JETWAY LI22 Series User manual

LI22 Series
User’Manual
NO. G03-LI22-F
Revision: 2.0
Release date: May 26, 2023
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

i
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.

ii
ENVIRONMENTAL SAFETY INSTRUCTION................................................................... iii
USER’S NOTICE .............................................................................................................iv
MANUAL REVISION INFORMATION.............................................................................. iv
ITEM CHECKLIST...........................................................................................................iv
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD ............................................................................1
1-2 SPECIFICATION ....................................................................................................2
1-3 LAYOUT DIAGRAM ...............................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTINGS ..............................................................................................8
2-2 CONNECTORS , HEADERS & WAFERS............................................................... 13
2-2-1 REAR I/O BACK PANEL CONNECTORS.................................................13
2-2-2 MOTHERBOARD INTERNAL CONNECTORS..........................................16
2-2-3 PIN DEFINITION FOR HEADERS & WAFERS.......................................... 19
2-2-4 MAXIMUM VOLTAGE & CURRENT LIMIT................................................ 26
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP................................................................................................. 27
3-2 BIOS MENU SCREEN............................................................................................28
3-3 FUNCTION KEYS................................................................................................... 29
3-4 GETTING HELP......................................................................................................29
3-5 MENU BARS .......................................................................................................... 30
3-6 MAIN MENU........................................................................................................... 30
3-7 ADVANCED MENU ................................................................................................ 31
3-8 CHIPSET MENU..................................................................................................... 50
3-9 SECURITY MENU ..................................................................................................53
3-10 BOOT MENU.......................................................................................................... 56
3-11 SAVE & EXIT MENU ..............................................................................................57
TABLE OF CONTENT

iii
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 40 centigrade is the suitable temperature. (The temperature comes from the
request of the chassis and thermal solution)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
2.0 Second Edition May 26, 2023
Item Checklist
Motherboard
Cable(s)

1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Intel®Q470E/H420E express chipset
LGA 1200 CPU socket for the 11th /10th Intel®Core™processors (TDP Max
support 65W)
Support 2* DDR4 3200/2933/2666MHz SO-DIMM, max up to 64GB with support
for dual channel function
Integrated with 1* Intel® i219-LM GbE & 1* Intel® i225V 2.5GbE LAN chips
Support 1* VGA, 1* HDMI, 1* DP, 1* LVDS/eDP Output
Support 2 * RS232/422/485 & 4 RS232 COM ports
LI22-Q470E Series supports up to 10 * USB 3.2 (Gen.1) ports & 3* USB 2.0 ports
LI22-H420E Series supports up to 6* USB 3.2 (Gen.1) ports & 3* USB 2.0 ports
Support 4 * SATAIII (6Gb/s) Devices
Support 1* PCIE 3.0 x16 slot, 1 * M.2 M-key 2280 slot (PCIex4) supports NVMe
SSD, 1* M.2 E-key 2230 slot supports WIFI/BT
Support onboard TPM 2.0 (option to LI22-Q470E2/LI22-H420E2 series)
Support CPU Smart FAN function
Supports ACPI S3 Function
Compliance with ErP Standard
Support Watchdog Timer Technology

2
1-2 Specification
Spec
Description
Design
Mini-ITX form factor; PCB size:17.0x17.0cm
Chipset
LI22-Q470E series: Intel Q470E Express Chipset
LI22-H420E series: Intel H420E Express Chipset
CPU Socket
IntelLGA 1200 Socket supports 11th /10th Core processors (Max. 65W TDP)
*Note: for detailed CPU support information please visit our website
Memory Slot
2*DDR4 SO-DIMM slot support 2* DDR4 SDRAM
Q470E chipset Maximum frequency: 3200MHz
H420E chipset Maximum frequency: 2933MHz
Maximum capacity: up to 64GB
Support dual channel function
*Note:Memory frequency range also depends on CPU support
Expansion Slot
PCIE1:1* PCIE x16 slot
M2E1:1*M.2 E-key 2230slot supports WIFI/BT Module (LI22-Q470E series:
support CNVi/ PCIex1/USB2.0 interface; LI22-H420E series: support
PCIex1/USB2.0 interface only).
Storage
4*SATAIII 6G/s ports (LI22-Q470E series support RAID 0/1/5/10 mode)
M2M1:1*M.2 M-key 2242/2280 PCIex4 slot supports NVMe SSD
LAN Chip
Integrated with:
1* Intel i225V 2.5GbE PCI-E LAN chip of providing 10/100/1000/2500Mbps
Ethernet data transfer rate
*Note: 2500Mbps high-speed transmission rate is only supported over CAT 5e
UTP cable.
1* Intel i219-LM Gigabit PHY LAN chip of providing 10/100/1000Mbps
Ethernet data transfer rate
Support Fast Ethernet LAN function
Audio Chip
Realtek HD Audio Codec integrated
Audio driver and utility included
BIOS
AMI 256Mb Flash ROM
Multi I/O
Rear Panel I/O:
2* RS232/422/485 COM ports (COM1/COM2:Support 5V/12V TTL)
1* HDMI port, 1*VGA & 1* DP port (LI22-Q470E series support Triple
Displays; LI22-H420E series support Dual Displays).
6* USB 3.2 (Gen.1) ports

3
1* 1.0GbE RJ-45 LAN port & 2.5GbE RJ-45 LAN port
1* 3-jack audio connector (Line-in, Line-out, MIC)
Internal I/O Connectors & Headers:
1* 24-pin main power connector
1* 4-pin 12V power connector
1* CPUFAN connector & 1* SYSFAN connector
1* CMOS battery connector
1* Front panel header
1* Front panel audio header
1* 9-Pin USB 2.0 header for 2* USB 2.0 ports +1* 4-Pin USB 2.0 wafer for 1*
USB 2.0 port
LI22-Q470E series: 2* 19-Pin 3.2(Gen.1) headers for 4* 3.2(Gen.1) ports
4* RS232 Serial port headers (COM3/4/5/6; COM3/4 Support 5V/12V TTL)
1* GPIO header
1* SMBUS header
1* PS2 Keyboard & Mouse header
1* LVDS/EDP header (LVDS_EDP1) & 1*Inverter
1* LCD brightness adjustment wafer (JP3)
1-3 Layout Diagram
Rear IO Diagram
USB 3.2 (Gen.1)
Ports
USB 3.2 (Gen.1)
Ports
VGA Port
COM1
RS232/422/485
Serial Port
COM2
RS232/422/485
Serial Port
HDMI Port
DisplayPort
2.5 Gbps
RJ-45 LAN Port
1.0 Gbps
RJ-45 LAN Port
Line-In
Line-Out
MIC

4
Motherboard Internal Diagram
* Note: FP_USB2 & FP_USB3 are only optional to LI22-Q470E series.
*Rear IO
Connector
(Refer to Page-3)
SMBUS Header
SYFFAN1
ATX 12V
Power Connector
ATX Type
Main Power Connector
DDR4
SODIMM Slots
(SODIMM1/SODIMM2)
4*SATAIII Ports
Intel Q470E/H420E Chipset
LGA 1200
CPU Socket
LVDS_EDP1 Wafer
M.2 E-Key
Slot
(M2E1)
M.2 M-Key
Slot
(M2M1)
CPUFAN1
Front Panel
Audio Header
JP3
INVERTER1
Serial Port Headers
(COM3/4/5/6)
GPIO Header
Optional
USB 3.2 (Gen.1)
Headers
(*FP_USB2/3)
Front Panel
Header
USB 2.0 Header
PS/2 KB&MS
Header
BATCON1
USB 2.0 Wafer

5
Motherboard Jumper Positions
*Note: The diagrams in the manual are mostly taken from LI22-Q470E series for illustration purpose ，
unless otherwise stated.
JPLVDS
JAT_ATX1
JCOM4
JBAT
JP2
JCOM2
JCOM1
JCOM3
COPEN1
JP5