Intel E6700 - Core 2 Duo Dual-Core Processor Guide

Document Number: 318734-017
Intel®Core™2 Duo Processor
E8000∆and E7000∆Series, Intel®
Pentium®Dual-Core Processor
E6000∆and E5000∆Series, and
Intel®Celeron®Processor E3000∆
Series
Thermal and Mechanical Design Guidelines
November 2010

2 Thermal and Mechanical Design Guidelines
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Thermal and Mechanical Design Guidelines 3
Contents
1Introduction...................................................................................................... 9
1.1 Document Goals and Scope...................................................................... 9
1.1.1 Importance of Thermal Management............................................ 9
1.1.2 Document Goals........................................................................ 9
1.1.3 Document Scope ......................................................................10
1.2 References............................................................................................11
1.3 Definition of Terms.................................................................................11
2Processor Thermal/Mechanical Information ..........................................................13
2.1 Mechanical Requirements........................................................................13
2.1.1 Processor Package....................................................................13
2.1.2 Heatsink Attach........................................................................15
2.1.2.1 General Guidelines.....................................................15
2.1.2.2 Heatsink Clip Load Requirement ..................................15
2.1.2.3 Additional Guidelines..................................................16
2.2 Thermal Requirements ...........................................................................16
2.2.1 Processor Case Temperature......................................................16
2.2.2 Thermal Profile.........................................................................17
2.2.3 Thermal Solution Design Requirements .......................................17
2.2.4 TCONTROL ...................................................................................18
2.3 Heatsink Design Considerations...............................................................19
2.3.1 Heatsink Size...........................................................................20
2.3.2 Heatsink Mass..........................................................................20
2.3.3 Package IHS Flatness................................................................21
2.3.4 Thermal Interface Material.........................................................21
2.4 System Thermal Solution Considerations ..................................................22
2.4.1 Chassis Thermal Design Capabilities............................................22
2.4.2 Improving Chassis Thermal Performance .....................................22
2.4.3 Summary ................................................................................23
2.5 System Integration Considerations...........................................................23
3Thermal Metrology............................................................................................25
3.1 Characterizing Cooling Performance Requirements.....................................25
3.1.1 Example..................................................................................26
3.2 Processor Thermal Solution Performance Assessment.................................27
3.3 Local Ambient Temperature Measurement Guidelines .................................27
3.4 Processor Case Temperature Measurement Guidelines................................30
4Thermal Management Logic and Thermal Monitor Feature......................................31
4.1 Processor Power Dissipation....................................................................31
4.2 Thermal Monitor Implementation.............................................................31
4.2.1 PROCHOT# Signal ....................................................................32
4.2.2 Thermal Control Circuit .............................................................32
4.2.2.1 Thermal Monitor ........................................................32
4.2.3 Thermal Monitor 2 ....................................................................33
4.2.4 Operation and Configuration ......................................................34
4.2.5 On-Demand Mode.....................................................................35

4 Thermal and Mechanical Design Guidelines
4.2.6 System Considerations..............................................................35
4.2.7 Operating System and Application Software Considerations ...........36
4.2.8 THERMTRIP# Signal..................................................................36
4.2.9 Cooling System Failure Warning .................................................36
4.2.10 Digital Thermal Sensor..............................................................37
4.2.11 Platform Environmental Control Interface (PECI) ..........................38
5Balanced Technology Extended (BTX) Thermal/Mechanical Design Information.........39
5.1 Overview of the BTX Reference Design .....................................................39
5.1.1 Target Heatsink Performance .....................................................39
5.1.2 Acoustics.................................................................................40
5.1.3 Effective Fan Curve...................................................................41
5.1.4 Voltage Regulator Thermal Management......................................42
5.1.5 Altitude ...................................................................................43
5.1.6 Reference Heatsink Thermal Validation........................................43
5.2 Environmental Reliability Testing .............................................................43
5.2.1 Structural Reliability Testing ......................................................43
5.2.1.1 Random Vibration Test Procedure ................................43
5.2.1.2 Shock Test Procedure.................................................44
5.2.2 Power Cycling ..........................................................................45
5.2.3 Recommended BIOS/CPU/Memory Test Procedures ......................46
5.3Material and Recycling Requirements........................................................46
5.4 Safety Requirements..............................................................................47
5.5 Geometric Envelope for Intel®Reference BTX Thermal Module Assembly......47
5.6 Preload and TMA Stiffness.......................................................................48
5.6.1 Structural Design Strategy.........................................................48
5.6.2 TMA Preload verse Stiffness.......................................................48
6ATX Thermal/Mechanical Design Information........................................................51
6.1 ATX Reference Design Requirements........................................................51
6.2 Validation Results for Reference Design....................................................53
6.2.1 Heatsink Performance ...............................................................53
6.2.2 Acoustics.................................................................................54
6.2.3 Altitude ...................................................................................54
6.2.4 Heatsink Thermal Validation.......................................................55
6.3 Environmental Reliability Testing .............................................................55
6.3.1 Structural Reliability Testing ......................................................55
6.3.1.1 Random Vibration Test Procedure ................................55
6.3.1.2 Shock Test Procedure.................................................56
6.3.2 Power Cycling ..........................................................................57
6.3.3 Recommended BIOS/CPU/Memory Test Procedures ......................58
6.4 Material and Recycling Requirements........................................................58
6.5 Safety Requirements..............................................................................59
6.6 Geometric Envelope for Intel®Reference ATX Thermal Mechanical Design.....59
6.7 Reference Attach Mechanism...................................................................60
6.7.1 Structural Design Strategy.........................................................60
6.7.2 Mechanical Interface to the Reference Attach Mechanism ..............61
7Intel®Quiet System Technology (Intel®QST) ......................................................63
7.1 Intel®QST Algorithm..............................................................................63
7.1.1 Output Weighting Matrix............................................................64
7.1.2 Proportional-Integral-Derivative (PID).........................................64
7.2 Board and System Implementation of Intel®QST.......................................66

Thermal and Mechanical Design Guidelines 5
7.3 Intel®QST Configuration and Tuning........................................................68
7.4 Fan Hub Thermistor and Intel®QST .........................................................68
Appendix A LGA775 Socket Heatsink Loading........................................................................69
A.1 LGA775 Socket Heatsink Considerations ...................................................69
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant with Intel®
Reference Design...................................................................................69
A.3 Heatsink Preload Requirement Limitations.................................................69
A.3.1 Motherboard Deflection Metric Definition......................................70
A.3.2 Board Deflection Limits..............................................................71
A.3.3 Board Deflection Metric Implementation Example .........................72
A.3.4 Additional Considerations...........................................................73
A.3.4.1 Motherboard Stiffening Considerations .........................74
A.4 Heatsink Selection Guidelines..................................................................74
Appendix B Heatsink Clip Load Metrology .............................................................................75
B.1 Overview ..............................................................................................75
B.2 Test Preparation ....................................................................................75
B.2.1 Heatsink Preparation.................................................................75
B.2.2 Typical Test Equipment .............................................................78
B.3 Test Procedure Examples........................................................................78
B.3.1 Time-Zero, Room Temperature Preload Measurement ...................79
B.3.2 Preload Degradation under Bake Conditions.................................79
Appendix C Thermal Interface Management..........................................................................81
C.1 Bond Line Management ..........................................................................81
C.2 Interface Material Area ...........................................................................81
C.3 Interface Material Performance................................................................81
Appendix D Case Temperature Reference Metrology...............................................................83
D.1 Objective and Scope...............................................................................83
D.2 Supporting Test Equipment.....................................................................83
D.3 Thermal Calibration and Controls.............................................................85
D.4 IHS Groove...........................................................................................85
D.5 Thermocouple Attach Procedure...............................................................89
D.5.1 Thermocouple Conditioning and Preparation.................................89
D.5.2Thermocouple Attachment to the IHS..........................................90
D.5.3 Solder Process .........................................................................95
D.5.4 Cleaning and Completion of Thermocouple Installation..................98
D.6 Thermocouple Wire Management...........................................................102
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations ..................103
Appendix F Fan Performance for Reference Design ..............................................................107
Appendix G Mechanical Drawings.......................................................................................109
Appendix H Intel® Enabled Reference Solution Information ...................................................125

6 Thermal and Mechanical Design Guidelines
Figures
Figure 2-1. Package IHS Load Areas ...................................................................13
Figure 2-2. Processor Case Temperature Measurement Location.............................17
Figure 2-3. Example Thermal Profile....................................................................18
Figure 3-1. Processor Thermal Characterization Parameter Relationships.................26
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX Heatsink29
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink ...29
Figure 4-1. Thermal Monitor Control....................................................................33
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering..............................34
Figure 4-3. TCONTROL for Digital Thermal Sensor.....................................................37
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion ..............................42
Figure 5-2. Random Vibration PSD......................................................................44
Figure 5-3. Shock Acceleration Curve..................................................................44
Figure 5-4. Intel®Type II TMA 65W Reference Design...........................................47
Figure 5-5. Upward Board Deflection During Shock ...............................................48
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
Stiffness....................................................................................................49
Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features.......50
Figure 6-1. E18764-001 Reference Design – Exploded View...................................52
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease.......................52
Figure 6-3. Random Vibration PSD......................................................................56
Figure 6-4. Shock Acceleration Curve..................................................................56
Figure 6-5. Upward Board Deflection during Shock................................................60
Figure 6-6. Reference Clip/Heatsink Assembly......................................................61
Figure 6-7. Critical Parameters for Interfacing to Reference Clip.............................62
Figure 6-8. Critical Core Dimension.....................................................................62
Figure 7-1. Intel®QST Overview ........................................................................64
Figure 7-2. PID Controller Fundamentals .............................................................65
Figure 7-3. Intel®QST Platform Requirements .....................................................66
Figure 7-4. Example Acoustic Fan Speed Control Implementation...........................67
Figure 7-5. Digital Thermal Sensor and Thermistor ...............................................68
Figure 7-6. Board Deflection Definition................................................................71
Figure 7-7. Example—Defining Heatsink Preload Meeting Board Deflection Limit.......73
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View ..76
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View ......77
Figure 7-10. Preload Test Configuration...............................................................77
Figure 7-11. Omega Thermocouple.....................................................................84
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit.....86
Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock Exit (Old
Drawing)...................................................................................................87
Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package ................88
Figure 7-15. IHS Groove at 6 o’clock Exit Orientation Relative to the LGA775 Socket 88
Figure 7-16. Inspection of Insulation on Thermocouple..........................................89
Figure 7-17. Bending the Tip of the Thermocouple................................................90
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach..........90
Figure 7-19. Thermocouple Bead Placement.........................................................91
Figure 7-20. Position Bead on the Groove Step.....................................................92
Figure 7-21. Detailed Thermocouple Bead Placement ............................................92
Figure 7-22. Third Tape Installation ....................................................................93
Figure 7-23. Measuring Resistance between Thermocouple and IHS........................93
Figure 7-24. Applying Flux to the Thermocouple Bead...........................................94
Figure 7-25. Cutting Solder................................................................................94
Figure 7-26. Positioning Solder on IHS ................................................................95

Thermal and Mechanical Design Guidelines 7
Figure 7-27. Solder Station Setup.......................................................................96
Figure 7-28. View Through Lens at Solder Station.................................................97
Figure 7-29. Moving Solder back onto Thermocouple Bead.....................................97
Figure 7-30. Removing Excess Solder..................................................................98
Figure 7-31. Thermocouple placed into groove .....................................................99
Figure 7-32. Removing Excess Solder..................................................................99
Figure 7-33. Filling Groove with Adhesive ..........................................................100
Figure 7-34. Application of Accelerant ...............................................................100
Figure 7-35. Removing Excess Adhesive from IHS ..............................................101
Figure 7-36. Finished Thermocouple Installation.................................................101
Figure 7-37. Thermocouple Wire Management....................................................102
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified .104
Figure 7-39. Thermal sensor Location Illustration ...............................................105
Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1 ...........................................110
Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2 ...........................................111
Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3 ...........................................112
Figure 7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1.........................113
Figure 7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2.........................114
Figure 7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3.........................115
Figure 7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4.........................116
Figure 7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5.........................117
Figure 7-48. ATX Reference Clip – Sheet 1.........................................................118
Figure 7-49. ATX Reference Clip - Sheet 2 .........................................................119
Figure 7-50. Reference Fastener - Sheet 1.........................................................120
Figure 7-51. Reference Fastener - Sheet 2.........................................................121
Figure 7-52. Reference Fastener - Sheet 3.........................................................122
Figure 7-53. Reference Fastener - Sheet 4.........................................................123
Figure 7-54. Intel®E18764-001 Reference Solution Assembly..............................124
Tables
Table 2–1. Heatsink Inlet Temperature of Intel®Reference Thermal Solutions..........22
Table 2–2. Heatsink Inlet Temperature of Intel®Boxed Processor Thermal Solutions.22
Table 5–1. Balanced Technology Extended (BTX) Type II Reference TMA Performance39
Table 5–2. Acoustic Targets ...............................................................................40
Table 5–3. VR Airflow Requirements....................................................................42
Table 5–4. Processor Preload Limits....................................................................49
Table 6–1. E18764-001 Reference Heatsink Performance ......................................53
Table 6–2. Acoustic Results for ATX Reference Heatsink (E18764-001)....................54
Table 7–1. Board Deflection Configuration Definitions............................................70
Table 7–2. Typical Test Equipment......................................................................78
Table 7–3. Fan Electrical Performance Requirements...........................................107
Table 7–4. Intel®Representative Contact for Licensing Information of BTX Reference
Design ....................................................................................................125
Table 7–5. E18764-001 Reference Thermal Solution Providers .............................125
Table 7–6. BTX Reference Thermal Solution Providers.........................................126

8 Thermal and Mechanical Design Guidelines
Revision History
Revision
Number Description Revision
001 •Initial release. January 2008
002 •Added Intel®Core™2 Duo processor E8300 and E7200 April 2008
003 •Added Intel®Core™2 Duo processor E8600 and E7300 August 2008
004 •Added Intel®Pentium dual-core processor E5200 August 2008
005 •Added Intel®Core™2 Duo processor E7400 October 2008
006 •Added Intel®Pentium dual-core processor E5300 December 2008
007 •Added Intel®Pentium dual-core processor E5400
•Added Intel®Core™2 Duo processor E7500 January 2009
008 •Added Intel®Pentium dual-core processor E6300 May 2009
009 •Added Intel®Core™2 Duo processor E7600 June 2009
010 •Added Intel®Pentium dual-core processor E6500 August 2009
011 •Intel®Celeron®processor E3x00 series August 2009
012 •Added Intel®Pentium dual-core processor E6600
•Intel®Celeron®processor E3400 January 2010
013 •Added Intel®Pentium dual-core processor E5500 April 2010
014 •Added Intel®Pentium dual-core processor E6700 June 2010
015 •Added Intel®Pentium dual-core processor E5700 August 2010
016
•Added Intel®Pentium dual-core processor E6800
•Added Intel®Celeron®processor E3500
•Changed the processor numbering from Intel Celeron processor E3x00
series to Intel Celeron processor E3000 series.
August 2010
017 •Added Intel®Pentium dual-core processor E5800 November 2010
§

Introduction
Thermal and Mechanical Design Guidelines 9
1Introduction
1.1 Document Goals and Scope
1.1.1 Importance of Thermal Management
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within their functional temperature range.
Within this temperature range, a component is expected to meet its specified
performance. Operation outside the functional temperature range can degrade system
performance, cause logic errors or cause component and/or system damage.
Temperatures exceeding the maximum operating limit of a component may result in
irreversible changes in the operating characteristics of this component.
In a system environment, the processor temperature is a function of both system and
component thermal characteristics. The system level thermal constraints consist of the
local ambient air temperature and airflow over the processor as well as the physical
constraints at and above the processor. The processor temperature depends in
particular on the component power dissipation, the processor package thermal
characteristics, and the processor thermal solution.
All of these parameters are affected by the continued push of technology to increase
processor performance levels and packaging density (more transistors). As operating
frequencies increase and packaging size decreases, the power density increases while
the thermal solution space and airflow typically become more constrained or remains
the same within the system. The result is an increased importance on system design
to ensure that thermal design requirements are met for each component, including the
processor, in the system.
1.1.2 Document Goals
Depending on the type of system and the chassis characteristics, new system and
component designs may be required to provide adequate cooling for the processor.
The goal of this document is to provide an understanding of these thermal
characteristics and discuss guidelines for meeting the thermal requirements imposed
on single processor systems using the Intel®Core™2 Duo processor E8000, E7000
series, Intel®Pentium®dual-core processor E6000, E5000 series, and Intel®Celeron®
processor E3000 series.
The concepts given in this document are applicable to any system form factor. Specific
examples used will be the Intel enabled reference solution for ATX/uATX systems. See
the applicable BTX form factor reference documents to design a thermal solution for
that form factor.

Introduction
10 Thermal and Mechanical Design Guidelines
1.1.3 Document Scope
This design guide supports the following processors:
•Intel®Core™2 Duo processor E8000 series with 6 MB cache applies to Intel®
Core™2 Duo processors E8600, E8500, E8400, E8300, E8200, and E8190
•Intel®Core™2 Duo processor E7000 series with 3 MB cache applies to Intel®
Core™2 Duo processors E7600, E7500, E7400, E7300, and E7200
•Intel®Pentium®dual-core processor E5000 series with 2 MB cache applies to
Intel®Pentium®dual-core processors E5800, E5700, E5500, E5400, E5300, and
E5200
•Intel®Pentium®dual-core processor E6000 series with 2 MB cache applies to
Intel®Pentium®dual-core processor E6800, E6700, E6600, E6500, and E6300
•Intel®Celeron®processor E3000 series with 1 MB cache applies to the Intel®
Celeron®processor E3500, E3400, E3300, and E3200
In this document when a reference is made to “the processor” it is intended that this
includes all the processors supported by this document. If needed for clarity, the
specific processor will be listed.
In this document, when a reference is made to the “the reference design” it is
intended that this means ATX reference designs (E18764-001) supported by this
document. If needed for clarify, the specific reference design will be listed.
In this document, when a reference is made to “the datasheet”, the reader should
refer to the Intel®Core™2 Duo Processor E8000 and E7000 Series Datasheet, Intel®
Pentium®Dual-Core Processor E6000 and E5000 Series Datasheet, and Intel®
Celeron®Processor E3000 Series Datasheet. If needed for clarity the specific
processor datasheet will be referenced.
Chapter 2 of this document discusses package thermal mechanical requirements to
design a thermal solution for the processor in the context of personal computer
applications.
Chapter 3 discusses the thermal solution considerations and metrology
recommendations to validate a processor thermal solution.
Chapter 4 addresses the benefits of the processor’s integrated thermal management
logic for thermal design.
Chapter 5 gives information on the Intel reference thermal solution for the processor
in BTX platform.
Chapter 6 gives information on the Intel reference thermal solution for the processor
in ATX platform.
Chapter 7 discusses the implementation of acoustic fan speed control.
The physical dimensions and thermal specifications of the processor that are used in
this document are for illustration only. Refer to the datasheet for the product
dimensions, thermal power dissipation and maximum case temperature. In case of
conflict, the data in the datasheet supersedes any data in this document.