Intel E3300 User manual

Document Number: 322567-003
Intel®Celeron®Processor E3000
Series
Datasheet
August 2010

2Datasheet
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Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel Celeron®processor E3000 series may contain design defects or errors known as errata which may cause the product to
deviate from published specifications.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor
family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time
processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not
intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number
progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Intel®64 requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled
for Intel 64. Processor will not operate (including 32-bit operation) without an Intel 64-enabled BIOS. Performance will vary
depending on your hardware and software configurations. See http://developer.intel.com/technology/intel64/ for more information
including details on which processors support Intel 64 or consult with your system vendor for more information.
Enabling Execute Disable Bit functionality requires a PC with a processor with Execute Disable Bit capability and a supporting
operating system. Check with your PC manufacturer on whether your system delivers Execute Disable Bit functionality.
‡ Not all specified units of this processor support Enhanced Intel SpeedStep®Technology. See the Processor Spec Finder at http:/
/processorfinder.intel.com or contact your Intel representative for more information.
Not all specified units of this processor support Thermal Monitor 2, Enhanced HALT State and Enhanced Intel SpeedStep®
Technology. See the Processor Spec Finder at http://processorfinder.intel.com or contact your Intel representative for more
information.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Pentium, Celeron, Intel Core, Intel SpeedStep, and the Intel logo are trademarks of Intel Corporation in the U.S. and other
countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2009–2010, Intel Corporation. All rights reserved.

Datasheet 3
Contents
1 Introduction ..............................................................................................................9
1.1 Terminology .......................................................................................................9
1.1.1 Processor Terminology Definitions ............................................................ 10
1.2 References .......................................................................................................11
2 Electrical Specifications........................................................................................... 13
2.1 Power and Ground Lands.................................................................................... 13
2.2 Decoupling Guidelines........................................................................................13
2.2.1 VCC Decoupling ......................................................................................13
2.2.2 VTT Decoupling ......................................................................................13
2.2.3 FSB Decoupling......................................................................................14
2.3 Voltage Identification......................................................................................... 14
2.4 Reserved, Unused, and TESTHI Signals ................................................................ 16
2.5 Power Segment Identifier (PSID)......................................................................... 16
2.6 Voltage and Current Specification........................................................................ 17
2.6.1 Absolute Maximum and Minimum Ratings ..................................................17
2.6.2 DC Voltage and Current Specification ........................................................ 18
2.6.3 VCC Overshoot .......................................................................................20
2.6.4 Die Voltage Validation............................................................................. 21
2.7 Signaling Specifications...................................................................................... 21
2.7.1 FSB Signal Groups.................................................................................. 22
2.7.2 CMOS and Open Drain Signals ................................................................. 23
2.7.3 Processor DC Specifications ..................................................................... 24
2.7.3.1 Platform Environment Control Interface (PECI) DC Specifications..... 25
2.7.3.2 GTL+ Front Side Bus Specifications .............................................26
2.8 Clock Specifications ........................................................................................... 27
2.8.1 Front Side Bus Clock (BCLK[1:0]) and Processor Clocking............................ 27
2.8.2 FSB Frequency Select Signals (BSEL[2:0])................................................. 28
2.8.3 Phase Lock Loop (PLL) and Filter .............................................................. 29
2.8.4 BCLK[1:0] Specifications ......................................................................... 29
3 Package Mechanical Specifications .......................................................................... 33
3.1 Package Mechanical Drawing............................................................................... 33
3.2 Processor Component Keep-Out Zones................................................................. 37
3.3 Package Loading Specifications ........................................................................... 37
3.4 Package Handling Guidelines............................................................................... 37
3.5 Package Insertion Specifications.......................................................................... 38
3.6 Processor Mass Specification............................................................................... 38
3.7 Processor Materials............................................................................................ 38
3.8 Processor Markings............................................................................................ 38
3.9 Processor Land Coordinates ................................................................................ 39
4 Land Listing and Signal Descriptions ....................................................................... 41
4.1 Processor Land Assignments............................................................................... 41
4.2 Alphabetical Signals Reference............................................................................ 64
5 Thermal Specifications and Design Considerations .................................................. 75
5.1 Processor Thermal Specifications......................................................................... 75
5.1.1 Thermal Specifications ............................................................................ 75
5.1.2 Thermal Metrology ................................................................................. 78
5.2 Processor Thermal Features................................................................................ 78
5.2.1 Thermal Monitor.....................................................................................78
5.2.2 Thermal Monitor 2..................................................................................79
5.2.3 On-Demand Mode .................................................................................. 80
5.2.4 PROCHOT# Signal.................................................................................. 81
5.2.5 THERMTRIP# Signal ............................................................................... 81
5.3 Platform Environment Control Interface (PECI)...................................................... 82

4Datasheet
5.3.1 Introduction...........................................................................................82
5.3.1.1 TCONTROL and TCC activation on PECI-Based Systems.....................82
5.3.2 PECI Specifications .................................................................................83
5.3.2.1 PECI Device Address..................................................................83
5.3.2.2 PECI Command Support.............................................................83
5.3.2.3 PECI Fault Handling Requirements...............................................83
5.3.2.4 PECI GetTemp0() Error Code Support ..........................................83
6 Features ..................................................................................................................85
6.1 Power-On Configuration Options ..........................................................................85
6.2 Clock Control and Low Power States.....................................................................85
6.2.1 Normal State .........................................................................................86
6.2.2 HALT and Extended HALT Powerdown States ..............................................86
6.2.2.1 HALT Powerdown State ..............................................................87
6.2.2.2 Extended HALT Powerdown State ................................................87
6.2.3 Stop Grant and Extended Stop Grant States...............................................87
6.2.3.1 Stop-Grant State.......................................................................87
6.2.3.2 Extended Stop Grant State .........................................................88
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended
Stop Grant Snoop State, and Stop Grant Snoop State..................................88
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................88
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......88
6.2.5 Sleep State............................................................................................89
6.2.6 Deep Sleep State....................................................................................89
6.2.7 Deeper Sleep State.................................................................................90
6.2.8 Enhanced Intel SpeedStep®Technology ....................................................90
6.3 Processor Power Status Indicator (PSI) Signal .......................................................90
7 Boxed Processor Specifications................................................................................91
7.1 Introduction......................................................................................................91
7.2 Mechanical Specifications....................................................................................92
7.2.1 Boxed Processor Cooling Solution Dimensions.............................................92
7.2.2 Boxed Processor Fan Heatsink Weight .......................................................93
7.2.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....93
7.3 Electrical Requirements ......................................................................................93
7.3.1 Fan Heatsink Power Supply ......................................................................93
7.4 Thermal Specifications........................................................................................95
7.4.1 Boxed Processor Cooling Requirements......................................................95
7.4.2 Variable Speed Fan.................................................................................97
8 Debug Tools Specifications ......................................................................................99
8.1 Logic Analyzer Interface (LAI) .............................................................................99
8.1.1 Mechanical Considerations .......................................................................99
8.1.2 Electrical Considerations ..........................................................................99

Datasheet 5
Figures
1 Processor VCC Static and Transient Tolerance............................................................... 20
2 VCC Overshoot Example Waveform ............................................................................. 21
3 Differential Clock Waveform ...................................................................................... 30
4 Measurement Points for Differential Clock Waveforms ................................................... 31
5 Processor Package Assembly Sketch...........................................................................33
6 Processor Package Drawing Sheet 1 of 3 ..................................................................... 34
7 Processor Package Drawing Sheet 2 of 3 ..................................................................... 35
8 Processor Package Drawing Sheet 3 of 3 ..................................................................... 36
9 Intel®Celeron®Processor E3000 Series Top-Side Markings Example..............................38
10 Processor Land Coordinates and Quadrants, Top View...................................................39
11 land-out Diagram (Top View – Left Side)..................................................................... 42
12 land-out Diagram (Top View – Right Side)................................................................... 43
13 Processor Series Thermal Profile ................................................................................ 77
14 Case Temperature (TC) Measurement Location ............................................................ 78
15 Thermal Monitor 2 Frequency and Voltage Ordering...................................................... 80
16 Conceptual Fan Control Diagram on PECI-Based Platforms............................................. 82
17 Processor Low Power State Machine ........................................................................... 86
18 Mechanical Representation of the Boxed Processor .......................................................91
19 Space Requirements for the Boxed Processor (Side View).............................................. 92
20 Space Requirements for the Boxed Processor (Top View)............................................... 92
21 Overall View Space Requirements for the Boxed Processor............................................. 93
22 Boxed Processor Fan Heatsink Power Cable Connector Description.................................. 94
23 Baseboard Power Header Placement Relative to Processor Socket................................... 95
24 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 1 view) ................... 96
25 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side 2 view) ................... 96
26 Boxed Processor Fan Heatsink Set Points..................................................................... 97

6Datasheet
Tables
1 References ..............................................................................................................11
2 Voltage Identification Definition..................................................................................15
3 Absolute Maximum and Minimum Ratings ....................................................................17
4 Voltage and Current Specifications..............................................................................18
5 Processor VCC Static and Transient Tolerance ...............................................................19
6 VCC Overshoot Specifications......................................................................................20
7 FSB Signal Groups....................................................................................................22
8 Signal Characteristics................................................................................................23
9 Signal Reference Voltages .........................................................................................23
10 GTL+ Signal Group DC Specifications ..........................................................................24
11 Open Drain and TAP Output Signal Group DC Specifications ...........................................24
12 CMOS Signal Group DC Specifications..........................................................................25
13 PECI DC Electrical Limits ...........................................................................................26
14 GTL+ Bus Voltage Definitions.....................................................................................27
15 Core Frequency to FSB Multiplier Configuration.............................................................28
16 BSEL[2:0] Frequency Table for BCLK[1:0] ...................................................................29
17 Front Side Bus Differential BCLK Specifications.............................................................29
18 FSB Differential Clock Specifications (800 MHz FSB)......................................................30
19 Processor Loading Specifications.................................................................................37
20 Package Handling Guidelines......................................................................................37
21 Processor Materials...................................................................................................38
22 Alphabetical Land Assignments...................................................................................44
23 Numerical Land Assignment.......................................................................................54
24 Signal Description.....................................................................................................64
25 Processor Thermal Specifications ................................................................................76
26 Processor Thermal Profile ..........................................................................................77
27 GetTemp0() Error Codes ...........................................................................................83
28 Power-On Configuration Option Signals .......................................................................85
29 Fan Heatsink Power and Signal Specifications...............................................................94
30 Fan Heatsink Power and Signal Specifications...............................................................98

Datasheet 7
Intel®Celeron®Processor E3000 Series Features
The Intel®Celeron®processor E3000 series is based on the Enhanced Intel®Core™
microarchitecture. The Enhanced Intel®Core™ microarchitecture combines the performance across
applications and usages where end-users can truly appreciate and experience the performance. These
applications include Internet audio and streaming video, image processing, video content creation,
speech, 3D, CAD, games, multimedia, and multitasking user environments.
Intel®64 architecture enables the processor to execute operating systems and applications written
to take advantage of the Intel 64 architecture. The processor, supporting Enhanced Intel Speedstep®
technology, allows tradeoffs to be made between performance and power consumption.
The Intel Celeron processor E3000 series also includes the Execute Disable Bit capability. This feature,
combined with a supported operating system, allows memory to be marked as executable or non-
executable.
• Available at 2.70, 2.60 GHz, 2.50 GHz and
2.40 GHz
• Enhanced Intel Speedstep®Technology
• Supports Intel®64 architecture
• Supports Execute Disable Bit capability
• FSB frequency at 800 MHz
• Binary compatible with applications running
on previous members of the Intel
microprocessor line
• Advance Dynamic Execution
• Very deep out-of-order execution
• Enhanced branch prediction
• Optimized for 32-bit applications running on
advanced 32-bit operating systems
• Intel®Advanced Smart Cache
• 1 MB Level 2 cache
• Intel®Advanced Digital Media Boost
• Enhanced floating point and multimedia unit
for enhanced video, audio, encryption, and
3D performance
• Power Management capabilities
• System Management mode
• Multiple low-power states
• 8-way cache associativity provides improved
cache hit rate on load/store operations
• 775-land Package

8Datasheet
Revision History
§ §
Revision
Number Description Revision Date
001 • Initial release August 2009
002 • Intel®Celeron®processor E3400 January 2010
003 • Changed the processor numbering from Intel Celeron processor E3x00 series to Intel Celeron
processor E3000 series.
• Intel®Celeron®processor E3500 August 2010

Datasheet 9
Introduction
1 Introduction
The Intel®Celeron®processor E3000 series is based on the Enhanced Intel®Core™
microarchitecture. The Intel Enhanced Core™ microarchitecture combines the
performance of previous generation Desktop products with the power efficiencies of a
low-power microarchitecture to enable smaller, quieter systems. The Intel Celeron
processor E3000 series is a 64-bit processor that maintains compatibility with IA-32
software.
Note: In this document, the Intel®Celeron®processor E3000 series may be referred to as
"the processor."
Note: In this document, unless otherwise specified, the Intel®Celeron®processor E3000
series refers to the Intel®Celeron®processor E3500, E3400, E3300, and E3200.
The processors use Flip-Chip Land Grid Array (FC-LGA8) package technology, and plugs
into a 775-land surface mount, Land Grid Array (LGA) socket, referred to as the
LGA775 socket.
The processors are based on 45 nm process technology. The processors feature the
Intel®Advanced Smart Cache, a shared multi-core optimized cache that significantly
reduces latency to frequently used data. The processors feature an 800 MHz front side
bus (FSB) and 1 MB of L2 cache. The processors support all the existing Streaming
SIMD Extensions 2 (SSE2), Streaming SIMD Extensions 3 (SSE3), and Supplemental
Streaming SIMD Extension 3 (SSSE3). The processors support several Advanced
Technologies: Execute Disable Bit, Intel®64 architecture, and Enhanced Intel
SpeedStep®Technology.
The processor's front side bus (FSB) use a split-transaction, deferred reply protocol.
The FSB uses Source-Synchronous Transfer of address and data to improve
performance by transferring data four times per bus clock (4X data transfer rate).
Along with the 4X data bus, the address bus can deliver addresses two times per bus
clock and is referred to as a "double-clocked" or 2X address bus. Working together, the
4X data bus and 2X address bus provide a data bus bandwidth of up to 8.5 GB/s.
Intel has enabled support components for the processor including heatsink, heatsink
retention mechanism, and socket. Manufacturability is a high priority; hence,
mechanical assembly may be completed from the top of the baseboard and should not
require any special tooling.
1.1 Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in
the active state when driven to a low level. For example, when RESET# is low, a reset
has been requested. Conversely, when NMI is high, a nonmaskable interrupt has
occurred. In the case of signals where the name does not imply an active state but
describes part of a binary sequence (such as address or data), the ‘#’ symbol implies
that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and
D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“Front Side Bus” refers to the interface between the processor and system core logic
(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors,
memory, and I/O.

Introduction
10 Datasheet
1.1.1 Processor Terminology Definitions
Commonly used terms are explained here for clarification:
•Intel®Celeron®processor E3000 series—Dual core processor in the FC-LGA8
package with a 1 MB L2 cache.
•Processor—For this document, the term processor is the generic form of the
Intel®Celeron®processor E3000 series.
•Voltage Regulator Design Guide—For this document “Voltage Regulator Design
Guide” may be used in place of:
—Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design
Guidelines For Desktop LGA775 Socket
•Enhanced Intel®Core™microarchitecture—A new foundation for Intel®
architecture-based desktop, mobile and mainstream server multi-core processors.
For additional information refer to: http://www.intel.com/technology/architecture/
coremicro/
•Keep-out zone—The area on or near the processor that system design can not
use.
•Processor core—Processor die with integrated L2 cache.
•LGA775 socket—The processors mate with the system board through a surface
mount, 775-land, LGA socket.
•Integrated heat spreader (IHS) —A component of the processor package used
to enhance the thermal performance of the package. Component thermal solutions
interface with the processor at the IHS surface.
•Retention mechanism (RM)—Since the LGA775 socket does not include any
mechanical features for heatsink attach, a retention mechanism is required.
Component thermal solutions should attach to the processor using a retention
mechanism that is independent of the socket.
•FSB (Front Side Bus)—The electrical interface that connects the processor to the
chipset. Also referred to as the processor system bus or the system bus. All
memory and I/O transactions as well as interrupt messages pass between the
processor and chipset over the FSB.
•Storage conditions—Refers to a non-operational state. The processor may be
installed in a platform, in a tray, or loose. Processors may be sealed in packaging or
exposed to free air. Under these conditions, processor lands should not be
connected to any supply voltages, have any I/Os biased, or receive any clocks.
Upon exposure to “free air”(that is, unsealed packaging or a device removed from
packaging material) the processor must be handled in accordance with moisture
sensitivity labeling (MSL) as indicated on the packaging material.
•Functional operation—Refers to normal operating conditions in which all
processor specifications, including DC, AC, system bus, signal quality, mechanical
and thermal are satisfied.
•Execute Disable Bit—Execute Disable Bit allows memory to be marked as
executable or non-executable, when combined with a supporting operating system.
If code attempts to run in non-executable memory the processor raises an error to
the operating system. This feature can prevent some classes of viruses or worms
that exploit buffer over run vulnerabilities and can thus help improve the overall
security of the system. See the Intel®Architecture Software Developer's Manual
for more detailed information.
•Intel®64 Architecture— An enhancement to Intel's IA-32 architecture, allowing
the processor to execute operating systems and applications written to take
advantage of the Intel 64 architecture. Further details on Intel 64 architecture and
programming model can be found in the Intel Extended Memory 64 Technology

Datasheet 11
Introduction
Software Developer Guide at http://developer.intel.com/technology/
64bitextensions/.
•Enhanced Intel SpeedStep®Technology—Enhanced Intel SpeedStep
Technology allows trade-offs to be made between performance and power
consumptions, based on processor utilization. This may lower average power
consumption (in conjunction with OS support).
•Intel®Virtualization Technology (Intel®VT)—A set of hardware
enhancements to Intel server and client platforms that can improve virtualization
solutions. Intel VT will provide a foundation for widely-deployed virtualization
solutions and enables more robust hardware assisted virtualization solutions. More
information can be found at: http://www.intel.com/technology/virtualization/
•Platform Environment Control Interface (PECI)—A proprietary one-wire bus
interface that provides a communication channel between the processor and
chipset components to external monitoring devices.
1.2 References
Material and concepts available in the following documents may be beneficial when
reading this document.
§
Table 1. References
Document Location
Intel®Celeron®Processor E3000 Series Specification Update http://download.intel.com/
design/processor/
specupdt/322568.pdf
Intel®Core™2 Duo Processor E8000 and E7000 Series, Intel®
Pentium®Dual-Core Processor E6000 and E5000 Series, and
Intel®Celeron Processor E3000 Series Thermal and Mechanical
Design Guidelines
www.intel.com/design/
processor/designex/
318734.htm
Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery
Design Guidelines For Desktop LGA775 Socket
http://www.intel.com/
design/processor/
applnots/313214.htm
LGA775 Socket Mechanical Design Guide http://intel.com/design/ Pentium4/guides/
302666.htm
Intel®64 and IA-32 Intel Architecture Software Developer's
Manuals
Volume 1: Basic Architecture
http://www.intel.com/
products/processor/
manuals/
Volume 2A: Instruction Set Reference, A-M
Volume 2B: Instruction Set Reference, N-Z
Volume 3A: System Programming Guide, Part 1
Volume 3B: System Programming Guide, Part 2

Introduction
12 Datasheet

Datasheet 13
Electrical Specifications
2 Electrical Specifications
This chapter describes the electrical characteristics of the processor interfaces and
signals. DC electrical characteristics are provided.
2.1 Power and Ground Lands
The processor has VCC (power), VTT, and VSS (ground) inputs for on-chip power
distribution. All power lands must be connected to VCC, while all VSS lands must be
connected to a system ground plane. The processor VCC lands must be supplied the
voltage determined by the Voltage IDentification (VID) lands.
The signals denoted as VTT provide termination for the front side bus and power to the
I/O buffers. A separate supply must be implemented for these lands, that meets the
VTT specifications outlined in Table 4.
2.2 Decoupling Guidelines
Due to its large number of transistors and high internal clock speeds, the processor is
capable of generating large current swings. This may cause voltages on power planes
to sag below their minimum specified values if bulk decoupling is not adequate. Larger
bulk storage (CBULK), such as electrolytic or aluminum-polymer capacitors, supply
current during longer lasting changes in current demand by the component, such as
coming out of an idle condition. Similarly, they act as a storage well for current when
entering an idle condition from a running condition. The motherboard must be designed
to ensure that the voltage provided to the processor remains within the specifications
listed in Table 4. Failure to do so can result in timing violations or reduced lifetime of
the component.
2.2.1 VCC Decoupling
VCC regulator solutions need to provide sufficient decoupling capacitance to satisfy the
processor voltage specifications. This includes bulk capacitance with low effective series
resistance (ESR) to keep the voltage rail within specifications during large swings in
load current. In addition, ceramic decoupling capacitors are required to filter high
frequency content generated by the front side bus and processor activity. Consult the
Voltage Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For
Desktop LGA775 Socket for further information. Contact your Intel field representative
for additional information.
2.2.2 VTT Decoupling
Decoupling must be provided on the motherboard. Decoupling solutions must be sized
to meet the expected load. To ensure compliance with the specifications, various
factors associated with the power delivery solution must be considered including
regulator type, power plane and trace sizing, and component placement. A
conservative decoupling solution would consist of a combination of low ESR bulk
capacitors and high frequency ceramic capacitors.

Electrical Specifications
14 Datasheet
2.2.3 FSB Decoupling
The processor integrates signal termination on the die. In addition, some of the high
frequency capacitance required for the FSB is included on the processor package.
However, additional high frequency capacitance must be added to the motherboard to
properly decouple the return currents from the front side bus. Bulk decoupling must
also be provided by the motherboard for proper [A]GTL+ bus operation.
2.3 Voltage Identification
The Voltage Identification (VID) specification for the processor is defined by the Voltage
Regulator-Down (VRD) 11.0 Processor Power Delivery Design Guidelines For Desktop
LGA775 Socket. The voltage set by the VID signals is the reference VR output voltage
to be delivered to the processor VCC lands (see Chapter 2.6.3 for VCC overshoot
specifications). Refer to Table 12 for the DC specifications for these signals. Voltages
for each processor frequency is provided in Table 4.
Note: To support the Deeper Sleep State the platform must use a VRD 11.1 compliant
solution. The Deeper Sleep State also requires additional platform support.
Individual processor VID values may be calibrated during manufacturing such that two
devices at the same core speed may have different default VID settings. This is
reflected by the VID Range values provided in Table 4. Refer to the Intel®Celeron®
Processor E3000 Series Specification Update for further details on specific valid core
frequency and VID values of the processor. Note that this differs from the VID
employed by the processor during a power management event (Thermal Monitor 2,
Enhanced Intel SpeedStep®technology, or Extended HALT State).
The processor uses eight voltage identification signals, VID[7:0], to support automatic
selection of power supply voltages. Table 2 specifies the voltage level corresponding to
the state of VID[7:0]. A ‘1’ in this table refers to a high voltage level and a ‘0’ refers to
a low voltage level. If the processor socket is empty (VID[7:0] = 11111110), or the
voltage regulation circuit cannot supply the voltage that is requested, it must disable
itself.
The processor provides the ability to operate while transitioning to an adjacent VID and
its associated processor core voltage (VCC). This will represent a DC shift in the load
line. It should be noted that a low-to-high or high-to-low voltage state change may
result in as many VID transitions as necessary to reach the target core voltage.
Transitions above the specified VID are not permitted. Table 4 includes VID step sizes
and DC shift ranges. Minimum and maximum voltages must be maintained as shown in
Table 5, and Figure 1, as measured across the VCC_SENSE and VSS_SENSE lands.
The VRM or VRD used must be capable of regulating its output to the value defined by
the new VID. DC specifications for dynamic VID transitions are included in Table 4 and
Table 5. Refer to the Voltage Regulator Design Guide for further details.

Datasheet 15
Electrical Specifications
Table 2. Voltage Identification Definition
VID
7VID 6VID 5VID 4VID 3VID 2VID 1VID 0Voltage VID 7VID 6VID 5VID 4VID 3VID 2VID 1VID 0Voltage
0 0 0 0 0 0 0 0 OFF 0 1 0 1 1 1 0 0 1.0375
0 0 0 0 0 0 1 0 1.6 0 1 0 1 1 1 1 0 1.025
0 0 0 0 0 1 0 0 1.5875 0 1 1 0 0 0 0 0 1.0125
0 0 0 0 0 1 1 0 1.575 0 1 1 0 0 0 1 0 1
0 0 0 0 1 0 0 0 1.5625 0 1 1 0 0 1 0 0 0.9875
0 0 0 0 1 0 1 0 1.55 0 1 1 0 0 1 1 0 0.975
0 0 0 0 1 1 0 0 1.5375 0 1 1 0 1 0 0 0 0.9625
0 0 0 0 1 1 1 0 1.525 0 1 1 0 1 0 1 0 0.95
0 0 0 1 0 0 0 0 1.5125 0 1 1 0 1 1 0 0 0.9375
0 0 0 1 0 0 1 0 1.5 0 1 1 0 1 1 1 0 0.925
0 0 0 1 0 1 0 0 1.4875 0 1 1 1 0 0 0 0 0.9125
0 0 0 1 0 1 1 0 1.475 0 1 1 1 0 0 1 0 0.9
0 0 0 1 1 0 0 0 1.4625 0 1 1 1 0 1 0 0 0.8875
0 0 0 1 1 0 1 0 1.45 0 1 1 1 0 1 1 0 0.875
0 0 0 1 1 1 0 0 1.4375 0 1 1 1 1 0 0 0 0.8625
0 0 0 1 1 1 1 0 1.425 0 1 1 1 1 0 1 0 0.85
0 0 1 0 0 0 0 0 1.4125 0 1 1 1 1 1 0 0 0.8375
0 0 1 0 0 0 1 0 1.4 0 1 1 1 1 1 1 0 0.825
0 0 1 0 0 1 0 0 1.3875 1 0 0 0 0 0 0 0 0.8125
0 0 1 0 0 1 1 0 1.375 1 0 0 0 0 0 1 0 0.8
0 0 1 0 1 0 0 0 1.3625 1 0 0 0 0 1 0 0 0.7875
0 0 1 0 1 0 1 0 1.35 1 0 0 0 0 1 1 0 0.775
0 0 1 0 1 1 0 0 1.3375 1 0 0 0 1 0 0 0 0.7625
0 0 1 0 1 1 1 0 1.325 1 0 0 0 1 0 1 0 0.75
0 0 1 1 0 0 0 0 1.3125 1 0 0 0 1 1 0 0 0.7375
0 0 1 1 0 0 1 0 1.3 1 0 0 0 1 1 1 0 0.725
0 0 1 1 0 1 0 0 1.2875 1 0 0 1 0 0 0 0 0.7125
0 0 1 1 0 1 1 0 1.275 1 0 0 1 0 0 1 0 0.7
0 0 1 1 1 0 0 0 1.2625 1 0 0 1 0 1 0 0 0.6875
0 0 1 1 1 0 1 0 1.25 1 0 0 1 0 1 1 0 0.675
0 0 1 1 1 1 0 0 1.2375 1 0 0 1 1 0 0 0 0.6625
0 0 1 1 1 1 1 0 1.225 1 0 0 1 1 0 1 0 0.65
0 1 0 0 0 0 0 0 1.2125 1 0 0 1 1 1 0 0 0.6375
0 1 0 0 0 0 1 0 1.2 1 0 0 1 1 1 1 0 0.625
0 1 0 0 0 1 0 0 1.1875 1 0 1 0 0 0 0 0 0.6125
0 1 0 0 0 1 1 0 1.175 1 0 1 0 0 0 1 0 0.6
0 1 0 0 1 0 0 0 1.1625 1 0 1 0 0 1 0 0 0.5875
0 1 0 0 1 0 1 0 1.15 1 0 1 0 0 1 1 0 0.575
0 1 0 0 1 1 0 0 1.1375 1 0 1 0 1 0 0 0 0.5625
0 1 0 0 1 1 1 0 1.125 1 0 1 0 1 0 1 0 0.55
0 1 0 1 0 0 0 0 1.1125 1 0 1 0 1 1 0 0 0.5375
0 1 0 1 0 0 1 0 1.1 1 0 1 0 1 1 1 0 0.525
0 1 0 1 0 1 0 0 1.0875 1 0 1 1 0 0 0 0 0.5125
0 1 0 1 0 1 1 0 1.075 1 0 1 1 0 0 1 0 0.5
0 1 0 1 1 0 0 0 1.0625 1 1 1 1 1 1 1 0 OFF
0 1 0 1 1 0 1 0 1.05

Electrical Specifications
16 Datasheet
2.4 Reserved, Unused, and TESTHI Signals
All RESERVED lands must remain unconnected. Connection of these lands to VCC, VSS,
VTT, or to any other signal (including each other) can result in component malfunction
or incompatibility with future processors. See Chapter 4 for a land listing of the
processor and the location of all RESERVED lands.
In a system level design, on-die termination has been included by the processor to
allow signals to be terminated within the processor silicon. Most unused GTL+ inputs
should be left as no connects as GTL+ termination is provided on the processor silicon.
However, see Table 7 for details on GTL+ signals that do not include on-die termination.
Unused active high inputs, should be connected through a resistor to ground (VSS).
Unused outputs can be left unconnected, however this may interfere with some TAP
functions, complicate debug probing, and prevent boundary scan testing. A resistor
must be used when tying bidirectional signals to power or ground. When tying any
signal to power or ground, a resistor will also allow for system testability. Resistor
values should be within ± 20% of the impedance of the motherboard trace for front
side bus signals. For unused GTL+ input or I/O signals, use pull-up resistors of the
same value as the on-die termination resistors (RTT). For details see Table 14.
TAP and CMOS signals do not include on-die termination. Inputs and used outputs must
be terminated on the motherboard. Unused outputs may be terminated on the
motherboard or left unconnected. Note that leaving unused outputs unterminated may
interfere with some TAP functions, complicate debug probing, and prevent boundary
scan testing.
All TESTHI[12,10:0] lands should be individually connected to VTT using a pull-up
resistor that matches the nominal trace impedance.
The TESTHI signals may use individual pull-up resistors or be grouped together as
detailed below. A matched resistor must be used for each group:
• TESTHI[1:0]
• TESTHI[7:2]
• TESTHI8/FC42 – cannot be grouped with other TESTHI signals
• TESTHI9/FC43 – cannot be grouped with other TESTHI signals
• TESTHI10 – cannot be grouped with other TESTHI signals
• TESTHI12/FC44 – cannot be grouped with other TESTHI signals
Terminating multiple TESTHI pins together with a single pull-up resistor is not
recommended for designs supporting boundary scan for proper Boundary Scan testing
of the TESTHI signals. For optimum noise margin, all pull-up resistor values used for
TESTHI[12,10:0] lands should have a resistance value within ± 20% of the impedance
of the board transmission line traces. For example, if the nominal trace impedance is
50 , then a value between 40 and 60 should be used.
2.5 Power Segment Identifier (PSID)
Power Segment Identifier (PSID) is a mechanism to prevent booting under mismatched
power requirement situations. The PSID mechanism enables BIOS to detect if the
processor in use requires more power than the platform voltage regulator (VR) is
capable of supplying. For example, a 130 W TDP processor installed in a board with a
65 W or 95 W TDP capable VR may draw too much power and cause a potential VR
issue.

Datasheet 17
Electrical Specifications
2.6 Voltage and Current Specification
2.6.1 Absolute Maximum and Minimum Ratings
Table 3 specifies absolute maximum and minimum ratings only and lie outside the
functional limits of the processor. Within functional operation limits, functionality and
long-term reliability can be expected.
At conditions outside functional operation condition limits, but within absolute
maximum and minimum ratings, neither functionality nor long-term reliability can be
expected. If a device is returned to conditions within functional operation limits after
having been subjected to conditions outside these limits, but within the absolute
maximum and minimum ratings, the device may be functional, but with its lifetime
degraded depending on exposure to conditions exceeding the functional operation
condition limits.
At conditions exceeding absolute maximum and minimum ratings, neither functionality
nor long-term reliability can be expected. Moreover, if a device is subjected to these
conditions for any length of time then, when returned to conditions within the
functional operating condition limits, it will either not function, or its reliability will be
severely degraded.
Although the processor contains protective circuitry to resist damage from static
electric discharge, precautions should always be taken to avoid high static voltages or
electric fields.
NOTES:
1. For functional operation, all processor electrical, signal quality, mechanical and thermal
specifications must be satisfied.
2. Excessive overshoot or undershoot on any signal will likely result in permanent damage to
the processor.
3. Storage temperature is applicable to storage conditions only. In this scenario, the
processor must not receive a clock, and no lands can be connected to a voltage bias.
Storage within these limits will not affect the long-term reliability of the device. For
functional operation, refer to the processor case temperature specifications.
4. This rating applies to the processor and does not include any tray or packaging.
5. Failure to adhere to this specification can affect the long term reliability of the processor.
Table 3. Absolute Maximum and Minimum Ratings
Symbol Parameter Min Max Unit Notes1, 2
VCC Core voltage with respect to
VSS –0.3 1.45 V -
VTT FSB termination voltage with
respect to VSS –0.3 1.45 V -
TCASE Processor case temperature See Section 5 See
Section 5 °C -
TSTORAGE Processor storage
temperature –40 85 °C 3, 4, 5

Electrical Specifications
18 Datasheet
2.6.2 DC Voltage and Current Specification
NOTES:
1. Each processor is programmed with a maximum valid voltage identification value (VID)
that is set at manufacturing and can not be altered. Individual maximum VID values are
calibrated during manufacturing such that two processors at the same frequency may have
different settings within the VID range. Note that this differs from the VID employed by the
processor during a power management event (Thermal Monitor 2, Enhanced Intel
SpeedStep®technology, or Extended HALT State).
2. Unless otherwise noted, all specifications in this table are based on estimates and
simulations or empirical data. These specifications will be updated with characterized data
from silicon measurements at a later date.
3. These voltages are targets only. A variable voltage source should exist on systems in the
event that a different voltage is required. See Section 2.3 and Table 2 for more
information.
4. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE
lands at the socket with a 100 MHz bandwidth oscilloscope, 1.5 pF maximum probe
capacitance, and 1 M minimum impedance. The maximum length of ground wire on the
probe should be less than 5 mm. Ensure external noise from the system is not coupled into
the oscilloscope probe.
Table 4. Voltage and Current Specifications
Symbol Parameter Min Typ Max Unit Notes2, 10
VID Range VID 0.8500 — 1.3625 V 1
Core VCC
Processor Number
(1 MB Cache):
E3500
E3400
E3300
E3200
VCC for
775_VR_CONFIG_06:
2.70 GHz
2.60 GHz
2.50 GHz
2.40 GHz
Refer to Table 5,Figure 1 V 3, 4, 5
VCC_BOOT Default VCC voltage for initial power up — 1.10 — V
VCCPLL PLL VCC - 5% 1.50 + 5% V
ICC
Processor Number
(1 MB Cache):
E3500
E3400
E3300
E3200
VCC for
775_VR_CONFIG_06:
2.70 GHz
2.60 GHz
2.50 GHz
2.40 GHz
— — 75
75
75
75
A 6
VTT
FSB termination
voltage
(DC + AC
specifications)
on Intel 3 series
Chipset family boards 1.045 1.1 1.155 V 7, 8
on Intel 4 series
Chipset family boards 1.14 1.2 1.26
VTT_OUT_LEFT
and
VTT_OUT_RIGHT
ICC
DC Current that may be drawn from
VTT_OUT_LEFT and VTT_OUT_RIGHT per
land — — 580 mA
ITT ICC for VTT supply before VCC stable
ICC for VTT supply after VCC stable — — 4.5 4.6 A 9
ICC_VCCPLL ICC for PLL land — — 130 mA
ICC_GTLREF ICC for GTLREF — — 200 µA

Datasheet 19
Electrical Specifications
5. Refer to Table 5 and Figure 1, for the minimum, typical, and maximum VCC allowed for a
given current. The processor should not be subjected to any VCC and ICC combination
wherein VCC exceeds VCC_MAX for a given current.
6. ICC_MAX specification is based on VCC_MAX loadline. Refer to Figure 1 for details.
7. VTT must be provided using a separate voltage source and not be connected to VCC. This
specification is measured at the land.
8. Baseboard bandwidth is limited to 20 MHz.
9. This is the maximum total current drawn from the VTT plane by only the processor. This
specification does not include the current coming from on-board termination (RTT),
through the signal line. Refer to the Voltage Regulator Design Guide to determine the total
ITT drawn by the system. This parameter is based on design characterization and is not
tested.
10. Adherence to the voltage specifications for the processor are required to ensure reliable
processor operation.
NOTES:
1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in
Section 2.6.3.
2. This table is intended to aid in reading discrete points on Figure 1.
3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage
regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer
to the Voltage Regulator Design Guide for socket loadline guidelines and VR implementation details.
4. Adherence to this loadline specification is required to ensure reliable processor operation.
Table 5. Processor VCC Static and Transient Tolerance
ICC (A)
Voltage Deviation from VID Setting (V)1, 2, 3, 4
Maximum Voltage
1.65 m Typical Voltage 1.73 m Minimum Voltage 1.80 m
0 0.000 -0.019 -0.038
5 -0.008 -0.028 -0.047
10 -0.017 -0.036 -0.056
15 -0.025 -0.045 -0.065
20 -0.033 -0.054 -0.074
25 -0.041 -0.062 -0.083
30 -0.050 -0.071 -0.092
35 -0.058 -0.079 -0.101
40 -0.066 -0.088 -0.110
45 -0.074 -0.097 -0.119
50 -0.083 -0.105 -0.128
55 -0.091 -0.114 -0.137
60 -0.099 -0.123 -0.146
65 -0.107 -0.131 -0.155
70 -0.116 -0.140 -0.164
75 -0.124 -0.148 -0.173

Electrical Specifications
20 Datasheet
NOTES:
1. The loadline specification includes both static and transient limits except for overshoot allowed as shown in
Section 2.6.3.
2. This loadline specification shows the deviation from the VID set point.
3. The loadlines specify voltage limits at the die measured at the VCC_SENSE and VSS_SENSE lands. Voltage
regulation feedback for voltage regulator circuits must be taken from processor VCC and VSS lands. Refer
to the Voltage Regulator Design Guide for socket loadline guidelines and VR implementation details.
2.6.3 VCC Overshoot
The processor can tolerate short transient overshoot events where VCC exceeds the VID
voltage when transitioning from a high to low current load condition. This overshoot
cannot exceed VID + VOS_MAX (VOS_MAX is the maximum allowable overshoot voltage).
The time duration of the overshoot event must not exceed TOS_MAX (TOS_MAX is the
maximum allowable time duration above VID). These specifications apply to the
processor die voltage as measured across the VCC_SENSE and VSS_SENSE lands.
Figure 1. Processor VCC Static and Transient Tolerance
VID - 0.000
VID - 0.013
VID - 0.025
VID - 0.038
VID - 0.050
VID - 0.063
VID - 0.075
VID - 0.088
VID - 0.100
VID - 0.113
VID - 0.125
VID - 0.138
VID - 0.150
VID - 0.163
VID - 0.175
VID - 0.188
0 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75
Icc [A]
Vcc Maximum
Vcc Typical
Vcc Minimum
Table 6. VCC Overshoot Specifications
Symbol Parameter Min Max Unit Figure Notes
VOS_MAX Magnitude of VCC overshoot above
VID — 50 mV 21
NOTES:
1. Adherence to these specifications is required to ensure reliable processor operation.
TOS_MAX Time duration of VCC overshoot above
VID — 25 µs 21