Intel DBPXA210 Technical manual

Intel®DBPXA250 and DBPXA210
Development Platform for Intel®
Personal Internet Client
Architecture
Specification Update
July 2002
Notice: The Intel®DBPXA250 andDBPXA210 Development Platform for Intel®Personal Internet
Client Architecture may contain design defects or errors known as errata which may cause the
product to deviate from published specifications. Current characterized errata are documented in
this specification update. Order Number: 278555-002

DBPXA250 and DBPXA210 Development Platforms Specification Update
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
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INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The DBPXA250 and DBPXA210 Development Platform for Intel®Personal Internet Client Architecture may contain design defects or errors known as
errata which may cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800-
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AlertVIEW, i960, AnyPoint, AppChoice, BoardWatch, BunnyPeople, CablePort, Celeron, Chips, Commerce Cart, CT Connect, CT Media, Dialogic,
DM3, EtherExpress, ETOX, FlashFile, GatherRound, i386, i486, iCat, iCOMP, Insight960, InstantIP, Intel, Intel logo, Intel386, Intel486, Intel740,
IntelDX2, IntelDX4, IntelSX2, Intel ChatPad, Intel Create&Share, Intel Dot.Station, Intel GigaBlade, Intel InBusiness, Intel Inside, Intel Inside logo, Intel
NetBurst, Intel NetStructure, Intel Play, Intel Play logo, Intel Pocket Concert, Intel SingleDriver, Intel SpeedStep, Intel StrataFlash, Intel TeamStation,
Intel WebOutfitter, Intel Xeon, Intel XScale, Itanium, JobAnalyst, LANDesk, LanRover, MCS, MMX, MMX logo, NetPort, NetportExpress, Optimizer
logo, OverDrive, Paragon, PC Dads, PC Parents, Pentium, Pentium II Xeon, Pentium III Xeon, Performance at Your Command, ProShare,
RemoteExpress, Screamline, Shiva, SmartDie, Solutions960, Sound Mark, StorageExpress, The Computer Inside, The Journey Inside, This Way In,
TokenExpress, Trillium, Vivonic, and VTune are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and
other countries.
Copyright © Intel Corporation, 2002
*Third-party brands and names are the property of their respective owners.

DBPXA250 and DBPXA210 Development Platforms Specification Update 3
Revision History............................................................................................................. 5
Preface.......................................................................................................................... 6
Affected Documents/Related Documents................................................................6
Nomenclature...........................................................................................................7
General Information .................................................................................................8
Summary of Changes.................................................................................................... 9
Codes Used in Summary Table...............................................................................9
Intel®BBPXA2xx Development Baseboard ................................................................ 12
Intel®DCPXA250 Processor Card.............................................................................. 16
Intel®DCPXA210 Processor Card............................................................................... 21

DBPXA250 and DBPXA210 Development Platforms Specification Update 5
Revision History
Date of
Revision Version Description
May 2002 -001 Public Release
July 2002 -002
Removed 1, 2, 3, 4, 5, 6, 7, 8, 9, from Intel® BBPXA2xx Development
Baseboard.
Removed 1, 2, 4, 5, 6, 11, 12 from Intel® DCPXA250 processor card.
Modified 12, 14 on the BBPXA2xx Development Baseboard.
Modified 7, 9, 10, and 13 on the DCPXA250 processor card.
Modified 1on the DCPXA210 processor card.
Added steppings matrix

6DBPXA250 and DBPXA210 Development Platforms Specification Update
Preface
Preface
This document is an update to the specifications contained in the Affected Documents/Related
Documents table below. This document is a compilation of device and documentation errata,
specification clarifications and changes. It is intended for hardware system manufacturers and
software developers of applications, operating systems, or tools.
We have endeavored to include all documented errata in the consolidation process; however, we
make no representations or warranties concerning the completeness of the Intel®DBPXA250 and
DBPXA210 Development Platforms for Intel®Personal Internet Client Architecture Specification
Update. This document may also contain information that was not previously published.
Information types defined in Nomenclature are consolidated into the specification update and are
no longer published in other documents.
This document may also contain information that was not previously published.
Affected Documents/Related Documents
Title Order
Intel®DBPXA250 Development Platform for Intel®PCA User’s Guide 278507
Intel® PXA250 and PXA210 Applications Processors Developer’s Manual 278522
Intel® PXA250 and PXA210 Applications Processors Design Guide 278523
Intel® PXA250 and PXA210 Applications Processors Specification Update 278534

DBPXA250 and DBPXA210 Development Platforms Specification Update 7
Preface
Nomenclature
Errata are design defects or errors. These may cause the Intel®DBPXA250 and DBPXA210
Development Platforms for Intel®PCA behavior to deviate from published specifications.
Hardware and software designed to be used with any given stepping must assume that all errata
documented for that stepping are present on all devices unless otherwise noted.
Documentation Changes include typos, errors, or omissions from the current published
specifications. These changes will be incorporated in the next release of the document.
Specification Clarifications describe a specification in greater detail or further highlight a
specification’s impact to a complex design situation. These clarifications will be incorporated in
any new release of the document.
Specification Changes are modifications to the current published specifications. These changes
will be incorporated in the next release of the document.
Note: Errata remain in the specification update throughout the product’s lifecycle, or until a particular
stepping is no longer commercially available. Under these circumstances, errata removed from the
specification update are archived and available upon request. Specification changes, specification
clarifications and documentation changes are removed from the specification update when the
appropriate changes are made to the appropriate product specification or user documentation
(datasheets, manuals, etc.).

8DBPXA250 and DBPXA210 Development Platforms Specification Update
Preface
General Information
Figure 1 and Figure 2 show the markings for the DCPXA250 and DCPXA210 processor cards.
DCPXA210
Figure 1. Intel®DCPXA250 Processor Card Markings
Figure 2. Intel®DCPXA210 Processor Card Markings
Intel
®
DCPXA250 32 Rev C/D
S/N
Intel Corp.
Austin, TX
Name of the card 32-Bit Processor Revision Letter (C/D) Card Serial Numbe
r
Intel
®
DCPXA210 16 Rev A
S/N
Intel Corp.
Austin, TX
Name of the card 16-Bit Processor Revision Letter (A) Card Serial Number

DBPXA250 and DBPXA210 Development Platforms Specification Update 9
Summary of Changes
Summary of Changes
The following tables indicates the errata, specification changes, specification clarifications, or
documentation changes which apply to the Intel®DBPXA250 and DBPXA210 Development
Platforms for Intel®PCA. This document covers these components of the development platform:
the Intel® BBPXA2xx development baseboard, the Intel®DCPXA250 processor card, and the
Intel®DCPXA210 processor card. Intel may fix some of the errata in a future stepping of the
component and account for the other outstanding issues through documentation or specification
changes as noted. This table uses the following notations:
Codes Used in Summary Table
X: Errata exists in the stepping indicated. Specification Change or
Clarification that applies to this stepping.
(No mark) or (Blank
box): This erratum is fixed in listed stepping or specification change does not apply to listed stepping.
Plan Fix: This erratum may be fixed in a future stepping of the product.
Fixed: This erratum has been previously fixed.
No Fix: There are no plans to fix this erratum.
Doc: Intel intends to update the appropriate documentation in a future
revision.
Shaded: This item is either new or modified from the previous version of the
document.

10 DBPXA250 and DBPXA210 Development Platforms Specification Update
Summary of Changes
Note: Fixed refers to latest revision of the board and does not refer to earlier revisions. Some ECOs have
specific Intel®PXA250 and PXA210 applications processors stepping requirements.
Summary of BBPXA2xx Development Baseboard ECOs
ECO NO. Rev A Rev B Refer
to: Status ECO Description
1-9 These errata apply to a previously released stepping.
10 XX12 Fixed “UCB1400 Generates Interrupts Incorrectly”
11 XX12 Fixed “USB Cable Attach/Detach Detection Interrupt Is
Constantly Asserted”
12 X X 13 No Fix “100-MHz SDRAM Failure”
13 There is no ECO 13.
14 X13 Fixed “LCD Touch Screen Intermittently Fails”
15 X15 Fixed “New Philips UCB1400 Audio Codec on BBPXA2xx Development Baseboard Requires Software
Change”
16 XX15 No Fix “Conditional ECO To Use 3.3-V PCMCIA Cards”
17 XX15 No Fix “Conditional ECO To Use The Expansion Port J26”
18 XX15 No Fix “Conditional ECO For USB “Soft Connect” Support”
Summary of DCPXA250 Processor Card ECOs
ECO NO. Rev C Rev D Refer
to: Status ECO Description
1-2 These errata apply to a previously released stepping.
3X16 Fixed “VCC_PLL And VCC_CORE Pin Voltage Must Be
Equal”
4-5 These errata apply to a previously released stepping.
6XFixed “50-MHz SDRAM Requires 0-ohm Resistors”
7X X 17 Fixed “For ARM* Multi-ICE* JTAG Use”
8X18 Fixed “Excessive Oscillator Output Voltage to PEXTAL Pin”
9X X 19 Fixed “Coin Cell Battery Issue”
10 X X 19 Plan Fix “Signal Integrity Problems On SDCLK”
11-12 These errata apply to a previously released stepping.
13 X X 20 Plan Fix “VCC Core Voltage Change”
Summary of DCPXA210 Processor Card ECOs (Sheet 1 of 2)
ECO NO. Rev A Refer to: Status ECO Description
1X21 No Fix “For Multi-ICE JTAG Use”
2X21 No Fix “MMC MMCLK Support”

DBPXA250 and DBPXA210 Development Platforms Specification Update 11
Summary of Changes
3X21 No Fix “PLL Voltage Too High”
4X22 No Fix “Remove Coin Cell Battery”
5X22 No Fix “Incorrect Boot Mode Selected For PXA210 Processor”
Table 1. Minimal Required ECOs for Intel® PXA250 and PXA210 Processor Cards and
Intel® BBPXA2xx Baseboards with B1 and B2 Silicon
Platform B1 Stepping B2 Stepping
BBPXA2xx Rev B 10,11, 12, 14,15 10,11, 12, 14,15
DCPXA250 D/C Rev C 3, 6, 7, 8, 9, 10, 13 3, 6, 7, 8, 9, 10, 13
DCPXA250 D/C Rev D 7, 9, 10, 13 7, 9, 10, 13
DCPXA250 D/C Rev E — —
DCPXA250 D/C Rev F — —
DCPXA210 D/C Rev A 1, 2, 3, 4, 51, 2, 3, 4, 5
NOTE: Intel recommends that customers should have the minimum platform revisions as listed below:
• B1 silicon or later
• Rev C DCPXA250 processor cards†
• Rev A DCPXA210 processor cards
• Rev B BBPXA2xx Development Baseboards
†Rev F DCPXA250 processor cards are recommended for systems using 100-MHz SDRAM
Summary of DCPXA210 Processor Card ECOs (Sheet 2 of 2)
ECO NO. Rev A Refer to: Status ECO Description

12 DBPXA250 and DBPXA210 Development Platforms Specification Update
Intel®BBPXA2xx Development Baseboard
Intel®BBPXA2xx Development
Baseboard
10. UCB1400 Generates Interrupts Incorrectly
Problem: The Philips UCB1400 interrupt signal is inverted.
Implication: The UCB1400 generates interrupts incorrectly.
Workaround: Reprogram FPGA U53/U54 with latest code. Refer to http://developer.intel.com for latest FPGA
updates.
Status: Fixed
Board Rev: Rev A and B
11. USB Cable Attach/Detach Detection Interrupt Is Constantly Asserted
Problem: Due to the hardware implementation of the USB cable detection feature, either the attach or detach
interrupt is constantly asserted depending on the attach or detach state of the cable.
Implication: Software does not know if there is a connect or disconnect. Incorrect USB state can be read
Workaround: Perform the following steps to fix the problem.
1. Replace U12, MAX6348XR40 with MAX6379XR44.
2. Update U53/U54 with the latest code. Refer to http://developer.intel.com for latest FPGA
updates.
One bit was added in the Miscellaneous Read register, bit 9, for cable detection state. Bit 9: logic
low = attach, logic high = detach. There are now two interrupt register bits both in the Interrupt
Mask/Enable and Interrupt Set/Clear registers to handle USB cable attach/detach states. Bit 2 is the
interrupt bit for attach and bit 6 is the interrupt bit for detach in both registers. Users must use each
register’s associated mask-bit accordingly. That is, users cannot clear the attach interrupt register if
the USB cable is attached. Users must determine the state of the cable attach using bit 9 in the
Miscellaneous Read register and then mask the associated interrupt bit in the Interrupt Mask/
Enable register. Refer to the Intel®DBPXA250 and DBPXA210 Development Platforms for Intel®
Personal Internet Client Architecture User’s Guide for more information.
Status: Fixed
Board Rev: Rev A and B

DBPXA250 and DBPXA210 Development Platforms Specification Update 13
Intel®BBPXA2xx Development Baseboard
12. 100-MHz SDRAM Failure
Problem: Excessive ringing on SDCLK pin.
Implication: SDRAM does not run at 100 MHz.
Workaround: For 100-MHz SDRAM development, Intel recommends using Rev F of the DCPXA250 processor
card in addition to this workaround. Contact your local Intel representative for availability.
Add a resistor termination network at the end of the SDCLK1 clock line.
1. Locate C68 on the top of the BBPXA2xx development baseboard. Solder one end of a
100-ohm, 0805 resistor to the plus (+) side of C68. Point this 100-ohm, 0805 resistor straight
up.
2. Solder one end of a 470-ohm, 0805 resistor to the ground side of C68. Point the 470-ohm,
0805 resistor straight up.
3. Connect the open sides of both the 100-ohm and 470-ohm resistors together with a small
gauge rework-wire.
4. Connect this junction to U40, pin 44.
Status: No Fix
Board Rev: Rev A and B
14. LCD Touch Screen Intermittently Fails
Problem: LCD screen is open to excessive noise disruption on the touch screen.
Implication: Excessive noise disruption reduces LCD screen display quality. The touch screen may not work
correctly.
Note: BBPXA2xx development baseboards received after December 2001 do not require this ECO. The
manufacturing process was changed to incorporate this ECO.
Workaround: Fix this problem by covering the back light inverter with copper foil shielding tape to decrease the
electrical noise transferred to the LCD and Touch Screen.
Material Needed:
•1-inch heat shrink tubing.
•2-inch wide EMI Copper Foil Shielding Tape.
Procedure:
1. Disassemble the BBPXA2xx development baseboard touch screen enclosure.
2. Remove the back light inverter.
3. Cut a piece of heat shrink tubing (1”x3”) and place over the inverter.
4. Heat the tubing until it collapses on the inverter.
5. Cut a 2”x5” piece of copper tape and place on clear plastic disk covering the inverter. The
adhesive side should face the plastic.
6. Cut a 2”x5” piece of copper tape and place on the black plastic disk under the inverter. The
adhesive side should face the back of the LCD metal enclosure.
7. Reassemble the touch screen enclosure.

14 DBPXA250 and DBPXA210 Development Platforms Specification Update
Intel®BBPXA2xx Development Baseboard
Status: Fixed
Board Rev: Rev B
Figure 3. LCD Picture 1
Figure 4. LCD Picture 2
Figure 5. LCD Picture 3

DBPXA250 and DBPXA210 Development Platforms Specification Update 15
Intel®BBPXA2xx Development Baseboard
15. New Philips UCB1400 Audio Codec on BBPXA2xx Development Baseboard
Requires Software Change
Problem: There is a new revision of the Philips UCB1400 audio codec. BBPXA2xx development baseboards
are now using UCB1400 Rev 2A (CB0829). The previous revision of the UCB1400 is Rev 1B
(CA5878). There are software changes that are required to support the new revision of the
UCB1400.
Implication: Current production versions of BBPXA2xx development baseboards use the new revision of the
UCB1400.
Workaround: Versions of Windows CE and Diagnostic Manager released after April 1st, 2002 automatically
detect the revision of the UCB1400 and configure it accordingly. Users writing their own software
for the UCB1400 should refer to the latest Philips UCB1400 documentation to ensure they are
configuring the new revision appropriately.
Status: Fixed
Board Rev: Rev B
16. Conditional ECO To Use 3.3-V PCMCIA Cards
Problem: The BBPXA2xx development baseboard does not support 3.3-V PCMCIA cards because it has a
5-V PCMCIA slot.
Implication: 3.3-V PCMCIA cards cannot be inserted into the 5-V slot.
Workaround: Replace 5-V PC-card header connector (part #535651-1) on the BBPXA2xx I/O board with 3.3-V
PC-card header connector (part #535651-2).
Status: No Fix
Board Rev: Rev A and B
17. Conditional ECO To Use The Expansion Port J26
Problem: The BBPXA2xx development baseboard does not support interfacing to the expansion port J26.
The X-RDY signal is tied low via R76B. This renders the port inactive.
Implication: Users of the BBPXA2xx development baseboard cannot use the expansion bus for development.
Workaround: Remove R76B and update U46 with the latest CPLD code. Refer to http://developer.intel.com for
latest CPLD updates.
Status: No Fix
Board Rev: Rev A and B
18. Conditional ECO For USB “Soft Connect” Support
Problem: The UDC+ signal is pulled-up to 3.3 V via resistor R109B (bottom of the baseboard).
Implication: Development of applications using the USB “soft-connect” feature that are supported by some
operating systems cannot be developed on the BBPXA2xx development baseboard.
Workaround: Lift the 1.5-Kohm resistor, R109B (turn it side ways to disconnect it from +3.3 V). The 3.3 V side
is closest to the edge of the board and connect the wire from lifted side of this resistor to J20 pin5.
Status: No Fix
Board Rev: Rev A and B

16 DBPXA250 and DBPXA210 Development Platforms Specification Update
Intel®DCPXA250 Processor Card
Intel®DCPXA250 Processor Card
3. VCC_PLL And VCC_CORE Pin Voltage Must Be Equal
Problem: The Intel®PXA250 and PXA210 Application Processors Developer’s Manual states VCC_PLL
requires VCC_CORE voltage instead of a separate voltage supply.
Implication: The PXA250 processor may not work if VCC_PLL is not equal to VCC_CORE.
Workaround: Perform the following steps to fix the problem.
1. Remove R9.
2. Add a 30-AWG wire from the R9 pad (inductor L2 side) to the positive side of C29. This can
be done on the top of the board.
Status: Fixed
Board Rev: Rev C
6. 50-MHz SDRAM Requires 0-ohm Resistors
Problem: Incorrect value resistor packs installed on Rev C DCPXA250 processor cards.
Implication: SDRAM at 50 MHz could fail.
Workaround: Replace RP7, RP8, RP9, RP12, RP13, RP15, RP16, RP17, RP18, RP19, RP20, RP21B, RP23B,
RP25B, RP26B, RP27B, RP28B with a 0-ohm resistor pack (Bourns CAY16-000J4). 0-ohm
resistors are recommended by the Intel® PXA250 and PXA210 Applications Processors Design
Guide.
Status: Fixed
Board Rev: Rev C
Figure 6. R9 Pad to C29

DBPXA250 and DBPXA210 Development Platforms Specification Update 17
Intel®DCPXA250 Processor Card
7. For ARM* Multi-ICE* JTAG Use
Problem: JTAG connection fails when using ARM Multi-ICE tools.
Implication: No JTAG debugging facility is available with ARM Multi-ICE.
Workaround: Perform the following steps to fix the problem.
Note: This ECO does not affect the performance of other JTAG tools.
1. Cut the trace on the top of the processor card between U1 pin 3 and via to the right.
2. Add 30-AWG wire from the J3-3 to the via of U1 pin 1 on the bottom of the processor card.
Note: Step 3 is not required for the Rev C and Rev D DCPXA250 processor cards and ARM Multi-ICE
with their own power supply.
3. Add a 30-AWG wire from J3-2 to +3.3 V.
Status: Fixed
Board Rev: Rev C and D
Figure 7. Wire From The J3-3 To The Via Of U1 Pin 1
Figure 8. Schematic Of JTAG Modification

18 DBPXA250 and DBPXA210 Development Platforms Specification Update
Intel®DCPXA250 Processor Card
8. Excessive Oscillator Output Voltage to PEXTAL Pin
Problem: On systems using an oscillator to drive PEXTAL, the 3.3 V output from the oscillator is too high.
Implication: Possible damage to chip.
Workaround: Follow the steps below:
Note: These steps bring the oscillator voltage down to 1.1 V. The oscillator and core voltages need to be
equal.
1. Attach one side of a 430-ohm resistor to the bottom (on the bottom of the processor card) of
TP19 (ground).
2. Attach a 30-AWG wire from the remaining side of the 430-ohm to crystal X1 (The pin closest
to the edge of the board).
3. Attach one side of a 620-ohm resistor to the junction of the wire and the 430-ohm resistor. The
two resistors will “sandwich” the wire going to X1.
4. Attach another 30-AWG wire from the +3.3 V oscillator output (bottom of U7) to the open end
of the 620-ohm resistor.
Status: Fixed
Board Rev: Rev C
Figure 9. Voltage Divider
Figure 10. Close-up of Voltage Divider

DBPXA250 and DBPXA210 Development Platforms Specification Update 19
Intel®DCPXA250 Processor Card
9. Coin Cell Battery Issue
Problem: Specification change to BATT_VCC. Stop using the backup battery and connect BATT_VCC to
VCCQ.
Implication: VCCQ might attempt to charge battery if BATT_VCC is lower than VCCQ
Workaround: For Rev C boards:
1. Remove CR2032 coin cell battery from battery holder B1.
2. Remove the 0-ohm resistor R23B.
3. Install, on the bottom of the board, a 30-AWG wire between TP11 (red) and J8 pin 1 (VCCQ).
For Rev D boards:
1. Remove CR2032 coin cell battery from battery holder B1.
2. Remove the 0-ohm resistor R23B.
3. Install, on the bottom of the board, a 30-AWG wire between TP11 (red) and TP30 (red).
Status: Fixed
Board Rev: Rev C and D
10. Signal Integrity Problems On SDCLK
Problem: Signal integrity problems on SDCLK.
Implication: Unstable operation with 100-MHz SDCLK.
Workaround: For 100-MHz SDRAM development, Intel recommends using Rev F of the DCPXA250 processor
card in place of this procedure. Contact your local Intel representative for availability.
Use the following procedure to improve the SDCLK signal integrity.
1. Cut the trace exiting U10B, pin 38 on the bottom of the DCPXA250 processor card.
2. Update CPLD U4 with latest code. Refer to http://developer.intel.com for latest CPLD
updates. This adjusts the voltage (VCC) from +1.2 V to +1.4 V.
Status: Plan Fix
Board Rev: Rev C and D
Figure 11. U10B Trace Cut Pin 38

20 DBPXA250 and DBPXA210 Development Platforms Specification Update
Intel®DCPXA250 Processor Card
13. VCC Core Voltage Change
Problem: VCC core voltage requires change.
Implication: Unstable operation at 400 MHz.
Workaround: Update U4 CPLD with latest code. Refer to http://developer.intel.com.
Status: Plan Fix
Board Rev: Rev C & Rev D cards