Kontron nanoETXexpress-SP User manual

nanoETXexpress-SP
Document Revision 1.43
If it's embedded it's Kontron

» Table of Contents «
1User Information.................................................................................................6
1.1 About This Document............................................................................................6
1.2 opyright Notice.................................................................................................. 6
1.3 Trademarks.........................................................................................................6
1.4 Standards...........................................................................................................6
1.5 Warranty............................................................................................................ 7
1.6 Technical Support................................................................................................ 7
2Introduction.......................................................................................................8
2.1 Product Description..............................................................................................8
2.2 Naming clarification.............................................................................................8
2.3 Understanding OM Express® Functionality...............................................................8
2.4 OM Express® Documentation................................................................................9
2.5 OM Express® Benefits..........................................................................................9
3Product Specification.......................................................................................... 10
3.1 Modules & Accessories.........................................................................................10
3.2 Functional Specification......................................................................................12
3.3 Block Diagram................................................................................................... 18
3.4 Electrical Specification........................................................................................19
3.4.1 Supply Voltage...................................................................................................19
3.4.2 Power Supply Rise Time........................................................................................19
3.4.3 Supply Voltage Ripple..........................................................................................19
3.4.4 Power onsumption............................................................................................19
3.5 Environmental Specification.................................................................................20
3.5.1 Temperature......................................................................................................20
3.5.2 Humidity..........................................................................................................20
3.6 Standards and ertifications.................................................................................21
3.7 MTBF............................................................................................................... 23
3.8 Mechanical Specification......................................................................................24
3.8.1 Module Dimension.............................................................................................. 24
3.8.2 Height on Top....................................................................................................24
3.8.3 Height on Bottom...............................................................................................24
3.8.4 Mechanical Drawing............................................................................................ 24
3.9 Thermal Management..........................................................................................25
3.10 Heatspreader.....................................................................................................25
www.kontron.com

4Features and Interfaces.......................................................................................26
4.1 Power ontrol....................................................................................................26
4.2 LP .................................................................................................................. 27
4.3 LP boot........................................................................................................... 27
4.4 JIDA16 and JIDA32.............................................................................................28
4.5 K-Station 1.......................................................................................................28
4.6 K-Station & API Resources....................................................................................29
4.6.1 I2 .................................................................................................................. 29
4.6.2 Storage............................................................................................................ 29
4.6.3 GPIO................................................................................................................ 29
4.6.4 Hardware Monitor...............................................................................................29
4.7 GPIO - General Purpose Input and Output.................................................................30
4.8 Watchdog Timer.................................................................................................32
4.9 Flash Backup Feature.......................................................................................... 33
4.10 Speedstep Technology.........................................................................................35
4.11 -States........................................................................................................... 36
4.12 Hyper Threading.................................................................................................37
4.13 A PI Suspend Modes and Resume Events..................................................................38
4.14 USB................................................................................................................. 39
4.15 SDIO................................................................................................................ 41
4.16 Graphics Interface..............................................................................................42
4.17 Fast I2 & SMBus................................................................................................44
4.18 LP Bus............................................................................................................ 45
5System Ressources..............................................................................................47
5.1 Interrupt Request (IRQ) Lines...............................................................................47
5.1.1 In 8259 PI Mode...............................................................................................47
5.1.2 In API mode.....................................................................................................47
5.2 Memory Area..................................................................................................... 48
5.3 I/O Address Map................................................................................................. 48
5.4 Peripheral omponent Interconnect (P I) Devices.....................................................49
5.5 Internal I2 Bus.................................................................................................49
5.6 JILI I2 Bus.......................................................................................................49
5.7 SDVO I2 Bus.....................................................................................................49
5.8 System Management (SM) Bus...............................................................................49
5.9 Pinout List........................................................................................................ 50
5.9.1 General Signal Description...................................................................................50
4

5.9.2 onnector X1A Row A...........................................................................................51
5.9.3 onnector X1A Row B..........................................................................................53
5.9.4 SDVO onnector J1801 (optional)..........................................................................55
5.9.5 XDP onnector J1400 (optional)............................................................................56
6BIOS Operation.................................................................................................. 57
6.1 Determining the BIOS Version...............................................................................57
6.2 Setup Guide......................................................................................................57
6.2.1 Start AMI® BIOS Setup Utility...............................................................................57
6.3 BIOS Setup.......................................................................................................59
6.3.1 Main Menu........................................................................................................59
6.3.2 Module Info...................................................................................................... 60
6.3.3 Advanced Menu..................................................................................................64
6.3.4 Advanced P I/PnP Settings...................................................................................81
6.3.5 Boot................................................................................................................ 82
6.3.6 Security........................................................................................................... 83
6.3.7 Advanced hipset Settings...................................................................................84
6.3.8 Exit Menu......................................................................................................... 88
5

1 User Information
1.1 About This Document
This document provides information about products from Kontron Embedded Modules GmbH and/or its subsidiaries. No
warranty of suitability, purpose, or fitness is implied. While every attempt has been made to ensure that the information
in this document is accurate, the information contained within is supplied “as-is” and is subject to change without notice.
For the circuits, descriptions and tables indicated, Kontron assumes no responsibility as far as patents or other rights of
third parties are concerned.
1.2 Copyright Notice
opyright © 2003-2011 Kontron Embedded Modules GmbH
All rights reserved. No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or
translated into any language or computer language, in any form or by any means (electronic, mechanical, photocopying,
recording, or otherwise), without the express written permission of Kontron Embedded Modules GmbH.
DIMM-P ®, PISA®, ETX®, ETXexpress®, microETXexpress®, X-board®, DIMM-IO® and DIMM-BUS® are trademarks or
registered trademarks of Kontron Embedded Modules GmbH. Kontron is trademark or registered trademark of Kontron AG.
1.3 Trademarks
The following lists the trademarks of components used in this board.
» IBM, XT, AT, PS/2 and Personal System/2 are trademarks of International Business Machines orp.
» Microsoft is a registered trademark of Microsoft orp.
» Intel is a registered trademark of Intel orp.
» All other products and trademarks mentioned in this manual are trademarks of their respective owners.
1.4 Standards
Kontron Embedded Modules GmbH is certified to ISO 9000 standards.
6

1.5 arranty
This Kontron Embedded Modules GmbH product is warranted against defects in material and workmanship for the
warranty period from the date of shipment. During the warranty period, Kontron Embedded Modules GmbH will at its
discretion decide to repair or replace defective products.
Within the warranty period, the repair of products is free of charge as long as warranty conditions are observed.
The warranty does not apply to defects resulting from improper or inadequate maintenance or handling by the buyer,
unauthorized modification or misuse, operation outside of the product’s environmental specifications or improper
installation or maintenance.
Kontron Embedded Modules GmbH will not be responsible for any defects or damages to other products not supplied by
Kontron Embedded Modules GmbH that are caused by a faulty Kontron Embedded Modules GmbH product.
1.6 Technical Support
Technicians and engineers from Kontron Embedded Modules GmbH and/or its subsidiaries are available for technical
support. We are committed to making our product easy to use and will help you use our products in your systems.
Please consult our Web site at http://www.kontron.com/support for the latest product documentation, utilities, drivers
and support contacts. onsult our customer section http://emdcustomersection.kontron.com for the latest BIOS
downloads, Product hange Notifications and additional tools and software. In any case you can always contact your
board supplier for technical support.
7

2 Introduction
2.1 Product Description
This credit card sized module is compatible to OM Express® pin-out Type 1. On 55 mm x 84 mm footprint nanoETXexpress-
SP is a perfect fit for the next generation of low power, ultra-mobile applications that require energy saving x86 processor
performance, high-end graphics, P I Express and Serial ATA combined with longer battery life. These include handheld
devices for medical or multi-media applications, small mobile data systems and a host of new applications that have not
previously been possible due to size or power consumption limitations.
This mini OM form factor is 100 percent compatible with the OM.0 Type 1 with respect to connector location and pin
definition. Thus guaranteering scalability between modules. The Kontron nanoETXexpress-SP OM is based on the highly-
efficient Intel® Atom™ 5XX processor series and Intel® System ontroller Hub single chip that combines the memory
controller, graphic engine and I/O in a single, space saving chipset design. With only one tenth of the Thermal Design
Power and one seventh the size of ULV processors at an identical performance, the nanoETXexpress-SP OM offers an
unprecedented power consumption / performance ratio for x86-based ultra-mobile designs.
The nanoETXexpress-SP with Flash and memory on-board support 1 P I Express x1 (opt. 2 x1 if no onboard LAN), Serial
ATA, High Definition Audio, LVDS and optional SDVO. 10/100/1000 Gigabit Ethernet is designed in onboard for high
connectivity and 8x USB provides fast and sufficient interfaces for external peripherals. All above mentioned
requirements are supported by nanoETXexpress - small power - low size - high performance.
2.2 Naming clarification
OM Express® defines a omputer-On-Module, or OM, with all components necessary for a bootable host computer,
packaged as a super component. Interfaces will provide a smooth transition path from legacy parallel interfaces to LVDS
(Low Voltage Differential Signaling) interfaces. These include the P I bus and parallel ATA as well as P I Express and
Serial ATA.
» ETXexpress® modules are Kontron's OM Express® modules in basic form factor (125mm x 95mm)
» microETXexpress® modules are Kontron's OM Express® modules in compact form factor (95mm x 95mm)
» nanoETXexpress modules are Kontron's OM Express® modules in mini form factor (55mm x 84mm)
2.3 Understanding COM Express® Functionality
All Kontron microETXexpress® and ETXexpress® modules contain two connectors; each of it has two rows. The primary
connector has two rows called Row A and Row B. The secondary connector has two rows called Row and Row D. On
nanoETXexpress® modules only the primary connector Row A and Row B is used.
The primary connector (Row A and Row B) feature the following legacy-free functionality:
» Ethernet
» Serial ATA (SATA)
» USB 2.0
» LVDS/VGA and dual display video
» High Definition Audio (Azalia)
» LP (low pin count) Bus
» P Iexpress
8

2.4 COM Express® Documentation
This product manual serves as one of three principal references for a OM Express® design. It documents the
specifications and features of nanoETXexpress-SP. The other two references, which are available from your Kontron
Support or from PI MG®, include:
» The OM Express® Specification defines the OM Express® module form factor, pin-out, and signals. This document
is available from the PIGMG website by filling out the order form.
» The OM Express® Design Guide by PI MG serves as a general guide for baseboard design, with a focus on maximum
flexibility to accommodate a wide range of OM Express® modules.
Some of the information contained within this product manual applies only to certain
product revisions ( E: xxx). If certain information applies to specific product revisions ( E:
xxx) it will be stated. Please check the product revision of your module to see if this
information is applicable.
2.5 COM Express® Benefits
OM Express® modules are very compact, highly integrated computers. All Kontron OM Express® modules, like
nanoETXexpress, microETXexpress® and ETXexpress®, feature a standardized form factor and a standardized connector
layout that carry a specified set of signals. Each OM is based on the OM Express® specification. This standardization
allows designers to create a single-system baseboard that can accept present and future OM Express® modules.
OM Express® modules include common personal computer (P ) peripheral functions such as:
» Graphics
» USB ports
» Ethernet
» Sound
» SATA
The baseboard designer can optimize exactly how each of these functions implements physically. Designers can place
connectors precisely where needed for the application on a baseboard designed to optimally fit a system’s packaging.
A P I bus can be implemented directly on the baseboard rather than on mechanically unwieldy expansion cards. The
ability to build a system on a single baseboard using the computer as one plug-in component simplifies packaging,
eliminates cabling, and significantly reduces system-level cost.
A single baseboard design can use a range of ETXexpress®, microETXexpress® and nanoETXexpress modules. This
flexibility can differentiate products at various price/performance points, or to design future proof systems that have a
built-in upgrade path. The modularity of a OM Express® solution also ensures against obsolescence as computer
technology evolves. A properly designed OM Express® baseboard can work with several successive generations of OM
Express® modules.
A OM Express® baseboard design has many advantages of a custom, computer-board design but delivers better
obsolescence protection, greatly reduced engineering effort, and faster time to market.
9

Product Specification
3.1 Modules & Accessories
The OM Express® mini sized omputer-on-Module nanoETXexpress-SP (NOW1) follows pin-out Type 1 and is compatible to
PI MG specification OM.0 Rev 1.0. The nanoETXexpress-SP, based on Intel's eMenlow platform, is available in different
variants to cover the demand of different performance, price and power:
Commercial grade modules (0°C to 60°C operating)
Product Number Product Name Processor SCH and Features
34001-2040-16-1 nETXe-SP 1.6GHz Intel® Atom™ Z530 US15W, 1xP Ie, 2GB DDR2, 4GB SSD
34001-1040-16-1 nETXe-SP 1.6GHz Intel® Atom™ Z530 US15W, 1xP Ie, 1GB DDR2, 4GB SSD
34001-5120-16-1 nETXe-SP 1.6GHz Intel® Atom™ Z530 US15W, 1xP Ie, 512MB DDR2, 2GB SSD
34001-1020-11-1 nETXe-SP 1.1GHz Intel® Atom™ Z510 US15W, 1xP Ie, 1GB DDR2, 2GB SSD
34001-5151-11-1 nETXe-SP 1.1GHz Intel® Atom™ Z510 US15W, 1xP Ie, 512MB DDR2, 512MB SSD
Extended temperature modules (-25°C to 75°C operating)
Product Number Product Name Processor SCH and Features
34001-1040-16-1EXT nETXe-SP 1.1GHz E1 Intel® Atom™ Z510 US15W, 1xP Ie, LAN, 1GB DDR2, 4GB SSD
34001-5120-16-1EXT nETXe-SP 1.1GHz E1 Intel® Atom™ Z510 US15W, 1xP Ie, LAN, 512MB DDR2, 2GB SSD
34001-5151-11-1EXT nETXe-SP 1.6GHz E1 Intel® Atom™ Z530 US15W, 1xP Ie, LAN, 512MB DDR2, 512MB SSD
Possible memory and onboard Flash configurations 34001-MMFF-xx-x:
» MM = 51: 512MB DDR2 Memory (4 x 1Gb chips on bottom)
» MM = 10: 1024MB DDR2 Memory (8 x 1Gb chips)
» MM = 20: 2048MB DDR2 Memory (8 x 2Gb chips)
» FF = 00: without PATA SSD
» FF = 51: 512MB onboard PATA SSD
» FF = 10: 1GB onboard PATA SSD
» FF = 20: 2GB onboard PATA SSD
» FF = 40: 4GB onboard PATA SSD
Please contact your local sales for customized Memory and Flash variants or modules with
2xP Ie (no-LAN version)
10

Accessories
Product Number Product Name
34101-0000-00-0 nanoETXexpress Evaluation Board (EOL)
34101-0000-00-1 OM Express® Eval Type 10/1
34100-0000-00-0 / S OM Express® HMI Baseboard Type 1 / Starterkit
34001-0000-99-0 nanoETXexpress-TT, Heatspreader, threaded
34001-0000-99-1 nanoETXexpress-TT, Heatspreader, through hole
34001-0000-99-2 nanoETXexpress-TT, Heatspreader, Slim Profile
34001-0000-99-0 O1 nanoETXexpress-TT, Heatsink, passiv, threaded
96007-0000-00-1 ADA-LVDS-DVI 24bit (LVDS to DVI converter)
38019-0000-00-1 adapter nanoExpr connector (Stack adapter)
Product Number Graphics Adapter (usable with SDVO option)
34120-0000-00-0 ADA-SDVO-PEG16
34120-0000-00-1 ADA- OMeType1-FF 30
34120-0000-00-2 ADA- OMeType1-Type2
34121-0000-00-0 ADA-SDVO30-DVI
11

3.2 Functional Specification
Processor
The Intel® ATOM™ (Silverthorne) PU family supports:
» Intel® Hyper-Threading Technology
» Intel® Virtualization Technology (VT-x)
» Idle States
» Enhanced Intel SpeedStep® Technology
» Intel® Demand Based Switching
» Thermal Monitoring Technologies
» Execute Disable Bit
CPU specifications
Processor Cores / Threads CPU Clock L2 Cache Bus Speed VT-x HTT EIST Max TDP
Intel® Atom™ Z510 1 / 1 1100MHz 512KB 400MHz No No Yes 2.0W
Intel® Atom™ Z530 1 / 2 1600MHz 512KB 533MHz YES YES Yes 2.2W
Memory
Sockets memory down
Memory Type DDR2-533
Maximum Size up to 2GB
Technology Single hannel (64bit)
The total amount of memory available on the module is used for main memory and graphics memory. The Unified Memory
Architecture (UMA) manages how the system shares memory between the graphics controller and the processor. The
maximum supported memory configuration is 8 x 2Gbit (2GB). Usually modules are equipped with 8 x 1Gbit (1GB) or 4 x
1Gbit (512MB mounted on bottom side of the P B).
8 memory chips are only supported on hardware revision E 4.x.x or newer. Former
hardware revisions supports up to 4x2Gbit (1GB) system memory.
12

Graphics Core
The integrated Intel® GMA 500 supports:
Graphics Core Render Clock 200MHz
Execution Units / Pixel Pipelines 4
Max Graphics Memory 352MB
GFX Memory Bandwidth (GB/s) 4.2
GFX Memory Technology DVMT
API (DirectX/OpenGL) 9.0c / 2.0
Shader Model 3.0
Hardware accelerated Video H.264,MPEG2/4,V 1,WMV9
Independent/Simultaneous Displays 2 (with SDVO option)
Display Port -
HDCP support -
SDVO available via opt. FlatFoil or on OMe connector
Monitor output
CRT max Resolution -
TV out: -
LVDS
LVDS Bits/Pixel 1x18 and 1x24
LVDS Bits/Pixel with dithering -
LVDS max Resolution: WXGA (1366x768, 112MHz)
PWM Backlight Control: YES
Display Interfaces
Discrete Graphics -
Digital Display Interface DDI1 SDVOB optional
Digital Display Interface DDI2 -
Digital Display Interface DDI -
Chipset
The 130nm Intel System ontroller Hub Poulsbo supports:
» P I Express Revision 1.0
» USB 2.0
» USB lient
» SDIO 1.0
Storage
onboard SSD up to 8GB (IDE Master)
SD Card support SD 1.1 shared with GPIO
IDE Interface -
Serial-ATA 1 x SATA 1.5GB/s
SATA AHCI -
SATA RAID -
When using a hard disk on SATA #0 as primary device for the operating system the boot
order should be changed according the usage. Wrong boot order may cause problems
writing the MBR during OS installation.
13

Onboard SSD
The nanoETXexpress-SP is equipped with an onboard commercial or industrial flash drive from 512MB up to 4 GB capacity.
The onboard flash drive is connected as the primary master device to the US15W PATA interface through a standard
ATA/IDE bus interface. Basic features of the nanoETXexpress-SP onboard Flash Drive:
» up to PIO Mode 6
» up to multi word DMA Mode 4
» up to ultra DMA-6
» Build in E (Error orrection ode)
» Dynamic Wear Leveling
» Expanded Data Protection
The is equipped with different commercial and industrial SSD flash types. Find the details according to the module
hardware revision below:
512MB onboard SSD
Module HW Revision CE 1.0.x CE 1.1.x and newer / CE 4.x.x
Flash Size 512MB commercial 512MB industrial
Flash Part No. SST85LD0512T-120-5 -LBZE SST85LD0512-60-RI-LBTE
NAND Type SL NAND SL NAND
Host write Cycles - 100M
Flash Erase Cycles 100k 100k
Temperature Range [°C] 0 to 70 -40 to 85
Sustained Read Speed 10 MB/s 17 MB/s
Sustained Write Speed 5 MB/s 5 MB/s
ATA Modes PIO4, MWDMA2 PIO6, MWDMA4, UDMA4
Total Bytes 512,483,328 512,483,328
Cylinders/Heads/Sectors 993/16/63 993/16/63
2GB onboard SSD
Module HW Revision CE 1.0.x CE 1.1.x up to CE 4.6.0 CE 4.7.0 and newer
Flash Size 2GB commercial 2GB industrial 2GB industrial
Flash Part No. SST85LD1002L-60-4 -LBTE SST85LD1002U-60RI-LBTE Greenliant GLS85LP1002P-S-I-FTE
NAND Type SL NAND SL NAND SL NAND
Host write Cycles 10M 100M 70M
Flash Erase Cycles 10k 100k 70k
Temperature Range [°C] 0 to 70 -40 to 85 -40 to 85
Sustained Read Speed 23 MB/s 30 MB/s 28 MB/s
Sustained Write Speed 4 MB/s 20 MB/s 11 MB/s
ATA Modes PIO6, MWDMA4, UDMA4 PIO6, MWDMA4, UDMA4 PIO6, MWDMA4, UDMA6
Total Bytes 2,048,385,024 2,048,385,024 2,000,388,096
Cylinders/Heads/Sectors 3969/16/63 3969/16/63 3876/16/63
4GB onboard SSD
Module HW Revision CE 1.0.x (Samples) CE 1.1.x up to CE 4.6.0 CE 4.7.0 and newer
Flash Size 4GB commercial 4GB industrial 4GB industrial
Flash Part No. SST85LD1004M-60-4 -LBTE SST85LD1004T-60-RI Greenliant GLS85LP1004P-S-I-FTE
NAND Type ML NAND SL NAND SL NAND
Host write Cycles 10M 100M 70M
Flash Erase Cycles 10k 100k 70k
Temperature Range [°C] 0 to 70 -40 to 85 -40 to 85
Sustained Read Speed 30 MB/s 20 MB/s 50 MB/s
Sustained Write Speed 8 MB/s 20 MB/s 20 MB/s
ATA Modes PIO6, MWDMA4, UDMA4 PIO6, MWDMA4, UDMA4 PIO6, MWDMA4, UDMA6
Total Bytes 4,096,253,952 4,096,253,952 4,068,384,768
Cylinders/Heads/Sectors 7937/16/63 7937/16/63 7883/16/63
14

8GB onboard SSD
Module HW Revision CE 4.7.0 and newer
Flash Size 8GB industrial
Flash Part No. Greenliant GLS85LP1008P-S-I-FTE
NAND Type SL NAND
Host write Cycles 70M
Flash Erase Cycles 70k
Temperature Range [°C] -40 to 85
Sustained Read Speed 50 MB/s
Sustained Write Speed 39 MB/s
ATA Modes PIO6, MWDMA4, UDMA6
Total Bytes 8,136,769,536
Cylinders/Heads/Sectors 15,766/16/63
15

Connectivity
USB 8x USB 2.0
USB Client 1 x USB lient (USB #7)
PCI -
PCI External Masters -
PCI Express 1x P Ie x1
Max PCI Express 2x P Ie x1 without LAN
PCI Express x2/x4 configuration -
Ethernet 10/100/1000 Mbit
Ethernet controller Intel® 82574L (Hartwell)
Express ard Hot-plug is not supported by US15W S H
Ethernet
The Intel® 82574L (Hartwell) ethernet supports:
» Jumbo Frames
» Time Sync Protocol Indicator
» WOL (Wake On LAN)
» PXE (Preboot eXecution Environment)
Misc Interfaces and Features
Audio HD Audio
Onboard Hardware Monitor WINBOND W83L771W
Trusted Platform Module Infineon TPM 1.2 SLB9635TT optional
Miscellaneous -
TPM is only available on customized variants and requires BIOS NOW1R118 or newer. With
TPM option booting from external LP FWH is not supported
Kontron Features
External I2C Bus Fast I2
M.A.R.S. support YES
Embedded API JIDA16 / JIDA32
JIDA 2 Applications / K-Station YES
Custom BIOS Settings / Flash Backup YES
Watchdog support Single Staged
Power Features
Singly Supply Support YES
Supply Voltage 4.75 - 14V
ACPI A PI 3.0
S-States S0, S3, S4, S5
S5 Eco Mode -
Graphic States -
Misc Power Management -
16

Power Consumption and Performance
Full Load Power Consumption 4.9 - 6.2W
Kontron Performance Index 1107 - 1671
Kontron Performance/Watt 211 - 270
Detailed Power onsumption measurements in all states and bechmarks for PU, Graphics
and Memory performance are available in Application Note KEMAP054 at EMD ustomer
Section.
Supported Operating Systems
The nanoETXexpress-SP supports:
» Microsoft Windows E 6.0
» Microsoft Windows XP embedded
» Microsoft Windows XP x86
» Microsoft Windows Embedded Standard 7
» Microsoft Windows 7 x86
» Linux
» WindRiver VxWorks 6.6 - 6.8
» QNX Neutrino
17

3.3 Block Diagram
18

3.4 Electrical Specification
3.4.1 Supply Voltage
Following supply voltage is specified at the OM Express® connector for commercial grade and industrial grade modules:
nominal Voltage: 4.75 - 14V
5V_Stb: 5V D +/- 5%
Following supply voltage is specified at the OM Express® connector for extended temperature modules:
nominal Voltage: 12V D +/- 5%
5V_Stb: 5V D +/- 5%
5V Standby voltage is not mandatory for operation
3.4.2 Power Supply Rise Time
» The input voltages shall rise from ≤10% of nominal to within the regulation ranges within 0.1ms to 20ms.
» There must be a smooth and continuous ramp of each D input voltage from 10% to 90% of its final set-point
following the ATX specification
3.4.3 Supply Voltage Ripple
» Maximum 100 mV peak to peak 0 – 20 MHz
3.4.4 Power Consumption
The maximum Power onsumption of the different nanoETXexpress-SP modules is 4.9 - 6.2W (100% PU load; 90° PU
temperature). Further details with measurements and TDP values of the single variants can be found in our customer
section. Information there is available after registration.
19

3.5 Environmental Specification
3.5.1 Temperature
General Specification Operating Non-operating
ommercial grade 0° to +60° -30° to +85°
Extended (E1) -25° to +75° -30° to +85°
Industrial grade (E2) -40° to +85° -40° to +85°
See available module variants in chapter Product Specification
With Kontron Embedded Modules GmbH heatspreader plate assembly
The operating temperature defines two requirements:
» the maximum ambient temperature with ambient being the air surrounding the module.
» the maximum measurable temperature on any spot on the heatspreader's surface
Without Kontron Embedded Modules GmbH heatspreader plate assembly
The operating temperature is the maximum measurable temperature on any spot on the module's surface.
3.5.2 Humidity
» Operating: 10% to 90% (non condensing)
» Non operating: 5% to 95% (non condensing)
20