JETWAY LI1BV Series User manual

LI1BV Series
User’s Manual
NO. G03-LI1BV-F
Revision: 1.0
Release date: March 17, 2022
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

ii
ENVIRONMENTAL SAFETY INSTRUCTION............................................................................. iii
USER’S NOTICE...............................................................................................................................iv
MANUAL REVISION INFORMATION...........................................................................................iv
ITEM CHECKLIST............................................................................................................................ iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD.........................................................................................1
1-2 SPECIFICATION.................................................................................................................... 2
1-3 LAYOUT DIAGRAM...............................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING................................................................................................................ 9
2-2 CONNECTORS AND HEADERS........................................................................................ 16
2-2-1 CONNECTORS........................................................................................................16
2-2-2 HEADERS................................................................................................................ 20
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP................................................................................................................ 28
3-2 BIOS MENU SCREEN........................................................................................................... 29
3-3 FUNCTION KEYS...................................................................................................................30
3-4 GETTING HELP......................................................................................................................30
3-5 MENU BARS........................................................................................................................... 30
3-6 MAIN MENU............................................................................................................................ 31
3-7 ADVANCED MENU................................................................................................................32
3-8 CHIPSET MENU..................................................................................................................... 44
3-9 SECURITY MENU.................................................................................................................. 47
3-10 BOOT MENU........................................................................................................................... 50
3-11 SAVE & EXIT MENU..............................................................................................................51
TABLE OF CONTENT

iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 40 centigrade is the suitable temperature. (The temperature comes from the
request of the chassis and thermal solution)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition March 17, 2022
Item Checklist
Motherboard
Cable(s)
I/O Back panel shield

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel®ElkhartLake series processor
Support 1* DDR4 3200MHz SO-DIMM up to 32GB and single channel function
Integrated with Intel i225V 2.5GbE LAN chip (dual-chip optional by order )
Support 2* USB 3.1(Gen.2) & 7* USB2.0 data transport demand
Support 1* SATAIII (6Gb/s) Devices & 1* M.2 (M-key)
Support 1* VGA port & 1* EDP & 1* LVDS Output
Support 2* COM port (RS232/422/485) & 4* COM port (RS232)
Onboard 1* M.2 E-key support WIFI/BT Module
Onboard 1* M.2 B-key support 4G/5G Module
Support Smart FAN function
Support ACPI S3 Function
Support Watchdog Timer Technology

2
1-2 Specification
Spec
Description
Design
Mini-ITX form factor 6 layers; PCB size: 17.0x17.0cm
Embedded CPU
Integrated Intel®ElkhartLake series CPU
* for detailed CPU support information please visit our website
Memory Slot
1*DDR4 SO-DIMM slot support 1* DDR4 3200MHz up to 32GB
Expansion Slot
1* M.2 E-key 2230 slot supports WIFI/BT Module (M2E1)
1* M.2 B-key 3042/3052 slot supports 4G/5G Module (M2B1)
1* SIM card slot function with M.2 B-key, 3042/3052 slot (SIMCARD1)
Storage
1* SATA III 6G/s connector
1 * M.2 M-key 2242/2280 slot supports SATA or NVMe/ PCIex2
interface (M2M1)
LAN Chip
Model LI1BV-00:Integrated with1* Intel i225-V Ethernet LAN chip
Model LI1BV-0L:Integrated with 2* Intel i225-V Ethernet LAN chips
Support up to 2.5Gbps data transfer rate for Fast Ethernet LAN
function
BIOS
AMI 128M Flash ROM
Rear I/O
1* 12V DC-in power jack
1* VGA port (co-lay HDMI1)
2* USB 3.1 (Gen.2) ports
Model LI1BV-00: 4* USB2.0 & 1* RJ-45 LAN Port
Model LI1BV-0L: 2* USB2.0 & 2* RJ-45 LAN ports
1* Audio Line-out & 1* MIC-in
Internal I/O
1* 4-pin internal 12V DC-in power connector
1* SATA power-out connector
1* Front panel hearer
1* Front audio header
1* 3W Speaker header

3
Model LI1BV-00: 1* 9-Pin USB 2.0 header
Model LI1BV-0L: 2* 9-Pin USB 2.0 headers
1* 4-Pin USB 2.0/1.1 wafer for 1* USB 2.0/1.1 port
1* SMBUS header
1* GPIO header
6* Serial port header (COM3/4/5/6 support RS232;COM1/2 support
RS232/422/485)
1* EDP2 connector (co-lay HDMI2)
1* LVDS1 connector (co-lay EDP1)
1* Inverter connector
TPM 2.0
Supported by LI1BV-002/LI1BV-0L2 Series
1-3 Layout Diagram
Rear IO Diagram
For LI1BV-00 Series:
For LI1BV-0L Series:
VGA Port
USB 3.1 (Gen. 2) Ports
RJ-45 LAN Ports
Line-OUT
MIC-IN
RJ-45 LAN Port
USB 3.1 (Gen. 2) Ports
VGA Port
USB 2.0 Ports
USB 2.0 Ports
12V DC-IN
12V DC-IN
Line-OUT
MIC-IN

4
Motherboard Internal Diagram-Front
For LI1BV-00 Series:
VGA port
RJ-45 LAN Port
LINE-OUT Port
USB 3.1(Gen.2) Ports
USB 2.0 Ports
MIC-in Port
12V DC
Power Connector
EDP Connector
12V DC-in Jack
DDR4
SODIMM Slot
SATAIII Port
(SATA1)
LVDS
Connector
Inverter
Connector
SATA power
Connector
Front Panel
Header
USB 2.0 Header
(FP_USB1)
Serial Port Headers
(COM3~6)
Front Audio
Header
GPIO Header
USB 2.0 Wafer
Serial Port Headers
(COM1~2)
*SIM Card
Slot
M.2 M-key
(M2M1)
SUBUS
Header
M.2 B-key
(M2B1)
M.2 E-key
(M2E1)
Speaker
CPUFAN
Connector
TX-RXCOM2
TX-RXCOM1

5
For LI1BV-0L Series:
*Note: SIM card slot only work when compatible SIM card installed & 4G/5G LAN card installed in
M2B1 USB slot.
VGA port
RJ-45 LAN Ports
LINE-OUT Port
12V DC
Power Connector
USB 2.0 Header
(FP_USB1)
Serial Port Headers
(COM3~6)
EDP Connector
DDR4
SODIMM Slot
SATAIII Port
(SATA1)
Front Audio
Header
*SIM Card
Slot
GPIO Header
M.2 M-key
(M2M1)
SUBUS
Header
USB 2.0 Wafer
USB 3.1(Gen.2) Ports
USB 2.0 Ports
MIC-in Port
12V DC-in Jack
Serial Port Headers
(COM1~2)
LVDS
Connector
Inverter
Connector
SATA power
Connector
Front Panel
Header
M.2 B-key
(M2B1)
M.2 E-key
(M2E1)
Speaker
USB 2.0 Header
(FP_USB2)
CPUFAN
Connector
TX-RXCOM2
TX-RXCOM1

6
Motherboard Jumper Position
JPBKLT2
JPLCD2
M2E_PWR1
JPCOM1
M2B_PWR1
JPCOM2
JPCOM3
JPCOM4
JP3
JP2
JP80P1
AT_MODE
M2M_PWR1
JPCLR1
JPLCD1
JPBKLT1
JP1

7
Jumper
Jumper
Name
Description
JPCOM1
COM1 Header Pin9 Function Select
4-pin Block (2.0 pitch)
JPCOM2
COM2 Header Pin9 Function Select
4-pin Block (2.0 pitch)
JPCOM3
COM3 Header Pin9 Function Select
4-pin Block (2.0 pitch)
JPCOM4
COM4 Header Pin9 Function Select
4-pin Block (2.0 pitch)
JP2
M2M1 Connector Function Select
6-pin Block (2.0 pitch)
JP3
M2M1 Connector Function Select
6-pin Block (2.0 pitch)
JPLCD1
LVDS1/EDP1 LCD Panel VCC Select
4-pin Block (2.0 pitch)
JPLCD2
EDP2 LCD Panel VCC Select
4-pin Block (2.0 pitch)
JPBKLT1
LVDS1/EDP1 LCD BACKLIGHT VCC Select
3-pin Block (2.0 pitch)
JPBKLT2
EDP2 LCD BACKLIGHT VCC Select
3-pin Block (2.0 pitch)
JPCLR1
PIN (1-2) = Clear ME_RTC
PIN (3-4) = Clear CMOS
PIN (5-6) = TXE Override
PIN (7-8) = CASE OPEN
8-pin Block (2.0 pitch)
M2M_PWR1
M.2 M-key Power Select
3-pin Block (2.0 pitch)
M2B_PWR1
M.2 B-key Power Select
3-pin Block (2.0 pitch)
M2E_PWR1
M.2 E-key Power Select
3-pin Block (2.0 pitch)
JP80P1
GPIO/80 Port Function Select
2-pin Block (2.0 pitch)
AT_MODE
AT/ATX Mode Select
3-pin Block (2.0 pitch)
Connectors
Connector
Name
DCIN1
12V DC–in Power Jack
ATX12V1
4-Pin 12V Power Connector
VGA
VGA Port Connector
USB1
USB 3.1 (Gen.2) Port Connector X2
USB2
USB 2.0 Port Connector X2
USB3
USB 2.0 Wafer
USB4
USB 2.0 Port Connector X2

8
*Option for LI1BV-00 Series
RJ-45 LAN Connector X1
*Option for LI1BV-0L Series
LAN1
RJ-45 LAN Connector
LINE-OUT
Line-out Connector
MIC
MIC Connector
SPEAK_CON1
3W Amplifier Connector
SIMCARD
SIM card slot
SATA1
SATAIII Connector
SATAPWR1
SATA Power out Connector
CPUFAN1
FAN Connector
JP1
Light Control Connector
Headers
Header
Name
Description
JW_FP1
Front Panel Header (PWR LED/
HD LED/Power Button /Reset)
9-pin Block (2.54 pitch)
FP_AUDIO1
Audio Header X1
9-pin Block (2.0 pitch)
FP_USB1
USB 2.0 Port Header X1
9-pin Block (2.0 pitch)
FP_USB2
USB 2.0 Port Header X1
*Option for LI1BV-0L Series
9-pin Block (2.0 pitch)
SMBUS1
SMBUS Header
5-pin Block (2.0 pitch)
GPIO1
GPIO Header
10-pin Block (2.0 pitch)
COM1/2/3/4/5/6
Serial Port Header
9-pin Block (2.0 pitch)
TX-RXCOM1
COM1 port RS422/RS485
4-pin Block (2.0 pitch)
TX-RXCOM2
COM2 port RS422/RS485
4-pin Block (2.0 pitch)
LVDS1
LVDS Inverter
30-pin Block (2.0 pitch)
EDP2
EDP Header
30-pin Block (2.0 pitch)
INVERTER1
Inverter Header
6-pin Block (2.0 pitch)

9
Chapter 2
Hardware Installation
2-1 Jumper Setting
JPCOM1/2/3/4 (4-pin): COM1/2/3/4 Port Pin9 Function Select (2.0 pitch)
JP2&JP3 (6-pin): M2M1 Connector Function Select (2.0 pitch)
JPCOM2
JPCOM3
JPCOM4
JPCOM1
JP3
JP2

10
JPLCD1/JPLCD2 (4-pin): LCD Panel VCC Select (2.0 pitch)
JPBKLT1 (3-pin): LVDS1/EDP1 LCD BACKLIGHT VCC Select (2.0 pitch)
*Note:LI1BV series co-lay LVDS1 and EDP1 (EDP1 is optional by order;please refer to the actual
model you purchased).
JPLCD2
JPLCD1

11
JPBKLT2 (3-pin): EDP2 LCD BACKLIGHT VCC Select (2.0 pitch)
Pin (1-2) of JPCLR1 (8-pin): Clear ME_RTC (2.0 pitch)
1-2 Closed: Clear ME_RTC
1-2 Open: Normal(Default)
PIN(1-2) Clear ME_RTC
Pin1
2
Pin1
2
3
4
4
3
5
7
6
3
8
8
6
3
7
5

12
Pin (3-4) of JPCLR1 (8-pin): Clear CMOS (2.0 pitch)
Pin (5-6) of JPCLR1 (8-pin): TXE Override (2.0 pitch)
5-6 Closed: TXE Override
5-6 Open: Normal(Default)
PIN(5-6) TXE Override
Pin1
2
Pin1
2
3
4
4
3
5
7
6
3
8
8
6
3
7
5

13
Pin (7-8) of JPCLR1 (8-pin): CASE OPEN (2.0 pitch)
7-8 Closed: CASE OPEN
7-8 Open: Normal(Default)
PIN(7-8) CASE OPEN
Pin1
2
Pin1
2
3
4
4
3
5
7
6
3
8
8
6
3
7
5
M2M_PWR1 (3-pin): M.2 M-key Power Select (2.0 pitch)

14
M2B_PWR1 (3-pin): M.2 B-key Power Select (2.0 pitch)
M2E_PWR1 (3-pin): M.2 E-key Power Select (2.0 pitch)

15
JP80P1 (2-pin): GPIO/80 Port Function Select (2.0 pitch)
AT_MODE(3-pin): ATX Mode/AT Mode Select (2.0 pitch)
*ATX Mode Selected: Press power button to power on after power input ready;
AT Mode Selected: Directly power on as power input ready.