JETWAY BA-500PRO User manual

USER'S MANUAL
Of
AMD 890GX & AMD SB850
Based
M/B for Socket AM3
AMD Processor
NO. G03-BA500PRO-F
Rev
： 1.0
Release date: April, 2010
Trademark:
* Specifications and information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize pollution
and ensure environment protection of mother earth, please recycle.

ii
ENVIRONMENTAL SAFETY INSTRUCTION ...........................................................iii
USER’S NOTICE.........................................................................................................iv
MANUAL REVISION INFORMATION.........................................................................iv
COOLING SOLUTIONS ..............................................................................................iv
CHAPTER 1 INTRODUCTION OF AMD 890GX MOTHERBOARDS
1-1 FEATURES OF MOTHERBOARD .............................................................................1
1-1.1 SPECIAL FEATURES OF MOTHERBOARD...............................................2
1-2 SPECIFICATION.........................................................................................................3
1-3 PERFORMANCE LIST................................................................................................4
1-4 LAYOUT DIAGRAM....................................................................................................5
CHAPTER 2 HARDWARE INSTALLATION
2-1 HARDWARE INSTALLATION STEPS.......................................................................7
2-2 CHECKING MOTHERBOARD'S JUMPER SETTING................................................7
2-3 INSTALL CPU.............................................................................................................8
2-3-1 GLOSSARY...................................................................................................8
2-3-2 ABOUT AMD AM3 CPU INSTALLATION.................................................9
2-4 INSTALL MEMORY ....................................................................................................9
2-5 EXPANSION CARDS..................................................................................................10
2-5-1 PROCEDURE FOR EXPANSION CARD INSTALLATION..........................10
2-5-2 ASSIGNING IRQS FOR EXPANSION CARD ..............................................10
2-5-3 EXPANSION SLOTS.....................................................................................11
2-6 CONNECTORS AND HEADERS ..............................................................................12
2-6-1 CONNECTORS .............................................................................................12
2-6-2 HEADERS .....................................................................................................15
2-7 STARTING UP YOUR COMPUTER ...........................................................................19
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP .....................................................................................................20
3-2 GETTING HELP ..........................................................................................................20
3-3 THE MAIN MENU........................................................................................................21
3-4 STANDARD BIOS FEATURES ..................................................................................22
3-5 ADVANCED BIOS FEATURES..................................................................................23
3-5-1 CPU CONFIGURATION...................................................................................24
3-6 ADVANCED CHIPSET FEATURES ...........................................................................24
3-6-1 ONBOARD VGA CONFIGURATION .........................................................25
3-6-2 PCI EXPRESS CONFIGURATION ............................................................26
3-7 INTEGRATED PERIPHERALS...................................................................................26
3-8 POWER MANAGEMENT FEATURES .......................................................................27
3-9 MISCELLANEOUS CONFIGURATION.....................................................................28
3-10 PC HEALTH...............................................................................................................29
3-11 POWER USER OVERCLOCK SETTING..................................................................29
3-11-1 MEMORY CONFIGURATION ..................................................................31
3-12 BIOS SECURITY ......................................................................................................32
3-13 LOAD OPTIMAL/FAILSAFE DEFAULTS.................................................................33
3-14 SAVE CHANGES AND EXIT/DISCARD CHANGES AND EXIT ..............................34
CHAPTER 4 DRIVER & FREE PROGRAM INSTALLATION
MAGIC INSTALL SUPPORTS WINDOWS XP/VISTA/7.....................................................35
4-1 DOTNET INSTALL MICROSOFT DOTNETX 3.5 DRIVER....................................36
4-2 ATI INSTALL ATI INTEGRATED DRIVER PACK.................................................36
4-3 SOUND INSTALL ALC HD AUDIO CODEC DRIVER...........................................37
4-4 LAN INSTALL GIGABIT ETHERNET NIC DRIVER ..............................................38
4-5 USB3.0 INSTALL USB3.0 DRIVER..........................................................................39
4-6 RAIDDISK INSTALL ATI SATA DRIVER AND UTILITY ...........................................40
4-7 NORTON INSTALLNORTON 2009 ANTI-VIRUS PROGRAM ............................40
4-8 PC-HEALTH INSTALL MYGUARD HARDWARE MONITOR UTILITY.....................41
4-9 HDMI INSTALL ATI HDMI AUDIO DRIVER...............................................................41
4-10 OVERCLOCK INSTALL OVERCLOCK DRIVER AND UTILITY.............................42
4-11 FUSION INSTALL FUSION DRIVER AND TOOLS.................................................43
4-12 HOW TO UPDATE BIOS ............................................................................................44
TABLE OF CONTENT

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4-13 AMD PLATFORM RAID FUNCTION INSTALLATION ..............................................44
4-14 PRO MAGIC PLUS FUNCTION INTRODUCTION.....................................................49
4-15 G.P.I FUNCTION LED DISPLAY………………………………………….. …. ………... 51
APPENDIX I……………………………………………………………………………………………...52
Environmental Safety Instruction
zAvoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
z0 to 40 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
zGenerally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
zThe increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
zAttention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.

iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS
MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE
REPRODUCED, TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY
ANY MEANS WITHOUT WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE 890GX MOTHERBOARD AND
WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT
ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT
WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL,
INCIDENTIAL OR CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF
PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA, INTERRUPTION OF BUSINESS AND
THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND
THEY ARE USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S
BENEFIT, WITHOUT INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition April, 2010
Item Checklist
5AMD 890GX Platform Processor Chipset based motherboard
5User’s Manual
5DVD for motherboard utilities
5HDD Cable
5SATA Cable
5I/O back panel shield
AMD AM3 Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance with increasing
operation clock, thermal management becomes increasingly crucial while building computer
systems. Maintaining the proper computing environment without thermal increasing is the key to
reliable, stable, and 24 hours system operation. The overall goal is keeping the processor
below its specified maximum case temperature. Heatsinks induce improved processor heat
dissipation through increasing surface area and concentrated airflow from attached active
cooling fans. In addition, interface materials allow effective transfers of heat from the
processor to the heatsink. For optimum heat transfer, AMD recommends the use of thermal
grease and mounting clips to attach the heatsink to the processor.
Please refer to the website below for collection of heatsinks evaluated and recommended for
Socket AM3 processors by AMD. In addition, this collection is not intended to be a
comprehensive listing of all heatsinks that support Socket-AM3 processors.

1
Chapter 1
Introduction of AMD 890GX Motherboards
1-1 Features of motherboard
The AMD 890GX chipset motherboard series are based on the latest AMD 890GX
Chipset and the SB 850 chipset which supports: Phenom™ II X 4, Phenom™ II X3 ,
Phenom™ II X2 processor; Athlon™ II X4; Athlon™ II X3; Athlon™ II X2 processor
and Sempron AM3 CPU under 125W power consumption. With an integrated
low-latency high-bandwidth DDRIII memory controller and a highly-scalable Hyper
Transport technology-based system bus up to HT 3.0. AMD 890GX Platform Processor
Chipset motherboard series deliver the outstanding system performance and
professional desktop platform solution.
The AMD 890GX Series motherboards support new generation Socket AM3
processors with an integrated DDRIII memory controller for Dual channel DDRIII
800/DDRIII 1066 / DDRIII 1333 Module up to 16GB, also providing DDRIII 128Mb
GPU Memory. The motherboard supports ULTRA ATA 133 connectors and Serial
ATA3 with RAID 0, 1, 5, 10 and JBOD functions which support up to two IDE and six
Serial ATA3 devices to accelerate hard disk drives and guarantee the data security
without failure in advanced computing performance.
The AMD 890GX motherboards provide 10/100/1000 LAN function with Gigabit LAN
chip which supports 10/100/1000Mbps data transfer rate. And the embedded
8-channel HD Audio CODEC is fully compatible with Sound Blaster Pro standards
that offer you with the home cinema quality and satisfying software compatibility.
The AMD 890GX Series motherboards deliver outstanding value and performance for
gamers, with a true bandwidth design for Multi-GPU configurations. This high
bandwidth architecture in the AMD 890GX chipset is with the flexibility for single or
dual card configurations. The AMD 890GX chipset provides two PCI Express 2.0
x16@8 lane slots to support simultaneous operation of graphics cards for astonishing
performance with brilliant and intense 3D graphics.
AMD 890GX Series motherboard series offer two PCI-Express 2.0x16@ 8 lanes
graphics slots. When PE4 installed switch card, the PE1 becomes PCI-Express
2.0x16@ 16 lanes graphics slot. Two PCI Express x1 I/O slot tackling the most
demanding multimedia tasks nowadays. The AMD 890GX motherboards also carry
two 32-bit PCI slots to guarantee the rich connectivity for the I/O peripheral devices.
This motherboard support Hybrid CrossFireX function, the VGA Card on PE1 or PE4
will activate a Hybrid CrossFire with the onboard VGA Card, the performance will be
increased 15% to 75%.
Embedded USB controllers as well as capability of expanding to 12 of USB2.0
functional ports delivering 480Mb/s bandwidth of rich connectivity and two of USB3.0
functional ports delivering 5 Gbps bandwidth of rich connectivity.(USB3.0 can not run
under DOS, but can be run under the OS)

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These motherboards meet the future USB demands which are also equipped with
hardware monitor function on system to monitor and protect your system and
maintain your non-stop business computing.
Some special features--- CPU Smart Fan / CPU Vcore 7-shift / OC-CON / G.P.I
Function/3D Audio in this motherboard are designed for power user to use the
over-clocking function in more flexible ways. But please be caution that the
over-clocking maybe causes the fails in system reliabilities. This motherboard
provides the guaranteed performance and meets the demands of the next generation
computing. But if you insist to gain more system performance with variety possibilities
of the components you choose, please be careful and make sure to read the detailed
descriptions of these value added product features, please get them in the coming
section.
1-1.1 Special Features of Motherboard
CPU Smart Fan--- (The Noise Management System)
It’s never been a good idea to gain the performance of your system by sacrificing its
acoustics. CPU Smart Fan Noise Management System is the answer to control the
noise level needed for now-a-day’s high performance computing system. The system
will automatically increase the fan speed when CPU operating loading is high, after
the CPU is in normal operating condition, the system will low down the fan speed for
the silent operating environment. The system can provide the much longer life cycle
for both CPU and the system fans for game use and business requirements.
CPU Vcore 7-Shift--- (Shift to Higher Performance)
The CPU voltage can be adjusted up by 7 steps for the precisely over-clocking of
extra demanding computing performance.
OC-CON ---（High-polymer Solid Electrolysis Aluminum Capacitors）
The working temperature is from 55 degrees Centigrade below zero to 125 degrees
Centigrade, OC-CON capacitors possess superior physical characteristics that can
be while reducing the working temperature between 20 degrees Centigrade each time,
intact extension 10 times of effective product operation lives, at not rising degrees
Centigrade of working temperatures each time a relative one, life of product decline
10% only too.
G.P.I. Function—(Green power indicator function)
The full name of G.P.I technology is Green Power Indicator technology, obviously
technology utilized to low power consumption. G.P.I is a technology with remarkable
power saving function.
3D Audio—(3D Audio Sound Effect)
OP with two-stage Butterworth filter and quadruple noninverting amplifier enhances
bass effect under the 100MHz range to perfect audio effect, brings you stunning
shock experience in video game, true-to-life simulated feeling when watching films
and the greatest touch as that in the concert. There is a 3D Audio button integrated on
the board. Press down the button to enable 3D audio effect or press again to disabled
it.

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1-2 Specification
Spec Description
Design zATX form factor; PCB size: 30.5cm x24.5cm
Chipset zAMD 890GX North Bridge Chipset
zAMD SB 850 South Bridge Chipset
CPU Socket AM3
zSupport AMD AM3 CPU : Phenom™ II X 4, Phenom™ II X3 ,
Phenom™ II X2 processor; Athlon™ II X4; Athlon™ II X3; Athlon™ II
X2 processor and Sempron AM3 CPU
zCPU Power consumption should be under 125 W
zSupport HT 3.0
Memory Slot
z240-pin DDRIII Module slot x 4
zSupport 4pcs DDRIII 800/DDRIII 1066 /DDRIII 1333 Modules
Expandable to 16GB
zDual channel supported
Expansion Slot
z2pcs PCI-Express 2.0x16 by 8 lane
z2pcs PCI-Express 2.0 x1 slot
z2pcs 32-bit PCI slot
Integrate IDE and
Serial ATA3 RAID
zJMB368 chip support one IDE HD connector that deliver the data
transfer rate up to 133 MB/s for 2 IDE Devices
zSB 850 supports 6 Serial ATAIII 6 Gb/s connectors with RAID 0, 1,
10,5 and JBOD function
Gigabit LAN
zIntegrated Gigabit LAN chip.
zSupport Fast Ethernet LAN function of providing 10Mb/100Mb/1000
Mb/s data transfer rate
8 CH-Audio
zRealtek Azalia 8-channel Audio Codec integrated
zSupport 8-channel 3D surround & Positioning Audio
zAudio driver and utility included
Sideport Memory zEmbedded DDR III 128Mb sideport memory
BIOS zAMI 16MB DIP Flash ROM
Multi I/O
zPS/2 keyboard
zCoaxial /Optical SPDIF_OUT connectors
zHDMI connector
zDVI connector (HDMI connector and DVI connector can not be used
at the same time)
zVGA connector
zRJ-45 connector x1
zUSB3.0 port x 2；USB2.0 port x 4 and headers x 4
zAudio connector x1 (8CH Audio)
zHard Disk Drive Connector x1
zAUDIO1 header x1
zSerial port header x1
zHDMI-SPDIF header x1
zIR1 header x1
zPARALLEL1 header x1
zCDIN header x1

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1-3 Performance List
The following performance data list is the testing result of some popular benchmark
testing programs. These data are just referred by users, and there is no responsibility
for different testing data values gotten by users (the different Hardware & Software
configuration will result in different benchmark testing results.)
Performance Test Report
CPU: HDX810WFK4FGI
MEMORY: KINGSTON 2G 1333 X2
Hard Disk Driver: WD160G SATA
BIOS: T04
3D Mark 2003 5842
3D Mark 2005 2162
3D Mark 06 4714
PCMark2005
System / CPU / Memory 6260/7909/4892
Graph / HDD 2967/5324
Content Creation Winstone 2004 46.3/
Business Winstone 2004 30.5
Winbench 99 V2.0:
Business/Hi-end Disk Winmark99 28600
Business/Hi-end Graphic Winmark
SySMark 2004: SISMark Rating(Internet Content Creation / Office Productivity )
SySMark 2004
3D Creation / 2D Creation
/ Web publication
Communication / Document Creation
/ Data Analysis
SiSOFT Sandra 2005 : 1.CPU Arithmetic Benchmark 2.Memory bandwidth Benchmark
3.CPU Multi-Media Benchmark
1.Dhrystone ALU MIPS 35.20GIPS
Whetstone FPU iSSE2 FLOPS 34GIPS
2.Int/Float Buffered iSSE2 MB/S 101.3MB/S/44.16MB/S
3.Integer/Floating-Point
SSE2 IT/S 12.34GB/S /12.37GB/S
UT2003 Benchmark (flyby/botmatch) 245.282/124.758
Quake3 DEMO1 / DEMO2 582.2FPS/571.3FPS
Return to Castle Wolfenstein FPS
Super Pi (1M) Second 26.578
CPUZ System / CPU Clock 200*13/2000

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1-4 Layout Diagram
Rear I / O for BA-500PRO
USB 2.0 Connectors
RS-OUT
Line-OUT
CS-OUT
SS-OUT
MIC-IN
DVI
Connector
HDMI
Connector
Coaxial
SPDIF_OUT
Connector
Optical
SPDIF_OUT
Connector
USB 3.0
Connectors
VGA
Connector PS/2
Keyboard Port
RJ-45
Connector Line-IN
16 MBit DIP Flash
ROM BIOS
Front Panel Header
ATA 133 IDE
Conn (IDE1)
AM3 CPU Socket
ATX Power Conn.
PS2 KB Port
Over USB Port
Audio Connector
RJ-45 Ove
r
USB Connectors
DDR III Slot x 4
ATX 12V2
Power Connector
Realtek ALC883
Audio Decode
CDIN1
Gigabit LAN Chip
Speaker Header
USB Heade
r
(USB1, 2, 3, 4)
Power Led Header
AMD 890GX Chipset
AMD SB 850 Chipset
Front Panel
AudioHeader
KB/USB Power On(JP1)
IR1 Header
PARALLEL1 Header
USB 3.0
Connectors
HDMI-SPDIF
Header
CPUFAN1
SATA III
Connectors
4-pin PWR Connector
PCI Express 2.0 x16
by 8-lane Slot
HDMI Connector
VGA over DVI
Connector
PCI Express 2.0 x1 Slot
SYSFAN2
Clear CMOS (JBAT)
DDRIII 128Mb
GPU Memory
COM1 Header SYSFAN1
Coaxial Over Optical
SPDIF_OUT Connectors
PCI Slot
3D Audio Button
SSP＿LED