Intel X3350 - Xeon 2.66 Ghz 12M L2 Cache 1333MHz FSB LGA775 Quad-Core... Guide

Order Number: 323107-002US
Intel®Xeon®Processor
C5500/C3500 Series and LGA1366
Socket
Thermal/Mechanical Design Guide
August 2010

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
2Order Number: 323107-002US
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Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
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The Intel®Xeon®Processor C5500/C3500 Series and LGA1366 socket may contain design defects or errors known as errata which
may cause the product to deviate from published specifications. Current characterized errata are available on request.
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Copyright © 2010, Intel Corporation.

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 3
Contents
1Introduction..............................................................................................................8
1.1 Reference Documents..........................................................................................9
1.2 Definition of Terms..............................................................................................9
2 Package Mechanical Specifications ..........................................................................11
2.1 Package Mechanical Specifications.......................................................................11
2.1.1 Package Mechanical Drawing....................................................................12
2.1.2 Processor Component Keep-Out Zones......................................................15
2.1.3 Package Loading Specifications ................................................................15
2.1.4 Package Handling Guidelines.................................................................... 15
2.1.5 Package Insertion Specifications...............................................................15
2.1.6 Processor Mass Specification....................................................................16
2.1.7 Processor Materials................................................................................. 16
2.1.8 Processor Markings.................................................................................16
2.1.9 Processor Land Coordinates.....................................................................17
3 LGA1366 Socket ......................................................................................................18
3.1 Board Layout....................................................................................................20
3.2 Attachment to Motherboard ................................................................................21
3.3 Socket Components...........................................................................................21
3.3.1 Socket Body Housing..............................................................................21
3.3.2 Solder Balls...........................................................................................21
3.3.3 Contacts ............................................................................................... 22
3.3.4 Pick and Place Cover...............................................................................22
3.4 Package Installation / Removal ........................................................................... 23
3.4.1 Socket Standoffs and Package Seating Plane..............................................23
3.5 Durability.........................................................................................................24
3.6 Markings..........................................................................................................24
3.7 Component Insertion Forces ...............................................................................24
3.8 Socket Size ......................................................................................................24
3.9 LGA1366 Socket NCTF Solder Joints.....................................................................24
4 Independent Loading Mechanism (ILM)...................................................................26
4.1 Design Concept.................................................................................................26
4.1.1 ILM Cover Assembly Design Overview.......................................................26
4.1.2 ILM Back Plate Design Overview............................................................... 27
4.2 Assembly of ILM to a Motherboard.......................................................................28
5 LGA1366 Socket and ILM Electrical, Mechanical and Environmental Specifications ..31
5.1 Component Mass...............................................................................................31
5.2 Package/Socket Stackup Height .......................................................................... 31
5.3 Socket Maximum Temperature............................................................................31
5.4 Loading Specifications........................................................................................33
5.4.1 Board Deflection Guidance.......................................................................33
5.5 Electrical Requirements...................................................................................... 34
5.6 Environmental Requirements ..............................................................................35
6Thermal Specifications ............................................................................................36
6.1 Package Thermal Specifications...........................................................................36
6.1.1 Thermal Specifications ............................................................................ 36
6.1.2 Thermal Metrology .................................................................................47
6.2 Processor Thermal Features................................................................................48
6.2.1 Processor Temperature ...........................................................................48
6.2.2 Adaptive Thermal Monitor........................................................................48

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
4Order Number: 323107-002US
6.2.3 THERMTRIP# Signal................................................................................51
6.3 Platform Environment Control Interface (PECI) ......................................................51
6.3.1 Introduction...........................................................................................51
6.3.2 PECI Specifications .................................................................................53
7ThermalSolutions....................................................................................................54
7.1 Performance Targets..........................................................................................54
7.2 Heat Pipe Considerations ....................................................................................56
7.3 Assembly..........................................................................................................57
7.3.1 Thermal Interface Material (TIM) ..............................................................58
7.4 Structural Considerations....................................................................................58
7.5 Thermal Design.................................................................................................59
7.5.1 Thermal Characterization Parameter..........................................................59
7.5.2 NEBS Thermal Profile ..............................................................................60
7.5.3 Power Thermal Utility..............................................................................61
7.6 Thermal Features...............................................................................................61
7.6.1 Fan Speed Control ..................................................................................61
7.6.2 PECI Averaging and Catastrophic Thermal Management...............................62
7.6.3 Intel®Turbo Boost Technology.................................................................62
7.6.4 Absolute Processor Temperature...............................................................63
7.6.5 Custom Heat Sinks For UP ATCA...............................................................63
8 Quality and Reliability Requirements .......................................................................66
8.1 Use Conditions ..................................................................................................66
8.2 Intel Reference Component Validation ..................................................................67
8.2.1 Board Functional Test Sequence ...............................................................67
8.2.2 Post-Test Pass Criteria.............................................................................68
8.2.3 Recommended BIOS/Processor/Memory Test Procedures .............................68
8.3 Material and Recycling Requirements....................................................................68
A Component Suppliers...............................................................................................70
B Mechanical Drawings ...............................................................................................72
C Socket Mechanical Drawings....................................................................................89

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 5
Figures
1-1 Intel®Xeon®Processor C5500/C3500 Series Socket Stack-up .......................................8
2-1 Processor Package Assembly Sketch .........................................................................11
2-2 Processor Package Drawing (Sheet 1 of 2)................................................................. 13
2-3 Processor Package Drawing (Sheet 2 of 2)................................................................. 14
2-4 Processor Top-Side Markings ...................................................................................16
2-5 Processor Land Coordinates and Quadrants, Bottom View............................................17
3-1 LGA1366 Socket with Pick and Place Cover Removed .................................................. 18
3-2 LGA1366 Socket Contact Numbering (Top View of Socket)...........................................19
3-3 LGA1366 Socket Land Pattern (Top View of Board) ..................................................... 20
3-4 Attachment to Motherboard..................................................................................... 21
3-5 Pick and Place Cover...............................................................................................22
3-6 Package Installation / Removal Features ...................................................................23
3-7 LGA1366 NCTF Solder Joints....................................................................................25
4-1 ILM Cover Assembly ............................................................................................... 27
4-2 Back Plate.............................................................................................................28
4-3 ILM Assembly ........................................................................................................29
4-4 Pin1 and ILM Lever.................................................................................................30
5-1 Socket Temperature Measurement Location............................................................... 32
5-2 Flow Chart of Knowledge-Based Reliability Evaluation Methodology............................... 35
6-1 Intel®Xeon®Processor EC5549 and EC5509 Thermal Profile ....................................... 37
6-2 Intel®Xeon®Processor EC3539 and EC5539 Thermal Profile ...................................... 39
6-3 Intel®Xeon®Processor LC5528 Thermal Profile.........................................................40
6-4 Intel®Xeon®Processor LC5518 Thermal Profile.........................................................42
6-5 Intel®Celeron®Processor P1053 Thermal Profile.......................................................43
6-6 Intel®Xeon®Processor LC3528 Thermal Profile.........................................................44
6-7 Intel®Xeon®Processor LC3518 Thermal Profile.........................................................46
6-8 TTV Case Temperature (TCASE) Measurement Location...............................................47
6-9 Frequency and Voltage Ordering ..............................................................................49
7-1 1U Heatsink Performance Curves.............................................................................. 55
7-2 ATCA Heatsink Performance Curves.......................................................................... 56
7-3 TTV Die Size and Orientation ................................................................................... 57
7-4 1U Reference Heatsink Assembly..............................................................................57
7-5 Processor Thermal Characterization Parameter Relationships........................................59
7-6 NEBS Thermal Profile..............................................................................................60
7-7 UP ATCA Thermal Solution.......................................................................................64
7-8 UP ATCA System Layout..........................................................................................64
7-9 UP ATCA Heat Sink Drawing ....................................................................................65
B-1 Board Keepin / Keepout Zones (Sheet 1 of 4) ............................................................73
B-2 Board Keepin / Keepout Zones (Sheet 2 of 4) ............................................................74
B-3 Board Keepin / Keepout Zones (Sheet 3 of 4) ............................................................75
B-4 Board Keepin / Keepout Zones (Sheet 4 of 4) ............................................................76
B-5 1U Reference Heatsink Assembly (Sheet 1 of 2) .........................................................77
B-6 1U Reference Heatsink Assembly (Sheet 2 of 2) .........................................................78
B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2).....................................................79
B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2).....................................................80
B-9 Heatsink Shoulder Screw (1U, 2U, and Tower) ...........................................................81
B-10 Heatsink Compression Spring (1U, 2U, and Tower) .....................................................82
B-11 Heatsink Retaining Ring (1U, 2U, and Tower).............................................................83
B-12 Heatsink Load Cup (1U, 2U, and Tower).................................................................... 84
B-13 ATCA Reference Heatsink Assembly (Sheet 1 of 2)......................................................85
B-14 ATCA Reference Heatsink Assembly (Sheet 2 of 2)......................................................86
B-15 ATCA Reference Heatsink Fin and Base (Sheet 1 of 2).................................................87
B-16 ATCA Reference Heatsink Fin and Base (Sheet 2 of 2).................................................88

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
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C-1 Socket Mechanical Drawing - (Sheet 1 of 4) ...............................................................90
C-2 Socket Mechanical Drawing - (Sheet 2 of 4) ...............................................................91
C-3 Socket Mechanical Drawing - (Sheet 3 of 4) ...............................................................92
C-4 Socket Mechanical Drawing - (Sheet 4 of 4) ...............................................................93
Tables
1-1 Reference Documents .............................................................................................. 9
1-2 Terms and Descriptions ............................................................................................ 9
2-1 Processor Loading Specifications...............................................................................15
2-2 Package Handling Guidelines....................................................................................15
2-3 Processor Materials.................................................................................................16
5-1 Socket Component Mass..........................................................................................31
5-2 1366-land Package and LGA1366 Socket Stackup Height .............................................31
5-3 Socket and ILM Mechanical Specifications ..................................................................33
5-4 Electrical Requirements for LGA1366 Socket...............................................................34
6-1 Intel®Xeon®Processor EC5549 and EC5509 Thermal Specifications .............................37
6-2 Intel®Xeon®Processor EC5549 and EC5509 Thermal Profile........................................38
6-3 Intel®Xeon®Processor EC3539 and EC5539 Thermal Specifications ............................38
6-4 Intel®Xeon®Processor EC3539 and EC5539 Thermal Profile.......................................39
6-5 Intel®Xeon®Processor LC5528 Thermal Specifications ...............................................40
6-6 Intel®Xeon®Processor LC5528 Thermal Profile .........................................................41
6-7 Intel®Xeon®Processor LC5518 Thermal Specifications ...............................................41
6-8 Intel®Xeon®Processor LC5518 Thermal Profile .........................................................42
6-9 Intel®Celeron®Processor P1053 Thermal Specifications .............................................43
6-10 Intel®Celeron®Processor P1053 Thermal Profile........................................................43
6-11 Intel®Xeon®Processor LC3528 Thermal Specifications ...............................................44
6-12 Intel®Xeon®Processor LC3528 Thermal Profile .........................................................45
6-13 Intel®Xeon®Processor LC3518 Thermal Specifications ...............................................45
6-14 Intel®Xeon®Processor LC3518 Thermal Profile .........................................................46
6-15 GetTemp0() Error Codes..........................................................................................53
7-1 Boundary Conditions and Performance Targets ...........................................................54
7-2 Fan Speed Control, TCONTROL and DTS Relationship...................................................61
7-3 TCONTROL Guidance...............................................................................................62
8-1 Server Use Conditions Environment (System Level).....................................................66
8-2 Server Use Conditions Environment (System Level).....................................................67
A-1 Heatsinks and Thermal Interface Material ..................................................................70
A-2 LGA1366 Socket and ILM Components.......................................................................71
B-1 Mechanical Drawing List ..........................................................................................72
C-1 Mechanical Drawing List ..........................................................................................89

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 7
Revision History
§ §
Revision Number Description Revision Date
002 Modified Table 5-3, Socket and ILM Mechanical Specifications
Modified Section 7.6.1, Fan Speed Control August 2010
001 First release February 2010

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 8
Introduction
1Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for processors in the Picket Post platform. The components described in this document
include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back
plate.
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Other processor specifications are provided in the Intel®Xeon®Processor C5500/
C3500 Series Datasheet.
Figure 1-1. Intel®Xeon®Processor C5500/C3500 Series Socket Stack-up
Heatsink
Socket and ILM
Back Plate

Introduction
Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
9Order Number: 323107-002US
1.1 Reference Documents
Material and concepts in the following documents may be beneficial when reading this
document.
Notes:
1. See http://developer.intel.com/design/intarch/xeon5000/documentation.htm
2. See http://www.intel.com/p/en_US/products/server/processor/xeon5000/tools
3. Available at http://www.blauer-engel.de
4. Available at http://ssiforum.oaktree.com/
1.2 Definition of Terms
Table 1-1. Reference Documents
Document Document# Notes
European Blue Angel Recycling Standards 3
Intel®Xeon®Processor C5500/C3500 Series Datasheet, Volume 1 323103 1
Intel®Xeon®Processor C5500/C3500 Series Datasheet, Volume 2 323317 1
Intel®Xeon®Processor 5500 Series Mechanical Model 321326 2
Intel®Xeon®Processor 5500 Series Thermal Model 321327 2
Entry-level Electronics Bay Specification 4
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1366-LGA land
package onto the socket contacts.
IMON The current monitor input to the CPU. The VRM tells the CPU how much current it is
drawing.
LGA1366 socket The processor mates with the system board through this surface mount, 1366-land
socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
ΨCA Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (TCASE – TLA) / Total
Package Power. Heat source should always be specified for Ψmeasurements.
ΨCS Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (TCASE – TS) / Total
Package Power.
ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (TS– TLA) / Total Package Power.
TCASE The case temperature of the processor, measured at the geometric center of the topside
of the IHS.
TCASE_MAX The maximum case temperature as specified in a component specification.

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
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Introduction
§
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature
by using clock modulation and/or operating frequency and input voltage adjustment
when the die temperature is very near its operating limits.
TCONTROL Tcontrol is a static value below TCC activation used as a trigger point for fan speed
control.
TDP Thermal Design Power: Thermal solution must be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Thermal Profile Line that defines case temperature specification of a processor at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
TLA The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
TSA The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
UA unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U
equals 3.50 in, etc.
Table 1-2. Terms and Descriptions (Sheet 2 of 2)
Term Description

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 11
Package Mechanical Specifications
2Package Mechanical
Specifications
2.1 Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array (FC-LGA6) package that
interfaces with the motherboard via an LGA1366 socket. The package consists of a
processor mounted on a substrate land-carrier. An integrated heat spreader (IHS) is
attached to the package substrate and core and serves as the mating surface for
processor component thermal solutions, such as a heatsink. Figure 2-1 shows a sketch
of the processor package components and how they are assembled together. See
Section 3 and Section 4.
The package components shown in Figure 2-1 include the following:
• Integrated Heat Spreader (IHS)
• Thermal Interface Material (TIM)
• Processor core (die)
• Package substrate
• Capacitors
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
Figure 2-1. Processor Package Assembly Sketch
IHS
Substrate
LGA1366 Socket
System Board
Capacitors
TIM
IHS
Substrate
LGA
System Board
Capacitors
Die TIM

Package Mechanical Specifications
Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
12 Order Number: 323107-002US
2.1.1 Package Mechanical Drawing
The package mechanical drawings are shown in Figure 2-2 and Figure 2-3. The
drawings include dimensions necessary to design a thermal solution for the processor.
These dimensions include:
1. Package reference with tolerances (total height, length, width, etc.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 13
Package Mechanical Specifications
Figure 2-2. Processor Package Drawing (Sheet 1 of 2)
8 7 6 5 4 3 2
H
G
F
E
D C
B A
8 7 6 5 4 3 2 1
H
G
F
E
D C
B A
AA
R
D
E
C
C
4X RM
1
M
2
M
3
F4
F2
B1 C1
C3
B2
C2
C4
G
2
G
1
H1
H2
J1
J2
0.02
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
D76126 1 7
DWG. NO SHT. REV
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
D76126 1 7
DWG. NO SHT. REV
DEPARTMENT
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
TITLE
EMTS DRAWING
SIZE DRAWING NUMBER REV
A1 D76126 7
SCALE: 2:1
DO NOT SCALE DRAWING
SHEET 1OF 2
FINISHMATERIAL DATEAPPROVED BY DATECHECKED BY DATEDRAWN BY DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MILLIMETERS
ALL UNTOLERANCED LINEAR
DIMENSIONS ±0
ANGLES ± 0.5
THIRD ANGLE PROJECTION
SEE DETAIL B
SEE DETAIL B
SEE DETAIL B
SEE DETAIL B
IHS LID
SEE DETAIL B
PIN 1
SEE DETAIL C
PIN 1
BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42
SEE DETAIL A
SECTION A-A
DETAIL A SCALE 20:1
PACKAGE SUBSTRATE IHS SEALANT
IHS LID
DETAIL C
SCALE 20:1
DETAIL B
SUBSTRATE ALIGNMENT FIDUCIAL
X5
SCALE 35:1
SYMBOL MILLIMETERS COMMENTS
MIN MAX
B144.93 45.07 B242.43 42.57
C138.9 39.1 1CE
C236.4 36.6 1CD
C32.2 2.3
C42.2 2.3
F24.377 4.757 F42.498 2.896
G142.672 BASIC
G240.64 BASIC
H121.336 BASIC
H220.32 BASIC
J11.016 BASIC
J21.016 BASIC
M10.19 0.23 M20.88 0.96 M30.53 0.61
0.203
0.08
0.203 C
0.203 C D E 0.071 C
0.05
0.203 C

Package Mechanical Specifications
Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
14 Order Number: 323107-002US
Figure 2-3. Processor Package Drawing (Sheet 2 of 2)
H
G
F
E
D C
B A
H
G
F
E
D C
B A
8 7 6 5 4 3 2
8 7 6 5 4 3 2 1
R
H
H
H
C
9.455
7.2
1.06 MAX COMPONENT HEIGHT
T1
T2
V1
V2
2X 36.5
2X 39
14.4
18.91
E G
E
G
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION. THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
D76126 2 7
DWG. NO SHT. REV
DEPARTMENT
2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119
SIZE DRAWING NUMBER REV
A1 D76126 7
SCALE: 2:1
DO NOT SCALE DRAWING
SHEET 2OF 2
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39 41 43
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42
SEE DETAIL D
SEE DETAIL E
BA AY AW AV AU AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A
DETAIL D SCALE 15:1
0.23 C H E
M N
NM
R2
DETAIL E
SCALE 15:1
0.23 C H G
J K
KJ
R1
4X
SURFACE
TEST PAD AREA
SYMBOL MILLIMETERS COMMENTS
MIN MAX
R1R1.09 -- R2R1.09 --
T10.2 --
T211.7 --
V10.2 --
V211.7 --

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 15
Package Mechanical Specifications
2.1.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component
keep-out zone requirements. A thermal and mechanical solution design must not
intrude into the required keep-out zones. Do not contact the Test Pad Area with
conductive material. Decoupling capacitors are typically mounted to either the topside
or land-side of the package substrate. See Figure 2-2 and Figure 2-3 for keep-out
zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in.
2.1.3 Package Loading Specifications
Table 2-1 provides load specifications for the processor package. These maximum
limits should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Exceeding these limits during test may result in component
failure. The processor substrate should not be used as a mechanical reference or load-
bearing surface for thermal solutions.
.
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum static force that can be applied by the heatsink and Independent Loading Mechanism
(ILM).
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package constrained by the limits of the processor socket.
4. Dynamic loading is defined as an 11 ms duration average load superimposed on the static load
requirement.
2.1.4 Package Handling Guidelines
Table 2-2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
2.1.5 Package Insertion Specifications
The processor can be inserted into and removed from a LGA1366 socket 15 times. The
socket should meet the LGA1366 requirements detailed in Section 5.
Table 2-1. Processor Loading Specifications
Parameter Maximum Notes
Static Compressive Load 890 N [200 lbf] 1, 2, 3
Dynamic Compressive Load 1779 N [400 lbf] [max static
compressive + dynamic load] 1, 3, 4
Table 2-2. Package Handling Guidelines
Parameter Maximum Recommended
Shear 70 lbs
Tensile 25 lbs
Torque 35 in.lbs

Package Mechanical Specifications
Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
16 Order Number: 323107-002US
2.1.6 Processor Mass Specification
The typical mass of the processor is 35 grams. This mass [weight] includes all the
components that are included in the package.
2.1.7 Processor Materials
Table 2-3 lists some of the package components and associated materials.
2.1.8 Processor Markings
Figure 2-4 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 2-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 2-4. Processor Top-Side Markings
GRP1LINE1
GRP1LINE2
G2L1
G2L2 G3L1 G3L2
Legend: Mark Text (Engineering Mark):
GRP1LINE1: INTEL{M}{C}’YY
GRP1LINE2: INTEL CONFIDENTIAL
GRP1LINE3: QDF ES XXXXX
GRP1LINE4: FORECAST-NAME
GRP1LINE5: {FPO} {e4}
Legend: Mark Text (Production Mark):
GRP1LINE1: INTEL{M}{C}’YY PROC#
GRP1LINE2: SUB-BRAND
GRP1LINE3: SSPEC XXXXX
GRP1LINE4: SPEED/CACHE/INTC
GRP1LINE5: {FPO} {e4}

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 17
Package Mechanical Specifications
2.1.9 Processor Land Coordinates
Figure 2-5 shows the bottom view of the processor land coordinates. The coordinates
are referred to throughout the document to identify processor lands.
.
§
Figure 2-5. Processor Land Coordinates and Quadrants, Bottom View

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 18
LGA1366 Socket
3LGA1366 Socket
This section describes a surface mount, LGA (Land Grid Array) socket intended for the
Intel®Xeon®processor C5500/C3500 series in the Picket Post platform. The socket
provides I/O, power and ground contacts. The socket contains 1366 contacts arrayed
about a cavity in the center of the socket with lead-free solder balls for surface
mounting on the motherboard.
The socket has 1366 contacts with 1.016 mm X 1.016 mm pitch (X by Y) in a 43 x 41
grid array with 21 x 17 grid depopulation in the center of the array and selective
depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The design includes a back plate which is integral to having
a uniform load on the socket solder joints. Socket loading specifications are listed in
Section 5.
Figure 3-1. LGA1366 Socket with Pick and Place Cover Removed
socket
cavity
package socket
cavity
package

LGA1366 Socket
Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
Thermal/Mechanical Design Guide August 2010
19 Order Number: 323107-002US
Figure 3-2. LGA1366 Socket Contact Numbering (Top View of Socket)

Intel®Xeon®Processor C5500/C3500 Series and LGA1366 Socket
August 2010 Thermal/Mechanical Design Guide
Order Number: 323107-002US 20
LGA1366 Socket
3.1 Board Layout
The land pattern for the LGA1366 socket is 40 mils X 40 mils (X by Y), and the pad size
is 18 mils. There is no round-off (conversion) error between socket pitch (1.016 mm)
and board pitch (40 mil) because these values are equivalent.
In general, metal defined (MD) pads perform better than solder mask defined (SMD)
pads under thermal cycling, and SMD pads perform better than MD pads under
dynamic stress. Recommendations for pad definition on a per pad basis do not exist for
the LGA1366 socket.
The 40 mil spacing results in a reduced drill keepout as compared to previous
platforms. Drill keepout is explained in section 3.2.1 of the Intel®Xeon®5500 Platform
Design Guide (PDG). Select PCB suppliers are capable of producing 40 mil spacing.
Figure 3-3. LGA1366 Socket Land Pattern (Top View of Board)
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW BA
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY BB
1
3
7
5
9
11
15
13
17
19
23
21
25
27
31
29
1
3
7
5
9
11
15
13
17
19
23
21
25
27
31
29
2
8
4
6
10
16
12
14
18
24
20
22
26
32
28
30
2
8
4
6
10
16
12
14
18
24
20
22
26
32
28
30
16
12
15
13
14
17
18
24
20 19
23
21
22
25
26
32
28 27
31
29
30
33
34
40
36 35
39
37
38
41
42 43