Intel TIGH2U - Carrier Grade Server Operating and safety instructions

Product Overview
The Intel® Carrier Grade Server TIGH2U is a NEBS-3 and ETSI-
compliant 2U carrier-grade rack-mount server, delivering industry-
leading performance-per-watt over previous-generation rack-
mount servers. It features the Quad-Core Intel® Xeon® processor
5400∆series — based on Intel’s latest 45nm technology — to
provide breakthrough performance and energy efficiency for
compute- and I/O-intensive applications and workloads.
This high-performing server is an excellent choice for the
demanding environment and limited space of the central office
and high availability data centers. It enables OEMs and TEMs to
create specialized, value-added solutions for a variety of telecom
applications including unified messaging, SoIP, call control, media
and signaling gateways, and operational system support.
The TIGH2U is designed to be fire-resistant and to withstand
extreme heat, humidity, altitude and zone 4 earthquake shock.
Advanced server management and telco alarm management
features provide visual, audible (optional) and SNMP event
indications of faults, consistent with the rigid requirements
of the telecom central office environment.
45nm Quad-Core Intel® Xeon® Processor 5400∆
Series with Extended Life Cycle Support
Dual-processor platforms based on the Quad-Core Intel Xeon
processor 5400 series provide high levels of computing for
threaded applications, delivering eight-thread, 32- and 64-bit
processing capabilities with 12 MB of L2 cache per processor.
Based on 45nm enhanced Intel® Core™ microarchitecture, the
processor delivers up to 38-percent improvement in perform-
ance-per-watt1over previous-generation Intel® quad-core
processors. It has also been demonstrated to deliver up to 2x
faster performance2than Intel® dual-core processors, and up to
5x increased performance3over Intel® single-core processors.
Support for Intel® Advanced Technologies
The Intel Carrier Grade Server TIGH2U supports many of Intel’s
advanced hardware technologies, including:
• Intel® Virtualization Technology4(Intel® VT) provides hardware
assistance for software-based virtual environments, allowing
multiple operating systems and applications to run in indepen-
dent partitions. It helps reduce total cost-of-ownership by
facilitating remote upgrades of applications and operating
systems.
• Intel® I/O Acceleration Technology5(Intel® I/OAT), supported by
the server chipset, significantly improves data throughput via
hardware- and software-supported I/O acceleration by reducing
CPU over-head to free resources for more critical tasks. Addi-
tionally, it provides network acceleration that scales seamlessly
across multiple Gigabit Ethernet (GbE) ports.
• Intel® 64 Architecture6provides flexibility for 64-bit and
32-bit applications and operating systems.
• Fully Buffered DIMM (FB-DIMM) technology enables the
flexibility to optimize system for performance and capacity
or for cost effectiveness and power efficiency.
Product Brief
Intel® Carrier Grade Server TIGH2U
Telecom and Compute Products
Intel® Carrier Grade Server TIGH2U

Intel® Carrier Grade Server TIGH2U
Standard Features Benefits
Support for two Quad-Core Intel® Xeon® processors 5400∆series • New 45nm enhanced Intel® Core™ microarchitecture boosts performance on
multiple applications/user environments and data-demanding workloads
• Faster performance with improved energy efciency enables denser deployments
Three-year extended life cycle support with possible extension
to ve years
• Reduces customer risk for long product roll-outs
• Fewer platform transitions requiring additional testing and software
Shallow 20-inch depth • Increases installation and service exibility
600W AC or DC hot-swap power supply • Flexibility of installation and applications; uninterrupted operation (DC)
• Upgradeable to second power supply for redundancy
Telco alarm management • Front-panel feature supports central ofce alarm systems
Two rear-panel GbE NIC (Cu) ports • Scalable Ethernet ports, upgradeable to 20 GbE (max) based on PCI
conguration and optional I/O modules
Eight FB-DIMM slots (240-pin DDR2-533/667 MHz) • Maximum 32 GB memory (non-mirrored mode)
Drive trays for up to six hot-swap 2.5-inch SAS hard disk drives • High-performance, enterprise-class drives for 24/7 operation
Bay supports optical drive (purchased separately) • Accommodates Slimline CD-ROM; CD-R/W; CD DVD-R/W
Up to ve PCI slots for exibility and additional I/O • Low-prole riser supports two PCIe x4 slots
• Full-height, full-length riser supports three slots (two PCIe x4 [or 1 PCIe x8]
and one PCI-X)
Figure 1. Intel® Carrier Grade Server TIGH2U front panel
A Anti-static connection
B Optical drive (optional)
or ller panel
C Power switch
D Reset switch
E Critical alarm LED
F Major alarm LED
G Minor alarm LED
H Power alarm LED
I NMI switch
J ID switch
K System ID LED
L NIC activity LED
M Main power LED
N HDD activity LED
O Hard drive bays
(supports six 2.5” SAS)
P Drive fault indicator
(one per hard drive)
Q Drive activity indicator
(one per hard drive)
R USB port 2 connector
S RJ45 serial port
connector (COM 2)
Figure 2. Intel® Carrier Grade Server TIGH2U rear panel
A Low-prole PCIe add-in
cards or ller panels
B Full-height PCI-X/PCIe
add-in cards or ller
panels
C Grounding studs (for
DC system)
D Power supply #2 slot
(ller panel shown)
E Power supply #1
(AC module shown; DC
modules also available)
F GCM port connector
(optional) or ller panel
G I/O expansion module
connector (optional)
or ller panel
H USB 0 and USB 1
port connectors
I Video connector
J GbE NIC 2 connector
K GbE NIC 1 connector
L RJ45 serial port
connector (COM 2)
M PS/2 keyboard and
mouse connectors
N Telco alarms connector

Intel® Carrier Grade Server TIGH2U
Figure 3. Intel® Carrier Grade Server TIGH2U block diagram (shown as fully configured system with all optional features included)
Intel® 5000P
Memory
Controller Hub
Intel®
6321 ESB
I/O
Controller
Hub
600 W
Redundant
Hot-Swappable
Power Supply
Module #1
Power Distribution Board
600 W
Redundant
Hot-Swappable
Power Supply
Module #2
PCIe x8 20 Gb/s
ESI x4
PATA
DVI
LPC
FB-DIMM
Branch 0
Branch 1
PCIe x8
PCIe x4
Bridge
Board
PCI 32/33
USB 7
USB 6
USB 5
PCI x 64/133
PCIe x8 20 Gb/s
Quad-Core
Intel® Xeon®
Processor
5400
Low-Profile
Riser
FH
Riser
Full-Height Intel®
Adaptive Slot
IDE Connector
Keyboard/Mouse
D2
Fan 3Fan 4 Fan 2 Fan 1
D1
C2
C1
B2
B1
A2
A1
Rear Serial Port
Front Serial Port
Status LEDs
Optical Drive
Buttons
RMM
Dual Gb
Ethernet
16 MB
DDR
ATI Rage
XL Video RMM
NIC
RMM
Slot
USBCOM
2
External
Alarms
Connector
Power
Connector
SFP
Power
Disk 0
Disk 2
Disk 4
Disk 1
Disk 3
Disk 5
IDE
Connector
SAS
Backplane
Power In
Alarms
Connector
SAS
Backplane
Power Out
Super
I/O
Rear Port
Rear Port
Low-Profile
PCIe Slot
Slot 1
PCIe
Slot 2
PCIe
Slot 1
PCIe
Slot 2
PCIe
Slot 3
PCI-X
Quad-Core
Intel® Xeon®
Processor
5400
I/O Module
Slot Dual GbE/
4-port SAS
Server Board
SFP Board
SAS Backplane
TAM Board
Flex Cable
Cable
Optional Features Benefits
Hardware RAID 5 • Greater protection and reliability of data storage
Intel® Remote Management Module 2 • Lights-out management
Flash storage capability supports Intel® Z-U130 Value Solid
State Drive (Purchased separately)
• High-speed, high-density storage, faster boot times, USB interface
Optional I/O modules (rear) • Enables additional external SAS storage or two additional GbE NIC
(Cu) ports on rear panel
Additional full-height riser options for PCI-X • PCI-X (active): three independent PCI-X, each with maximum 133 MHz
• PCI-X (passive): two PCI-X with maximum 100 MHz and one PCI-X (66 MHz)
all on a shared PCI bus
Order Information Description
TLHA0201W Base model with AC power supply
TLHD0201W Base model with DC power supply

Embedded Intel® Architecture in Networking and Communications: intel.com/netcomms/
∆
Intelprocessornumbersarenotameasureofperformance.Processornumbersdifferentiatefeatureswithineachprocessorfamily,notacrossdifferentprocessorfamilies.
Seehttp://www.intel.com/products/processor_numberfordetails.
1
Quad-CoreIntel®Xeon®processor5300series.Upto38%(1.38x)higherPerf/WattE5450vsE5335–Published/measuredresultsonSPECjbb2005*–Oct2,2007.
2
Dual-CoreIntel®Xeon®processor5100series.Upto119%(2.19x)higherPerformanceX5460vs5160–Published/measuredresultsonSPECjbb2005*–Oct2,2007.
3
Single-Core64-bitIntel®Xeon®processor3.80GHz.Upto443%(5.43x)higherPerformanceX5460vsXeon3.80–Published/measuredresultsonSPECint*_rate_base2006–Oct2,2007.
4
Intel®VirtualizationTechnologyrequiresacomputersystemwithanenabledIntel®processor,BIOS,virtualmachinemonitor(VMM)and,forsomeuses,certainplatformsoftwareenabledforit.Functionality,
performanceorotherbenetswillvarydependingonhardwareandsoftwarecongurationsandmayrequireaBIOSupdate.Softwareapplicationsmaynotbecompatiblewithalloperatingsystems.Pleasecheck
withyourapplicationvendor.
5Intel®I/OAccelerationTechnology(Intel®I/OAT)requiresanoperatingsystemthatsupportsIntelI/OAT.
6
64-bitcomputingonIntelarchitecturerequiresacomputersystemwithaprocessor,chipset,BIOS,operatingsystem,devicedriversandapplicationsenabledforIntel®64architecture.Performancewillvary
dependingonyourhardwareandsoftwarecongurations.Consultwithyoursystemvendorformoreinformation.
7Asper25-GS0009BoardsandSystemsEnvironmentalGoverningSpecication.
INFORMATIONINTHISDOCUMENTISPROVIDEDINCONNECTIONWITHINTEL®PRODUCTS.NOLICENSE,EXPRESSORIMPLIED,BYESTOPPELOROTHERWISE,TOANYINTELLECTUAL
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ANDINTELDISCLAIMSANYEXPRESSORIMPLIEDWARRANTY,RELATINGTOSALEAND/ORUSEOFINTELPRODUCTSINCLUDINGLIABILITYORWARRANTIESRELATINGTOFITNESSFORA
PARTICULARPURPOSE,MERCHANTABILITY,ORINFRINGEMENTOFANYPATENT,COPYRIGHTOROTHERINTELLECTUALPROPERTYRIGHT.UNLESSOTHERWISEAGREEDINWRITINGBYINTEL,
THEINTELPRODUCTSARENOTDESIGNEDNORINTENDEDFORANYAPPLICATIONINWHICHTHEFAILUREOFTHEINTELPRODUCTCOULDCREATEASITUATIONWHEREPERSONALINJURYOR
DEATHMAYOCCUR.
Intelmaymakechangestospecificationsandproductdescriptionsatanytime,withoutnotice.Designersmustnotrelyontheabsenceorcharacteristicsofanyfeatures
orinstructionsmarked“reserved”or“undefined.”Intelreservestheseforfuturedefinitionandshallhavenoresponsibilitywhatsoeverforconflictsorincompatibilitiesarising
fromfuturechangestothem.Theinformationhereissubjecttochangewithoutnotice.Donotfinalizeadesignwiththisinformation.Theproductsdescribedinthisdocument
maycontaindesigndefectsorerrorsknownaserratawhichmaycausetheproducttodeviatefrompublishedspecifications.Currentcharacterizederrataareavailableon
request.ContactyourlocalIntelsalesofficeoryourdistributortoobtainthelatestspecificationsandbeforeplacingyourproductorder.Copiesofdocumentswhichhavean
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Intel,theIntellogo,Intel.Leapahead.,Intel.Leapahead.logo,Xeon,andIntelCorearetrademarksofIntelCorporationintheU.S.andothercountries.
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Specifications
Processor
Type Two (2) Quad-Core Intel® Xeon® processors 5400∆series
with 12 MB cache
Front-side bus 1333 MHz
Chipset
Memory Controller Hub Intel® 5000P Memory Controller Hub (MCH)
I/O Controller Hub Intel® 6321ESB I/O Controller Hub (ICH)
Connections
Two (2) PCI risers
supporting up to
ve PCI slots (included)
• One (1) low-prole riser supporting two PCIe x4 slots
• One (1) full-height, full-length riser supporting three
slots (two PCIe x4 [or one PCIe x8] and one PCI-X)
Additional full-height
riser conguration
(optional)
• PCI-X (active): Three (3) independent PCI-X slots
(133 MHz max)
• PCI-X (passive): Two (2) PCI-X slots (100 MHz max)
and one PCI-X slot (66 MHz) on shared bus
GbE NIC (CU) ports • Two (2) on base board (rear)
• Two (2) via optional I/O Module (rear, optional)
USB 2.0 ports • Three (3): One front/two rear
Storage
Type SAS 2.5-inch hot-swap HDD
Redundancy RAID 1 and RAID 5
Internal Carrier with six HDD trays
External SAS port on rear supports JBOD
Environmental
Temperature, operating +5° C to +40° C (41° F to 104° F)
Temperature, short-term
operating (<96 hrs)
-5° C to 50° C
Temperature, non-
operating
-40° C to 70° C (-40° F to 158° F)
Altitude 0 to 1,800 m (0 to 5,905 ft) @ 40° C
0 to 4,000 m (0 to 13,123 ft) @ 30° C
Humidity, operating 5% to 85%
Humidity, short-term
operating
5% to 90%
Humidity, non-operating 93%, non-condensing at temperatures of 23° C (73° F)
to 40° C (104° F)
Vibration, operating Swept sine survey at an acceleration amplitude of
0.1 G from 5 to 100 Hz and back to 5 Hz at a rate of
0.1 octave/minute; 90 minutes per axis on all three
axes as per Bellcore GR-63-CORE standards
Vibration, non-operating Swept sine survey at an acceleration amplitude of 0.5
G from 5 to 50 Hz at a rate of 0.1 octaves/ minute, and
an acceleration amplitude of 3.0 G from 50 to 500 Hz at
a rate of 0.25 octaves/minute, on all three axes as per
Bellcore GR-63-CORE standard. 2.2 Grms, 10 minutes
per axis on all three axes
Shock, operating Half-sine 2 G, 11 ms pulse, 100 pulses in each direction,
on each of the three axes7
Environmental, continued
Shock, non-operating Trapezoidal, 25 G, 170 inches/sec delta V, three drops in
each direction, on each of the three axes4
Acoustic Sound pressure: < 55 dBA at ambient temperatures
< 24° C measured at bystander positions in operating
mode
Memory
Maximum memory
capacity
32 GB (non-mirrored mode)
DIMM slots Eight (8)
Memory type FB-DIMM technology at 533 and 667 MHz
Physical
Height 3.45 inches (87.6 mm)
Width 17.14 inches (435.3 mm)
Depth 20 inches (508 mm)
Regulatory Compliance
Safety UL 60950-1, 1st Edition/CSA 22.2 60950-1, Low Voltage
Directive 2006/95/EC, GS to EN60950-1, 1st Edition CB
Certicate and Report to IEC60950-1, 1st Edition and all
international deviations
Electromagnetic
Compatibility:
Australia/New Zealand C-tick, Class A
Canada ICES-003, Issue 4, Class A Limit
China CCC Approval, Class A (EMC and Safety)
Europe EMC Directive, 2004/108/EC
EN55022, Class A Limit, Radiated and
Conducted Emissions
EN55024 Immunity Characteristics for ITE
EN61000-4-2 ESD Immunity
EN61000-4-3 Radiated Immunity
EN61000-4-4 Electrical Fast Transient
EN61000-4-5 Surge
EN61000-4-6 Conducted RF
EN61000-4-8 Power Frequency Magnetic Fields
EN61000-4-11 Voltage Fluctuations and Short
Interrupts
EN61000-3-2 Harmonic Currents
EN61000-3-3 Voltage Flicker
International CISPR 22, Class A Limit, CISPR 24 Immunity
Japan VCCI Class A
Korea RRL Approval, Class A
Russia Gost Approval
Taiwan BSMI Approval, CNS 13438, Class A and CNS13436 Safety
USA FCC 47 CFR Parts 2 and 15, Veried Class A Limit