Kontron ETX-CD User manual

ETX®-CD
Document Revision 130
www.kontron.com

» Table of Contents «
1User Information..................................................................................5
1.1 About This Document.................................................................................................................... 5
1. Copyright Notice.......................................................................................................................... 5
1.3 Trademarks................................................................................................................................. 5
1.4 Standards................................................................................................................................... 5
1.5 Warranty.................................................................................................................................... 6
1.6 Technical Support......................................................................................................................... 6
Introduction........................................................................................7
.1 Product Description...................................................................................................................... 7
. ETX® Documtentation...................................................................................................................7
.3 ETX® Benefits.............................................................................................................................. 8
3Specification.......................................................................................9
3.1 Modules & Accessories................................................................................................................... 9
3. Functional Specification...............................................................................................................10
3.3 Block Diagram............................................................................................................................ 13
3.4 Electrical Specification................................................................................................................ 14
3.4.1 Supply Voltage........................................................................................................................... 14
3.4. Power Supply Rise Time................................................................................................................ 14
3.4.3 Supply Voltage Ripple.................................................................................................................. 14
3.4.4 Power Consumption..................................................................................................................... 14
3.5 Environmental Specification.........................................................................................................15
3.5.1 Temperature Specification............................................................................................................15
3.5. Humidity................................................................................................................................... 15
3.6 Standards and Certifications.........................................................................................................16
3.7 MTBF........................................................................................................................................ 18
3.8 Mechanical Specification.............................................................................................................. 19
3.9 Module Drillhole Dimension.......................................................................................................... 19
3.10 Thermal Management.................................................................................................................. 0
3.11 Heatspreader............................................................................................................................. 0
3.1 Onboard Fan Connector................................................................................................................ 1
3.1 .1 Electrical Characteristics.............................................................................................................. 3
4Features and Interfaces....................................................................... 4
4.1 LPC.......................................................................................................................................... 4
4. M.A.R.S.................................................................................................................................... 5
4.3 JIDA16 and JIDA3 ..................................................................................................................... 6
4.4 K-Station 1................................................................................................................................ 7
4.5 GPIO - General Purpose Input and Output......................................................................................... 8
4.6 Watchdog Timer.......................................................................................................................... 9
4.7 Speedstep Technology................................................................................................................. 30
www.kontron.com

ETX®-CD /
4.8 C-States.................................................................................................................................... 31
4.9 ACPI Suspend Modes and Resume Events..........................................................................................3
4.10 ISA Bus Limitation...................................................................................................................... 33
5System Resources...............................................................................34
5.1 Interrupt Request (IRQ) Lines........................................................................................................ 34
5. Direct Memory Access (DMA) Channels.............................................................................................36
5.3 Memory Area............................................................................................................................. 36
5.4 I/O Address Map.........................................................................................................................36
5.5 Inter-IC (I C) Bus....................................................................................................................... 36
5.6 System Management (SM) Bus....................................................................................................... 36
5.7 JILI-I C Bus.............................................................................................................................. 36
6ETX® Connectors................................................................................37
6.1 Connector Locations.................................................................................................................... 37
6. General Signal Description............................................................................................................37
6.3 Connector X1 (PCI bus, USB, Audio)................................................................................................38
6.3.1 Connector X1 Signal Levels...........................................................................................................39
6.3. Connector X1 Signal Description.....................................................................................................41
6.4 Connector X (ISA Bus)................................................................................................................4
6.4.1 Connector X Signal Levels...........................................................................................................43
6.4. Connector X Signal Description....................................................................................................45
6.5 Connector X3 (VGA, LCD, Video, COM1 and COM , LPT/Floppy, Mouse, Keyboard).......................................45
6.5.1 Connector X3 (Signal Levels)......................................................................................................... 47
6.5. Connector X3 Signal Description....................................................................................................49
6.6 Connector X4 Subsystems............................................................................................................. 51
6.6.1 Connector X4 (IDE 1, IDE , Ethernet, Miscellaneous)..........................................................................51
6.6. Connector X4 (Signal Levels)......................................................................................................... 5
6.6.3 Connector X4 Signal Description....................................................................................................54
6.7 Feature Connector J11.................................................................................................................56
6.7.1 SDVO Output.............................................................................................................................. 56
6.7. SDVO Connector and Flat Foil Cable.................................................................................................56
6.7.3 Pinout Feature Connector J11........................................................................................................ 56
7BIOS Operation...................................................................................58
7.1 Determining the BIOS Version....................................................................................................... 58
7.1.1 Start Phoenix BIOS Setup Utility....................................................................................................58
7. BIOS Setup Menu........................................................................................................................ 60
7. .1 Info Screen................................................................................................................................ 60
7. . Main Menu................................................................................................................................. 61
7. .3 Advanced.................................................................................................................................. 63
7. .4 Security.................................................................................................................................... 8
7. .5 Power....................................................................................................................................... 83
7. .6 Boot........................................................................................................................................ 86
7. .7 Exit Menu.................................................................................................................................. 87
4

ETX®-CD / User Information
1 User Information
1.1 About This Document
This document provides information about products from Kontron Europe GmbH and/or its subsidiaries. No warranty of
suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information in this
document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
Copyright © 003- 01 Kontron Europe GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Europe GmbH.
DIMM-PC®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Europe GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/ and Personal System/ are trademarks of International Business Machines Corp.
» Microsoft is a registered trademark of Microsoft Corp.
» Intel is a registered trademark of Intel Corp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Europe GmbH is certified to ISO 9000 standards.
5

ETX®-CD / User Information
1.5 arranty
This Kontron Europe GmbH product is warranted against defects in material and workmanship for the warranty period
from the date of shipment. During the warranty period, Kontron Europe GmbH will at its discretion decide to repair or
replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.
Kontron Europe GmbH will not be responsible for any defects or damages to other products not supplied by Kontron
Europe GmbH that are caused by a faulty Kontron Europe GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Europe GmbH and/or its subsidiaries are available for technical support. We are
committed to making our product easy to use and will help you use our products in your systems.
Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. Consult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product Change Notifications, Board Support Packages, DemoImages, 3D drawings and additional tools and
software. In any case you can always contact your board supplier for technical support.
6

ETX®-CD / Introduction
2 Introduction
2.1 Product Description
Based on the ETX® standard, Kontron’s ETX®-CD, powered by a variety of Intel Pentium core duo processors, is a next-
generation embedded module that brings advanced technology to tomorrow’s applications, as well as continuing today’s
legacy devices. Built around serial differential signaling technologies, ETX®-CD modules incorporate the following
interfaces into a 95 x 114 small form factor embedded module:
» PCI
» x Serial ATA (SATA)
» 1x Parallel ATA (IDE)
» USB
» x Serial Port (COM)
» 1x Parallel Port (LPT) shared with Floppy
» LVDS, SDVO, VGA
» 10/100 MB Ethernet
» ISA bus
» Audio
» Advanced Configuration and Power Interface (ACPI)
The ETX®-CD is built around the Intel Core Duo processors that use the Yonah and Merom Core and the Mobile Intel
945GME Express chipset, which is the first mobile platform to offer PCI Express functionality with extended life cycle
support. These modules feature the most current desktop features such as USB, SATA, and PCI buses. The ETX®-CD delivers
up to GHz performance and up to GB DDR RAM. For applications that require advanced real-time video capabilities, the
ETX®-CD has integrated graphics based on the Intel® Graphics Media Accelerator 900 architecture. The ETX®-CD supports
4 PCI 3 -bit PCI devices. A 10/100 megabits per second Ethernet port provides fast connectivity to LAN/WAN and 4x USB
interface provides fast and sufficient interfaces for external peripherals. ETX®-CD modules also provide the following
interfaces that are always located in the same physical position on each board: PCI3 , USB, serial ATA (SATA), parallel ATA
(PATA), LVDS Multi Media ports, as well as an ACPI (Advanced Configuration and Power Interface) for optimized power
management are available on the board. Six mounting holes on the board provide secure mounting to allow the module
increased shock and vibration resistance.
2.2 ETX® Documtentation
This product manual serves as one of three principal references for an ETX® design. It documents the specifications and
features of ETX®-CD. The other two references, which are available from the Kontron Europe GmbH Web site, include:
» The ETX® Specification defines the ETX® module form factor, pinout, and signals.
» The ETX® Design Guide serves as a general guide for baseboard design, with a focus on maximum flexibility to
accommodate a wide range of ETX® modules.
Some of the information contained within this product manual applies only to certain
product revisions (CE: xxx). If certain information applies to specific product revisions (CE:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.

ETX®-CD / Introduction
2.3 ETX® Benefits
Embedded technology extended (ETX) modules are very compact (114 x 95 mm), highly integrated computers. All ETX®
modules feature a standardized form factor and a standardized connector layout that carry a specified set of signals. This
standardization allows designers to create a single-system baseboard that can accept present and future ETX® modules.
ETX® modules include common personal computer (PC) peripheral functions such as:
» Graphics
» Parallel, Serial, and USB ports
» Keyboard/mouse
» Ethernet
» Sound
» IDE (and SATA)
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
Peripheral PCI or ISA buses can be implemented directly on the baseboard rather than on mechanically unwieldy
expansion cards. The ability to build a system on a single baseboard using the computer as one plug-in component
simplifies packaging, eliminates cabling, and significantly reduces system-level cost. A single baseboard design can use a
range of ETX® modules. This flexibility can differentiate products at various price/performance points, or to design future
proof systems that have a builtin upgrade path. The modularity of an ETX® solution also ensures against obsolescence as
computer technology evolves. A properly designed ETX® baseboard can work with several successive generations of ETX®
modules. An ETX® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.
8

ETX®-CD / Specification
3 Specification
3.1 Modules & Accessories
The Computer-on-Module ETX®-CD (MCAL) based on Intel's Napa platform is available in different variants to cover the
demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor Chipset and Features
18030-0000-11-4 ETX-CD 1.06GHz C4 3 Intel® Celeron® M ULV 4 3 Intel® 945GME, ICH7M
18030-0000-1 -5 ETX-CD 1. GHz U 500 Intel® Core™ Duo U 500 Intel® 945GME, ICH7M
18030-0000-15-6 ETX-CD 1.5GHz L7400 Intel® Core™ Duo L7400 Intel® 945GME, ICH7M
18030-0000-17-5 ETX-CD 1.66GHz L 400 Intel® Core™ Duo L 400 Intel® 945GME, ICH7M
18030-0000-19-4 ETX-CD 1.86GHz C440 Intel® Celeron® M ULV 4 3 Intel® 945GME, ICH7M
Extended Temperature modules (-25°C to 5°C operating)
Product Number Product Name Processor Chipset and Features
18030-0000-17-5EXT ETX-CD 1.66GHz E1 Intel® Core™ Duo L 400 Intel® 945GME, ICH7M
18030-0000-11-4EXT ETX-CD 1.06GHz C4 3 E1 Intel® Celeron® M ULV 4 3 Intel® 945GME, ICH7M
Documentation is also valid for following End-of-Live (EOL) variants:
Product Number Product Name Processor Chipset and Features
18030-0000-11-1 ETX-CD 1.06GHz Intel® Celeron® M ULV 4 3 Intel® 945GM, ICH7M
18030-0000-11-1EXT ETX-CD 1.06GHz E1 Intel® Celeron® M ULV 4 3 Intel® 945GM, ICH7M
18030-0000-1 - ETX-CD 1. GHz Intel® Core™ Duo U 500 Intel® 945GM, ICH7M
18030-0000-15-3 ETX-CD 1.5GHz Intel® Core™ Duo L7400 Intel® 945GM, ICH7M
18030-0000-17- ETX-CD 1.66GHz Intel® Core™ Duo L 400 Intel® 945GM, ICH7M
18030-0000-17- EXT ETX-CD 1.66GHz E1 Intel® Core™ Duo L 400 Intel® 945GM, ICH7M
Accessories
Product Number Product Name
18010-0000-00-0 ETX® Eval (ADA8)
180 8-0000-00-0 ETX® miniBaseboard (ADAB)
97011-51 0-08-0 DDR -800 SODIMM / 51 MB
97011-10 4-08-0 DDR -800 SODIMM / 1GB
97011- 048-08-0 DDR -800 SODIMM / GB
97011-51 0-08- DDR -800 SODIMM / 51 MB E (industrial temperature)
97011-10 4-08- DDR -800 SODIMM / 1GB E (industrial temperature)
97011- 048-08- DDR -800 SODIMM / GB E (industrial temperature)
18030-0000-99-0 ETX®-CD, Heatspreader, threaded
18030-0000-99-1 ETX®-CD, Heatspreader, through hole
18030-0000-99-0C01 ETX®-CD, Passive Cooling Solution, threaded
18030-0000-99-0CO ETX®-CD, Active Cooling Solution, threaded
96006-0000-00-4 ADA-ETX-CD-FC4 (SDVO FFC45 to xDVI Adaptor)
96006-0000-00-5 ADA-SDVOB-FC5 (SDVO FFC45 to 1xDVI Adaptor)
96006-0000-00-6 ADA-SDVOB-LVDS (SDVO FFC45 to LVDS Adaptor)
9-5000-035 ADA-LVDS-DVI 18bit (LVDS to DVI converter)
9-5000-0353 ADA-LVDS-DVI 4bit (LVDS to DVI converter)
96079-0000-00-0 KAB-HSP 00mm (Cable adapter to connect FAN to module)
96079-0000-00- KAB-HSP 40mm (Cable adapter to connect FAN to module)
9

ETX®-CD / Specification
3.2 Functional Specification
Processor
The Intel® Core™ Duo / Celeron® (Yonah / Merom) CPU supports:
» Intel® Hyper-Threading Technology (HTT)
» Enhanced Intel SpeedStep® Technology (EIST)
» Thermal Monitoring Technologies
» Idle States (C-States)
» Execute Disable Bit
Processor # of Cores Lithography Core Core Clock L2 Cache VT-x HT Intel® 64 EIST Max TDP
Intel® Celeron® M ULV 4 3 1 65nm Yonah 1066 MHz 1MB No No No No 5.5W
Intel® Celeron® M 440 1 65nm Yonah 1866 MHz 1MB No No No No 7W
Intel® Core™ Duo U 500 65nm Yonah 1 00 MHz MB Yes No No Yes 9W
Intel® Core™ Duo L 400 65nm Yonah 1666 MHz MB Yes No No Yes 15W
Intel® Core™ Duo L7400 65nm Merom 1500 MHz 4MB Yes No No Yes 17W
Chipset
Chipset Graphic Outputs
8 945GM VGA, SDVO, LVDS, TVout
8 945GME VGA, SDVO, LVDS
Memory
Sockets 1x DDR SO-DIMM
Memory Type DDR -533, DDR -667
Maximum Size GB
Technology Single Channel
Graphics Core
The integrated Intel® GMA950 (Gen3.5) supports:
Graphics Core Render Clock 50 MHz
Execution Units / Pixel Pipelines 4
Max Graphics Memory 56MB
GFX Memory Bandwidth (GB/s) 10.7
GFX Memory Technology DVMT 3.0
API (DirectX/OpenGL) 9.0c / 1.4
Shader Model 3.0 (SW) / .0
Hardware accelerated Video -
Independent/Simultaneous Displays
Display Interfaces
CRT max Resolution 048x1536
TV out: YES
Digital Display: SDVOB and SDVOC (onboard FFC45)
LVDS
LVDS Bits/Pixel 1x18, x18
LVDS Bits/Pixel with dithering 1x 4 and x 4
LVDS max Resolution: 1600x1 00
PWM Backlight Control: -
10

ETX®-CD / Specification
Chipset & IOH
# of USB: 4x USB 1.1/ .0
USB onboard Connector: -
Audio: Crystal CS4 99 / Via VT161 AC97 Audio
PCI Bus: PCI Rev .3 (33MHz/3.3V)
ISA Bus: LPC ISA Fintek F85 6FG
SuperI/O Controller Winbond 836 7HFJ LPC-I/O
COM Ports: x RS 3
IrDA Support: IrDA 1.0 (SIR) or ASK-IrDA (COM )
LPT Support: EPP, ECP, bi-dir.
Max TDP: 7W + 3.3W
Storage
Primary IDE: PATA 100
Secondary IDE: -
SATA onboard connector: x SATA 1.5Gb/s
SATA features: NCQ, HotPlug, Staggered Spinup
SATA RAID support: -
onboard SSD: -
onboard CF Card: -
Onboard devices
Audio Crystal CS4 99 / Via VT161 AC97 Audio
Trusted Platform Module STMicro ST19WP18 optional
Ethernet
The Intel 8 56 GZ ethernet supports:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Kontron Features
I2C/SMB support: YES/YES
M.A.R.S. support YES
Embedded API JIDA16 / JIDA3
JIDA32 Applications / K-Station YES, K-Station 1 w/o BIOS modification
Custom BIOS Settings / Flash Backup -
Watchdog support YES
11

ETX®-CD / Specification
Power Features
ACPI ACPI 1.0b / .0
S-States S0, S1, S3, S4, S5
Graphic States D0, D3
Misc Power Management DPST .0
Power Consumption and Performance
Full Load Power Consumption 19 - 40W
Kontron Performance Index 1387-3 96
Kontron Performance/Watt 71 - 103
Detailed Power Consumption measurements in all states and bechmarks for CPU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD Customer
Section.
Supported Operating Systems
The ETX®-CD currently supports:
» Microsoft Windows XP x86
» Microsoft Windows 7 x86
» Microsoft Windows CE 6.0
» Microsoft Windows XP embedded
» Linux
» WindRiver VxWorks
12

ETX®-CD / Specification
3.3 Block Diagram
13

ETX®-CD / Specification
3.4 Electrical Specification
3.4.1 Supply Voltage
Following supply voltage is specified at the ETX® connector:
Supply Voltage: 5V +/- 5%
5V_Stb: 5V DC +/- 5%
3.4.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 0ms.
» There must be a smooth and continuous ramp of each DC input voltage from 10% to 90% of its final set-point
following the ATX specification
3.4.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 0 MHz
3.4.4 Power Consumption
The maximum Power Consumption of the different ETX®-CD modules is 19 - 40W (100% CPU load; 90°C CPU temperature).
Further details with measurements and TDP values of the single variants can be found in our customer section.
Information there is available after registration.
14

ETX®-CD / Specification
3.5 Environmental Specification
3.5.1 Temperature Specification
General Kontron Specification Operating Non-operating
Commercial grade 0°C to +60°C -30°C to +85°C
Extended Temperature(E1) - 5°C to +75°C -30°C to +85°C
Industrial grade by Screening (XT) -40°C to +85°C -40°C to +85°C
Industrial grade by Design (E ) -40°C to +85°C -40°C to +85°C
Please see chapter Product Specification for available variants for extended or industrial
temperate grade
With Kontron heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Without Kontron heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.5.2 Humidity
» 93% relative Humidity at 40°C, non-condensing (according to IEC 60068- -78)
15

ETX®-CD / Specification
3.6 Standards and Certifications
RoHS
The ETX®-CD is compliant to the directive 00 /95/EC on the restriction of the use of certain hazardous substances
(RoHS) in electrical and electronic equipment.
CE marking
The ETX®-CD is CE marked according to Low Voltage Directive 006/95/EC – Test standard EN60950
Component Recognition UL 60950-1
The ETX® form factor Computer-on-Modules are Recognized by Underwriters Laboratories Inc. Representative samples of
this component have been evaluated by UL and meet applicable UL requirements.
UL Listings:
» NWGQ .E304 78
» NWGQ8.E304 78
WEEE Directive
WEEE Directive 00 /96/EC is not applicable for Computer-on-Modules.
Conformal Coating
Conformal Coating is available for Kontron Computer-on-Modules and for validated SO-DIMM memory modules. Please
contact your local sales or support for further details.
16

ETX®-CD / Specification
Shock & Vibration
The ETX® form factor Computer-on-Modules successfully passed shock and vibration tests according to
» IEC/EN 60068- -6 (Non operating Vibration, sinusoidal, 10Hz-4000Hz, +/-0.15mm, g)
» IEC/EN 60068- - 7 (Non operating Shock Test, half-sinusoidal, 11ms, 15g)
EMC
Validated in Kontron reference housing for EMC the ETX®-CD follows the requirements for electromagnetic compatibility
standards
» EN550
1

ETX®-CD / Specification
3.7 MTBF
The following MTBF (Mean Time Before Failure) values were calculated using a combination of manufacturer’s test data, if
the data was available, and the Telcordia (Bellcore) issue calculation for the remaining parts.
The calculation methode used is “Bellcore Method 1 Case 1” in a ground benign, controlled environment (GB,GC). This
particular method takes into account varying temperature and stress data and the system is assumed to have not been
burned in.
Other environmental stresses (extreme altitude, vibration, salt water exposure, etc) lower MTBF values.
System MTBF (hours): 109418 @ 40°C
Fans usually shipped with Kontron Europe GmbH products have 50,000-hour typical
operating life. The above estimates assume no fan, but a passive heat sinking arrangement
Estimated RTC battery life (as opposed to battery failures) is not accounted for in the above
figures and need to be considered for separately. Battery life depends on both temperature
and operating conditions. When the Kontron unit has external power; the only battery
drain is from leakage paths.
18

ETX®-CD / Specification
3.8 Mechanical Specification
» 95.0 mm x 114.0 mm
» Hight approx. 1 mm (0.4”)
CAD drawings are available at EMD CustomerSection
3.9 Module Drillhole Dimension
The not shown drill holes match with the ETX® specification.
The maximum height of electrical components on the bottom side of the module is
specified with .0mm in the ETX@ specification. On the ETX@-CD the Southbridge is
soldered on the bottom side and Intel specified the ICH7 with . 8mm ± 0. 1mm
19

ETX®-CD / Specification
3.10 Thermal Management
A heatspreader plate assembly is available from Kontron Europe GmbH for the ETX®-CD. The heatspreader plate on top of
this assembly is NOT a heat sink. It works as a ETX®-standard thermal interface to use with a heat sink or other cooling
device.
External cooling must be provided to maintain the heatspreader plate at proper operating temperatures. Under worst-
case conditions, the cooling mechanism must maintain an ambient air and heatspreader plate temperature of 60° C or
less.
The aluminum slugs and thermal pads on the underside of the heatspreader assembly implement thermal interfaces
between the heatspreader plate and the major heat-generating components on the ETX®-CD. About 80 percent of the
power dissipated within the module is conducted to the heatspreader plate and can be removed by the cooling solution.
You can use many thermal-management solutions with the heatspreader plates, including active and passive approaches.
The optimum cooling solution varies, depending on the ETX® application and environmental conditions. Please see the
ETX® Design Guide for further information on thermal management.
3.11 Heatspreader
Documentation and CAD drawings of ETX®-CD heatspreader and cooling solutions is provided at
http://emdcustomersection.kontron.com.
20