Intel Braswell Series User manual

Technical Manual
Of
Intel Braswell Series CPU
Based Mini-ITX M/B
NO.G03-NF596I-F
Revision: 1.0
Release date: August 31, 2021
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

iii
ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iv
USER’S NOTICE .......................................................................................................................v
MANUAL REVISION INFORMATION.......................................................................................v
ITEM CHECKLIST .....................................................................................................................v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD................................................................................1
1-2 SPECIFICATION.........................................................................................................2
1-3 LAYOUT DIAGRAM....................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING .....................................................................................................8
2-2 CONNECTORS AND HEADERS................................................................................13
2-2-1 CONNECTORS .............................................................................................13
2-2-2 HEADERS .....................................................................................................17
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................23
3-2 BIOS MENU SCREEN ................................................................................................24
3-3 FUNCTION KEYS .......................................................................................................24
3-4 GETTING HELP ..........................................................................................................25
3-5 MEMU BARS...............................................................................................................25
3-6 MAIN MENU................................................................................................................26
3-7 ADVANCED MENU.....................................................................................................27
3-8 CHIPSET MENU..........................................................................................................42
3-9 SECURITY MENU.......................................................................................................46
3-10 BOOT MENU...............................................................................................................47
3-11 SAVE & EXIT MENU...................................................................................................48
TABLE OF CONTENT

iv
Environmental Safety Instruction
⚫Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
⚫0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
⚫Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
⚫The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
⚫Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIESANDWE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition August 31, 2021
Item Checklist
Motherboard
Cable(s)

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
◼Onboard Intel®Braswell N3160 2.24GHz SoC Processor, with low power
consumption never denies high performance
◼Support 1* DDR3L 1600 MHz SO-DIMM, up to 8GB
◼Onboard 2 * Intel i211AT gigabit Ethernet LAN chip
◼Support USB 3.0 data transport demand
◼Support DVI-D, HDMI & LVDS multi-display
◼Support 1* SATAIII device
◼Onboard 1*M.2 M-key (type-2242,SATA interface) slot
◼Onboard 1* full-size Mini-PCIE slot & 1* PCIE x1 slot
◼Onboard 1* SIM card slot
◼Support CPU Over-Temperature protection
◼Support CPU Over-Current/Under Voltage protection
◼Support DRAM Over-Current/Under Voltage protection
◼Support Smart FAN
◼Compliance with ErP standard
◼Support Watchdog function

2
1-2 Specification
Spec
Description
Design
⚫6 layers; PCB size: 17x 17 cm
Embedded CPU
⚫Intel®Braswell *SoC CPU
*CPU model varies from different IPC options. Please consult your dealer
for more information of onboard CPU.
Memory Slot
⚫1 * DDR3L SODIMM Slot for un-buffered *DDR3L 1600 MHz SDRAM,
expandable to 8GB
Expansion Slot
⚫1* Full-size Mini-PCIE slot
⚫1* PCIE x1 slot
⚫1* SIM card slot
LAN Chip
⚫Integrated with 2* Intel i211AT Gigabit Ethernet LAN chip
⚫Support Fast Ethernet LAN function of providing 10/100/1000Mbps
Ethernet data transfer rate
Storage
⚫1* SATAIII port (SATA1)
⚫1*M.2 M-key, type-2242, SATA interface slot
Audio Chip
⚫C-Media HS-100B USB Audio IC
BIOS
⚫AMI 64MB Flash ROM
Rear I/O
⚫1* 12V DC-in system power Jack
⚫1* DVI-D port
⚫1* HDMI port
⚫2* Serial port (COM1/COM2,COM1 support RS232/422/485 function)
⚫4* USB 3.0 port
⚫2* RJ-45 LAN port
⚫1* Line-out port
⚫1* MIC port
Internal I/O
⚫1* 2-Pin Internal 12V DC-in power connector
⚫1* SATA Power-out connector
⚫1* CPUFAN header & 2* SYSFAN header
⚫1* Front panel audio header

3
⚫1* Front panel header
⚫1* Power LED & speaker header
⚫1* 9-pin USB 2.0 header (Expansible to 2* USB 2.0 ports)
⚫1* PS/2 keyboard & mouse header
⚫4* RS232 serial port header(COM3/4/5/6)
⚫1* SMBUS header/I2C
⚫1* GPIO_CON header
⚫1* LVDS header
⚫1* LVDS inverter header
* Note: 1. Many PCs now include XHCI USB controllers which allow for the support of USB 3.0 and higher USB
speeds. This inclusion of XHCI controllers has lessened the need for EHCI USB controllers within platforms.
However, legacy operating systems (OS) may not natively recognize XHCI controllers. You might need to
pre-install XHCI driver while desiring to install a non-xHCI OS (ex.Windows* 7) on Intel platforms which do not
include EHCI controllers. Please contact your representative for more details. 2. Braswell SOC will support
memory speed at 1600 MHz and 1066 MHz only. If 1333 MHz DIMM is installed, it will run at 1066 MHz. It is not
validated while installing 1066MHz DIMM with this SOC.
1-3 Layout Diagram
Rear IO Panel Diagram:
Warning!
The board has a DC 12V power connector (DCIN) in I/O back panel and an internal ATX12V
(ATX2P) power connector. User can only connect one type of compatible power supply to one
of them to power the system.
RJ-45 LAN Ports
USB 3.0 Ports
DVI-D Port
COM1
Serial Port
DC-in 12V
Power
Connector
HDMI Port
COM2
Serial Port
Line-Out Port
MIC Port

4
Motherboard Internal Diagram
Note: SODIMM module should be 1.35V DDRIII SODIMM and not exceeding 8GB total capacity.
Internal 12V DC-in
Power connector
SYSFAN1 Header
*DDR3L SODIMM Slot
(SODIMM1)
DVI-D Port
over HDMI Port
RJ-45 LAN Ports
over USB 3.0 Ports
Serial Ports
12V DC -in
Power Connector
Line-Out Port
over MIC Port
Full-size
Mini-PCIE
Slot (MPE)
Front Panel
Audio Header
PCI Express x1 Slot
SATAIII Port
SATA Hard Disk
Power-Out Connector
Power LED Header &
Speaker Header
SYSFAN2 Header
Front Panel
Header
Serial Port Headers
(COM3/4/5/6)
GPIO Header
Intel CPU
Full-size
Mini-SATA
Slot (MSATA1)
CPUFAN Header
SIM Card Slot
LVDS Inverter
SMBUS Header
LVDS Header
USB 2.0 Header
PS2KBMS
Header
LANLED Headers

5
Jumper Position:
JPCOM2
JPCOM1
JBAT
JPLED
JAT_COPEN
JPLCD
JPCOM3
JPCOM4
JPCOM5
JPCOM6