,
refresh, scrubbing, sparing, configuration access, and power management.
Tcase_max Maximum die operating temperature, and is measured at the geometric
center of the top of the die.
Tcase_min Minimum die operating temperature, and is measured at the geometric
center of the top of the die.
TDP Thermal design power: Thermal solutions should be designed to dissipate
this target power level. TDP is not the maximum power that the chipset can
dissipate.
Figure 1-1. Thermal Design Process
Therm al M odel
Therm al M odel U ser's G uide
Step 1: Therm al
Sim ulation
Therm al Reference
Mechanical R eferenc e
S tep 2 : Hea ts ink S electio n
Therm al T es ting S oftware
Software User's G uide
S tep 3 : T herm al V alidation

Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG 9
Introduction
1.3 Reference Documents
The reader of this specification should also be familiar with material and concepts
presented in the following documents:
• Intel®7500, 7510, and 7512 Scalable Memory Buffer Datasheet
• Various system thermal design suggestions (http://www.formfactors.org)
§

Introduction
10 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG

Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG 11
Packaging Technology
2Packaging Technology
The Intel 7500, 7510, and 7512 Scalable Memory Buffer components uses a 24.5 mm x
19.5 mm, 12-layer FC-BGA package (see Figure 2-1,Figure 2-2 and Figure 2-3).
Figure 2-1. Scalable Memory Buffer Package Dimensions (Top View)
Figure 2-2. Scalable Memory Buffer Package Dimensions (Side View)
Die
Die
Keepout
Area
Handling
Exclusion
Area
19.50mm.
13.50mm.
9.50mm.
24.50mm.
18.50mm.
14.50mm.
8.50mm.12.50mm.
5.30mm.
11.30mm.

Packaging Technology
12 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
Notes:
1. All dimensions are in millimeters.
2. All dimensions are tolerances confirm to ANSI Y14.5M-1994.
Figure 2-3. Scalable Memory Buffer Package Dimensions (Bottom View)

Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG 13
Packaging Technology
2.1 Package Mechanical Requirements
The component package has an exposed bare die which is capable of sustaining a
maximum static normal load of 15 lbf. The package is NOT capable of sustaining a
dynamic or static compressive load applied to any edge of the bare die. These
mechanical load limits must not be exceeded during heatsink installation, mechanical
stress testing, standard shipping conditions and/or any other use condition.
Notes:
1. The heatsink attach solutions must not include continuous stress onto the chipset
package with the exception of a uniform load to maintain the heatsink-to-package
thermal interface.
2. These specifications apply to uniform compressive loading in a direction
perpendicular to the bare die top surface.
3. These specifications are based on limited testing for design characterization.
Loading limits are for the package only.
§

Packaging Technology
14 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG

Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG 15
Thermal Specifications
3Thermal Specifications
3.1 Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the component to
consume maximum power dissipation for sustained time periods. Therefore, in order to
arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting
power consumption is referred to as the Thermal Design Power (TDP). Hence, TDP is
the design target for the thermal solution. TDP is not the maximum power that the
memory buffer component can dissipate.
For TDP specifications, see Table 3-1 for the Intel 7500, 7510, and 7512 Scalable
Memory Buffer components. FC-BGA packages have poor heat transfer capability into
the board, and have minimal thermal capability without a thermal solution. Intel
recommends that system designers plan for a heatsink when using an Intel 7500
Scalable Memory Buffer component.
3.2 Die Case Temperature Specifications
To ensure proper operation and reliability of the component, the die temperature must
comply with the thermal profile as specified in Table 3-2. System and/or component
level thermal solutions are required to maintain these temperature specifications. Refer
to Chapter 4, “Thermal Metrology,” for guidelines on accurately measuring package die
temperatures.
Notes:
1. These specifications are based on preliminary post-silicon measurement and subject to change.
2. Maximum of four (4) memory buffers are supported per processor socket. Additionally, Each memory buffer can support up to
4 memory DIMMs. See specific memory buffer datasheet or electronic design specification documents for additional
information.
3. TDP values for the memory buffers are based on loading Quad Rank, two DIMM per Channel per Intel 7510/7512 Scalable
Memory Buffer.
4. When Intel 7510/7512 Scalable Memory Buffer is used with the Intel® Xeon® processor 7500/6500 series, only the Intel
7500 Scalable Memory Buffer feature set is supported and validated; no validation, support, or warranty of LV-DIMMs with
Intel 7510/7512 Scalable Memory Buffer on Intel® Xeon® processor 7500 series-based platforms.
5. Intel 7510/7512 Scalable Memory Buffer idle power assumption is with the processor C3E power saving mode enabled.
Table 3-1. Intel®Scalable Memory Buffer Thermal Design Power
RDIMM LVDIMM
Component Standard /
Low Power Platform Configurations TDP_max3Idle Power3TDP_Max3Idle Power3
Intel® 7500
Scalable
Memory Buffer
NA 4 Socket, 130 W Intel®
Xeon®processor 7500 series 10 W 7 W — —
NA 4 Socket, 185 W Intel®
Itanium®processor 9300
series
10 W 7 W — —
Intel® 7510
Memory Buffer Standard 4 Socket, 130 W Intel® Xeon®Processor 7500 Series 8.7 W 3 W NA4NA4

Thermal Specifications
16 Intel® 7500, 7510, and 7512 Scalable Memory Buffer TMDG
Notes:
1. Tcase_min and Tcase_max represent the operating temperature range of the memory buffer. For additional
information on memory buffer thermal specifications Refer to the Intel® 7500,7510, and 7512 Scalable
Memory Buffer Datasheet.
2. Refer to the Intel® 7500, 7510, 7512 Scalable Memory Buffer Datasheet for thermal management
mechanism and Tcontrol usage.
3. The Tcontrol threshold value to be compared against the thermal sensor reading.
4. When the thermal sensor reading is less than the Tcontrol value, system can run under acoustic condition.
5. When the thermal sensor reading is larger than the Tcontrol value, the fan speed must increase as
necessary to maintain the sensor temperature at or below the Tcontrol value.
6. These specifications apply to Intel 7500, 7510, and 7512 Scalable Memory Buffer.
§
Table 3-2. Intel®7500 Scalable Memory Buffer Thermal Specification
Parameter Value Note
Tcase_max 92°C 1,2,6
Tcase_min 5°C 1,2,3,4,5,6
Tcontrol 87°C 1,2,3,4,5,6

Intel® 7500, 7510, 7512 Scalable Memory Buffer TMDG 17
Thermal Metrology
4Thermal Metrology
The system designer must make temperature measurements to accurately determine
the thermal performance of the system. Intel has established guidelines for proper
techniques to measure the component die temperatures. Section 4.1 provides
guidelines on how to accurately measure the Intel 7500 Scalable Memory Buffer die
temperatures.
4.1 Die Temperature Measurements
To ensure functionality and reliability, the component Tcase must be maintained at or
between the maximum/minimum operating range of the temperature specification as
noted in Table 3-1. The surface temperature at the geometric center of the die
corresponds to Tcase. Measuring Tcase requires special care to ensure an accurate
temperature measurement.
Temperature differences between the temperature of a surface and the surrounding
local ambient air can introduce errors in the measurements. The measurement errors
could be due to a poor thermal contact between the thermocouple junction and the
surface of the package, heat loss by radiation and/or convection, conduction through
thermocouple leads, and/or contact between the thermocouple cement and the
heatsink base (if a heatsink is used). For maximum measurement accuracy, only the 0°
thermocouple attach approach is recommended.
4.1.1 Zero Degree Angle Attach Methodology
1. Mill a 3.3 mm (0.13 in.) diameter and 1.5 mm (0.06 in.) deep hole centered on the
bottom of the heatsink base.
2. Mill a 1.3 mm (0.05 in.) wide and 0.5 mm (0.02 in.) deep slot from the centered
hole to one edge of the heatsink. The slot should be parallel to the heatsink fins
(see Figure 4-2).
3. Attach thermal interface material (TIM) to the bottom of the heatsink base.
4. Cut out portions of the TIM to make room for the thermocouple wire and bead. The
cutouts should match the slot and hole milled into the heatsink base.
5. Attach a 36 gauge or smaller calibrated K-type thermocouple bead or junction to
the center of the top surface of the die using a high thermal conductivity cement.
During this step, ensure no contact is present between the thermocouple cement
and the heatsink base because any contact will affect the thermocouple reading.
It is critical that the thermocouple bead makes contact with the die (see
Figure 4-3).
6. Attach heatsink assembly to the component and route thermocouple wires out
through the milled slot.

Thermal Metrology
18 Intel® 7500, 7510, 7512 Scalable Memory Buffer TMDG
Note: Not to scale.
Figure 4-1. Thermal Solution Decision Flowchart
Figure 4-2. Zero Degree Angle Attach Heatsink Modifications
Attach
thermocouples
using recommended
metrology. Setup
the system in the
desired
configuration.
Tdie >
Specification? No
Yes
Heatsink
Required
Select
Heatsink
End
Start
Run the Power
program and
monitor the
device die
temperature.
Attach device
to board
using normal
reflow
process.

Intel® 7500, 7510, 7512 Scalable Memory Buffer TMDG 19
Thermal Metrology
Note: Not to scale.
§
Figure 4-3. Zero Degree Angle Attach Methodology (Top View)
Cement +
Thermocouple Bead
Die
Thermocouple
Wire
Substrate

Thermal Metrology
20 Intel® 7500, 7510, 7512 Scalable Memory Buffer TMDG