Intel BX80570E8200 - Core 2 Duo 2.66 GHz Processor Guide

Document Number: 318734-011
Intel®Core™2 Duo Processor
E8000and E7000Series, and
Intel®Pentium®Dual-Core
Processor E6000and E5000
Series, and Intel®Celeron®
Processor E3x00Series
Thermal and Mechanical Design Guidelines
August 2009

2 Thermal and Mechanical Design Guidelines
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Thermal and Mechanical Design Guidelines 3
Contents
1Introduction ...................................................................................................11
1.1 Document Goals and Scope ...................................................................11
1.1.1 Importance of Thermal Management ..........................................11
1.1.2 Document Goals......................................................................11
1.1.3 Document Scope .....................................................................12
1.2 References ..........................................................................................13
1.3 Definition of Terms ...............................................................................13
2Processor Thermal/Mechanical Information .........................................................15
2.1 Mechanical Requirements ......................................................................15
2.1.1 Processor Package...................................................................15
2.1.2 Heatsink Attach ......................................................................17
2.1.2.1 General Guidelines....................................................17
2.1.2.2 Heatsink Clip Load Requirement..................................17
2.1.2.3 Additional Guidelines.................................................18
2.2 Thermal Requirements ..........................................................................18
2.2.1 Processor Case Temperature .....................................................18
2.2.2 Thermal Profile .......................................................................19
2.2.3 Thermal Solution Design Requirements ......................................19
2.2.4 TCONTROL..................................................................................20
2.3 Heatsink Design Considerations..............................................................21
2.3.1 Heatsink Size..........................................................................22
2.3.2 Heatsink Mass.........................................................................22
2.3.3 Package IHS Flatness...............................................................23
2.3.4 Thermal Interface Material........................................................23
2.4 System Thermal Solution Considerations .................................................24
2.4.1 Chassis Thermal Design Capabilities...........................................24
2.4.2 Improving Chassis Thermal Performance ....................................24
2.4.3 Summary ...............................................................................25
2.5 System Integration Considerations..........................................................25
3Thermal Metrology ..........................................................................................27
3.1 Characterizing Cooling Performance Requirements ....................................27
3.1.1 Example ................................................................................28
3.2 Processor Thermal Solution Performance Assessment ................................29
3.3 Local Ambient Temperature Measurement Guidelines.................................29
3.4 Processor Case Temperature Measurement Guidelines ...............................32
4Thermal Management Logic and Thermal Monitor Feature .....................................33
4.1 Processor Power Dissipation...................................................................33
4.2 Thermal Monitor Implementation ............................................................33
4.2.1 PROCHOT# Signal ...................................................................34
4.2.2 Thermal Control Circuit ............................................................34
4.2.2.1 Thermal Monitor .......................................................34
4.2.3 Thermal Monitor 2 ...................................................................35
4.2.4 Operation and Configuration .....................................................36

4 Thermal and Mechanical Design Guidelines
4.2.5 On-Demand Mode ...................................................................37
4.2.6 System Considerations.............................................................37
4.2.7 Operating System and Application Software Considerations ...........38
4.2.8 THERMTRIP# Signal.................................................................38
4.2.9 Cooling System Failure Warning ................................................38
4.2.10 Digital Thermal Sensor.............................................................38
4.2.11 Platform Environmental Control Interface (PECI)..........................39
5Balanced Technology Extended (BTX) Thermal/Mechanical Design Information ........41
5.1 Overview of the BTX Reference Design ....................................................41
5.1.1 Target Heatsink Performance ....................................................41
5.1.2 Acoustics ...............................................................................42
5.1.3 Effective Fan Curve .................................................................43
5.1.4 Voltage Regulator Thermal Management.....................................44
5.1.5 Altitude..................................................................................45
5.1.6 Reference Heatsink Thermal Validation .......................................45
5.2 Environmental Reliability Testing ............................................................45
5.2.1 Structural Reliability Testing .....................................................45
5.2.1.1 Random Vibration Test Procedure................................45
5.2.1.2 Shock Test Procedure ................................................46
5.2.2 Power Cycling .........................................................................47
5.2.3 Recommended BIOS/CPU/Memory Test Procedures ......................48
5.3 Material and Recycling Requirements ......................................................48
5.4 Safety Requirements ............................................................................49
5.5 Geometric Envelope for Intel Reference BTX Thermal Module Assembly........49
5.6 Preload and TMA Stiffness .....................................................................50
5.6.1 Structural Design Strategy........................................................50
5.6.2 TMA Preload verse Stiffness ......................................................50
6ATX Thermal/Mechanical Design Information.......................................................53
6.1 ATX Reference Design Requirements .......................................................53
6.2 Validation Results for Reference Design ...................................................55
6.2.1 Heatsink Performance ..............................................................55
6.2.2 Acoustics ...............................................................................56
6.2.3 Altitude..................................................................................56
6.2.4 Heatsink Thermal Validation .....................................................57
6.3 Environmental Reliability Testing ............................................................57
6.3.1 Structural Reliability Testing .....................................................57
6.3.1.1 Random Vibration Test Procedure................................57
6.3.1.2 Shock Test Procedure ................................................58
6.3.2 Power Cycling .........................................................................59
6.3.3 Recommended BIOS/CPU/Memory Test Procedures ......................60
6.4 Material and Recycling Requirements ......................................................60
6.5 Safety Requirements ............................................................................61
6.6 Geometric Envelope for Intel Reference ATX Thermal Mechanical Design ......61
6.7 Reference Attach Mechanism..................................................................62
6.7.1 Structural Design Strategy........................................................62
6.7.2 Mechanical Interface to the Reference Attach Mechanism ..............63
7Intel®Quiet System Technology (Intel®QST) .....................................................65
7.1 Intel®QST Algorithm ............................................................................65
7.1.1 Output Weighting Matrix ..........................................................66
7.1.2 Proportional-Integral-Derivative (PID) ........................................66

Thermal and Mechanical Design Guidelines 5
7.2 Board and System Implementation of Intel®QST ......................................68
7.3 Intel®QST Configuration & Tuning..........................................................70
7.4 Fan Hub Thermistor and Intel®QST ........................................................70
Appendix A LGA775 Socket Heatsink Loading ......................................................................71
A.1 LGA775 Socket Heatsink Considerations ..................................................71
A.2 Metric for Heatsink Preload for ATX/uATX Designs Non-Compliant
with Intel®Reference Design .................................................................71
A.3 Heatsink Preload Requirement Limitations................................................71
A.3.1 Motherboard Deflection Metric Definition.....................................72
A.3.2 Board Deflection Limits ............................................................73
A.3.3 Board Deflection Metric Implementation Example.........................74
A.3.4 Additional Considerations .........................................................75
A.3.4.1 Motherboard Stiffening Considerations .........................76
A.4 Heatsink Selection Guidelines.................................................................76
Appendix B Heatsink Clip Load Metrology............................................................................77
B.1 Overview ............................................................................................77
B.2 Test Preparation...................................................................................77
B.2.1 Heatsink Preparation................................................................77
B.2.2 Typical Test Equipment ............................................................80
B.3 Test Procedure Examples.......................................................................80
B.3.1 Time-Zero, Room Temperature Preload Measurement...................81
B.3.2 Preload Degradation under Bake Conditions ................................81
Appendix C Thermal Interface Management.........................................................................83
C.1 Bond Line Management .........................................................................83
C.2 Interface Material Area..........................................................................83
C.3 Interface Material Performance...............................................................83
Appendix D Case Temperature Reference Metrology..............................................................85
D.1 Objective and Scope .............................................................................85
D.2 Supporting Test Equipment....................................................................85
D.3 Thermal calibration and controls.............................................................87
D.4 IHS Groove .........................................................................................87
D.5 Thermocouple Attach Procedure .............................................................91
D.5.1 Thermocouple Conditioning and Preparation ................................91
D.5.2 Thermocouple Attachment to the IHS.........................................92
D.5.3 Solder Process ........................................................................97
D.5.4 Cleaning & Completion of Thermocouple Installation................... 100
D.6 Thermocouple Wire Management .......................................................... 104
Appendix E Balanced Technology Extended (BTX) System Thermal Considerations.................. 105
Appendix F Fan Performance for Reference Design ............................................................. 109
Appendix G Mechanical Drawings ..................................................................................... 111
Appendix H Intel® Enabled Reference Solution Information .................................................. 127

6 Thermal and Mechanical Design Guidelines
Figures
Figure 2-1. Package IHS Load Areas ..................................................................15
Figure 2-2. Processor Case Temperature Measurement Location ............................19
Figure 2-3. Example Thermal Profile ..................................................................20
Figure 3-1. Processor Thermal Characterization Parameter Relationships.................28
Figure 3-2. Locations for Measuring Local Ambient Temperature, Active ATX
Heatsink .......................................................................................31
Figure 3-3. Locations for Measuring Local Ambient Temperature, Passive Heatsink ...31
Figure 4-1. Thermal Monitor Control ..................................................................35
Figure 4-2. Thermal Monitor 2 Frequency and Voltage Ordering .............................36
Figure 4-3. TCONTROL for Digital Thermal Sensor ....................................................39
Figure 5-1. Effective TMA Fan Curves with Reference Extrusion..............................44
Figure 5-2. Random Vibration PSD ....................................................................46
Figure 5-3. Shock Acceleration Curve.................................................................46
Figure 5-4. Intel Type II TMA 65W Reference Design............................................49
Figure 5-5. Upward Board Deflection During Shock ..............................................50
Figure 5-6. Minimum Required Processor Preload to Thermal Module Assembly
Stiffness .......................................................................................51
Figure 5-7. Thermal Module Attach Pointes and Duct-to-SRM Interface Features ......52
Figure 6-1. E18764-001 Reference Design – Exploded View ..................................54
Figure 6-2. Bottom View of Copper Core Applied by TC-1996 Grease ......................54
Figure 6-3. Random Vibration PSD ....................................................................58
Figure 6-4. Shock Acceleration Curve.................................................................58
Figure 6-5. Upward Board Deflection During Shock ..............................................62
Figure 6-6. Reference Clip/Heatsink Assembly.....................................................63
Figure 6-7. Critical Parameters for Interfacing to Reference Clip.............................64
Figure 6-8. Critical Core Dimension ...................................................................64
Figure 7-1. Intel®QST Overview .......................................................................66
Figure 7-2. PID Controller Fundamentals ............................................................67
Figure 7-3. Intel®QST Platform Requirements ....................................................68
Figure 7-4. Example Acoustic Fan Speed Control Implementation...........................69
Figure 7-5. Digital Thermal Sensor and Thermistor ..............................................70
Figure 7-6. Board Deflection Definition...............................................................73
Figure 7-7. Example: Defining Heatsink Preload Meeting Board Deflection Limit .......75
Figure 7-8. Load Cell Installation in Machined Heatsink Base Pocket – Bottom View ..78
Figure 7-9. Load Cell Installation in Machined Heatsink Base Pocket – Side View ......79
Figure 7-10. Preload Test Configuration..............................................................79
Figure 7-11. Omega Thermocouple....................................................................86
Figure 7-12. 775-LAND LGA Package Reference Groove Drawing at 6 o’clock Exit .....88
Figure 7-13. 775-LAND LGA Package Reference Groove Drawing at 3 o’clock
Exit (Old Drawing)........................................................................89
Figure 7-14. IHS Groove at 6 o’clock Exit on the 775-LAND LGA Package ................90
Figure 7-15. IHS Groove at 6 o’clock Exit Orientation Relative to the
LGA775 Socket ............................................................................90
Figure 7-16. Inspection of Insulation on Thermocouple.........................................91
Figure 7-17. Bending the Tip of the Thermocouple ...............................................92
Figure 7-18. Securing Thermocouple Wires with Kapton* Tape Prior to Attach .........92
Figure 7-19. Thermocouple Bead Placement........................................................93
Figure 7-20. Position Bead on the Groove Step....................................................94
Figure 7-21. Detailed Thermocouple Bead Placement ...........................................94

Thermal and Mechanical Design Guidelines 7
Figure 7-22. Third Tape Installation ...................................................................94
Figure 7-23. Measuring Resistance between Thermocouple and IHS .......................95
Figure 7-24. Applying Flux to the Thermocouple Bead ..........................................96
Figure 7-25. Cutting Solder ..............................................................................96
Figure 7-26. Positioning Solder on IHS ...............................................................97
Figure 7-27. Solder Station Setup .....................................................................98
Figure 7-28. View Through Lens at Solder Station................................................99
Figure 7-29. Moving Solder back onto Thermocouple Bead ....................................99
Figure 7-30. Removing Excess Solder .............................................................. 100
Figure 7-31. Thermocouple placed into groove .................................................. 101
Figure 7-32. Removing Excess Solder .............................................................. 101
Figure 7-33. Filling Groove with Adhesive ......................................................... 102
Figure 7-34. Application of Accelerant .............................................................. 102
Figure 7-35. Removing Excess Adhesive from IHS ............................................. 103
Figure 7-36. Finished Thermocouple Installation ................................................ 103
Figure 7-37. Thermocouple Wire Management................................................... 104
Figure 7-38. System Airflow Illustration with System Monitor Point Area Identified . 106
Figure 7-39. Thermal sensor Location Illustration .............................................. 107
Figure 7-40. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 1 .............................. 112
Figure 7-41. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 2 .............................. 113
Figure 7-42. ATX/µATX Motherboard Keep-out Footprint Definition and Height
Restrictions for Enabling Components - Sheet 3 .............................. 114
Figure 7-43. BTX Thermal Module Keep Out Volumetric – Sheet 1 ........................ 115
Figure 7-44. BTX Thermal Module Keep Out Volumetric – Sheet 2 ........................ 116
Figure 7-45. BTX Thermal Module Keep Out Volumetric – Sheet 3 ........................ 117
Figure 7-46. BTX Thermal Module Keep Out Volumetric – Sheet 4 ........................ 118
Figure 7-47. BTX Thermal Module Keep Out Volumetric – Sheet 5 ........................ 119
Figure 7-48. ATX Reference Clip – Sheet 1........................................................ 120
Figure 7-49. ATX Reference Clip - Sheet 2 ........................................................ 121
Figure 7-50. Reference Fastener - Sheet 1........................................................ 122
Figure 7-51. Reference Fastener - Sheet 2........................................................ 123
Figure 7-52. Reference Fastener - Sheet 3........................................................ 124
Figure 7-53. Reference Fastener - Sheet 4........................................................ 125
Figure 7-54. Intel®E18764-001 Reference Solution Assembly ............................. 126

8 Thermal and Mechanical Design Guidelines
Tables
Table 2–1. Heatsink Inlet Temperature of Intel Reference Thermal Solutions ...........24
Table 2–2. Heatsink Inlet Temperature of Intel Boxed Processor Thermal Solutions ..24
Table 5–1. Balanced Technology Extended (BTX) Type II Reference TMA
Performance...................................................................................41
Table 5–2. Acoustic Targets..............................................................................42
Table 5–3. VR Airflow Requirements ..................................................................44
Table 5–4. Processor Preload Limits ................................................................... 51
Table 6–1. E18764-001 Reference Heatsink Performance......................................55
Table 6–2. Acoustic Results for ATX Reference Heatsink (E18764-001) ...................56
Table 7–1. Board Deflection Configuration Definitions...........................................72
Table 7–2. Typical Test Equipment ....................................................................80
Table 7–3. Fan Electrical Performance Requirements .......................................... 109
Table 7–4. Intel®Representative Contact for Licensing Information of
BTX Reference Design.................................................................... 127
Table 7–5. E18764-001 Reference Thermal Solution Providers............................. 127
Table 7–6. BTX Reference Thermal Solution Providers ........................................ 128

Thermal and Mechanical Design Guidelines 9
Revision History
Revision
Number Description Revision
-001 Initial release. January 2008
-002 Added Intel®Core™2 Duo processor E8300 and E7200 April 2008
-003 Added Intel®Core™2 Duo processor E8600 and E7300 August 2008
-004 Added Intel®Pentium dual-core processor E5200 August 2008
-005 Added Intel®Core™2 Duo processor E7400 October 2008
-006 Added Intel®Pentium dual-core processor E5300 December 2008
-007 Added Intel®Pentium dual-core processor E5400
Added Intel®Core™2 Duo processor E7500
January 2009
-008 Added Intel®Pentium dual-core processor E6300 May 2009
-009 Added Intel®Core™2 Duo processor E7600 June 2009
-010 Added Intel®Pentium dual-core processor E6500 August 2009
-011 Intel®Celeron®processor E3x00 series August 2009
§

10 Thermal and Mechanical Design Guidelines