Intel M20NTP1UR Quick setup guide

Intel® Server System
M20NTP1UR
System Integration and Service Guide
A guide providing instructions for the insertion and
extraction of system components and available
Intel accessories and spares
Rev. 1.0
February 2022
Delivering Breakthrough Data Center System Innovation – Experience What’s Inside!

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Document Revision History
Date Revision Changes
February 2022 1.0 First Public release.

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Disclaimers
Intel technologies’ features and benefits depend on system configuration and may require enabled hardware, software, or service
activation. Performance varies depending on system configuration. No computer system can be absolutely secure. Check with your
system manufacturer or retailer or learn more at intel.com.
You may not use or facilitate the use of this document in connection with any infringement or other legal analysis concerning Intel
products described herein. You agree to grant Intel a non-exclusive, royalty-free license to any patent claim thereafter drafted which
includes subject matter disclosed herein.
No license (express or implied, by estoppel or otherwise) to any intellectual property rights is granted by this document.
The products described may contain design defects or errors known as errata which may cause the product to deviate from
published specifications. Current characterized errata are available on request.
Intel disclaims all express and implied warranties, including without limitation, the implied warranties of merchantability, fitness
for a particular purpose, and non-infringement, as well as any warranty arising from course of performance, course of dealing, or
usage in trade.
Copies of documents which have an order number and are referenced in this document may be obtained by calling 1-800-548-4725
or by visiting www.intel.com/design/literature.htm.
Intel, the Intel logo, and Xeon are trademarks of Intel Corporation or its subsidiaries in the U.S. and/or other countries.
*Other names and brands may be claimed as the property of others.
© Intel Corporation

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Safety Warnings
Heed safety instructions:
Before working with your server product, whether you are using this guide or any other resource as a
reference, pay close attention to the safety instructions. You must adhere to the assembly instructions in this
guide to ensure and maintain compliance with existing product certifications and approvals. Use only the
described, regulated components specified in this guide. Use of other products/components will void the UL
listing and other regulatory approvals of the product and will most likely result in noncompliance with
product regulations in the region(s) in which the product is sold.
System power on/off:
The power button DOES NOT turn off the system AC power. To remove power from the system, you must
unplug the AC power cord. Make sure the AC power cord is unplugged before you open the chassis, add, or
remove any components.
Hazardous conditions, devices and cables:
Hazardous electrical conditions may be present on power, telephone, and communication cables. Turn off
the server and disconnect the power cord, telecommunications systems, networks, and modems attached to
the server before opening it. Otherwise, personal injury or equipment damage can result.
Electrostatic Discharge (ESD):
Electrostatic discharge can damage the computer or the components within it. ESD can occur without the
user feeling a shock while working inside the system chassis or while improperly handling electronic devices
like processors, memory or other storage devices, and add-in cards.
Intel recommends the following steps be taken when performing any procedures described within this
document or while performing service to any computer system.
•Where available, all system integration and/or service should be performed at a properly equipped
ESD workstation
•Wear ESD protective gear like a grounded antistatic wrist strap, sole grounders, and/or conductive
shoes
•Wear an anti-static smock or gown to cover any clothing that may generate an electrostatic charge
•Remove all jewelry
•Disconnect all power cables and cords attached to the server before performing any integration or
service
•Touch any unpainted metal surface of the chassis before performing any integration or service
•Hold all circuit boards and other electronic components by their edges only
•After removing electronic devices from the system or from their protective packaging, place them
component side up on to a grounded anti-static surface or conductive workbench pad. Do not place
electronic devices on to the outside of any protective packaging.

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Weight of the system:
•Due to the weight of a system, Intel recommends carrying the system with two people supporting the
system from the sides or using a mechanical lift or a cart when moving the system from one location
to another.
•If your system has rack handles installed, do not lift or carry the system by the rack handles
•When lifting or moving a chassis, always grasp it by all four corners. Do not grasp the chassis by two
points at opposing diagonal corners, doing so may damage the internal components.
•If you can only grasp the chassis at two different points, always grasp the chassis by the sides at the
midpoint.
Installing or removing jumpers:
A jumper is a small plastic encased conductor that slips over two jumper pins. Some jumpers have a small
tab on top that you can grip with your fingertips or with a pair of fine needle nosed pliers. If your jumpers do
not have such a tab, take care when using needle nosed pliers to remove or install a jumper; grip the narrow
sides of the jumper with the pliers, never the wide sides. Gripping the wide sides can damage the contacts
inside the jumper, causing intermittent problems with the function controlled by that jumper. Take care to
grip with, but not squeeze, the pliers or other tool you use to remove a jumper, or you may bend or break the
pins on the board.
Additional Cautions:
•Slide / Rail mounted equipment is not to be used as a shelf or a workspace
•Intel warranties that this product will perform to its published specifications. However, all computer
systems are inherently subject to unpredictable system behavior under various environmental and
other conditions.
•This product is not intended to be the sole source for any critical data and the user must maintain a
verified backup. Failure to do so or to comply with other user notices in the product user guide and
specification documents may result in loss of or access to data.

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Table of Contents
1. Introduction............................................................................................................................................................... 13
1.1 Reference Documents and Support Collaterals................................................................................................15
2. Essential System Component Installation.......................................................................................................... 17
2.1 System Top Cover Removal / Installation ...........................................................................................................18
2.1.1 System Top Cover Removal.......................................................................................................................................18
2.1.2 System Top Cover Installation .................................................................................................................................19
2.2 Air Duct Removal and Installation...........................................................................................................................20
2.2.1 Air Duct Removal............................................................................................................................................................20
2.2.2 Air Duct Installation.......................................................................................................................................................20
2.3 Processor Assembly and Installation ....................................................................................................................21
2.3.1 PHM Assembly ................................................................................................................................................................22
2.3.2 PHM Installation .............................................................................................................................................................24
2.4 Memory Module Installation .....................................................................................................................................26
2.4.1 DIMM Installation ...........................................................................................................................................................26
3. System Options / Accessory Kit Installation...................................................................................................... 28
3.1 System Top Cover Removal / Installation ...........................................................................................................28
3.1.1 System Top Cover Removal.......................................................................................................................................28
3.1.2 System Top Cover Installation .................................................................................................................................29
3.2 Air Duct Removal and Installation...........................................................................................................................30
3.2.1 Air Duct Removal............................................................................................................................................................30
3.2.2 Air Duct Installation.......................................................................................................................................................30
3.3 Power Supply Module Installation..........................................................................................................................31
3.4 PCIe* Add-in Card Installation..................................................................................................................................31
3.5 Front Drive Installation ................................................................................................................................................33
3.5.1 Front Drive Removal .....................................................................................................................................................34
3.5.2 3.5” Drive Assembly ......................................................................................................................................................35
3.5.3 2.5” Drive Assembly ......................................................................................................................................................35
3.5.4 Front Drive Installation ................................................................................................................................................37
3.6 NVMe* SSD Support .....................................................................................................................................................38
3.7 M.2 SSD Installation......................................................................................................................................................39
3.8 Ethernet Network Adapter for OCP* – Installation ..........................................................................................41
3.9 Trusted Platform Module (TPM) Installation......................................................................................................43
3.10 Intel® VROC 7.5 Key Installation ..............................................................................................................................44
4. System Software Updates and Configuration.................................................................................................... 45
5. System Service – System Features Overview..................................................................................................... 46
5.1 System Status LED State Identification ................................................................................................................50
5.2 Server Board Jumper Blocks and Service Buttons ..........................................................................................51
5.2.1 PC Beep Jumper.............................................................................................................................................................51
5.2.2 BMC COM Port Configuration Jumpers................................................................................................................51

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5.2.3 ME Recovery Jumper....................................................................................................................................................51
5.3 Support Requirements for Thermal Management...........................................................................................52
6. System Service and FRU Replacement................................................................................................................ 53
6.1 System Top Cover Removal / Installation ...........................................................................................................54
6.1.1 System Top Cover Removal.......................................................................................................................................54
6.1.2 System Top Cover Installation .................................................................................................................................55
6.2 Air Duct Removal and Installation...........................................................................................................................56
6.2.1 Air Duct Removal............................................................................................................................................................56
6.2.2 Air Duct Installation.......................................................................................................................................................56
6.3 Memory Module Replacement .................................................................................................................................57
6.4 System Fan Replacement ...........................................................................................................................................58
6.5 Power Supply Replacement ......................................................................................................................................59
6.6 Front Drive Replacement............................................................................................................................................60
6.6.1 Drive Carrier Extraction................................................................................................................................................60
6.6.2 3.5” Drive Replacement...............................................................................................................................................61
6.6.3 2.5” Drive Replacement...............................................................................................................................................62
6.6.4 Front Drive Installation ................................................................................................................................................64
6.7 Riser Card Replacement..............................................................................................................................................65
6.8 OCP* Module Replacement .......................................................................................................................................68
6.9 Backplane Replacement..............................................................................................................................................70
6.10 M.2 SSD Replacement..................................................................................................................................................73
6.11 Intel® VROC 7.5 (VMD NVMe* RAID) Key Replacement..................................................................................74
6.12 System Battery Replacement....................................................................................................................................75
6.13 Processor Replacement...............................................................................................................................................76
6.14 Server Board Replacement ........................................................................................................................................83
Appendix A. Getting Help .......................................................................................................................................... 85
Appendix B. Internal Cable Routing Channels...................................................................................................... 86
Appendix C.Memory Population Rules.................................................................................................................. 87
Recommended Memory Configurations.....................................................................................................................................88
Appendix D. POST Code Errors ................................................................................................................................ 90
Appendix E. System Packaging Assembly Instructions...................................................................................... 96
Appendix F. Safety Instructions............................................................................................................................... 99
Appendix G. Glossary ............................................................................................................................................... 114

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List of Figures
Figure 1. Intel® Server System M20NTP1UR .................................................................................................................................13
Figure 2. Intel® Server System M20NTP1UR Features ..............................................................................................................17
Figure 3. System Top Cover Screws..................................................................................................................................................18
Figure 4. System Cover Removal........................................................................................................................................................18
Figure 5. System Cover Installation...................................................................................................................................................19
Figure 6. Air Duct Removal....................................................................................................................................................................20
Figure 7. Air Duct Installation...............................................................................................................................................................20
Figure 8. Processor Heat Sink Module (PHM) Reference Diagram .......................................................................................21
Figure 9. Installing Processor Carrier Clip onto Processor – Part 1 .....................................................................................22
Figure 10. Installing Processor Carrier Clip onto Processor – Part 2...................................................................................22
Figure 11. Processor Heat Sink Handling........................................................................................................................................23
Figure 12. Processor Heat Sink Anti-tilt Wires in the Outward Position............................................................................23
Figure 13. Pin 1 Indicator of Processor Carrier Clip ...................................................................................................................23
Figure 14. Processor Socket Cover Removal.................................................................................................................................24
Figure 15. PHM Alignment with Processor Socket Assembly ................................................................................................24
Figure 16. PHM Installation onto Server Board............................................................................................................................25
Figure 17. Tighten Heat Sink Fasteners...........................................................................................................................................25
Figure 18. DIMM Blank Removal.........................................................................................................................................................26
Figure 19. Memory Module Installation...........................................................................................................................................26
Figure 20. System Top Cover Screws ...............................................................................................................................................28
Figure 21. System Cover Removal .....................................................................................................................................................29
Figure 22. System Cover Installation................................................................................................................................................29
Figure 23. Air Duct Removal .................................................................................................................................................................30
Figure 24. Air Duct Installation............................................................................................................................................................30
Figure 25. Power Supply Installation................................................................................................................................................31
Figure 26. Riser Card Bracket Removal............................................................................................................................................32
Figure 27. PCIe* Add-in Card Installation .......................................................................................................................................32
Figure 28. Riser Card Assembly Installation ..................................................................................................................................33
Figure 29. Extracting Drive Carrier from Chassis .........................................................................................................................34
Figure 30. 3.5" Drive Blank Removal .................................................................................................................................................34
Figure 31. 3.5” Drive Installation to Drive Carrier........................................................................................................................35
Figure 32. 3.5" Drive Blank to 2.5” SSD Mounting Bracket Conversion .............................................................................35
Figure 33. 2.5” SSD Mounting Bracket Assembly........................................................................................................................36
Figure 34. 3.5" Drive Carrier to 2.5” SSD Bracket – Mount Bracket Assembly to Carrier............................................36
Figure 35. Secure 2.5” SSD Assembly to Drive Carrier..............................................................................................................37
Figure 36. Drive Carrier into Chassis Installation.........................................................................................................................37
Figure 37. NVMe* Support Cable Connectors...............................................................................................................................38
Figure 38. NVMe* Cable Kit Routing..................................................................................................................................................39
Figure 39. M.2 Mounting Latch Placement.....................................................................................................................................40

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Figure 40. M.2 SSD Installation ...........................................................................................................................................................40
Figure 41. OCP* Adapter Bay Filler Removal.................................................................................................................................41
Figure 42. OCP* Mounting Bracket Installation............................................................................................................................41
Figure 43. OCP* Module Mounting Screws ....................................................................................................................................42
Figure 44. OCP* Module Installation.................................................................................................................................................42
Figure 45. TPM Placement ....................................................................................................................................................................43
Figure 46. Intel® VROC Key Installation ...........................................................................................................................................44
Figure 47. System Features...................................................................................................................................................................48
Figure 48. Back Panel Features ...........................................................................................................................................................49
Figure 49. Front Panel Features..........................................................................................................................................................49
Figure 50. Backplane Cable Connectors..........................................................................................................................................49
Figure 51. Control Panel Features......................................................................................................................................................49
Figure 52. Server Board Jumper Blocks and Service Buttons................................................................................................51
Figure 53. System Airflow......................................................................................................................................................................52
Figure 54. DIMM Blank............................................................................................................................................................................52
Figure 55. System Top Cover Panel Shipping Screws...............................................................................................................54
Figure 56. System Cover Removal .....................................................................................................................................................54
Figure 57. System Cover Installation................................................................................................................................................55
Figure 58. Air Duct Removal .................................................................................................................................................................56
Figure 59. Air Duct Installation............................................................................................................................................................56
Figure 60. Memory Module Removal................................................................................................................................................57
Figure 61. DIMM Installation.................................................................................................................................................................57
Figure 62. System fan assembly removal .......................................................................................................................................58
Figure 63. System fan assembly installation.................................................................................................................................59
Figure 64. Power Supply Removal.....................................................................................................................................................59
Figure 65. Power Supply Installation................................................................................................................................................60
Figure 66. Extracting Drive Carrier from Chassis .........................................................................................................................60
Figure 67. 3.5” Drive Removal from Drive Carrier........................................................................................................................61
Figure 68. 3.5” Drive Installation to Drive Carrier........................................................................................................................61
Figure 69. 2.5” Drive Mounting Bracket Removal from Drive Carrier (Step 1).................................................................62
Figure 70. 2.5” Drive Mounting Bracket Removal from Drive Carrier (Step 2)................................................................. 62
Figure 71. 2.5” Drive Removal from Mounting Bracket.............................................................................................................62
Figure 72. 2.5” Drive Installation to Mounting Bracket .............................................................................................................63
Figure 73. 2.5” Drive Assembly Installation to Drive Carrier (Step 7)..................................................................................63
Figure 74. 2.5” SSD Assembly Installation to Drive Carrier (Step 8)....................................................................................64
Figure 75. Drive Carrier into Chassis Installation.........................................................................................................................64
Figure 76. Riser Card Bracket Removal............................................................................................................................................65
Figure 77. PCIe* Add-in Card Removal ............................................................................................................................................65
Figure 78. Riser Card Removal from Bracket.................................................................................................................................66
Figure 79. Riser Card Installation........................................................................................................................................................66
Figure 80. PCIe* Add-in Card Installation .......................................................................................................................................66

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Figure 81. Riser Card Assembly Installation ..................................................................................................................................67
Figure 82. OCP* Module Removal......................................................................................................................................................68
Figure 83. OCP* Module Installation.................................................................................................................................................69
Figure 84. Backplane Removal (Step 1) ...........................................................................................................................................70
Figure 85. Backplane Removal (Step 2) ...........................................................................................................................................70
Figure 86. Backplane Removal (Step 3) ...........................................................................................................................................71
Figure 87. Backplane Installation (Step 1)......................................................................................................................................71
Figure 88. Backplane Installation (Step 2)......................................................................................................................................72
Figure 89. Backplane Installation (Step 3)......................................................................................................................................72
Figure 90. M.2 SSD Removal ................................................................................................................................................................73
Figure 91. M.2 SSD Installation ...........................................................................................................................................................73
Figure 92. Intel® VROC Key Removal ................................................................................................................................................74
Figure 93. Intel® VROC Key Installation ...........................................................................................................................................74
Figure 94. System Battery Removal ..................................................................................................................................................75
Figure 95. System Battery Installation .............................................................................................................................................75
Figure 96. PHM Assembly Removal from Processor Socket...................................................................................................76
Figure 97. Processor Socket Cover Installation............................................................................................................................77
Figure 98. PHM Disassembly................................................................................................................................................................78
Figure 99. Processor Carrier Clip Removal from PHM Assembly..........................................................................................78
Figure 100. Installing Processor Carrier Clip onto Processor – Part 1................................................................................79
Figure 101. Installing Processor Carrier Clip onto Processor – Part 2................................................................................79
Figure 102. Processor Heat Sink Handling.....................................................................................................................................80
Figure 103. Processor Heat Sink Anti-tilt Wires in the Outward Position.........................................................................80
Figure 104. Processor Heat Sink Placement..................................................................................................................................80
Figure 105. Processor Socket Cover Removal..............................................................................................................................81
Figure 106. PHM Alignment with Processor Socket Assembly..............................................................................................81
Figure 107. PHM Installation onto Server Board .........................................................................................................................82
Figure 108. Tighten Heat Sink Fasteners........................................................................................................................................82
Figure 109. Server Board Removal ....................................................................................................................................................83
Figure 110. Server Board Installation...............................................................................................................................................84
Figure 111. Cable Routing Channels.................................................................................................................................................86
Figure 112. Server Board Memory Slot Association by CPU ..................................................................................................87
Figure 113. Processor Memory Slot Support Overview ...........................................................................................................87

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List of Tables
Table 1. Intel® Server System M20NTP1UR Reference Documents and Support Collaterals..................................15
Table 2. PCIe* NVMe* Cable Routing................................................................................................................................................38
Table 3. Intel® Server System M20NTP1UR Features................................................................................................................46
Table 4. System Status LED State Definitions...............................................................................................................................50
Table 5. Recommended DDR4 DIMM per Socket Population Configurations.................................................................88
Table 6. DDR4 DIMM Attributes Table for “Identical” and “Like” DIMMs ..........................................................................89

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1. Introduction
The Intel® Server System M20NTP1UR is a purpose-built rack mount server that delivers power and
performance within a 1U form factor. The system supports up to two 3rd Gen Intel® Xeon® Scalable
processors, providing flexible performance. Previous generation Intel® Xeon® processor and Intel® Xeon®
Scalable processor families are not supported.
The Intel® Server System M20NTP1UR supports up to 16 DDR4 DIMMs, providing high memory bandwidth
for memory intensive workloads.
For a complete overview of system features and functions, refer to the following Intel documents:
•Intel® Server Board M20NTP2SB Technical Product Specification (TPS)
•Intel® Server System M20NTP1UR Technical Product Specification (TPS)
Figure 1. Intel® Server System M20NTP1UR
Refer to Section 1.1 for a complete list of available product documentation. For the latest revision of this
document, go to:
https://www.intel.com/content/www/us/en/support/products/77593/server-products/server-systems.html

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About This Document
This document provides system integrators and service technicians with instructions for the installation and
removal of system components and supported Intel accessories.
The document is organized into two sections. The first section (Chapters 2 through 4) is focused on the
installation of system components and accessories into an L6 or L9 integrated server system1.
The second section (Chapters 5, 6, and appendices A-E) is focused on system service. The section provides
the service technician with valuable system information and procedures necessary to successfully identify
and replace a faulty system component.
System Integration
Chapter 2 – L6 Only: Essential Component Integration – Installation procedures for components
required to make an L6 integrated system power on ready.
Chapter 3 – L6/L9: Optional Component Integration – Installation procedures for optional components
and/or available accessory kits used to enhance the base system feature set.
Chapter 4 – System Software Update and Configuration – A short overview describing the system
software stack installed on new Intel servers and where to get the latest updates.
System Service
Chapter 5 – Product Overview – Provides an overview of the system features.
Chapter 6 – FRU Replacement – Replacement procedures for components identified as field replaceable
units (FRUs).
Appendix A – Getting Help. Provides server system support and contact information.
Appendix B – Internal Cable Routing Channels. Provides cable routing guidance.
Appendix C – General Memory Population Rules. Provides a summary of general memory population
rules.
Appendix D – POST Code Errors. List of POST code errors that represent specific failures, warnings, or
information.
Appendix E – System Packaging Assembly Instructions.Provides detailed instructions to repack the
server system into the original Intel packaging.
1An L6 integrated system is non-functional as received and requires essential components to be installed to
make it power-on ready. An L9 integrated system is power-on ready but may require additional options and
or accessories to enhance the base system configuration.

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1.1 Reference Documents and Support Collaterals
For additional information and other support collaterals related to this Intel server product, see Table 1.
Listed documents and utilities can be downloaded from the following Intel web sites or can be ordered
through your local Intel support representative.
https://www.intel.com/content/www/us/en/design/resource-design-center.html
Note: Some of the Intel documents listed in Table 1are classified as “Intel Confidential”. These documents
are only made available under a Non-Disclosure Agreement (NDA) with Intel. With an appropriate NDA in
place, listed classified documents can be downloaded from the Intel Resource & Design Center web site at
the following link: https://www.intel.com/content/www/us/en/design/resource-design-center.html
Table 1. Intel® Server System M20NTP1UR Reference Documents and Support Collaterals
Topic Document Title or Support Collateral
Document
Classification
Server board-level architectural
and features overview
Intel® Server Board M20NTP Technical Product Specification Public
System-level architectural and
features overview
Intel® Server System M20NTP1UR Technical Product Specification
Public
Intel® Server System M20NTP2UR Technical Product Specification
Public
System integration and service
instructions
Intel® Server System M20NTP2UR System Integration and Service Guide
Public
Intel® Server System M20NTP1UR System Integration and Service Guide
Public
Available product family options,
spares, accessories.
Intel® Server M20NTP Family Configuration Guide Public
Integrated BMC Web Console
Intel® Integrated Baseboard Management Controller Web Console
(Integrated BMC Web Console) User Guide Public
Base specifications for the IPMI
architecture and interfaces
Intelligent Platform Management Interface Specification Second
Generation v2.0
Intel
Confidential
Specifications for the PCIe* 3.0
architecture and interfaces
PCIe* Base Specification, Revision 3.0
http://www.pcisig.com/specifications
Public
Specifications for the PCIe* 4.0
architecture and interfaces
PCIe* Base Specification, Revision 4.0
http://www.pcisig.com/specifications
Public
Specification for OCP* Open Compute Project* (OCP*) Specification
Intel
Confidential
TPM for PC Client specifications TPM PC Client Specifications, Revision 2.0
Intel
Confidential
Functional specifications of 3rd Gen
Intel® Xeon® Scalable processor
family
3rd Generation Intel® Xeon® Scalable Processors, Codename Ice Lake-SP
External Design Specification (EDS): Document IDs: 574451, 574942,
575291
Intel
Confidential
Processor thermal design
specifications and
recommendations
3rd Generation Intel® Xeon® Scalable Processor, Codename Ice Lake-SP
and Cooper Lake-SP - Thermal and Mechanical Specifications and
Design Guide (TMSDG): Document ID 574080
Intel
Confidential
Intel® Virtual RAID on CPU (VROC) Intel® Virtual RAID on CPU (VROC) Technical Product Specification (TPS)
Intel
Confidential
Intel® Virtual RAID on CPU (VROC) User Guide
Public
BIOS and BMC Security Best
Practices
Intel® Server Systems Baseboard Management Controller (BMC) and
BIOS Security Best Practices White Paper
https://www.intel.com/content/www/us/en/support/articles/000055785/
server-products.html
Public
Managing an Intel Server Overview
Managing an Intel Server System 2020
https://www.intel.com/content/www/us/en/support/articles/000057741/
server-products.html
Public
Intel® Server Update Package (SUP) for Intel® Server M20NTP Family
Public

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Topic Document Title or Support Collateral
Document
Classification
Latest system software updates:
BIOS and Firmware
Intel® Server Firmware Update Utility (SYSFWUPDT) - Various operating
system support
Intel® Server Firmware Update Utility User Guide
To obtain full system information
Intel® Server Information Utility – SYSINFO
Public
Intel® Server Information Utility User Guide
To configure, save, and restore
various system options
Intel® Server Configuration Utility – SYSCFG – Various operating system
support
Public
Intel® Server Configuration Utility User Guide
Product Warranty Information
Warranty Terms and Conditions
https://www.intel.com/content/www/us/en/support/services/00000588
6.html
Public
Intel® Data Center Manager (Intel®
DCM) information
Intel® Data Center Manager (Intel® DCM) Product Brief
https://software.intel.com/content/www/us/en/develop/download/dcm
-product-brief.html
Public
Intel® Data Center Manager (Intel® DCM) Console User Guide
https://software.intel.com/content/www/us/en/develop/download/dcm
-user-guide.html
Public

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2. Essential System Component Installation
The Intel® Server System M20NTP1UR is offered as an L6 integrated system. As received, the L6 system is
not functional and will not boot. It requires additional components (sold separately) to be added to the
system to make the base system configuration power on ready.
The procedures in this chapter should be used to install the following components:
•1 (Required) or 2 (Optional) processors – 3rd Gen Intel® Xeon® Scalable processor family
•Memory – Up to 16 DDR4 DIMMs
If your Intel server system came preinstalled with all the components listed above, then skip this chapter and
go to Chapter 3 for installation procedures associated with all other system options and accessories.
Figure 2. Intel® Server System M20NTP1UR Features
Before You Begin
Before integration of any system components, review all the safety and ESD precautions found in the Safety
Warnings section at the beginning of this document.
System Reference
In the following procedures, all references to left, right, front, top, and bottom assume the reader is facing
the front of the server chassis.
Instruction Format
Each procedure described in this chapter follows an illustration first format. This format gives the reader the
option to follow a quicker path to component integration by first seeing an illustration of the intended
procedure. If necessary, the reader can then follow the step-by-step instructions that accompany each
procedure.

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2.1 System Top Cover Removal / Installation
Required Tools and Supplies
•Anti-static wrist strap and conductive workbench pad (recommended)
•Phillips* head screwdriver #1
2.1.1 System Top Cover Removal
Removal of the top cover is necessary when installing or replacing any system component within the server
chassis.
The system ships from the factory with the top cover secured to the chassis using three screws.
1. Remove the three top cover screws (See Figure 3).
Figure 3. System Top Cover Screws
Note: A non-skid surface or a stop behind the server system may be needed to prevent the server system
from sliding on the work surface.
2. Remove the top cover (See Figure 4)
Figure 4. System Cover Removal

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•While pushing down on both the left and right buttons (see Letter “B”), slide the top cover
~10mm towards the back of the chassis (see Letter “C”).
•Carefully lift the top cover up and away from the chassis.
2.1.2 System Top Cover Installation
To maintain proper air flow within the system, the top cover must be in place when the system is operating.
1. Install the top cover (See Figure 5)
Figure 5. System Cover Installation
•Align and place the top cover on the top edges of the chassis.
•Slide it towards the front of the chassis until it locks into place (see Letter “A”).
Shipping Note: When transporting the server system, Intel recommends installing the three top cover
screws before shipping (see Letter “B”).

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2.2 Air Duct Removal and Installation
Required Tools and Supplies
•Anti-static wrist strap and conductive workbench pad (recommended)
2.2.1 Air Duct Removal
1. Remove the system top cover (see Section 2.1.1).
2. Remove the air duct (See Figure 6)
Figure 6. Air Duct Removal
•Lift the air duct straight up and away from the server system.
2.2.2 Air Duct Installation
To maintain proper air flow within the system, the air duct must be in place when the system is operating.
1. Ensure cable channels on each side of the air duct are oriented towards the front of the system
2. Install the air duct (See Figure 7)
Figure 7. Air Duct Installation
•Lower the air duct into the system, ensuring that all cables are clear from the installation area.
•The air duct is properly installed when it sits flat and is securely in place