2.7.1.2 SerDes Interface................................................................................................................................................ 31
2.7.1.3 GPIOs From LS1021A...................................................................................................................................... 31
2.7.2 FPGA Interfaces ....................................................................................................................................32
2.7.2.1 GTY High Speed Transceivers........................................................................................................................... 32
2.7.2.2 FPGA IOs –HD BANK92................................................................................................................................. 35
2.7.2.3 FPGA IOs –HP BANK65 & 67......................................................................................................................... 38
2.7.3 Power Control Input...............................................................................................................................40
2.8 Board to Board Connector2 .......................................................................................................................41
2.8.1 LS1021A Interfaces...............................................................................................................................45
2.8.1.1 Gigabit Ethernet Interface................................................................................................................................. 45
2.8.1.2 USB2.0 Interface............................................................................................................................................... 46
2.8.1.3 Debug UART Interface...................................................................................................................................... 46
2.8.1.4 Data UART Interface ........................................................................................................................................ 47
2.8.1.5 I2C Interface..................................................................................................................................................... 47
2.8.1.6 JTAG Interface.................................................................................................................................................. 48
2.8.1.7 SerDes Interface................................................................................................................................................ 48
2.8.1.8 GPIOs From LS1021A...................................................................................................................................... 49
2.8.2 FPGA Interfaces ....................................................................................................................................50
2.8.2.1 FPGA IOs –HP BANK66,65............................................................................................................................. 50
2.8.2.2 FPGA IOs –HP BANK67................................................................................................................................... 55
2.8.3 Power & Reset Input..............................................................................................................................61
2.9 Board to Board Connector3 .......................................................................................................................62
2.9.1 FPGA Interfaces ....................................................................................................................................66
2.9.1.1 GTY High Speed Transceivers........................................................................................................................... 66
2.9.2 Power....................................................................................................................................................71
2.10 Board to Board Connector4 .......................................................................................................................73
2.10.1 FPGA Interfaces ....................................................................................................................................75
2.10.1.1 GTY High Speed Transceivers....................................................................................................................... 75
2.10.2 Power....................................................................................................................................................76
2.11 LS1021A Processor Pin Multiplexing on Board-to-Board Connectors........................................................77
3. TECHNICAL SPECIFICATION...................................................................................................................85
3.1 Electrical Characteristics............................................................................................................................85
3.1.1 Power Input Requirement.......................................................................................................................85
3.1.2 Power Input Sequencing ........................................................................................................................86
3.1.3 Power Consumption...............................................................................................................................87
3.2 Environmental Characteristics ...............................................................................................................88
3.2.1 Temperature Specification ..................................................................................................................88
3.2.2 RoHS2 Compliance..............................................................................................................................88
3.2.3 Electrostatic Discharge........................................................................................................................88
3.2.4 Heat Sink...............................................................................................................................................89
3.3 Mechanical Characteristics ........................................................................................................................90
3.3.1 Kintex Ultrascale+ FPGA SOM Mechanical Dimensions.......................................................................90
4. ORDERING INFORMATION.......................................................................................................................93