Intel WiFi Link 5100 Guide

Order Number: 318676-003US
Intel®5100 Memory Controller Hub
Chipset for Communications,
Embedded, and Storage Applications
Thermal/Mechanical Design Guide
July 2008
Revision 003US

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
2Order Number: 318676-003US
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Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
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Intel®5100 MCH Chipset
Contents
1.0 Introduction..............................................................................................................6
1.1 Design Flow........................................................................................................6
1.2 Definition of Terms..............................................................................................7
1.3 Related Documents .............................................................................................8
1.4 Thermal Simulation .............................................................................................9
2.0 Packaging Technology...............................................................................................9
2.1 Package Mechanical Requirements....................................................................... 11
3.0 Thermal Specifications ............................................................................................ 12
3.1 Thermal Design Power (TDP) .............................................................................. 12
3.2 Case Temperature............................................................................................. 12
4.0 Thermal Solution Requirements............................................................................... 12
4.1 Characterizing the Thermal Solution Requirement.................................................. 12
5.0 Thermal Metrology .................................................................................................. 15
5.1 MCH Case Measurement..................................................................................... 15
5.1.1 Supporting Test Equipment...................................................................... 15
5.1.2 Thermal Calibration and Controls.............................................................. 16
5.1.3 IHS Groove ........................................................................................... 16
5.1.4 Thermocouple Conditioning and Preparation............................................... 18
5.1.5 Thermocouple Attachment to IHS ............................................................. 18
5.1.6 Curing Process....................................................................................... 22
5.1.7 Thermocouple Wire Management.............................................................. 23
5.2 Power Simulation Software ................................................................................. 24
6.0 Reference Thermal Solution..................................................................................... 24
6.1 AdvancedTCA* Reference Heatsink...................................................................... 25
6.1.1 Thermal Performance.............................................................................. 25
6.1.2 Mechanical Design Envelope .................................................................... 25
6.1.3 Board-level Components Keepout Dimensions ............................................ 26
6.1.4 Torsional Clip Heatsink Thermal Solution Assembly ..................................... 26
6.1.5 Heatsink Orientation............................................................................... 27
6.1.6 Extruded Heatsink Profiles.......................................................................27
6.1.7 Mechanical Interface Material................................................................... 27
6.1.8 Thermal Interface Material....................................................................... 27
6.1.8.1 Effect of Pressure on TIM Performance......................................... 28
6.1.9 Heatsink Clip ......................................................................................... 28
6.1.10 Clip Retention Anchors............................................................................ 28
6.1.11 Reliability Guidelines............................................................................... 28
6.2 CompactPCI* Reference Heatsink ........................................................................ 29
6.2.1 Component Overview.............................................................................. 29
6.2.2 Thermal Solution Performance Characteristics ............................................ 30
7.0 Reliability Guidelines............................................................................................... 30
A Mechanical Drawings............................................................................................... 31
B Thermal Solution Component Suppliers ...................................................................40

Intel®5100 MCH Chipset
Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
4Order Number: 318676-003US
Figures
1 Thermal Design Process ............................................................................................. 7
2 MCH Package Dimensions (Top View)..........................................................................10
3 MCH Package Dimensions (Side View) .........................................................................10
4 MCH Package Dimensions (Bottom View).....................................................................11
5 Processor Thermal Characterization Parameter Relationships..........................................13
6 IHS Groove Dimensions.............................................................................................17
7 Orientation of Thermocouple Groove Relative to Package Pin..........................................18
8 Bending Tip of Thermocouple .....................................................................................18
9 Securing Thermocouple Wires with Kapton Tape Prior to Attach ......................................19
10 Thermocouple Bead Placement...................................................................................20
11 Positioning Bead on Groove .......................................................................................20
12 Using 3D Micromanipulator to Secure Bead Location......................................................21
13 Measuring Resistance between Thermocouple and IHS ..................................................21
14 Applying Adhesive on Thermocouple Bead....................................................................22
15 Thermocouple Wire Management in Groove..................................................................23
16 Removing Excess Adhesive from IHS...........................................................................23
17 Filling Groove with Adhesive ......................................................................................24
18 Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity .............25
19 AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink ..................26
20 Torsional Clip Heatsink Assembly................................................................................27
21 Isometric View of the CompactPCI* Reference Heatsink.................................................29
22 CompactPCI* Reference Heatsink Thermal Performance.................................................30
23 AdvancedTCA* Heatsink Assembly Drawing .................................................................32
24 AdvancedTCA* Heatsink Drawing................................................................................33
25 AdvancedTCA* Component Keepout Zone....................................................................34
26 CompactPCI* Heatsink Assembly Drawing ...................................................................35
27 CompactPCI* Heatsink Drawing..................................................................................36
28 CompactPCI* Component Keepout Zone......................................................................37
29 Torsional Clip Heatsink Clip Drawing ...........................................................................38
30 TIM2 Drawing ..........................................................................................................39
Tables
1 Definition of Terms .................................................................................................... 7
2 Related Documents.................................................................................................... 8
3Intel
®5100 Memory Controller Hub Chipset Thermal Specifications.................................12
4 Required Heatsink Thermal Performance (ΨCA).............................................................15
5 Thermocouple Attach Support Equipment ....................................................................16
6 Honeywell* PCM45F TIM Performance as Function of Attach Pressure ..............................28
7 Reliability Guidelines.................................................................................................29
8 Reliability Requirements............................................................................................30
9 Mechanical Drawing List ............................................................................................31
10 MCH Torsional Clip Heatsink Thermal Solution ..............................................................40

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July 2008 TDG
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Intel®5100 MCH Chipset
Revision History
Date Revision Description
July 2008 003 Added the CompactPCI* reference solution Added Figure 26, Figure 27, and Figure 28
Updated the supplier information
February 2008 002 Updated the TDPMax config value to 25.7 W in Table 3
November 2007 001 Initial release
Revision Number Descriptions
Revision Associated Life Cycle Milestone Release Information
0.0 POP L3 Closure Initial Documentation - Typically Internal Only
0.1–0.4 When Needed Project Dependent - Typically Internal Only
0.5 Design Win Phase First, Required Customer Release
0.6–0.7 When Needed Project Dependent
0.7 Simulations Complete Second, Recommended Customer Release
0.8–0.9 When Needed Project Dependent
1.0 First Silicon Samples Required Customer Release
1.1–1.4 When Needed Project Dependent (Recommended)
1.5 Qualification Silicon Samples Project Dependent
1.6–1.9 When Needed Project Dependent
NDA - 2.0
Public - XXXXXX-001 First SKU Launch Required Customer Release - Product Launch
2.1 and up When Needed Project Dependent
Note: Rows highlighted in gray are required revisions.

Intel®5100 MCH Chipset
Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
6Order Number: 318676-003US
1.0 Introduction
As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the
Intel®5100 Memory Controller Hub Chipset (Intel®5100 MCH Chipset)
• Describe reference thermal solutions that meet the specification of the Intel®5100
MCH Chipset
Properly designed thermal solutions provide adequate cooling to maintain the Intel®
5100 MCH Chipset die temperatures at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the
Intel®5100 MCH Chipset die temperature at or below the specified limits, a system
designer can ensure the proper functionality, performance, and reliability of the
chipset. Operation outside the functional limits can degrade system performance and
may cause permanent changes in the operating characteristics of the component.
The simplest and most cost effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel®5100 MCH
Chipset components only. For thermal design information on other chipset components,
refer to the respective component datasheet. For the ICH9R, refer to the Intel®I/O
Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.
Note: Unless otherwise specified, the term “MCH” refers to the Intel®5100 MCH Chipset.
1.1 Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided
to the system designer. Figure 1 illustrates the design process implicit to this document
and the tools appropriate for each step.

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Intel®5100 MCH Chipset
1.2 Definition of Terms
Figure 1. Thermal Design Process
Table 1. Definition of Terms
Term Definition
FC-BGA
Flip Chip Ball Grid Array. A package type defined by a plastic substrate where
a die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls
attached to the substrate opposite the die.
Note: The device arrives at the customer with solder balls attached.
BLT Bond line thickness. Final settled thickness of the thermal interface material
after installation of heatsink.
ICH9 I/O Controller Hub 9
IHS Integrated Heat Spreader
MCH Memory controller hub. The chipset component that contains the processor interface, the memory interface, the PCI Express* interface and the ESI
interface.
Tcase_max Maximum allowed component temperature. This temperature is measured at
the geometric center of the top of the package IHS.
Tcase_min Minimum allowed component temperature. This temperature is measured at
the geometric center of the top of the package IHS.
TDP Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can
dissipate.
TIM Thermal Interface Material
ΨCA Case-to-ambient thermal characterization parameter. A measure of the
thermal solution thermal performance including TIM using the thermal
design power. Defined as (TCASE - TLA) / TDP
ΨCS Case-to-sink thermal characterization parameter. A measure of the TIM thermal performance using the thermal design power. Defined as (TCASE -
TLA) / TDP
ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using the thermal design power. Defined as (TCASE -
TLA) / TDP
•Package Level Thermal Models
•Thermal Model User’s Guide
Step 1: Thermal Simulation
•Reference Heatsinks
•Reference Mounting Hardware
•Vendor Contacts
Step 2: Heatsink Design
and Selection
Step 3: Thermal Validation
•Thermal Testing Software
•Thermal Test Vehicle
•User Guides

Intel®5100 MCH Chipset
Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
8Order Number: 318676-003US
1.3 Related Documents
Intel®Electronic Design Kits (EDKs) provide online, real-time collateral updates. The
following links take you to the EDK server and require you to log into Intel®Business
Link (IBL).
•Quad-Core and Dual-Core Intel® Xeon® Processor 5000 Sequence with Intel®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage
Applications
•Intel® Core™2 Duo Processors T9400 and SL9400 and Intel® 5100 Memory
Controller Hub Chipset for Communications and Embedded Applications
The reader of this specification should also be familiar with material and concepts
presented in the documents listed in Table 2.
Table 2. Related Documents (Sheet 1 of 2)
Document Document Number/URL
BGA/OLGA Assembly Development Guide Note 1
Dual-Core Intel®Xeon®Processor 5100 Series Datasheet http://www.intel.com/ (313355)
Dual-Core Intel®Xeon®Processor 5100 Series Specification
Update http://www.intel.com/ (313356)
Dual-Core Intel®Xeon®Processor 5100 Series Thermal/
Mechanical Design Guidelines http://www.intel.com/ (313357)
Dual-Core Intel®Xeon®Processor 5200 Series Datasheet http://www.intel.com/ (318590)
Dual-Core Intel®Xeon®Processor 5200 Series Specification
Update http://www.intel.com/ (318586)
Dual-Core Intel®Xeon®Processor 5200 Series Thermal/
Mechanical Design Guidelines http://www.intel.com/ (318675)
Dual-Core Intel®Xeon®Processor LV 5138 in Embedded
Applications Thermal/Mechanical Design Guidelines http://www.intel.com/ (315225)
Intel®5000 Series Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide http://www.intel.com/ (313067)
Intel®5100 Memory Controller Hub Chipset (embedded) –
External Design Specification (EDS) Addendum Note 1
Intel®5100 Memory Controller Hub Chipset (embedded) –
Maximum Power Application Note 1
Intel®5100 Memory Controller Hub Chipset Datasheet http://www.intel.com/ (318378)
Intel®5100 Memory Controller Hub Chipset Specification Update http://www.intel.com/ (318385)
Intel®Core™2 Duo Processor, Intel®Core™2 Solo Processor and
Intel®Core™2 Extreme Processor on 45-nm Process Datasheet http://www.intel.com/ (320120)
Intel®Core™2 Duo Processor, Intel®Core™2 Solo Processor and
Intel®Core™2 Extreme Processor on 45-nm Process
Specification Update http://www.intel.com/ (320121)
Intel®Core™2 Duo Processors on 45-nm process for Embedded
Applications Thermal Design Guide http://www.intel.com/ (320028)
Intel®Core™2 Duo Processors T9400 and SL9400 and Intel®
5100 Memory Controller Hub Chipset for Communications and
Embedded Applications – Platform Design Guide Note 1
Intel®I/O Controller Hub 9 (ICH9) Family Datasheet http://www.intel.com/ (316972)
Intel®I/O Controller Hub 9 (ICH9) Family Specification Update http://www.intel.com/ (316973)
Notes:
1. Contact your Intel sales representative. Some documents may not be available at this time.

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
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Intel®5100 MCH Chipset
1.4 Thermal Simulation
Intel provides thermal simulation models of the Intel®5100 MCH Chipset and
associated user’s guides to aid system designers in simulating, analyzing, and
optimizing their thermal solutions in an integrated, system-level environment. The
models are for use with the commercially available Computational Fluid Dynamics
(CFD)-based thermal analysis tools Flomerics* FLOTHERM* (version 5.1 or higher) and
Fluent* Icepak* (version 4.3.10 or higher). Contact your Intel field sales representative
to order the thermal models and user’s guides.
2.0 Packaging Technology
Intel®5100 MCH Chipset-based platforms consist of two individual components: the
Intel®5100 MCH Chipset and the ICH9R. The Intel®5100 MCH Chipset uses a 42.5
mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2, Figure 3, and
Figure 4). For information on the ICH9R package, refer to the Intel®I/O Controller Hub
9 (ICH9) Family Thermal and Mechanical Design Guidelines.
Intel®I/O Controller Hub 9 (ICH9) Family Thermal and
Mechanical Design Guidelines http://www.intel.com/ (316974)
Quad-Core and Dual-Core Intel®Xeon®Processor 5000
Sequence with Intel®5100 Memory Controller Hub Chipset for
Communications, Embedded, and Storage Applications –
Platform Design Guide
Note 1
Quad-Core Intel®Xeon®Processor 5300 Series Datasheet http://www.intel.com/ (315569)
Quad-Core Intel®Xeon®Processor 5300 Series Specification
Update http://www.intel.com/ (315338)
Quad-Core Intel®Xeon®Processor 5300 Series Thermal/
Mechanical Design Guidelines http://www.intel.com/ (315794)
Quad-Core Intel®Xeon®Processor 5400 Series Datasheet http://www.intel.com/ (318589)
Quad-Core Intel®Xeon®Processor 5400 Series Specification
Update http://www.intel.com/ (318585)
Quad-Core Intel®Xeon®Processor 5400 Series Thermal/
Mechanical Design Guidelines http://www.intel.com/ (318611)
Quad-Core Intel®Xeon®Processor L5318 in Embedded
Applications Thermal and Mechanical Design Guidelines http://www.intel.com/ (318474)
Various system thermal design suggestions http://www.formfactors.org
Table 2. Related Documents (Sheet 2 of 2)
Document Document Number/URL
Notes:
1. Contact your Intel sales representative. Some documents may not be available at this time.

Intel®5100 MCH Chipset
Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
10 Order Number: 318676-003US
Figure 2. MCH Package Dimensions (Top View)
Figure 3. MCH Package Dimensions (Side View)
MCH
IHS
Handling
Exclusion
Area
42.5 mm.
42.5 mm.38.5 mm.
38.5 mm,
0.20 –C–
IHS Substrate
0.435 ± 0.025 mm
See note 3
Seating Plane
2.44 ± 0.071 mm
See note 1.
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)
orientation after reflow
0.20 See note 4.
3.79 ± 0.144 mm
4.23 ± 0.146 mm

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July 2008 TDG
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Intel®5100 MCH Chipset
2.1 Package Mechanical Requirements
The Intel®5100 MCH Chipset package has an integrated heat spreader (IHS) that is
capable of sustaining a maximum static normal load of 15 lbf. These mechanical load
limits must not be exceeded during heatsink installation, mechanical stress testing,
standard shipping conditions and/or any other use condition.
Note: The heatsink attach solutions must not include continuous stress to the chipset
package with the exception of a uniform load to maintain the heatsink-to-package
thermal interface.
Figure 4. MCH Package Dimensions (Bottom View)
Notes:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
42.5 + 0.05
11 252321191715139753127293733 3531
2822 26242018161412108642 36343230 38
A
AJ
AE
AC
AA
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AH
AF
AD
AB
Y
V
T
P
M
K
H
F
D
AK
AM
AP
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AV
B
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B
42.5 + 0.05
C A0.2
- A -
37X 1.092
20.202
20.202
37X 1.092

Intel®5100 MCH Chipset
Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
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Note: These specifications apply to uniform compressive loading in a direction perpendicular
to the IHS top surface.
Note: These specifications are based on limited testing for design characterization. Loading
limits are for the package only.
3.0 Thermal Specifications
3.1 Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the MCH component to
consume maximum power dissipation for sustained time periods. Therefore, in order to
arrive at a more realistic power level for thermal design purposes, Intel characterizes
power consumption based on known platform benchmark applications. The resulting
power consumption is referred to as the Thermal Design Power (TDP). TDP is the target
power level to which the thermal solutions should be designed. TDP is not the
maximum power that the chipset can dissipate.
FC-BGA packages have a poor heat transfer capability into the board and have a
minimal thermal capability without a thermal solution. Intel recommends that system
designers plan for a heatsink when using the Intel®5100 MCH Chipset.
3.2 Case Temperature
To ensure proper operation and reliability of the Intel®5100 MCH Chipset, the case
temperatures must be at or between the maximum/minimum operating temperature
ranges as specified in Table 3. System and/or component level thermal solutions are
required to maintain these temperature specifications. Refer to Section 5.0, “Thermal
Metrology” on page 15 for guidelines on accurately measuring package case
temperatures.
4.0 Thermal Solution Requirements
4.1 Characterizing the Thermal Solution Requirement
The idea of a “thermal characterization parameter” Ψ (the Greek letter Psi) is a
convenient way to characterize the performance needed for the thermal solution and to
compare thermal solutions in identical situations (in other words, heating source, local
ambient conditions, and so forth). The thermal characterization parameter is calculated
using total package power; whereas, actual thermal resistance, θ(theta), is calculated
using actual power dissipated between two points. Measuring actual power dissipated
into the heatsink is difficult, because some of the power is dissipated through a heat
transfer into the package and board.
Table 3. Intel®5100 Memory Controller Hub Chipset Thermal Specifications
Parameter Value Notes
Tcase_max 105 °C
Tcase_min 5 °C
TDPMax config 25.7 W DP FSB 1333, 2 channel DDR2 667, 3 x8 PCI Express*
TDPTypical ATCA config 23.0 W DP FSB 1067, 2 channel DDR2 533, 3 x8 PCI Express*
TDPTypical UP config 19.5 W UP FSB 1067, 1 channel DDR2 533, 1 x8 PCI Express*

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Intel®5100 MCH Chipset
The case-to-local ambient thermal characterization parameter (ΨCA) is used as a
measure of the thermal performance of the overall thermal solution. It is defined by
Equation 1 and is measured in units of °C/W.
Equation 1. Case-to-local Ambient Thermal Characterization Parameter (ΨCA)
The case-to-local ambient thermal characterization parameter, ΨCA, is comprised of
ΨCS, the thermal interface material (TIM) thermal characterization parameter, and of
ΨSA, the sink-to-local ambient thermal characterization parameter.
Equation 2. Case-to-local Ambient Thermal Characterization Parameter (ΨCA)
ΨCS is strongly dependent on the thermal conductivity and thickness of the TIM
between the heatsink and device package.
ΨSA is a measure of the thermal characterization parameter from the bottom of the
heatsink to the local ambient air. ΨSA is dependent on the heatsink material, thermal
conductivity, and geometry. It is also strongly dependent on the air velocity through
the fins of the heatsink. Figure 5 illustrates the combination of the different thermal
characterization parameters.
Example 1. Calculating the Required Thermal Performance
The cooling performance, ΨCA, is defined using the thermal characterization parameter
previously described. The process to determine the required thermal performance to
cool the device includes the following.
1. Define a target component temperature TCASE and corresponding TDP.
ΨCA
TCASE TLA –
TDP
-------------------------
=
ΨCA ΨCS ΨSA +=
Figure 5. Processor Thermal Characterization Parameter Relationships
TC
TA
Ψ
CA
TIM
Device
TS
Ψ
SA
Ψ
CS

Intel®5100 MCH Chipset
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14 Order Number: 318676-003US
2. Define a target local ambient temperature, TLA.
3. Use Equation 1 and Equation 2 to determine the required thermal performance
needed to cool the device.
The following provides an example of how you might determine the appropriate
performance targets.
Assume:
•TDP=25.0WandT
CASE = 105 °C
• Local processor ambient temperature, TLA, = 60 °C
Then the following could be calculated using Equation 1 for the given chipset
configuration.
To determine the required heatsink performance, a heatsink solution provider would
need to determine ΨCS performance for the selected TIM and mechanical load
configuration. If the heatsink solution were designed to work with a TIM material
performing at ΨCS ≤0.20 °C/W, solving from Equation 2, the performance needed from
the heatsink is as follows.
If the local ambient temperature is relaxed to 45 °C, the same calculation can be
carried out to determine the new case-to-ambient thermal resistance.
It is evident from the above calculations that a reduction in the local ambient
temperature has a significant effect on the case-to-ambient thermal resistance
requirement. This effect can contribute to a more reasonable thermal solution including
reduced cost, heatsink size, heatsink weight, and a lower system airflow rate.
ΨCA
TCASE TLA –
TDP
-------------------------105 60–
25
---------------1.8°CW⁄===
ΨSA ΨCA ΨCS – 1.8 0.20– 1.6°CW⁄===
ΨCA
TCASE TLA –
TDP
-------------------------105 45–
25
---------------2.4°C
W
----
===

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Intel®5100 MCH Chipset
Table 4 summarizes the thermal budget required to adequately cool the Intel®5100
MCH Chipset in one configuration using a TDP of 25 W. Further calculations would need
to be performed for different TDPs. Because the results are based on air data at sea
level, a correction factor would be required to estimate the thermal performance at
other altitudes.
5.0 Thermal Metrology
The system designer must make temperature measurements to accurately determine
the thermal performance of the system. Intel has established guidelines for proper
techniques to measure the MCH case temperatures. Section 5.1 provides guidelines on
how to accurately measure the MCH case temperatures. Section 5.2 contains
information on running an application program that will emulate anticipated maximum
thermal design power (Figure 6).
5.1 MCH Case Measurement
The Intel®5100 MCH Chipset cooling performance is determined by measuring the
case temperature using a thermocouple. For case temperature measurements, the
attached method outlined in this section is recommended for mounting a
thermocouple.
Special care is required when measuring the case temperature (TC) to ensure an
accurate temperature measurement. Thermocouples are often used to measure TC.
When measuring the temperature of a surface that is at a different temperature from
the surrounding local ambient air, errors may be introduced in the measurements. The
measurement errors can be caused by poor thermal contact between the thermocouple
junction and the surface of the integrated heat spreader, heat loss by radiation,
convection, by conduction through thermocouple leads, or by contact between the
thermocouple cement and the heatsink base. To minimize these measurement errors,
the approach outlined in the next section is recommended.
Note: The thermocouple attach example shown below is on a different package, but the
method and groove dimensions are the same. The thermocouple bead needs to be
centered on the IHS.
5.1.1 Supporting Test Equipment
To apply the reference thermocouple attach procedure, it is recommended that you use
the equipment (or equivalent) given in Table 5.
Table 4. Required Heatsink Thermal Performance (ΨCA)
Device ΨCA (°C/W) at TLA = 45 °C ΨCA (°C/W) at TLA = 60 °C
Intel®5100 MCH Chipset @ 25 W 2.4 1.8

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5.1.2 Thermal Calibration and Controls
It is recommended that full and routine calibration of temperature measurement
equipment be performed before attempting to perform a temperature case
measurement of the Intel®5100 MCH Chipset. Intel recommends checking the meter
probe set against known standards. This should be done at 0 °C (using an ice bath or
other stable temperature source) and at an elevated temperature, around 80 °C (using
an appropriate temperature source).
Wire gauge and length also should be considered because some less expensive
measurement systems are heavily impacted by impedance. There are numerous
resources available throughout the industry to assist with implementation of proper
controls for thermal measurements.
Note: It is recommended to follow company standard procedures and wear safety items like
glasses for cutting the IHS and gloves for chemical handling.
Note: Ask your Intel field sales representative if you need assistance to groove and/or install
a thermocouple according to the reference process.
5.1.3 IHS Groove
Cut a groove in the package IHS according to the drawing given in Figure 6.
Note: The center of the round at the end of the IHS groove should be at the center of the
package.
Table 5. Thermocouple Attach Support Equipment
Item Description Part Number
Measurement and Output
Microscope Olympus* light microscope or equivalent SZ-40
Digital multi-meter Digital multi-meter for resistance measurement Not Available
Test Fixture(s)
Micromanipulator1Micromanipulator set from YOU Ltd. or equivalent mechanical 3D arm with needle
(not included) to maintain TCbead location during the attach process YOU-3
Miscellaneous Hardware
Locite* 498* Super
Bonder* Instant
Adhesive Thermal
Cycling Resistant
Super glue with thermal characteristics 49850
Adhesive accelerator Locite 7452 Tak Pak* accelerator for fast glue curing 18490
Kapton tape For holding thermocouple in place or equivalent Not Available
Thermocouple OMEGA*, 36 gauge, “T” type 5SRTC-TT-36-72
Calibration and Control
ice point* Cell OMEGA, stable 0 °C temperature source for calibration and offset TRCIII
hot point* Cell OMEGA, temperature source to control and understand meter slope gain CL950-A-110
Notes:
1. Three axes set consists of (1 ea. U-31CF), (1 ea. UX-6-6), (1 ea. USM6) and (1 ea. UPN-1). More information is
available at http://www.narishige.co.jp/you/english/products/set/index.htm.

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Intel®5100 MCH Chipset
Figure 6. IHS Groove Dimensions

Intel®5100 MCH Chipset
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5.1.4 Thermocouple Conditioning and Preparation
1. Use a calibrated thermocouple as specified in Table 5.
2. Measure the thermocouple resistance by holding both wires on one probe and the
tip of the thermocouple to the other probe of the DMM (compare to thermocouple
resistance specifications).
3. Straighten the wire for about 38 mm (1½") from the bead to place it inside the
channel.
4. Bend the tip of the thermocouple to approximately a 45 degree angle by 0.8 mm
(0.030") from the tip (Figure 8).
5.1.5 Thermocouple Attachment to IHS
Caution: To avoid impact on the thermocouple during the SMT process, reflow must be
performed before attaching the thermocouple to the grooved MCH IHS.
1. Clean the thermocouple wire groove with isopropyl alcohol (IPA) and a lint-free
cloth removing all residue prior to thermocouple attachment.
Figure 7. Orientation of Thermocouple Groove Relative to Package Pin
Figure 8. Bending Tip of Thermocouple

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Intel®5100 MCH Chipset
2. Place the thermocouple wire inside the groove letting the exposed wire and bead
extend about 3.2 mm (0.125") past the end of the groove. Secure it with Kapton
tape (Figure 9).
3. Lift the wire at the middle of groove with tweezers and bend the front of the wire to
place the thermocouple in the channel ensuring that the tip is in contact with the
end of the channel grooved in the IHS (Figure 10 A and B).
4. Place the MCH under the microscope unit (similar to the one used in Figure 13) to
continue with the process. It is also recommended to use a fixture to help hold the
unit in place for the rest of the attach process.
5. Press the wire down about 6 mm (0.125") from the thermocouple bead using the
tweezers. Look in the microscope to perform this task. Place a piece of Kapton tape
to hold the wire inside the groove (Figure 12). Refer to Figure 11 for detailed bead
placement.
6. Using the micromanipulator, place the needle near the end of groove on top of the
thermocouple. Using the X, Y, and Z axes on the arm, place the tip of the needle on
top of the thermocouple bead. Press down until the bead is seated at the end of the
groove on top of the step (see Figure 11 and Figure 12).
7. Measure resistance from thermocouple end wires (hold both wires to a DMM probe)
to the IHS surface. This should be the same value as measured during the
thermocouple conditioning. See Section 5.1.4, step 2., and Figure 13.
8. Place a small amount of Locite* 498* Super Bonder* adhesive in the groove where
the bead is installed. Using a fine point device, spread the adhesive in the groove
around the needle, the thermocouple bead, and the thermocouple wires already
installed in the groove during step 5. Be careful not to move the thermocouple
bead during this step (Figure 14).
Figure 9. Securing Thermocouple Wires with Kapton Tape Prior to Attach

Intel®5100 MCH Chipset
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Figure 10. Thermocouple Bead Placement
Figure 11. Positioning Bead on Groove