Intel BX80605X3440 - Quad Core Xeon X3440 Service manual

Reference Number: 322374-001
Intel® Xeon®Processor 3400 Series
and LGA1156 Socket
Thermal/Mechanical Specifications and Design Guidelines
September 2009

2Thermal/Mechanical Specifications and Design Guidelines
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BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS
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life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future
changes to them.
The Intel® Xeon® Processor 3400 Series and LGA1156 socket may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.
ÄIntel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor
family, not across different processor families. See http://www.intel.com/products/processor_number for details. Over time
processor numbers will increment based on changes in clock, speed, cache, FSB, or other features, and increments are not
intended to represent proportional or quantitative increases in any particular feature. Current roadmap processor number
progression is not necessarily representative of future roadmaps. See www.intel.com/products/processor_number for details.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Intel, Xeon, Intel Flexible Display Interface, Intel Core, Intel Thermal Monitor, and the Intel logo are trademarks of Intel
Corporation in the U.S and other countries.
* Other brands and names may be claimed as the property of others.
Copyright © 2008-2009 Intel Corporation.

Thermal/Mechanical Specifications and Design Guidelines 3
Contents
1Introduction..............................................................................................................7
1.1 References .........................................................................................................7
1.2 Definition of Terms ..............................................................................................8
2 Package Mechanical and Storage Specifications....................................................... 11
2.1 Package Mechanical Specifications ....................................................................... 11
2.2 Processor Storage Specifications ......................................................................... 16
3 LGA1156 Socket ...................................................................................................... 17
3.1 Board Layout .................................................................................................... 19
3.2 LGA1156 Socket NCTF Solder Joints..................................................................... 20
3.3 Attachment to Motherboard ................................................................................ 21
3.4 Socket Components........................................................................................... 21
3.5 Package Installation / Removal ........................................................................... 23
3.6 Durability ......................................................................................................... 24
3.7 Markings .......................................................................................................... 25
3.8 Component Insertion Forces ............................................................................... 25
3.9 Socket Size ...................................................................................................... 25
4 Independent Loading Mechanism (ILM)................................................................... 27
4.1 Design Concept................................................................................................. 27
4.2 Assembly of ILM to a Motherboard....................................................................... 30
4.3 ILM Interchangeability ....................................................................................... 31
4.4 Markings .......................................................................................................... 32
5 LGA1156 Socket and ILM Electrical, Mechanical, and Environmental Specifications .33
5.1 Component Mass............................................................................................... 33
5.2 Package/Socket Stackup Height .......................................................................... 33
5.3 Socket Maximum Temperature............................................................................ 33
5.4 Loading Specifications........................................................................................ 34
5.5 Electrical Requirements...................................................................................... 35
5.6 Environmental Requirements .............................................................................. 36
6 Thermal Specifications ............................................................................................ 37
6.1 Thermal Specifications ....................................................................................... 37
6.2 Processor Thermal Features................................................................................ 44
6.3 Platform Environment Control Interface (PECI)...................................................... 48
7 Sensor Based Thermal Specification Design Guidance.............................................. 51
7.1 Sensor Based Specification Overview ................................................................... 51
7.2 Sensor Based Thermal Specification..................................................................... 52
7.3 Thermal Solution Design Process ......................................................................... 54
7.4 Fan Speed Control (FSC) design process............................................................... 56
7.5 System Validation ............................................................................................. 58
8 1U Collaboration Thermal Solution .......................................................................... 59
8.1 Performance Targets.......................................................................................... 59
8.2 Thermal Solution............................................................................................... 62
8.3 Assembly ......................................................................................................... 63
8.4 Geometric Envelope for 1U Thermal Mechanical Design .......................................... 64
8.5 Thermal Interface Material.................................................................................. 64
9 Thermal Solution Quality and Reliability Requirements............................................ 65
9.1 Collaboration Heatsink Thermal Verification .......................................................... 65
9.2 Mechanical Environmental Testing ....................................................................... 65

4Thermal/Mechanical Specifications and Design Guidelines
9.3 Material and Recycling Requirements....................................................................67
10 Boxed Processor Specifications................................................................................69
10.1 Introduction......................................................................................................69
10.2 Mechanical Specifications....................................................................................70
10.3 Electrical Requirements ......................................................................................72
10.4 Thermal Specifications........................................................................................73
A Component Suppliers...............................................................................................77
B Mechanical Drawings ...............................................................................................79
C Socket Mechanical Drawings....................................................................................97
D Package Mechanical Drawings ............................................................................... 103
Figures
2-1 Processor Package Assembly Sketch .......................................................................11
2-2 Package View ......................................................................................................12
2-3 Processor Top-Side Markings .................................................................................14
2-4 Processor Package Lands Coordinates .....................................................................15
3-1 LGA1156 Socket with Pick and Place Cover ..............................................................17
3-2 LGA1156 Socket Contact Numbering (Top View of Socket).........................................18
3-3 LGA1156 Socket Land Pattern (Top View of Board) ...................................................19
3-4 LGA1156 Socket NCTF Solder Joints .......................................................................20
3-5 Attachment to Motherboard ...................................................................................21
3-6 Pick and Place Cover.............................................................................................23
3-7 Package Installation / Removal Features .................................................................24
4-1 ILM Cover Assembly .............................................................................................28
4-2 Back Plate...........................................................................................................28
4-3 Shoulder Screw....................................................................................................29
4-4 ILM Assembly ......................................................................................................30
4-5 Pin 1 and ILM Lever..............................................................................................31
5-1 Flow Chart of Knowledge-Based Reliability Evaluation Methodology .............................36
6-1 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series (95W) .....39
6-2 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series (45W) .....41
6-3 TTV Case Temperature (TCASE) Measurement Location.............................................44
6-4 Frequency and Voltage Ordering ............................................................................46
6-5 Temperature Sensor Data Format...........................................................................49
7-1 Comparison of Case Temperature versus Sensor Based Specification...........................52
7-2 Intel® Xeon® Processor 3400 Series (95W) Thermal Profile........................................53
7-3 Required YCA for Various TAMBIENT Conditions........................................................55
8-1 1U Heatsink Performance Curves............................................................................60
8-2 1U Heatsink Performance Curves............................................................................61
8-3 1U Collaboration Heatsink Assembly .......................................................................63
8-4 KOZ 3-D Model (Top) in 1U Server .........................................................................64
10-1 Boxed Processor Fan Heatsink................................................................................69
10-2 Space Requirements for the Boxed Processor (side view)...........................................70
10-3 Space Requirements for the Boxed Processor (top view)............................................71
10-4 Space Requirements for the Boxed Processor (overall view) .......................................71
10-5 Boxed Processor Fan Heatsink Power Cable Connector Description ..............................72
10-6 Baseboard Power Header Placement Relative to Processor Socket ...............................73
10-7 Boxed Processor Fan Heatsink Airspace Keepout Requirements (top view) ...................74
10-8 Boxed Processor Fan Heatsink Airspace Keepout Requirements (side view) ..................74
10-9 Boxed Processor Fan Heatsink Set Points.................................................................75
B-1 Socket / Heatsink / ILM Keepout Zone Primary Side for 1U(Top).................................80
B-2 Socket / Heatsink / ILM Keepout Zone Secondary Side for 1U(Bottom)........................81

Thermal/Mechanical Specifications and Design Guidelines 5
B-3 Socket / Processor / ILM Keepout Zone Primary Side for 1U(Top) ............................... 82
B-4 Socket / Processor / ILM Keepout Zone Secondary Side for 1U(Bottom) ...................... 83
B-5 1U Collaboration Heatsink Assembly....................................................................... 84
B-6 1U Collaboration Heatsink..................................................................................... 85
B-7 1U Collaboration Heatsink Screw............................................................................ 86
B-8 Heatsink Compression Spring ................................................................................ 87
B-9 Heatsink Load Cup ............................................................................................... 88
B-10 Heatsink Retaining Ring........................................................................................ 89
B-11 Heatsink Backplate Assembly ................................................................................ 90
B-12 Heatsink Backplate .............................................................................................. 91
B-13 Heatsink Backplate Insulator ................................................................................. 92
B-14 Heatsink Backplate Stud ....................................................................................... 93
B-15 Thermocouple Attach Drawing ............................................................................... 94
B-16 1U ILM Shoulder Screw ........................................................................................ 95
B-17 1U ILM Standard 6-32 Thread Fastener................................................................... 96
C-1 Socket Mechanical Drawing (Sheet 1 of 4)............................................................... 98
C-2 Socket Mechanical Drawing (Sheet 2 of 4)............................................................... 99
C-3 Socket Mechanical Drawing (Sheet 3 of 4)............................................................. 100
C-4 Socket Mechanical Drawing (Sheet 4 of 4)............................................................. 101
D-1 Processor Package Drawing (Sheet 1 of 2) ............................................................ 104
D-2 Processor Package Drawing (Sheet 2 of 2) ............................................................ 105
Tables
1-1 Reference Documents.............................................................................................7
1-2 Terms and Descriptions ..........................................................................................8
2-1 Processor Loading Specifications............................................................................ 13
2-2 Package Handling Guidelines ................................................................................. 13
2-3 Processor Materials .............................................................................................. 14
2-4 Storage Conditions............................................................................................... 16
5-1 Socket Component Mass....................................................................................... 33
5-2 1156-land Package and LGA1156 Socket Stackup Height .......................................... 33
5-3 Socket & ILM Mechanical Specifications................................................................... 34
5-4 Electrical Requirements for LGA1156 Socket............................................................ 35
6-1 Intel® Xeon® Processor 3400 Series Thermal Specifications ...................................... 38
6-2 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series (95W) .... 40
6-3 Thermal Test Vehicle Thermal Profile for Intel® Xeon® Processor 3400 Series (45W) .... 41
6-4 Thermal Solution Performance above TCONTROL for the Intel® Xeon®
Processor 3400 Series (95W) ................................................................................ 42
6-5 Thermal Solution Performance above TCONTROL for the Intel® Xeon®
Processor 3400 Series (45W) ................................................................................ 43
6-6 Supported PECI Command Functions and Codes ...................................................... 49
6-7 Error Codes and Descriptions................................................................................. 50
8-1 Boundary Conditions and Performance Targets ........................................................ 59
8-2 Comparison between TTV Thermal Profile and Thermal Solution Performance
for Intel® Xeon® Processor 3400 Series (95W) ........................................................ 61
9-1 Use Conditions (Board Level)................................................................................. 65
10-1 Fan Heatsink Power and Signal Specifications .......................................................... 73
10-2 Fan Heatsink Set Points ........................................................................................ 75
A-1 Collaboration Heatsink Enabled Components ........................................................... 77
A-2 LGA1156 Socket and ILM Components.................................................................... 77
A-3 Supplier Contact Information................................................................................. 77
B-1 Mechanical Drawing List........................................................................................ 79
C-1 Mechanical Drawing List........................................................................................ 97
D-1 Mechanical Drawing List...................................................................................... 103

6Thermal/Mechanical Specifications and Design Guidelines
§
Document
Number Revision Number Description Revision Date
322374 -001 • Initial release September 2009

Thermal/Mechanical Specifications and Design Guidelines 9
Introduction
1Introduction
This document differs from previous Thermal and Mechanical Design Guidelines. In this
document, mechanical and thermal specifications for the processor and the associated
socket are now included. The usual design guidance has been retained.
The components described in this document include:
• The thermal and mechanical specifications for the
—Intel
® Xeon® processor 3400 series
• The LGA1156 socket and the Independent Loading Mechanism (ILM) and back
plate.
• The collaboration design thermal solution (heatsink) for the processors and
associated retention hardware.
The Intel® Xeon® processor 3400 series has two thermal specifications. When required
for clarity this document will use Intel® Xeon® processor 3400 series (95W) or Intel®
Xeon® processor 3400 series (45W).
Note: For Workstation segment, since boundary conditions, ILM assembly and reference
thermal solution etc. are similar to Desktop’s corresponding parts, user could refer to
Intel® Core™ i7-800 and i5-700 Desktop Processor Series and LGA1156 Socket
Thermal/Mechanical Specifications and Design Guidelines.
Note: When the information is applicable to all products, the this document will use
“processor” or “processors” to simplify the document.
1.1 References
Material and concepts available in the following documents may be beneficial when
reading this document.
Table 1-1. Reference Documents
Document Location
Intel® Xeon®Processor 3400 Series Datasheet, Volume 1 www.intel.com/Assets/
PDF/datasheet/322371.pdf
Intel® Xeon®Processor 3400 Series Datasheet, Volume 2 www.intel.com/Assets/
PDF/datasheet/322372.pdf
Intel® Xeon®Processor 3400 Series Specification Update www.intel.com/Assets/
PDF/specupdate/
322173.pdf
Intel®5 Series Chipset and Intel®3400 Chipset Datasheet www.intel.com/Assets/
PDF/datasheet/322169.pdf
Intel®5 Series Chipset and Intel®3400 Chipset Specification Update www.intel.com/Assets/
PDF/specupdate/
322170.pdf
Intel®5 Series Chipset and Intel®3400 Chipset – Thermal Mechanical
Specifications and Design Guidelines www.intel.com/Assets/
PDF/designguide/
322171.pdf
4-Wire Pulse Width Modulation (PWM) Controlled Fans http://
www.formfactors.org/

Introduction
10 Thermal/Mechanical Specifications and Design Guidelines
1.2 Definition of Terms
Table 1-2. Terms and Descriptions (Sheet 1 of 2)
Term Description
Bypass Bypass is the area between a passive heatsink and any object that can act to form a
duct. For this example, it can be expressed as a dimension away from the outside
dimension of the fins to the nearest surface.
CTE Coefficient of Thermal Expansion. The relative rate a material expands during a thermal
event.
DTS Digital Thermal Sensor reports a relative die temperature as an offset from TCC
activation temperature.
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the 1156-LGA land
package onto the socket contacts.
PCH Platform Controller Hub. The PCH is connected to the processor via the Direct Media
Interface (DMI) and Intel® Flexible Display Interface (Intel® FDI).
LGA1156 socket The processor mates with the system board through this surface mount, 1156-land
socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides
a communication channel between Intel processor and chipset components to external
monitoring devices.
Ψ
CA Case-to-ambient thermal characterization parameter (psi). A measure of thermal
solution performance using total package power. Defined as (TCASE – TLA) / Total
Package Power. The heat source should always be specified for Ψ measurements.
Ψ
CS Case-to-sink thermal characterization parameter. A measure of thermal interface
material performance using total package power. Defined as (TCASE – TS) / Total Package
Power.
Ψ
SA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (TS – TLA) / Total Package Power.
TCASE or TCThe case temperature of the processor, measured at the geometric center of the topside
of the TTV IHS.
TCASE_MAX The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by
using clock modulation and/or operating frequency and input voltage adjustment when
the die temperature is very near its operating limits.
TCONTROL TCONTROL is a static value that is below the TCC activation temperature and used as a
trigger point for fan speed control. When DTS > TCONTROL, the processor must comply
with the TTV thermal profile.
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Thermal Profile Line that defines case temperature specification of the TTV at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.

Thermal/Mechanical Specifications and Design Guidelines 11
Introduction
§
TTV Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater
in the die to evaluate thermal solutions.
TLA The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
TSA The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
Table 1-2. Terms and Descriptions (Sheet 2 of 2)
Term Description

Introduction
12 Thermal/Mechanical Specifications and Design Guidelines

Thermal/Mechanical Specifications and Design Guidelines 13
Package Mechanical and Storage Specifications
2Package Mechanical and
Storage Specifications
2.1 Package Mechanical Specifications
The processor is packaged in a Flip-Chip Land Grid Array package that interfaces with
the motherboard via the LGA1156 socket. The package consists of a processor
mounted on a substrate land-carrier. An integrated heat spreader (IHS) is attached to
the package substrate and core and serves as the mating surface for processor thermal
solutions, such as a heatsink. Figure 2-1 shows a sketch of the processor package
components and how they are assembled together. Refer to Chapter 3 and Chapter 4
for complete details on the LGA1156 socket.
The package components shown in Figure 2-1 include the following:
1. Integrated Heat Spreader (IHS)
2. Thermal Interface Material (TIM)
3. Processor core (die)
4. Package substrate
5. Capacitors
Note:
1. Socket and motherboard are included for reference and are not part of processor package.
2. For clarity the ILM is not shown.
Figure 2-1. Processor Package Assembly Sketch
IHS
Substrate
System Board
Capacitors
Core (die) TIM
LGA1156 Socket

Package Mechanical and Storage Specifications
14 Thermal/Mechanical Specifications and Design Guidelines
2.1.1 Package Mechanical Drawing
Figure 2-2 shows the basic package layout and dimensions. The detailed package
mechanical drawings are in Appendix D. The drawings include dimensions necessary to
design a thermal solution for the processor. These dimensions include:
1. Package reference dimensions with tolerances (total height, length, width, and so
forth.)
2. IHS parallelism and tilt
3. Land dimensions
4. Top-side and back-side component keep-out dimensions
5. Reference datums
6. All drawing dimensions are in mm.
2.1.2 Processor Component Keep-Out Zones
The processor may contain components on the substrate that define component keep-
out zone requirements. A thermal and mechanical solution design must not intrude into
the required keep-out zones. Decoupling capacitors are typically mounted to either the
topside or land-side of the package substrate. See Figure B-3 and Figure B-4 for keep-
out zones. The location and quantity of package capacitors may change due to
manufacturing efficiencies but will remain within the component keep-in. This keep-in
zone includes solder paste and is a post reflow maximum height for the components.
Figure 2-2. Package View
37.5
37.5

Thermal/Mechanical Specifications and Design Guidelines 15
Package Mechanical and Storage Specifications
2.1.3 Package Loading Specifications
Tab l e 2 -1 provides dynamic and static load specifications for the processor package.
These mechanical maximum load limits should not be exceeded during heatsink
assembly, shipping conditions, or standard use condition. Also, any mechanical system
or component testing should not exceed the maximum limits. The processor package
substrate should not be used as a mechanical reference or load-bearing surface for
thermal and mechanical solution.
.
Notes:
1. These specifications apply to uniform compressive loading in a direction normal to the processor IHS.
2. This is the maximum static force that can be applied by the heatsink and retention solution to maintain the
heatsink and processor interface.
3. These specifications are based on limited testing for design characterization. Loading limits are for the
package only and do not include the limits of the processor socket.
4. Dynamic loading is defined as an 50g shock load, 2X Dynamic Acceleration Factor with a 500g maximum
thermal solution.
2.1.4 Package Handling Guidelines
Tab l e 2 -2 includes a list of guidelines on package handling in terms of recommended
maximum loading on the processor IHS relative to a fixed substrate. These package
handling loads may be experienced during heatsink removal.
Notes:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization.
2.1.5 Package Insertion Specifications
The processor can be inserted into and removed from an LGA1156 socket 15 times. The
socket should meet the LGA1156 socket requirements detailed in Chapter 5.
2.1.6 Processor Mass Specification
The typical mass of the processor is 21.5g (0.76 oz). This mass [weight] includes all
the components that are included in the package.
Table 2-1. Processor Loading Specifications
Parameter Minimum Maximum Notes
Static Compressive Load — 600 N [135 lbf] 1, 2, 3
Dynamic Compressive
Load
— 712 N [160 lbf] 1, 3, 4
Table 2-2. Package Handling Guidelines
Parameter Maximum Recommended Notes
Shear 311 N [70 lbf] 1, 4
Tensile 111 N [25 lbf] 2, 4
Torque 3.95 N-m [35 lbf-in] 3, 4

Package Mechanical and Storage Specifications
16 Thermal/Mechanical Specifications and Design Guidelines
2.1.7 Processor Materials
Table 2 -3 lists some of the package components and associated materials.
2.1.8 Processor Markings
Figure 2-3 shows the topside markings on the processor. This diagram is to aid in the
identification of the processor.
Table 2-3. Processor Materials
Component Material
Integrated Heat Spreader (IHS) Nickel Plated Copper
Substrate Fiber Reinforced Resin
Substrate Lands Gold Plated Copper
Figure 2-3. Processor Top-Side Markings
Legend:
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
Mark Text(Production Mark):
INTEL{M}{C}'08 PROC#
BRAND
SLxxx C00
SPEED/CACHE/FMB
FPO
Legend:
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
Mark Text(Engineering Mark):
INTEL{M}{C}'08
INTEL CONFIDENTIAL
Qxxx ES C00
PRODUCT CODE
FPO
e4
e4
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
GRP1LINE1
GRP1LINE2
GRP1LINE3
GRP1LINE4
GRP1LINE5
LOT NOS/N

Thermal/Mechanical Specifications and Design Guidelines 17
Package Mechanical and Storage Specifications
2.1.9 Processor Land Coordinates
Figure 2-4 shows the bottom view of the processor package.
.
Figure 2-4. Processor Package Lands Coordinates
AY
AV
AT
AP
AM
AK
AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
B
AW
AU
AR
AN
AL
AJ
AG
AE
AC
AA
W
U
N
R
K
J
G
E
C
A
1 3 5 7 9 11 13 15 17 19 21 23 25 27 29 31 33 35 37 39
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40

Package Mechanical and Storage Specifications
18 Thermal/Mechanical Specifications and Design Guidelines
2.2 Processor Storage Specifications
Table 2 -4 includes a list of the specifications for device storage in terms of maximum
and minimum temperatures and relative humidity. These conditions should not be
exceeded in storage or transportation.
.
Notes:
1. Refers to a component device that is not assembled in a board or socket that is not to be electrically
connected to a voltage reference or I/O signals.
2. Specified temperatures are based on data collected. Exceptions for surface mount reflow are specified in
applicable JEDEC standard and MAS document. Non-adherence may affect processor reliability.
3. TABSOLUTE STORAGE applies to the unassembled component only and does not apply to the shipping media,
moisture barrier bags or desiccant.
4. Intel® branded board products are certified to meet the following temperature and humidity limits that are
given as an example only (Non-Operating Temperature Limit: -40 °C to 70 °C, Humidity: 50% to 90%,
non-condensing with a maximum wet bulb of 28 °C). Post board attach storage temperature limits are not
specified for non-Intel branded boards.
5. The JEDEC, J-JSTD-020 moisture level rating and associated handling practices apply to all moisture
sensitive devices removed from the moisture barrier bag.
6. Nominal temperature and humidity conditions and durations are given and tested within the constraints
imposed by TSUSTAINED and customer shelf life in applicable Intel box and bags.
§
Table 2-4. Storage Conditions
Parameter Description Min Max Notes
TABSOLUTE STORAGE The non-operating device storage
temperature. Damage (latent or otherwise)
may occur when subjected to for any length of
time.
-55 °C 125 °C 1, 2, 3
TSUSTAINED STORAGE The ambient storage temperature limit (in
shipping media) for a sustained period of time.
-5 °C 40 °C 4, 5
RHSUSTAINED STORAGE The maximum device storage relative humidity
for a sustained period of time.
60% @ 24 °C 5, 6
TIMESUSTAINED STORAGE A prolonged or extended period of time;
typically associated with customer shelf life.
0
Months
6
Months
6

Thermal/Mechanical Specifications and Design Guidelines 19
LGA1156 Socket
3LGA1156 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the
processors. The socket provides I/O, power, and ground contacts. The socket contains
1156 contacts arrayed about a cavity in the center of the socket with lead-free solder
balls for surface mounting on the motherboard.
The contacts are arranged in two opposing L-shaped patterns within the grid array. The
grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and
selective depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The ILM design includes a back plate that is integral to
having a uniform load on the socket solder joints. Socket loading specifications are
listed in Chapter 5.
Figure 3-1. LGA1156 Socket with Pick and Place Cover

LGA1156 Socket
20 Thermal/Mechanical Specifications and Design Guidelines
Figure 3-2. LGA1156 Socket Contact Numbering (Top View of Socket)
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
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17
19
23
21
25
27
29
2
8
4
6
10
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12
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26
28
30
15
11
13
17
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21
25
31
27
29
33
39
35
37
32
14
12
16
18
22
20
24
26
30
28
34
38
36
40
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
3
7
5
9
11
15
13
17
19
23
21
25
27
29
2
8
4
6
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30
15
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32
14
12
16
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20
24
26
30
28
34
38
36
40
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AWA C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
3
7
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32
14
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34
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36
40

Thermal/Mechanical Specifications and Design Guidelines 21
LGA1156 Socket
3.1 Board Layout
The land pattern for the LGA1156 socket is 36 mils X 36 mils (X by Y) within each of the
two L-shaped sections. Note that there is no round-off (conversion) error between
socket pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The
two L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm
(122.6 mil) in the y direction (see Figure 3-3). This was to achieve a common package
land to PCB land offset that ensures a single PCB layout for socket designs from the
multiple vendors.
Figure 3-3. LGA1156 Socket Land Pattern (Top View of Board)
A C E G J L N R U W AAACAEAGAJ AL ANARAUAW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
3
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35 34
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37
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B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
122.6 mil (3.1144mm)
36mil (0.9144 mm)
A C E G J L N R U W AAACAEAGAJ AL ANARAUAW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
1
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B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
122.6 mil (3.1144mm)
36mil (0.9144 mm)

LGA1156 Socket
22 Thermal/Mechanical Specifications and Design Guidelines
3.2 LGA1156 Socket NCTF Solder Joints
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
when evaluating package solder joints post environmental testing. The signals at NCTF
locations are typically redundant ground or non-critical reserved, so the loss of the
solder joint continuity at end of life conditions will not affect the overall product
functionality. Figure 3-4 identifies the NCTF solder joints.
Figure 3-4. LGA1156 Socket NCTF Solder Joints
1
3
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5
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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
32
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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
32
15
11
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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
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3
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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
32
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A C E G J L N R U W AA AC AE AG AJ AL AN AR AU AW
B D F H K M P T V Y AB AD AF AH AK AM AP AT AV AY
20 mil corner NCTF
20 mil corner CTF
14 x 18 mil oval pads
16.9 mil circular pads