Intel WiFi Link 5100 Guide

Order Number: 318676-003US
Intel®5100 Memory Controller Hub
Chipset for Communications,
Embedded, and Storage Applications
Thermal/Mechanical Design Guide
July 2008
Revision 003US

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
2Order Number: 318676-003US
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Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
Order Number: 318676-003US 3
Intel®5100 MCH Chipset
Contents
1.0 Introduction..............................................................................................................6
1.1 Design Flow........................................................................................................6
1.2 Definition of Terms..............................................................................................7
1.3 Related Documents .............................................................................................8
1.4 Thermal Simulation .............................................................................................9
2.0 Packaging Technology...............................................................................................9
2.1 Package Mechanical Requirements....................................................................... 11
3.0 Thermal Specifications ............................................................................................ 12
3.1 Thermal Design Power (TDP) .............................................................................. 12
3.2 Case Temperature............................................................................................. 12
4.0 Thermal Solution Requirements............................................................................... 12
4.1 Characterizing the Thermal Solution Requirement.................................................. 12
5.0 Thermal Metrology .................................................................................................. 15
5.1 MCH Case Measurement..................................................................................... 15
5.1.1 Supporting Test Equipment...................................................................... 15
5.1.2 Thermal Calibration and Controls.............................................................. 16
5.1.3 IHS Groove ........................................................................................... 16
5.1.4 Thermocouple Conditioning and Preparation............................................... 18
5.1.5 Thermocouple Attachment to IHS ............................................................. 18
5.1.6 Curing Process....................................................................................... 22
5.1.7 Thermocouple Wire Management.............................................................. 23
5.2 Power Simulation Software ................................................................................. 24
6.0 Reference Thermal Solution..................................................................................... 24
6.1 AdvancedTCA* Reference Heatsink...................................................................... 25
6.1.1 Thermal Performance.............................................................................. 25
6.1.2 Mechanical Design Envelope .................................................................... 25
6.1.3 Board-level Components Keepout Dimensions ............................................ 26
6.1.4 Torsional Clip Heatsink Thermal Solution Assembly ..................................... 26
6.1.5 Heatsink Orientation............................................................................... 27
6.1.6 Extruded Heatsink Profiles.......................................................................27
6.1.7 Mechanical Interface Material................................................................... 27
6.1.8 Thermal Interface Material....................................................................... 27
6.1.8.1 Effect of Pressure on TIM Performance......................................... 28
6.1.9 Heatsink Clip ......................................................................................... 28
6.1.10 Clip Retention Anchors............................................................................ 28
6.1.11 Reliability Guidelines............................................................................... 28
6.2 CompactPCI* Reference Heatsink ........................................................................ 29
6.2.1 Component Overview.............................................................................. 29
6.2.2 Thermal Solution Performance Characteristics ............................................ 30
7.0 Reliability Guidelines............................................................................................... 30
A Mechanical Drawings............................................................................................... 31
B Thermal Solution Component Suppliers ...................................................................40

Intel®5100 MCH Chipset
Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
4Order Number: 318676-003US
Figures
1 Thermal Design Process ............................................................................................. 7
2 MCH Package Dimensions (Top View)..........................................................................10
3 MCH Package Dimensions (Side View) .........................................................................10
4 MCH Package Dimensions (Bottom View).....................................................................11
5 Processor Thermal Characterization Parameter Relationships..........................................13
6 IHS Groove Dimensions.............................................................................................17
7 Orientation of Thermocouple Groove Relative to Package Pin..........................................18
8 Bending Tip of Thermocouple .....................................................................................18
9 Securing Thermocouple Wires with Kapton Tape Prior to Attach ......................................19
10 Thermocouple Bead Placement...................................................................................20
11 Positioning Bead on Groove .......................................................................................20
12 Using 3D Micromanipulator to Secure Bead Location......................................................21
13 Measuring Resistance between Thermocouple and IHS ..................................................21
14 Applying Adhesive on Thermocouple Bead....................................................................22
15 Thermocouple Wire Management in Groove..................................................................23
16 Removing Excess Adhesive from IHS...........................................................................23
17 Filling Groove with Adhesive ......................................................................................24
18 Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity .............25
19 AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink ..................26
20 Torsional Clip Heatsink Assembly................................................................................27
21 Isometric View of the CompactPCI* Reference Heatsink.................................................29
22 CompactPCI* Reference Heatsink Thermal Performance.................................................30
23 AdvancedTCA* Heatsink Assembly Drawing .................................................................32
24 AdvancedTCA* Heatsink Drawing................................................................................33
25 AdvancedTCA* Component Keepout Zone....................................................................34
26 CompactPCI* Heatsink Assembly Drawing ...................................................................35
27 CompactPCI* Heatsink Drawing..................................................................................36
28 CompactPCI* Component Keepout Zone......................................................................37
29 Torsional Clip Heatsink Clip Drawing ...........................................................................38
30 TIM2 Drawing ..........................................................................................................39
Tables
1 Definition of Terms .................................................................................................... 7
2 Related Documents.................................................................................................... 8
3Intel
®5100 Memory Controller Hub Chipset Thermal Specifications.................................12
4 Required Heatsink Thermal Performance (ΨCA).............................................................15
5 Thermocouple Attach Support Equipment ....................................................................16
6 Honeywell* PCM45F TIM Performance as Function of Attach Pressure ..............................28
7 Reliability Guidelines.................................................................................................29
8 Reliability Requirements............................................................................................30
9 Mechanical Drawing List ............................................................................................31
10 MCH Torsional Clip Heatsink Thermal Solution ..............................................................40

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
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Intel®5100 MCH Chipset
Revision History
Date Revision Description
July 2008 003 Added the CompactPCI* reference solution Added Figure 26, Figure 27, and Figure 28
Updated the supplier information
February 2008 002 Updated the TDPMax config value to 25.7 W in Table 3
November 2007 001 Initial release
Revision Number Descriptions
Revision Associated Life Cycle Milestone Release Information
0.0 POP L3 Closure Initial Documentation - Typically Internal Only
0.1–0.4 When Needed Project Dependent - Typically Internal Only
0.5 Design Win Phase First, Required Customer Release
0.6–0.7 When Needed Project Dependent
0.7 Simulations Complete Second, Recommended Customer Release
0.8–0.9 When Needed Project Dependent
1.0 First Silicon Samples Required Customer Release
1.1–1.4 When Needed Project Dependent (Recommended)
1.5 Qualification Silicon Samples Project Dependent
1.6–1.9 When Needed Project Dependent
NDA - 2.0
Public - XXXXXX-001 First SKU Launch Required Customer Release - Product Launch
2.1 and up When Needed Project Dependent
Note: Rows highlighted in gray are required revisions.

Intel®5100 MCH Chipset
Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
6Order Number: 318676-003US
1.0 Introduction
As the complexity of computer systems increases, so do the power dissipation
requirements. Care must be taken to ensure that the additional power is properly
dissipated. Typical methods to improve heat dissipation include selective use of
ducting, and/or passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the
Intel®5100 Memory Controller Hub Chipset (Intel®5100 MCH Chipset)
• Describe reference thermal solutions that meet the specification of the Intel®5100
MCH Chipset
Properly designed thermal solutions provide adequate cooling to maintain the Intel®
5100 MCH Chipset die temperatures at or below thermal specifications. This is
accomplished by providing a low local-ambient temperature, ensuring adequate local
airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the
Intel®5100 MCH Chipset die temperature at or below the specified limits, a system
designer can ensure the proper functionality, performance, and reliability of the
chipset. Operation outside the functional limits can degrade system performance and
may cause permanent changes in the operating characteristics of the component.
The simplest and most cost effective method to improve the inherent system cooling
characteristics is through careful chassis design and placement of fans, vents, and
ducts. When additional cooling is required, component thermal solutions may be
implemented in conjunction with system thermal solutions. The size of the fan or
heatsink can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel®5100 MCH
Chipset components only. For thermal design information on other chipset components,
refer to the respective component datasheet. For the ICH9R, refer to the Intel®I/O
Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.
Note: Unless otherwise specified, the term “MCH” refers to the Intel®5100 MCH Chipset.
1.1 Design Flow
To develop a reliable, cost-effective thermal solution, several tools have been provided
to the system designer. Figure 1 illustrates the design process implicit to this document
and the tools appropriate for each step.

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
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Intel®5100 MCH Chipset
1.2 Definition of Terms
Figure 1. Thermal Design Process
Table 1. Definition of Terms
Term Definition
FC-BGA
Flip Chip Ball Grid Array. A package type defined by a plastic substrate where
a die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls
attached to the substrate opposite the die.
Note: The device arrives at the customer with solder balls attached.
BLT Bond line thickness. Final settled thickness of the thermal interface material
after installation of heatsink.
ICH9 I/O Controller Hub 9
IHS Integrated Heat Spreader
MCH Memory controller hub. The chipset component that contains the processor interface, the memory interface, the PCI Express* interface and the ESI
interface.
Tcase_max Maximum allowed component temperature. This temperature is measured at
the geometric center of the top of the package IHS.
Tcase_min Minimum allowed component temperature. This temperature is measured at
the geometric center of the top of the package IHS.
TDP Thermal design power. Thermal solutions should be designed to dissipate this target power level. TDP is not the maximum power that the chipset can
dissipate.
TIM Thermal Interface Material
ΨCA Case-to-ambient thermal characterization parameter. A measure of the
thermal solution thermal performance including TIM using the thermal
design power. Defined as (TCASE - TLA) / TDP
ΨCS Case-to-sink thermal characterization parameter. A measure of the TIM thermal performance using the thermal design power. Defined as (TCASE -
TLA) / TDP
ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal performance using the thermal design power. Defined as (TCASE -
TLA) / TDP
•Package Level Thermal Models
•Thermal Model User’s Guide
Step 1: Thermal Simulation
•Reference Heatsinks
•Reference Mounting Hardware
•Vendor Contacts
Step 2: Heatsink Design
and Selection
Step 3: Thermal Validation
•Thermal Testing Software
•Thermal Test Vehicle
•User Guides

Intel®5100 MCH Chipset
Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
8Order Number: 318676-003US
1.3 Related Documents
Intel®Electronic Design Kits (EDKs) provide online, real-time collateral updates. The
following links take you to the EDK server and require you to log into Intel®Business
Link (IBL).
•Quad-Core and Dual-Core Intel® Xeon® Processor 5000 Sequence with Intel®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage
Applications
•Intel® Core™2 Duo Processors T9400 and SL9400 and Intel® 5100 Memory
Controller Hub Chipset for Communications and Embedded Applications
The reader of this specification should also be familiar with material and concepts
presented in the documents listed in Table 2.
Table 2. Related Documents (Sheet 1 of 2)
Document Document Number/URL
BGA/OLGA Assembly Development Guide Note 1
Dual-Core Intel®Xeon®Processor 5100 Series Datasheet http://www.intel.com/ (313355)
Dual-Core Intel®Xeon®Processor 5100 Series Specification
Update http://www.intel.com/ (313356)
Dual-Core Intel®Xeon®Processor 5100 Series Thermal/
Mechanical Design Guidelines http://www.intel.com/ (313357)
Dual-Core Intel®Xeon®Processor 5200 Series Datasheet http://www.intel.com/ (318590)
Dual-Core Intel®Xeon®Processor 5200 Series Specification
Update http://www.intel.com/ (318586)
Dual-Core Intel®Xeon®Processor 5200 Series Thermal/
Mechanical Design Guidelines http://www.intel.com/ (318675)
Dual-Core Intel®Xeon®Processor LV 5138 in Embedded
Applications Thermal/Mechanical Design Guidelines http://www.intel.com/ (315225)
Intel®5000 Series Chipset Memory Controller Hub (MCH)
Thermal/Mechanical Design Guide http://www.intel.com/ (313067)
Intel®5100 Memory Controller Hub Chipset (embedded) –
External Design Specification (EDS) Addendum Note 1
Intel®5100 Memory Controller Hub Chipset (embedded) –
Maximum Power Application Note 1
Intel®5100 Memory Controller Hub Chipset Datasheet http://www.intel.com/ (318378)
Intel®5100 Memory Controller Hub Chipset Specification Update http://www.intel.com/ (318385)
Intel®Core™2 Duo Processor, Intel®Core™2 Solo Processor and
Intel®Core™2 Extreme Processor on 45-nm Process Datasheet http://www.intel.com/ (320120)
Intel®Core™2 Duo Processor, Intel®Core™2 Solo Processor and
Intel®Core™2 Extreme Processor on 45-nm Process
Specification Update http://www.intel.com/ (320121)
Intel®Core™2 Duo Processors on 45-nm process for Embedded
Applications Thermal Design Guide http://www.intel.com/ (320028)
Intel®Core™2 Duo Processors T9400 and SL9400 and Intel®
5100 Memory Controller Hub Chipset for Communications and
Embedded Applications – Platform Design Guide Note 1
Intel®I/O Controller Hub 9 (ICH9) Family Datasheet http://www.intel.com/ (316972)
Intel®I/O Controller Hub 9 (ICH9) Family Specification Update http://www.intel.com/ (316973)
Notes:
1. Contact your Intel sales representative. Some documents may not be available at this time.

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
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Intel®5100 MCH Chipset
1.4 Thermal Simulation
Intel provides thermal simulation models of the Intel®5100 MCH Chipset and
associated user’s guides to aid system designers in simulating, analyzing, and
optimizing their thermal solutions in an integrated, system-level environment. The
models are for use with the commercially available Computational Fluid Dynamics
(CFD)-based thermal analysis tools Flomerics* FLOTHERM* (version 5.1 or higher) and
Fluent* Icepak* (version 4.3.10 or higher). Contact your Intel field sales representative
to order the thermal models and user’s guides.
2.0 Packaging Technology
Intel®5100 MCH Chipset-based platforms consist of two individual components: the
Intel®5100 MCH Chipset and the ICH9R. The Intel®5100 MCH Chipset uses a 42.5
mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2, Figure 3, and
Figure 4). For information on the ICH9R package, refer to the Intel®I/O Controller Hub
9 (ICH9) Family Thermal and Mechanical Design Guidelines.
Intel®I/O Controller Hub 9 (ICH9) Family Thermal and
Mechanical Design Guidelines http://www.intel.com/ (316974)
Quad-Core and Dual-Core Intel®Xeon®Processor 5000
Sequence with Intel®5100 Memory Controller Hub Chipset for
Communications, Embedded, and Storage Applications –
Platform Design Guide
Note 1
Quad-Core Intel®Xeon®Processor 5300 Series Datasheet http://www.intel.com/ (315569)
Quad-Core Intel®Xeon®Processor 5300 Series Specification
Update http://www.intel.com/ (315338)
Quad-Core Intel®Xeon®Processor 5300 Series Thermal/
Mechanical Design Guidelines http://www.intel.com/ (315794)
Quad-Core Intel®Xeon®Processor 5400 Series Datasheet http://www.intel.com/ (318589)
Quad-Core Intel®Xeon®Processor 5400 Series Specification
Update http://www.intel.com/ (318585)
Quad-Core Intel®Xeon®Processor 5400 Series Thermal/
Mechanical Design Guidelines http://www.intel.com/ (318611)
Quad-Core Intel®Xeon®Processor L5318 in Embedded
Applications Thermal and Mechanical Design Guidelines http://www.intel.com/ (318474)
Various system thermal design suggestions http://www.formfactors.org
Table 2. Related Documents (Sheet 2 of 2)
Document Document Number/URL
Notes:
1. Contact your Intel sales representative. Some documents may not be available at this time.

Intel®5100 MCH Chipset
Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
10 Order Number: 318676-003US
Figure 2. MCH Package Dimensions (Top View)
Figure 3. MCH Package Dimensions (Side View)
MCH
IHS
Handling
Exclusion
Area
42.5 mm.
42.5 mm.38.5 mm.
38.5 mm,
0.20 –C–
IHS Substrate
0.435 ± 0.025 mm
See note 3
Seating Plane
2.44 ± 0.071 mm
See note 1.
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)
orientation after reflow
0.20 See note 4.
3.79 ± 0.144 mm
4.23 ± 0.146 mm